JP2017034158A - セラミック成形体の切断装置および積層セラミック電子部品の製造方法 - Google Patents

セラミック成形体の切断装置および積層セラミック電子部品の製造方法 Download PDF

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Publication number
JP2017034158A
JP2017034158A JP2015154268A JP2015154268A JP2017034158A JP 2017034158 A JP2017034158 A JP 2017034158A JP 2015154268 A JP2015154268 A JP 2015154268A JP 2015154268 A JP2015154268 A JP 2015154268A JP 2017034158 A JP2017034158 A JP 2017034158A
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JP
Japan
Prior art keywords
cutting
ceramic
molded body
angle
ceramic molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015154268A
Other languages
English (en)
Japanese (ja)
Inventor
伊藤　賢
Masaru Ito
賢 伊藤
宏太 長谷川
Kota Hasegawa
宏太 長谷川
学 春日
Manabu Kasuga
学 春日
肇 細田
hajime Hosoda
肇 細田
修二 玄行
Shuji Genko
修二 玄行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2015154268A priority Critical patent/JP2017034158A/ja
Priority to CN201610605601.4A priority patent/CN106426575B/zh
Priority to KR1020160098409A priority patent/KR101860104B1/ko
Priority to TW105124674A priority patent/TWI668089B/zh
Publication of JP2017034158A publication Critical patent/JP2017034158A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/14—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting
    • B28B11/145—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting for dividing block-shaped bodies of expanded materials, e.g. cellular concrete
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/02—Means for moving the cutting member into its operative position for cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/08—Means for actuating the cutting member to effect the cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Structural Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
JP2015154268A 2015-08-04 2015-08-04 セラミック成形体の切断装置および積層セラミック電子部品の製造方法 Pending JP2017034158A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015154268A JP2017034158A (ja) 2015-08-04 2015-08-04 セラミック成形体の切断装置および積層セラミック電子部品の製造方法
CN201610605601.4A CN106426575B (zh) 2015-08-04 2016-07-28 陶瓷成型体的切断装置以及层叠陶瓷电子元器件的制造方法
KR1020160098409A KR101860104B1 (ko) 2015-08-04 2016-08-02 세라믹 성형체의 절단 장치 및 적층 세라믹 전자부품의 제조방법
TW105124674A TWI668089B (zh) 2015-08-04 2016-08-03 陶瓷成形體之切斷裝置及積層陶瓷電子零件之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015154268A JP2017034158A (ja) 2015-08-04 2015-08-04 セラミック成形体の切断装置および積層セラミック電子部品の製造方法

Publications (1)

Publication Number Publication Date
JP2017034158A true JP2017034158A (ja) 2017-02-09

Family

ID=57989485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015154268A Pending JP2017034158A (ja) 2015-08-04 2015-08-04 セラミック成形体の切断装置および積層セラミック電子部品の製造方法

Country Status (4)

Country Link
JP (1) JP2017034158A (zh)
KR (1) KR101860104B1 (zh)
CN (1) CN106426575B (zh)
TW (1) TWI668089B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113241257A (zh) * 2020-01-22 2021-08-10 三星电机株式会社 陶瓷部件的制造方法及陶瓷部件的制造装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116901232B (zh) * 2023-09-14 2023-12-19 陶瓷工业设计研究院(福建)有限公司 一种高精度陶瓷成型体切断装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05205972A (ja) * 1992-01-29 1993-08-13 Rohm Co Ltd セラミック積層体シートの切断方法
JP2000263535A (ja) * 1999-03-11 2000-09-26 Murata Mfg Co Ltd グリーンシートの切断方法
JP2004276139A (ja) * 2003-03-13 2004-10-07 Murata Mfg Co Ltd セラミックグリーン成形体の切断方法および切断装置
JP2004276140A (ja) * 2003-03-13 2004-10-07 Murata Mfg Co Ltd セラミックグリーン成形体の切断方法および切断装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6129114A (ja) * 1984-07-18 1986-02-10 関西日本電気株式会社 積層セラミツク部品の製造方法
JP3166924B2 (ja) * 1991-02-07 2001-05-14 株式会社村田製作所 セラミック電子部品の製造方法
JPH0997736A (ja) * 1995-09-29 1997-04-08 Matsushita Electric Ind Co Ltd 積層体チップ部品の製造方法及びその方法で得られた積層体チップ部品
JP3675199B2 (ja) * 1998-11-13 2005-07-27 株式会社村田製作所 セラミックグリーンブロックのカット方法
JP2007118145A (ja) * 2005-10-28 2007-05-17 Asahi Glass Co Ltd 柔軟性フィルム切断装置及びその方法
JP2013000826A (ja) * 2011-06-15 2013-01-07 Murata Mfg Co Ltd カット刃、電子部品の製造方法、及び電子部品の製造装置
JP2014060259A (ja) * 2012-09-18 2014-04-03 Murata Mfg Co Ltd セラミック積層体のカット方法、セラミック積層体のカット装置、および積層セラミック電子部品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05205972A (ja) * 1992-01-29 1993-08-13 Rohm Co Ltd セラミック積層体シートの切断方法
JP2000263535A (ja) * 1999-03-11 2000-09-26 Murata Mfg Co Ltd グリーンシートの切断方法
JP2004276139A (ja) * 2003-03-13 2004-10-07 Murata Mfg Co Ltd セラミックグリーン成形体の切断方法および切断装置
JP2004276140A (ja) * 2003-03-13 2004-10-07 Murata Mfg Co Ltd セラミックグリーン成形体の切断方法および切断装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113241257A (zh) * 2020-01-22 2021-08-10 三星电机株式会社 陶瓷部件的制造方法及陶瓷部件的制造装置
JP2021118346A (ja) * 2020-01-22 2021-08-10 サムソン エレクトロ−メカニックス カンパニーリミテッド． セラミック部品の製造方法及びその製造装置

Also Published As

Publication number Publication date
TWI668089B (zh) 2019-08-11
KR20170016800A (ko) 2017-02-14
TW201716199A (zh) 2017-05-16
CN106426575B (zh) 2018-11-23
KR101860104B1 (ko) 2018-05-23
CN106426575A (zh) 2017-02-22

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