JP2017175092A5 - - Google Patents

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Publication number
JP2017175092A5
JP2017175092A5 JP2016062869A JP2016062869A JP2017175092A5 JP 2017175092 A5 JP2017175092 A5 JP 2017175092A5 JP 2016062869 A JP2016062869 A JP 2016062869A JP 2016062869 A JP2016062869 A JP 2016062869A JP 2017175092 A5 JP2017175092 A5 JP 2017175092A5
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JP
Japan
Prior art keywords
electronic component
bump
component according
substrate
area
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Application number
JP2016062869A
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English (en)
Japanese (ja)
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JP2017175092A (ja
JP6769721B2 (ja
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Priority to JP2016062869A priority Critical patent/JP6769721B2/ja
Priority claimed from JP2016062869A external-priority patent/JP6769721B2/ja
Priority to KR1020170017391A priority patent/KR102688696B1/ko
Priority to CN201710138345.7A priority patent/CN107230667B/zh
Publication of JP2017175092A publication Critical patent/JP2017175092A/ja
Priority to HK18104397.1A priority patent/HK1245502A1/zh
Publication of JP2017175092A5 publication Critical patent/JP2017175092A5/ja
Application granted granted Critical
Publication of JP6769721B2 publication Critical patent/JP6769721B2/ja
Active legal-status Critical Current
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JP2016062869A 2016-03-25 2016-03-25 電子部品、異方性接続構造体、電子部品の設計方法 Active JP6769721B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016062869A JP6769721B2 (ja) 2016-03-25 2016-03-25 電子部品、異方性接続構造体、電子部品の設計方法
KR1020170017391A KR102688696B1 (ko) 2016-03-25 2017-02-08 전자 부품, 이방성 접속 구조체, 전자 부품의 설계 방법
CN201710138345.7A CN107230667B (zh) 2016-03-25 2017-03-09 电子部件、各向异性连接结构体、电子部件的设计方法
HK18104397.1A HK1245502A1 (zh) 2016-03-25 2018-04-03 电子部件、各向异性连接结构体、电子部件的设计方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016062869A JP6769721B2 (ja) 2016-03-25 2016-03-25 電子部品、異方性接続構造体、電子部品の設計方法

Publications (3)

Publication Number Publication Date
JP2017175092A JP2017175092A (ja) 2017-09-28
JP2017175092A5 true JP2017175092A5 (enExample) 2019-04-18
JP6769721B2 JP6769721B2 (ja) 2020-10-14

Family

ID=59932991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016062869A Active JP6769721B2 (ja) 2016-03-25 2016-03-25 電子部品、異方性接続構造体、電子部品の設計方法

Country Status (4)

Country Link
JP (1) JP6769721B2 (enExample)
KR (1) KR102688696B1 (enExample)
CN (1) CN107230667B (enExample)
HK (1) HK1245502A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102791221B1 (ko) * 2019-01-31 2025-04-07 에스케이하이닉스 주식회사 앵커(anchor) 구조물을 포함하는 반도체 패키지
CN210167052U (zh) 2019-08-02 2020-03-20 云谷（固安）科技有限公司 柔性显示屏及显示装置
US20230215825A1 (en) * 2020-06-08 2023-07-06 Rohm Co., Ltd. Semiconductor element and semiconductor device
JP7491769B2 (ja) * 2020-08-04 2024-05-28 株式会社ジャパンディスプレイ 回路基板、ｌｅｄモジュール及び表示装置、並びにｌｅｄモジュールの作製方法及び表示装置の作製方法
US20240038640A1 (en) * 2020-12-16 2024-02-01 Rohm Co., Ltd. Semiconductor device
CN114220796B (zh) * 2021-12-10 2025-05-02 全球能源互联网研究院有限公司 一种功率半导体芯片封装结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3260414B2 (ja) * 1992-05-21 2002-02-25 シャープ株式会社 バンプ付き半導体装置とその製造方法
JP3826605B2 (ja) * 1999-03-08 2006-09-27 セイコーエプソン株式会社 半導体装置の実装構造の製造方法、液晶装置、および電子機器
KR100881183B1 (ko) * 2006-11-21 2009-02-05 삼성전자주식회사 높이가 다른 범프를 갖는 반도체 칩 및 이를 포함하는반도체 패키지
JP2014179363A (ja) * 2013-03-13 2014-09-25 Ps4 Luxco S A R L 半導体チップ及びこれを備える半導体装置
JP6303289B2 (ja) 2013-05-13 2018-04-04 日立化成株式会社 回路部材、接続構造体及び接続構造体の製造方法
JP2015076485A (ja) * 2013-10-08 2015-04-20 株式会社ジャパンディスプレイ 表示装置
JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法

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