JP2016535930A5 - - Google Patents
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- Publication number
- JP2016535930A5 JP2016535930A5 JP2016517478A JP2016517478A JP2016535930A5 JP 2016535930 A5 JP2016535930 A5 JP 2016535930A5 JP 2016517478 A JP2016517478 A JP 2016517478A JP 2016517478 A JP2016517478 A JP 2016517478A JP 2016535930 A5 JP2016535930 A5 JP 2016535930A5
- Authority
- JP
- Japan
- Prior art keywords
- ferrite
- semiconductor substrate
- layer
- resist coating
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 40
- 239000004065 semiconductor Substances 0.000 claims 36
- 239000000758 substrate Substances 0.000 claims 34
- 229910000859 α-Fe Inorganic materials 0.000 claims 29
- 239000011248 coating agent Substances 0.000 claims 16
- 238000000576 coating method Methods 0.000 claims 16
- 238000005530 etching Methods 0.000 claims 12
- 238000002161 passivation Methods 0.000 claims 12
- 238000000034 method Methods 0.000 claims 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 9
- 239000010931 gold Substances 0.000 claims 9
- 229910052737 gold Inorganic materials 0.000 claims 9
- 238000000151 deposition Methods 0.000 claims 7
- 239000012790 adhesive layer Substances 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 5
- 238000001459 lithography Methods 0.000 claims 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- 230000005496 eutectics Effects 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- ZEMPKEQAKRGZGQ-AAKVHIHISA-N 2,3-bis[[(z)-12-hydroxyoctadec-9-enoyl]oxy]propyl (z)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCCC(O)C\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CC(O)CCCCCC)COC(=O)CCCCCCC\C=C/CC(O)CCCCCC ZEMPKEQAKRGZGQ-AAKVHIHISA-N 0.000 claims 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- 238000000137 annealing Methods 0.000 claims 1
- 238000005234 chemical deposition Methods 0.000 claims 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 230000010363 phase shift Effects 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13187538 | 2013-10-07 | ||
| EP13187538.7 | 2013-10-07 | ||
| PCT/EP2014/071079 WO2015052059A1 (en) | 2013-10-07 | 2014-10-01 | Precision batch production method for manufacturing ferrite rods |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016535930A JP2016535930A (ja) | 2016-11-17 |
| JP6293875B2 JP6293875B2 (ja) | 2018-04-25 |
| JP2016535930A5 true JP2016535930A5 (OSRAM) | 2018-05-10 |
Family
ID=49303841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016517478A Expired - Fee Related JP6293875B2 (ja) | 2013-10-07 | 2014-10-01 | フェライトロッドを製造するための精密バッチ製造法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9825347B2 (OSRAM) |
| EP (1) | EP3055871A1 (OSRAM) |
| JP (1) | JP6293875B2 (OSRAM) |
| KR (1) | KR20160067940A (OSRAM) |
| CN (1) | CN105814655B (OSRAM) |
| SG (1) | SG11201602499TA (OSRAM) |
| WO (1) | WO2015052059A1 (OSRAM) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3140838B1 (en) | 2014-05-05 | 2021-08-25 | 3D Glass Solutions, Inc. | Inductive device in a photo-definable glass structure |
| KR20200010598A (ko) | 2016-02-25 | 2020-01-30 | 3디 글래스 솔루션즈 인코포레이티드 | 3d 커패시터 및 커패시터 어레이 제작용 광활성 기재 |
| US12165809B2 (en) | 2016-02-25 | 2024-12-10 | 3D Glass Solutions, Inc. | 3D capacitor and capacitor array fabricating photoactive substrates |
| US11161773B2 (en) | 2016-04-08 | 2021-11-02 | 3D Glass Solutions, Inc. | Methods of fabricating photosensitive substrates suitable for optical coupler |
| US9912028B2 (en) * | 2016-04-18 | 2018-03-06 | Eagantu Ltd. | Wide band radio frequency circulator |
| CA3058793C (en) * | 2017-04-28 | 2021-12-28 | 3D Glass Solutions, Inc. | Rf circulator |
| KR102386799B1 (ko) | 2017-07-07 | 2022-04-18 | 3디 글래스 솔루션즈 인코포레이티드 | 패키지 광활성 유리 기판들에서 ｒｆ 시스템을 위한 2ｄ 및 3ｄ 집중 소자 디바이스들 |
| US10854946B2 (en) | 2017-12-15 | 2020-12-01 | 3D Glass Solutions, Inc. | Coupled transmission line resonate RF filter |
| EP3735743A4 (en) | 2018-01-04 | 2021-03-03 | 3D Glass Solutions, Inc. | IMPEDANCE-ADJUSTING CONDUCTIVE STRUCTURE FOR HF CIRCUITS WITH HIGH EFFICIENCY |
| WO2019199470A1 (en) | 2018-04-10 | 2019-10-17 | 3D Glass Solutions, Inc. | Rf integrated power condition capacitor |
| CA3071138C (en) | 2018-05-29 | 2021-05-25 | 3D Glass Solutions, Inc. | Low insertion loss rf transmission line |
| KR102322938B1 (ko) | 2018-09-17 | 2021-11-09 | 3디 글래스 솔루션즈 인코포레이티드 | 접지면을 갖는 고효율 컴팩트형 슬롯 안테나 |
| US11996600B2 (en) | 2018-11-14 | 2024-05-28 | Optisys, Inc. | Hollow metal waveguides having irregular hexagonal cross sections with specified interior angles |
| KR102577948B1 (ko) * | 2018-11-14 | 2023-09-14 | 옵티시스 인코포레이티드 | 불규칙 육각형 단면을 가지는 중공의 금속 도파관 및 이를 제조하는 방법 |
| US11233304B2 (en) | 2018-11-19 | 2022-01-25 | Optisys, LLC | Irregular hexagon cross-sectioned hollow metal waveguide filters |
| US11270843B2 (en) | 2018-12-28 | 2022-03-08 | 3D Glass Solutions, Inc. | Annular capacitor RF, microwave and MM wave systems |
| CA3107810C (en) | 2018-12-28 | 2024-05-14 | 3D Glass Solutions, Inc. | Heterogenous integration for rf, microwave and mm wave systems in photoactive glass substrates |
| US11962057B2 (en) | 2019-04-05 | 2024-04-16 | 3D Glass Solutions, Inc. | Glass based empty substrate integrated waveguide devices |
| KR102473256B1 (ko) | 2019-04-18 | 2022-12-05 | 3디 글래스 솔루션즈 인코포레이티드 | 고효율 다이 다이싱 및 릴리스 |
| US10727216B1 (en) | 2019-05-10 | 2020-07-28 | Sandisk Technologies Llc | Method for removing a bulk substrate from a bonded assembly of wafers |
| CN110202880B (zh) * | 2019-06-03 | 2020-05-22 | 西安交通大学 | 一种柔性微波器件及其制备方法 |
| US11908617B2 (en) | 2020-04-17 | 2024-02-20 | 3D Glass Solutions, Inc. | Broadband induction |
| US11501905B2 (en) * | 2020-08-31 | 2022-11-15 | Boston Applied Technologies, Inc. | Composition and method of making a monolithic heterostructure of multiferroic thin films |
| KR20230088822A (ko) | 2020-10-19 | 2023-06-20 | 옵티시스 인코포레이티드 | 광대역 도파관 - 이중 동축 천이 구조 |
| WO2022094325A1 (en) | 2020-10-29 | 2022-05-05 | Optisys, Inc. | Integrated balanced radiating elements |
| CN112103602B (zh) * | 2020-11-05 | 2021-03-16 | 中国电子科技集团公司第九研究所 | 一种宽带高频法拉第隔离器 |
| CN112909458B (zh) * | 2021-02-08 | 2021-09-10 | 湖南国科雷电子科技有限公司 | 一种w波段e面波导滤波器 |
| WO2022241483A2 (en) | 2021-05-14 | 2022-11-17 | Optisys, Inc. | Planar monolithic combiner and multiplexer for antenna arrays |
| CN116345099A (zh) * | 2023-01-13 | 2023-06-27 | 西南应用磁学研究所(中国电子科技集团公司第九研究所) | 一种硅基腔体环行器/隔离器及其加工方法 |
| CN120824531A (zh) * | 2025-06-27 | 2025-10-21 | 河北美泰电子科技有限公司 | 一种晶圆级异质集成的mems环行器及其制备方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5238163A (en) * | 1975-09-20 | 1977-03-24 | Omron Tateisi Electronics Co | Passive element |
| JPS5246787A (en) * | 1975-10-11 | 1977-04-13 | Hitachi Ltd | Coil for integrated circuit and process for production of same |
| JPH02166801A (ja) * | 1988-12-20 | 1990-06-27 | Mitsubishi Electric Corp | ファラデー旋回子用フェライト |
| JPH02188001A (ja) * | 1989-01-17 | 1990-07-24 | Uniden Corp | 円偏波対直線偏波変換器 |
| JPH06164222A (ja) | 1992-11-25 | 1994-06-10 | Murata Mfg Co Ltd | マイクロ波用磁性体及びその製造方法 |
| US5772820A (en) | 1995-08-07 | 1998-06-30 | Northrop Grumman Corporation | Process for fabricating a microwave power device |
| US5828271A (en) | 1997-03-06 | 1998-10-27 | Northrop Grumman Corporation | Planar ferrite toroid microwave phase shifter |
| US5876539A (en) | 1997-06-17 | 1999-03-02 | Northrop Grumman Corporaiton | Fabrication of ferrite toroids |
| US6060433A (en) | 1998-01-26 | 2000-05-09 | Nz Applied Technologies Corporation | Method of making a microwave device having a polycrystalline ferrite substrate |
| US6171886B1 (en) * | 1998-06-30 | 2001-01-09 | Eastman Kodak Company | Method of making integrated hybrid silicon-based micro-actuator devices |
| US6249039B1 (en) * | 1998-09-10 | 2001-06-19 | Bourns, Inc. | Integrated inductive components and method of fabricating such components |
| US6498549B1 (en) | 1998-12-07 | 2002-12-24 | Corning Applied Technologies Corporation | Dual-tuning microwave devices using ferroelectric/ferrite layers |
| US6600601B1 (en) | 1999-04-12 | 2003-07-29 | Shin-Etsu Chemical Co., Ltd. | Polarization-independent optical isolator and production method thereof |
| US6645677B1 (en) | 2000-09-18 | 2003-11-11 | Micronic Laser Systems Ab | Dual layer reticle blank and manufacturing process |
| US6673181B1 (en) * | 2001-10-29 | 2004-01-06 | Northrop Grumman Corporation | Method of manufacturing ferromagnetic toroids used in ferrite phase shifters |
| JP2003264405A (ja) | 2002-03-08 | 2003-09-19 | Opnext Japan Inc | 高周波伝送線路およびそれを用いた電子部品並びに電子装置 |
| US6952042B2 (en) | 2002-06-17 | 2005-10-04 | Honeywell International, Inc. | Microelectromechanical device with integrated conductive shield |
| US7078983B2 (en) * | 2004-06-09 | 2006-07-18 | Raytheon Company | Low-profile circulator |
| JP2005244084A (ja) * | 2004-02-27 | 2005-09-08 | Mitsubishi Electric Corp | らせん状高周波コイルとその製造方法 |
| EP1746430A1 (en) * | 2005-07-22 | 2007-01-24 | Liaisons Electroniques-Mecaniques Lem S.A. | Orthogonal fluxgate magnetic field sensor |
| US7480435B2 (en) * | 2005-12-30 | 2009-01-20 | Intel Corporation | Embedded waveguide printed circuit board structure |
| TW200905703A (en) * | 2007-07-27 | 2009-02-01 | Delta Electronics Inc | Magnetic device and manufacturing method thereof |
| US20110123783A1 (en) | 2009-11-23 | 2011-05-26 | David Sherrer | Multilayer build processses and devices thereof |
| JP5815353B2 (ja) * | 2011-09-28 | 2015-11-17 | 株式会社フジクラ | コイル配線素子およびコイル配線素子の製造方法 |
| US9293245B2 (en) * | 2013-08-05 | 2016-03-22 | Qualcomm Mems Technologies, Inc. | Integration of a coil and a discontinuous magnetic core |
-
2014
- 2014-10-01 SG SG11201602499TA patent/SG11201602499TA/en unknown
- 2014-10-01 EP EP14780474.4A patent/EP3055871A1/en not_active Withdrawn
- 2014-10-01 JP JP2016517478A patent/JP6293875B2/ja not_active Expired - Fee Related
- 2014-10-01 WO PCT/EP2014/071079 patent/WO2015052059A1/en not_active Ceased
- 2014-10-01 US US15/027,286 patent/US9825347B2/en not_active Expired - Fee Related
- 2014-10-01 KR KR1020167011943A patent/KR20160067940A/ko not_active Ceased
- 2014-10-01 CN CN201480066647.2A patent/CN105814655B/zh not_active Expired - Fee Related
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