JP2017054901A - Iii族窒化物半導体発光装置とその製造方法 - Google Patents
Iii族窒化物半導体発光装置とその製造方法 Download PDFInfo
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- JP2017054901A JP2017054901A JP2015177254A JP2015177254A JP2017054901A JP 2017054901 A JP2017054901 A JP 2017054901A JP 2015177254 A JP2015177254 A JP 2015177254A JP 2015177254 A JP2015177254 A JP 2015177254A JP 2017054901 A JP2017054901 A JP 2017054901A
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- Prior art keywords
- dielectric film
- transparent conductive
- conductive oxide
- emitting device
- phosphor resin
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 104
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 65
- 239000011347 resin Substances 0.000 claims abstract description 65
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims description 19
- 238000001039 wet etching Methods 0.000 claims description 6
- 238000000605 extraction Methods 0.000 abstract description 8
- 230000006872 improvement Effects 0.000 abstract description 4
- 230000004907 flux Effects 0.000 description 18
- 229910004298 SiO 2 Inorganic materials 0.000 description 12
- 230000000903 blocking effect Effects 0.000 description 11
- 238000005229 chemical vapour deposition Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000005253 cladding Methods 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical class C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- USZGMDQWECZTIQ-UHFFFAOYSA-N [Mg](C1C=CC=C1)C1C=CC=C1 Chemical compound [Mg](C1C=CC=C1)C1C=CC=C1 USZGMDQWECZTIQ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004943 liquid phase epitaxy Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 1
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015177254A JP2017054901A (ja) | 2015-09-09 | 2015-09-09 | Iii族窒化物半導体発光装置とその製造方法 |
CN201610812839.4A CN106887503B (zh) | 2015-09-09 | 2016-09-09 | Iii族氮化物半导体发光装置及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015177254A JP2017054901A (ja) | 2015-09-09 | 2015-09-09 | Iii族窒化物半導体発光装置とその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2017054901A true JP2017054901A (ja) | 2017-03-16 |
Family
ID=58317255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015177254A Pending JP2017054901A (ja) | 2015-09-09 | 2015-09-09 | Iii族窒化物半導体発光装置とその製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2017054901A (zh) |
CN (1) | CN106887503B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108281529A (zh) * | 2018-04-04 | 2018-07-13 | 佛山市国星半导体技术有限公司 | 一种具有抗打击电极的led芯片及其制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09129922A (ja) * | 1995-10-31 | 1997-05-16 | Sanyo Electric Co Ltd | 発光素子と発光素子の製造方法 |
JP2011192999A (ja) * | 2010-03-15 | 2011-09-29 | Lg Innotek Co Ltd | 発光素子 |
US20130001615A1 (en) * | 2011-06-30 | 2013-01-03 | Shin Kim | Light emitting device and lighting system with the same |
JP2013214743A (ja) * | 2012-03-30 | 2013-10-17 | Advanced Optoelectronic Technology Inc | 発光ダイオードチップ及びその製造方法 |
JP2014057010A (ja) * | 2012-09-13 | 2014-03-27 | Toyoda Gosei Co Ltd | 半導体発光素子とその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4024994B2 (ja) * | 2000-06-30 | 2007-12-19 | 株式会社東芝 | 半導体発光素子 |
CN1316640C (zh) * | 2003-10-13 | 2007-05-16 | 光磊科技股份有限公司 | 可提高发光作用区域的发光元件 |
KR100887139B1 (ko) * | 2007-02-12 | 2009-03-04 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 제조방법 |
JP4686625B2 (ja) * | 2009-08-03 | 2011-05-25 | 株式会社東芝 | 半導体発光装置の製造方法 |
KR20120015651A (ko) * | 2010-08-12 | 2012-02-22 | 서울옵토디바이스주식회사 | 개선된 광 추출 효율을 갖는 발광 다이오드 |
JP5628056B2 (ja) * | 2011-01-21 | 2014-11-19 | スタンレー電気株式会社 | 半導体発光素子 |
JP5949294B2 (ja) * | 2011-08-31 | 2016-07-06 | 日亜化学工業株式会社 | 半導体発光素子 |
JP5644753B2 (ja) * | 2011-12-26 | 2014-12-24 | 豊田合成株式会社 | Iii族窒化物半導体発光素子 |
KR20150039518A (ko) * | 2013-10-02 | 2015-04-10 | 엘지이노텍 주식회사 | 발광소자 |
-
2015
- 2015-09-09 JP JP2015177254A patent/JP2017054901A/ja active Pending
-
2016
- 2016-09-09 CN CN201610812839.4A patent/CN106887503B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09129922A (ja) * | 1995-10-31 | 1997-05-16 | Sanyo Electric Co Ltd | 発光素子と発光素子の製造方法 |
JP2011192999A (ja) * | 2010-03-15 | 2011-09-29 | Lg Innotek Co Ltd | 発光素子 |
US20130001615A1 (en) * | 2011-06-30 | 2013-01-03 | Shin Kim | Light emitting device and lighting system with the same |
JP2013214743A (ja) * | 2012-03-30 | 2013-10-17 | Advanced Optoelectronic Technology Inc | 発光ダイオードチップ及びその製造方法 |
JP2014057010A (ja) * | 2012-09-13 | 2014-03-27 | Toyoda Gosei Co Ltd | 半導体発光素子とその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108281529A (zh) * | 2018-04-04 | 2018-07-13 | 佛山市国星半导体技术有限公司 | 一种具有抗打击电极的led芯片及其制作方法 |
CN108281529B (zh) * | 2018-04-04 | 2024-06-25 | 佛山市国星半导体技术有限公司 | 一种具有抗打击电极的led芯片及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106887503A (zh) | 2017-06-23 |
CN106887503B (zh) | 2019-06-28 |
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