JP2016537439A - セラミック研磨材複合体研磨溶液 - Google Patents
セラミック研磨材複合体研磨溶液 Download PDFInfo
- Publication number
- JP2016537439A JP2016537439A JP2016516917A JP2016516917A JP2016537439A JP 2016537439 A JP2016537439 A JP 2016537439A JP 2016516917 A JP2016516917 A JP 2016516917A JP 2016516917 A JP2016516917 A JP 2016516917A JP 2016537439 A JP2016537439 A JP 2016537439A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- abrasive
- polishing solution
- ceramic
- solution according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
- B24D3/18—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361882369P | 2013-09-25 | 2013-09-25 | |
| US61/882,369 | 2013-09-25 | ||
| PCT/US2014/056750 WO2015047939A1 (en) | 2013-09-25 | 2014-09-22 | Composite ceramic abrasive polishing solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016537439A true JP2016537439A (ja) | 2016-12-01 |
| JP2016537439A5 JP2016537439A5 (OSRAM) | 2017-11-02 |
Family
ID=52744375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016516917A Pending JP2016537439A (ja) | 2013-09-25 | 2014-09-22 | セラミック研磨材複合体研磨溶液 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10293458B2 (OSRAM) |
| EP (1) | EP3049215B1 (OSRAM) |
| JP (1) | JP2016537439A (OSRAM) |
| KR (1) | KR102289629B1 (OSRAM) |
| CN (1) | CN105517758B (OSRAM) |
| SG (1) | SG11201602206PA (OSRAM) |
| TW (1) | TWI669382B (OSRAM) |
| WO (1) | WO2015047939A1 (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019087660A (ja) * | 2017-11-08 | 2019-06-06 | Agc株式会社 | 研磨剤と研磨方法、および研磨用添加液 |
| JP2023141786A (ja) * | 2022-03-24 | 2023-10-05 | 株式会社ノリタケカンパニーリミテド | 研磨スラリー及び研磨方法 |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015048011A1 (en) | 2013-09-25 | 2015-04-02 | 3M Innovative Properties Company | Multi-layered polishing pads |
| US9978609B2 (en) * | 2015-04-27 | 2018-05-22 | Versum Materials Us, Llc | Low dishing copper chemical mechanical planarization |
| WO2016183126A1 (en) | 2015-05-13 | 2016-11-17 | 3M Innovative Properties Company | Polishing pads and systems for and methods of using same |
| JP6669331B2 (ja) * | 2015-05-19 | 2020-03-18 | 昭和電工株式会社 | 研磨組成物、及びその研磨組成物を用いた研磨方法 |
| WO2017142805A1 (en) * | 2016-02-16 | 2017-08-24 | 3M Innovative Properties Company | Polishing systems and methods of making and using same |
| ES2604830B1 (es) | 2016-04-28 | 2017-12-18 | Drylyte, S.L. | Proceso para alisado y pulido de metales por transporte iónico mediante cuerpos sólidos libres, y cuerpos sólidos para llevar a cabo dicho proceso. |
| US10195713B2 (en) | 2016-08-11 | 2019-02-05 | 3M Innovative Properties Company | Lapping pads and systems and methods of making and using the same |
| CA3045480C (en) | 2016-12-23 | 2022-08-30 | Saint-Gobain Abrasives, Inc. | Coated abrasives having a performance enhancing composition |
| US11781039B2 (en) * | 2016-12-26 | 2023-10-10 | Fujimi Incorporated | Polishing composition and polishing method |
| CN111032284B (zh) | 2017-08-04 | 2022-11-04 | 3M创新有限公司 | 具有增强的共平面性的微复制型抛光表面 |
| CN111032285B (zh) | 2017-08-25 | 2022-07-19 | 3M创新有限公司 | 表面突起抛光垫 |
| WO2019043819A1 (ja) * | 2017-08-30 | 2019-03-07 | 日立化成株式会社 | スラリ及び研磨方法 |
| CN109868447B (zh) | 2017-12-01 | 2022-03-25 | 通用电气公司 | 用于降低表面粗糙度的方法 |
| EP3768795A1 (en) | 2018-03-21 | 2021-01-27 | 3M Innovative Properties Company | Structured abrasives containing polishing materials for use in the home |
| CN110499102A (zh) * | 2018-05-20 | 2019-11-26 | 深圳市得益达电子科技有限公司 | 一种用于玻璃抛光的氧化铈液态悬浮抛光液 |
| EP3578998B1 (en) | 2018-06-08 | 2024-09-04 | 3M Innovative Properties Company | Impedance assembly |
| CN110772911B (zh) * | 2018-07-30 | 2021-11-09 | 天津大学 | 一种去除生物气溶胶的微波反应装置、反应系统及其应用 |
| US20210060724A1 (en) * | 2019-08-30 | 2021-03-04 | Sunnen Products Co. | Lapping Tool |
| EP4072782A1 (en) | 2019-12-12 | 2022-10-19 | 3M Innovative Properties Company | Polymer bond abrasive articles including continuous polymer matrix, and methods of making same |
| CN111558855A (zh) * | 2020-06-01 | 2020-08-21 | 宏明金属科技(无锡)有限公司 | 一种高精密机械配套零件抛光的工艺方法 |
| CN111607330A (zh) * | 2020-06-03 | 2020-09-01 | 大连理工大学 | 一种剪切增稠抛光液 |
| US20220301892A1 (en) * | 2021-03-19 | 2022-09-22 | Changxin Memory Technologies, Inc. | Wafer cleaning method and wafer cleaning apparatus |
| CN115247026A (zh) * | 2021-04-26 | 2022-10-28 | 福建晶安光电有限公司 | 一种蓝宝石抛光液及其制备方法 |
| WO2022240842A1 (en) * | 2021-05-13 | 2022-11-17 | Araca, Inc. | Silicon carbide (sic) wafer polishing with slurry formulation and process |
| CN113999653B (zh) * | 2021-10-28 | 2022-05-24 | 华南理工大学 | 一种硅单晶研磨剂及其制备方法与应用 |
| CN116000782B (zh) * | 2022-12-27 | 2023-09-19 | 昂士特科技(深圳)有限公司 | 用于金属合金cmp的化学机械抛光组合物 |
Citations (6)
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| US5855633A (en) * | 1997-06-06 | 1999-01-05 | Lockheed Martin Energy Systems, Inc. | Lapping slurry |
| JP2003504218A (ja) * | 1999-07-09 | 2003-02-04 | スリーエム イノベイティブ プロパティズ カンパニー | 多孔性セラミック研摩複合材料を含むメタルボンド研摩物品およびそれを用いたワークピースの研摩方法 |
| JP2004514017A (ja) * | 2000-11-10 | 2004-05-13 | スリーエム イノベイティブ プロパティズ カンパニー | 凝集砥粒を製造する噴霧乾燥法および研磨剤物品 |
| JP2009161572A (ja) * | 2007-12-28 | 2009-07-23 | Neos Co Ltd | ラップ剤組成物 |
| JP2011040427A (ja) * | 2009-08-06 | 2011-02-24 | Yamaguchi Seiken Kogyo Kk | 研磨剤組成物 |
| JP2013082050A (ja) * | 2011-10-12 | 2013-05-09 | Japan Fine Ceramics Center | 研磨材料、研磨用組成物及び研磨方法 |
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| CN103254799A (zh) * | 2013-05-29 | 2013-08-21 | 陈玉祥 | 一种亲水金刚石悬浮研磨抛光液及其制备方法 |
| WO2015048011A1 (en) * | 2013-09-25 | 2015-04-02 | 3M Innovative Properties Company | Multi-layered polishing pads |
-
2014
- 2014-09-22 SG SG11201602206PA patent/SG11201602206PA/en unknown
- 2014-09-22 EP EP14848408.2A patent/EP3049215B1/en active Active
- 2014-09-22 WO PCT/US2014/056750 patent/WO2015047939A1/en not_active Ceased
- 2014-09-22 US US14/915,651 patent/US10293458B2/en active Active
- 2014-09-22 CN CN201480049117.7A patent/CN105517758B/zh active Active
- 2014-09-22 KR KR1020167010337A patent/KR102289629B1/ko active Active
- 2014-09-22 JP JP2016516917A patent/JP2016537439A/ja active Pending
- 2014-09-24 TW TW103133084A patent/TWI669382B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5855633A (en) * | 1997-06-06 | 1999-01-05 | Lockheed Martin Energy Systems, Inc. | Lapping slurry |
| JP2003504218A (ja) * | 1999-07-09 | 2003-02-04 | スリーエム イノベイティブ プロパティズ カンパニー | 多孔性セラミック研摩複合材料を含むメタルボンド研摩物品およびそれを用いたワークピースの研摩方法 |
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| JP2023141786A (ja) * | 2022-03-24 | 2023-10-05 | 株式会社ノリタケカンパニーリミテド | 研磨スラリー及び研磨方法 |
| JP7621303B2 (ja) | 2022-03-24 | 2025-01-24 | ノリタケ株式会社 | 研磨スラリー及び研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI669382B (zh) | 2019-08-21 |
| SG11201602206PA (en) | 2016-04-28 |
| KR20160060690A (ko) | 2016-05-30 |
| US20160221146A1 (en) | 2016-08-04 |
| EP3049215A4 (en) | 2017-05-17 |
| EP3049215B1 (en) | 2021-04-14 |
| CN105517758B (zh) | 2020-03-31 |
| US10293458B2 (en) | 2019-05-21 |
| KR102289629B1 (ko) | 2021-08-17 |
| TW201525119A (zh) | 2015-07-01 |
| EP3049215A1 (en) | 2016-08-03 |
| WO2015047939A1 (en) | 2015-04-02 |
| CN105517758A (zh) | 2016-04-20 |
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