JP2017011319A5 - - Google Patents
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- Publication number
- JP2017011319A5 JP2017011319A5 JP2016207074A JP2016207074A JP2017011319A5 JP 2017011319 A5 JP2017011319 A5 JP 2017011319A5 JP 2016207074 A JP2016207074 A JP 2016207074A JP 2016207074 A JP2016207074 A JP 2016207074A JP 2017011319 A5 JP2017011319 A5 JP 2017011319A5
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- JP
- Japan
- Prior art keywords
- semiconductor
- conductivity type
- semiconductor layer
- semiconductor device
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims description 118
- 230000015556 catabolic process Effects 0.000 claims description 8
- 239000000969 carrier Substances 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000000704 physical effect Effects 0.000 claims description 2
- 210000000746 body region Anatomy 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016207074A JP6232687B2 (ja) | 2016-10-21 | 2016-10-21 | 半導体装置とその動作方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016207074A JP6232687B2 (ja) | 2016-10-21 | 2016-10-21 | 半導体装置とその動作方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012171456A Division JP2014022708A (ja) | 2012-07-17 | 2012-07-17 | 半導体装置とその動作方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017165059A Division JP2017228790A (ja) | 2017-08-30 | 2017-08-30 | 半導体装置とその動作方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017011319A JP2017011319A (ja) | 2017-01-12 |
| JP2017011319A5 true JP2017011319A5 (OSRAM) | 2017-06-08 |
| JP6232687B2 JP6232687B2 (ja) | 2017-11-22 |
Family
ID=57764483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016207074A Active JP6232687B2 (ja) | 2016-10-21 | 2016-10-21 | 半導体装置とその動作方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6232687B2 (OSRAM) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111048585B (zh) * | 2019-12-11 | 2021-06-11 | 四川大学 | 一种含有背面槽型介质及浮空区的逆导型igbt |
| JP7488778B2 (ja) | 2021-01-29 | 2024-05-22 | 株式会社東芝 | 半導体装置 |
| CN115148783A (zh) * | 2021-03-31 | 2022-10-04 | 四川大学 | 一种含有高阻p-top区的逆导型超结IGBT |
| CN117116938B (zh) * | 2023-10-24 | 2024-01-23 | 上海功成半导体科技有限公司 | 一种功率器件及其制备方法 |
| CN119153507B (zh) * | 2024-11-19 | 2025-02-11 | 深圳平湖实验室 | 一种半导体器件及其制备方法和电子设备 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005020320A1 (ja) * | 2003-08-22 | 2005-03-03 | The Kansai Electric Power Co., Inc. | 半導体装置及びその製造方法、この半導体装置を用いた電力変換装置 |
| WO2008015764A1 (en) * | 2006-08-04 | 2008-02-07 | The Kansai Electric Power Co., Inc. | Operating method of bipolar semiconductor device and bipolar semiconductor device |
| JP2011187693A (ja) * | 2010-03-09 | 2011-09-22 | Toshiba Corp | 半導体装置 |
| JP2012099630A (ja) * | 2010-11-02 | 2012-05-24 | Panasonic Corp | 半導体装置および電力変換器 |
-
2016
- 2016-10-21 JP JP2016207074A patent/JP6232687B2/ja active Active
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