JP2017067579A - 物理量センサ - Google Patents
物理量センサ Download PDFInfo
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- JP2017067579A JP2017067579A JP2015192510A JP2015192510A JP2017067579A JP 2017067579 A JP2017067579 A JP 2017067579A JP 2015192510 A JP2015192510 A JP 2015192510A JP 2015192510 A JP2015192510 A JP 2015192510A JP 2017067579 A JP2017067579 A JP 2017067579A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0016—Protection against shocks or vibrations, e.g. vibration damping
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0118—Cantilevers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/04—Electrodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/056—Rotation in a plane parallel to the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
- G01P2015/0882—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system for providing damping of vibrations
Abstract
外部から印加された力の影響を低減し信頼性の優れた物理量センサを提供すること
【解決手段】
デバイス基板に形成された錘または可動電極と、前記錘または可動電極を取り囲むように配置した外周部と、を有し、前記錘または可動電極が平面内で回転方向に変位可能な物理量センサにおいて、前記錘または可動電極が平面内で回転方向に変位した時に、前記錘または可動電極の中心位置から見た端部の外周部に、回転空間を設けた。
【選択図】 図1
Description
詳細には加速度センサにX方向から加速度が印加されると錘または可動電極3が変位し、固定電極2aとのギャップ距離が変化する。変位した錘または可動電極3は、ばね梁4によって元の位置に引き戻される。
加速度の検出は一般的に(1)式と(2)式の関係が重要となる。ここで、Fは力、mは錘または可動電極の重量、aは加速度、kはバネ定数、xは加速度が印加された場合のばね梁の変位を示している。例えば、破損などによって錘または可動電極の重量mとバネ定数kが変化すると正確に加速度を得ることが困難となる。
F=m×a ………(1)
F=k×x ………(2)
Claims (12)
- デバイス基板に形成された錘または可動電極と、前記錘または可動電極を取り囲むように配置した外周部と、を有し、前記錘または可動電極が平面内で回転方向に変位可能な物理量センサにおいて、
前記錘または可動電極が平面内で回転方向に変位した時に、前記錘または可動電極の中心位置から見た端部の外周部に、回転空間を設けたことを特徴とする物理量センサ。 - 請求項2に記載の物理量センサにおいて、
前記端部に面取り部を設けたことを特徴とする物理量センサ。 - 請求項1に記載の物理量センサにおいて、
前記デバイス基板に形成された錘または可動電極が固定基板に一点で支持されており、
前記錘または可動電極の支持点から平面的に平行な方向および平面的に垂直な方向にある錘または可動電極の端部とその端部と平行に外周部に配置した固定電極との第一の隙間の距離と比較して、前記錘または可動電極の支持点から平面的に見て対角線上で最も離れた位置の錘または可動電極の端部とその端部と平行に外周部に配置した固定電極との第二の隙間の距離が広いことを特徴とする物理量センサ。 - 請求項3に記載の物理量センサにおいて、
前記第一の隙間の距離と前記第二の隙間の距離とがテーパ状に広がっていることを特徴とする物理量センサ。 - 請求項4に記載の物理量センサにおいて、
前記テーパ状の斜面に突起を設けたことを特徴とする物理量センサの構造 - 請求項1に記載の物理量センサにおいて、
前記デバイス基板の錘または可動電極内部に形成されたばね梁の支点と近接する第三の隙間の距離を比較して、ばね梁の先端部と近接する第四の隙間の距離が広いことを特徴とする物理量センサの構造 - 請求項6に記載の物理量センサおいて、
前記第三の隙間の距離と前記第四の隙間の距離とがテーパ状広がっていることを特徴とする物理量センサ - 請求項7に記載の物理量センサにおいて、
前記テーパ状の斜面に突起を設けたことを特徴とする物理量センサの構造 - 請求項1に記載の物理量センサにおいて、
前記デバイス基板に形成された錘または可動電極が固定基板に一点で支持されており、
前記支持点から対角線上で最も離れた位置の錘または可動電極の端部とそれと対向する、外周部に緩衝部を設けるたことを特徴とする物理量センサ - 請求項1に記載の物理量センサにおいて、
前記デバイス基板の錘または可動電極内部に形成されたばね梁の支点から一番離れた位置の側壁に緩衝部を設けたことを特徴とする物理量センサ - 請求項9または10に記載の物理量センサにおいて、
前記緩衝部は両端支持梁からなることを特徴とする物理量センサ - 請求項1から9の記載の物理量センサにおいて、
該物理量センサは制御LSIとともに一つのパッケージに配置されたことを特徴とする物理量センサ
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015192510A JP6527801B2 (ja) | 2015-09-30 | 2015-09-30 | 物理量センサ |
CN201680054606.0A CN108027388B (zh) | 2015-09-30 | 2016-08-03 | 物理量传感器 |
EP16850878.6A EP3358358A4 (en) | 2015-09-30 | 2016-08-03 | SENSOR FOR PHYSICAL SIZE |
PCT/JP2016/072723 WO2017056701A1 (ja) | 2015-09-30 | 2016-08-03 | 物理量センサ |
US15/763,212 US10989731B2 (en) | 2015-09-30 | 2016-08-03 | Physical quantity sensor |
Applications Claiming Priority (1)
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JP2015192510A JP6527801B2 (ja) | 2015-09-30 | 2015-09-30 | 物理量センサ |
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JP2017067579A true JP2017067579A (ja) | 2017-04-06 |
JP6527801B2 JP6527801B2 (ja) | 2019-06-05 |
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JP2015192510A Expired - Fee Related JP6527801B2 (ja) | 2015-09-30 | 2015-09-30 | 物理量センサ |
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US (1) | US10989731B2 (ja) |
EP (1) | EP3358358A4 (ja) |
JP (1) | JP6527801B2 (ja) |
CN (1) | CN108027388B (ja) |
WO (1) | WO2017056701A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019148477A (ja) * | 2018-02-27 | 2019-09-05 | セイコーエプソン株式会社 | 角速度センサー、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、および移動体 |
US11099206B2 (en) | 2018-10-29 | 2021-08-24 | Seiko Epson Corporation | Physical quantity sensor, electronic apparatus and vehicle |
JP2022019831A (ja) * | 2018-02-27 | 2022-01-27 | セイコーエプソン株式会社 | 角速度センサー、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、および移動体 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019074433A (ja) * | 2017-10-17 | 2019-05-16 | セイコーエプソン株式会社 | 物理量センサー、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器および移動体 |
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2015
- 2015-09-30 JP JP2015192510A patent/JP6527801B2/ja not_active Expired - Fee Related
-
2016
- 2016-08-03 US US15/763,212 patent/US10989731B2/en active Active
- 2016-08-03 CN CN201680054606.0A patent/CN108027388B/zh not_active Expired - Fee Related
- 2016-08-03 EP EP16850878.6A patent/EP3358358A4/en not_active Withdrawn
- 2016-08-03 WO PCT/JP2016/072723 patent/WO2017056701A1/ja active Application Filing
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JP2019148477A (ja) * | 2018-02-27 | 2019-09-05 | セイコーエプソン株式会社 | 角速度センサー、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、および移動体 |
JP2021144035A (ja) * | 2018-02-27 | 2021-09-24 | セイコーエプソン株式会社 | 角速度センサー、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、および移動体 |
JP2022019831A (ja) * | 2018-02-27 | 2022-01-27 | セイコーエプソン株式会社 | 角速度センサー、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、および移動体 |
JP7036273B2 (ja) | 2018-02-27 | 2022-03-15 | セイコーエプソン株式会社 | 角速度センサー、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器、および移動体 |
US11099206B2 (en) | 2018-10-29 | 2021-08-24 | Seiko Epson Corporation | Physical quantity sensor, electronic apparatus and vehicle |
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CN108027388B (zh) | 2021-04-23 |
EP3358358A1 (en) | 2018-08-08 |
WO2017056701A1 (ja) | 2017-04-06 |
JP6527801B2 (ja) | 2019-06-05 |
CN108027388A (zh) | 2018-05-11 |
EP3358358A4 (en) | 2019-06-05 |
US10989731B2 (en) | 2021-04-27 |
US20180275159A1 (en) | 2018-09-27 |
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