HK1245502A1 - 電子部件、各向異性連接結構體、電子部件的設計方法 - Google Patents
電子部件、各向異性連接結構體、電子部件的設計方法Info
- Publication number
- HK1245502A1 HK1245502A1 HK18104397.1A HK18104397A HK1245502A1 HK 1245502 A1 HK1245502 A1 HK 1245502A1 HK 18104397 A HK18104397 A HK 18104397A HK 1245502 A1 HK1245502 A1 HK 1245502A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electronic component
- connection structure
- designing method
- anisotropic connection
- anisotropic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/1401—Structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/1405—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
- H01L2224/1701—Structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
- H01L2224/1705—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016062869A JP6769721B2 (ja) | 2016-03-25 | 2016-03-25 | 電子部品、異方性接続構造体、電子部品の設計方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1245502A1 true HK1245502A1 (zh) | 2018-08-24 |
Family
ID=59932991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18104397.1A HK1245502A1 (zh) | 2016-03-25 | 2018-04-03 | 電子部件、各向異性連接結構體、電子部件的設計方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6769721B2 (zh) |
CN (1) | CN107230667B (zh) |
HK (1) | HK1245502A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200095253A (ko) * | 2019-01-31 | 2020-08-10 | 에스케이하이닉스 주식회사 | 앵커(anchor) 구조물을 포함하는 반도체 패키지 |
CN210167052U (zh) * | 2019-08-02 | 2020-03-20 | 云谷(固安)科技有限公司 | 柔性显示屏及显示装置 |
WO2021251128A1 (ja) * | 2020-06-08 | 2021-12-16 | ローム株式会社 | 半導体素子、および、半導体装置 |
JP7491769B2 (ja) | 2020-08-04 | 2024-05-28 | 株式会社ジャパンディスプレイ | 回路基板、ledモジュール及び表示装置、並びにledモジュールの作製方法及び表示装置の作製方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3260414B2 (ja) * | 1992-05-21 | 2002-02-25 | シャープ株式会社 | バンプ付き半導体装置とその製造方法 |
JP3826605B2 (ja) * | 1999-03-08 | 2006-09-27 | セイコーエプソン株式会社 | 半導体装置の実装構造の製造方法、液晶装置、および電子機器 |
KR100881183B1 (ko) * | 2006-11-21 | 2009-02-05 | 삼성전자주식회사 | 높이가 다른 범프를 갖는 반도체 칩 및 이를 포함하는반도체 패키지 |
JP2014179363A (ja) * | 2013-03-13 | 2014-09-25 | Ps4 Luxco S A R L | 半導体チップ及びこれを備える半導体装置 |
JP2015076485A (ja) * | 2013-10-08 | 2015-04-20 | 株式会社ジャパンディスプレイ | 表示装置 |
JP6645730B2 (ja) * | 2014-01-28 | 2020-02-14 | デクセリアルズ株式会社 | 接続体及び接続体の製造方法 |
-
2016
- 2016-03-25 JP JP2016062869A patent/JP6769721B2/ja active Active
-
2017
- 2017-03-09 CN CN201710138345.7A patent/CN107230667B/zh active Active
-
2018
- 2018-04-03 HK HK18104397.1A patent/HK1245502A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN107230667B (zh) | 2023-01-17 |
JP6769721B2 (ja) | 2020-10-14 |
JP2017175092A (ja) | 2017-09-28 |
CN107230667A (zh) | 2017-10-03 |
KR20170113038A (ko) | 2017-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ZA201804421B (en) | An electronic transaction method and apparatus | |
IL259200A (en) | Strength amplifiers and a method for achieving strength gain in an electronic humidifier | |
EP3384421A4 (en) | Electronic device and method of operating same | |
EP3340264A4 (en) | ELECTRONIC DEVICE AND MANUFACTURING METHOD FOR THE ELECTRONIC DEVICE | |
EP3255965A4 (en) | Case component, electronic device and method for producing case component | |
EP3108373A4 (en) | Method of operating function and resource of electronic device | |
EP3221882A4 (en) | Assembling method, manufacturing method, device and electronic apparatus of flip-die | |
EP3528155A4 (en) | AUTHENTICATION METHOD AND ELECTRONIC DEVICE | |
EP3229467A4 (en) | Imaging method, imaging device, and electronic device | |
EP3550942A4 (en) | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | |
EP3517292A4 (en) | LAMINATE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | |
EP3371960A4 (en) | Electronic device and method of operating the same | |
EP3104400A4 (en) | Electronic component module, and manufacturing method of electronic component module | |
HK1254852A1 (zh) | 電子部件、連接體、電子部件的設計方法 | |
EP3166372A4 (en) | Electronic component and method for manufacturing same | |
EP3217424A4 (en) | Electroconductive assembly for electronic component, semiconductor device in which said assembly is used, and method for manufacturing electroconductive assembly | |
EP3105919A4 (en) | Photographing method of an electronic device and the electronic device thereof | |
EP3352449A4 (en) | Electronic device and photographing method | |
EP3251113A4 (en) | Method of entering data in an electronic device | |
EP3143641A4 (en) | Method of providing an electronic device and electronic device thereof | |
EP3603040A4 (en) | ELECTRONIC DEVICE AND METHOD FOR CARRYING OUT A FUNCTION OF THE ELECTRONIC DEVICE | |
EP3355172A4 (en) | Electronic device and ui providing method therefor | |
HK1245502A1 (zh) | 電子部件、各向異性連接結構體、電子部件的設計方法 | |
EP3336675A4 (en) | Electronic device and input method of electronic device | |
HK1245567A1 (zh) | 各向異性導電連接結構體、各向異性導電連接方法和各向異性導電粘接劑 |