JP2016537439A - セラミック研磨材複合体研磨溶液 - Google Patents

セラミック研磨材複合体研磨溶液 Download PDF

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Publication number
JP2016537439A
JP2016537439A JP2016516917A JP2016516917A JP2016537439A JP 2016537439 A JP2016537439 A JP 2016537439A JP 2016516917 A JP2016516917 A JP 2016516917A JP 2016516917 A JP2016516917 A JP 2016516917A JP 2016537439 A JP2016537439 A JP 2016537439A
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JP
Japan
Prior art keywords
polishing
abrasive
polishing solution
ceramic
solution according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016516917A
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English (en)
Japanese (ja)
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JP2016537439A5 (OSRAM
Inventor
ポール, エス. ラグ,
ポール, エス. ラグ,
デュイ, ケー. レフー,
デュイ, ケー. レフー,
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2016537439A publication Critical patent/JP2016537439A/ja
Publication of JP2016537439A5 publication Critical patent/JP2016537439A5/ja
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
    • B24D3/18Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2016516917A 2013-09-25 2014-09-22 セラミック研磨材複合体研磨溶液 Pending JP2016537439A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361882369P 2013-09-25 2013-09-25
US61/882,369 2013-09-25
PCT/US2014/056750 WO2015047939A1 (en) 2013-09-25 2014-09-22 Composite ceramic abrasive polishing solution

Publications (2)

Publication Number Publication Date
JP2016537439A true JP2016537439A (ja) 2016-12-01
JP2016537439A5 JP2016537439A5 (OSRAM) 2017-11-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016516917A Pending JP2016537439A (ja) 2013-09-25 2014-09-22 セラミック研磨材複合体研磨溶液

Country Status (8)

Country Link
US (1) US10293458B2 (OSRAM)
EP (1) EP3049215B1 (OSRAM)
JP (1) JP2016537439A (OSRAM)
KR (1) KR102289629B1 (OSRAM)
CN (1) CN105517758B (OSRAM)
SG (1) SG11201602206PA (OSRAM)
TW (1) TWI669382B (OSRAM)
WO (1) WO2015047939A1 (OSRAM)

Cited By (2)

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JP2019087660A (ja) * 2017-11-08 2019-06-06 Agc株式会社 研磨剤と研磨方法、および研磨用添加液
JP2023141786A (ja) * 2022-03-24 2023-10-05 株式会社ノリタケカンパニーリミテド 研磨スラリー及び研磨方法

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WO2015048011A1 (en) 2013-09-25 2015-04-02 3M Innovative Properties Company Multi-layered polishing pads
US9978609B2 (en) * 2015-04-27 2018-05-22 Versum Materials Us, Llc Low dishing copper chemical mechanical planarization
WO2016183126A1 (en) 2015-05-13 2016-11-17 3M Innovative Properties Company Polishing pads and systems for and methods of using same
JP6669331B2 (ja) * 2015-05-19 2020-03-18 昭和電工株式会社 研磨組成物、及びその研磨組成物を用いた研磨方法
WO2017142805A1 (en) * 2016-02-16 2017-08-24 3M Innovative Properties Company Polishing systems and methods of making and using same
ES2604830B1 (es) 2016-04-28 2017-12-18 Drylyte, S.L. Proceso para alisado y pulido de metales por transporte iónico mediante cuerpos sólidos libres, y cuerpos sólidos para llevar a cabo dicho proceso.
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
CA3045480C (en) 2016-12-23 2022-08-30 Saint-Gobain Abrasives, Inc. Coated abrasives having a performance enhancing composition
US11781039B2 (en) * 2016-12-26 2023-10-10 Fujimi Incorporated Polishing composition and polishing method
CN111032284B (zh) 2017-08-04 2022-11-04 3M创新有限公司 具有增强的共平面性的微复制型抛光表面
CN111032285B (zh) 2017-08-25 2022-07-19 3M创新有限公司 表面突起抛光垫
WO2019043819A1 (ja) * 2017-08-30 2019-03-07 日立化成株式会社 スラリ及び研磨方法
CN109868447B (zh) 2017-12-01 2022-03-25 通用电气公司 用于降低表面粗糙度的方法
EP3768795A1 (en) 2018-03-21 2021-01-27 3M Innovative Properties Company Structured abrasives containing polishing materials for use in the home
CN110499102A (zh) * 2018-05-20 2019-11-26 深圳市得益达电子科技有限公司 一种用于玻璃抛光的氧化铈液态悬浮抛光液
EP3578998B1 (en) 2018-06-08 2024-09-04 3M Innovative Properties Company Impedance assembly
CN110772911B (zh) * 2018-07-30 2021-11-09 天津大学 一种去除生物气溶胶的微波反应装置、反应系统及其应用
US20210060724A1 (en) * 2019-08-30 2021-03-04 Sunnen Products Co. Lapping Tool
EP4072782A1 (en) 2019-12-12 2022-10-19 3M Innovative Properties Company Polymer bond abrasive articles including continuous polymer matrix, and methods of making same
CN111558855A (zh) * 2020-06-01 2020-08-21 宏明金属科技(无锡)有限公司 一种高精密机械配套零件抛光的工艺方法
CN111607330A (zh) * 2020-06-03 2020-09-01 大连理工大学 一种剪切增稠抛光液
US20220301892A1 (en) * 2021-03-19 2022-09-22 Changxin Memory Technologies, Inc. Wafer cleaning method and wafer cleaning apparatus
CN115247026A (zh) * 2021-04-26 2022-10-28 福建晶安光电有限公司 一种蓝宝石抛光液及其制备方法
WO2022240842A1 (en) * 2021-05-13 2022-11-17 Araca, Inc. Silicon carbide (sic) wafer polishing with slurry formulation and process
CN113999653B (zh) * 2021-10-28 2022-05-24 华南理工大学 一种硅单晶研磨剂及其制备方法与应用
CN116000782B (zh) * 2022-12-27 2023-09-19 昂士特科技(深圳)有限公司 用于金属合金cmp的化学机械抛光组合物

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JP2023141786A (ja) * 2022-03-24 2023-10-05 株式会社ノリタケカンパニーリミテド 研磨スラリー及び研磨方法
JP7621303B2 (ja) 2022-03-24 2025-01-24 ノリタケ株式会社 研磨スラリー及び研磨方法

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Publication number Publication date
TWI669382B (zh) 2019-08-21
SG11201602206PA (en) 2016-04-28
KR20160060690A (ko) 2016-05-30
US20160221146A1 (en) 2016-08-04
EP3049215A4 (en) 2017-05-17
EP3049215B1 (en) 2021-04-14
CN105517758B (zh) 2020-03-31
US10293458B2 (en) 2019-05-21
KR102289629B1 (ko) 2021-08-17
TW201525119A (zh) 2015-07-01
EP3049215A1 (en) 2016-08-03
WO2015047939A1 (en) 2015-04-02
CN105517758A (zh) 2016-04-20

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