JP2016535457A - イオン注入によってドーピングし、外方拡散バリアを堆積することを含む太陽電池の製造方法 - Google Patents
イオン注入によってドーピングし、外方拡散バリアを堆積することを含む太陽電池の製造方法 Download PDFInfo
- Publication number
- JP2016535457A JP2016535457A JP2016541855A JP2016541855A JP2016535457A JP 2016535457 A JP2016535457 A JP 2016535457A JP 2016541855 A JP2016541855 A JP 2016541855A JP 2016541855 A JP2016541855 A JP 2016541855A JP 2016535457 A JP2016535457 A JP 2016535457A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cover layer
- dopant
- solar cell
- doping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009792 diffusion process Methods 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000005468 ion implantation Methods 0.000 title claims abstract description 10
- 230000004888 barrier function Effects 0.000 title claims abstract description 4
- 238000000151 deposition Methods 0.000 title description 6
- 238000000034 method Methods 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000002019 doping agent Substances 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 21
- 229910052698 phosphorus Inorganic materials 0.000 claims description 21
- 239000011574 phosphorus Substances 0.000 claims description 21
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 19
- 229910052796 boron Inorganic materials 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 17
- 238000002161 passivation Methods 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 238000011084 recovery Methods 0.000 claims description 11
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052785 arsenic Inorganic materials 0.000 claims description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 230000007935 neutral effect Effects 0.000 claims 1
- 238000005496 tempering Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 59
- 238000002513 implantation Methods 0.000 description 12
- 238000000137 annealing Methods 0.000 description 7
- 230000004913 activation Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000637 aluminium metallisation Methods 0.000 description 1
- 230000011712 cell development Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- -1 phosphorus Chemical compound 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/028—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic System
- H01L31/0288—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic System characterised by the doping material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1864—Annealing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- High Energy & Nuclear Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Sustainable Energy (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Inorganic Chemistry (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013218351.8 | 2013-09-13 | ||
DE102013218351.8A DE102013218351A1 (de) | 2013-09-13 | 2013-09-13 | Verfahren zur Herstellung einer Solarzelle |
PCT/EP2014/066856 WO2015036181A1 (de) | 2013-09-13 | 2014-08-05 | Verfahren zur herstellung einer solarzelle umfassend eine dotierung durch ionenimplantation und abscheiden einer ausdiffusionsbarriere |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016535457A true JP2016535457A (ja) | 2016-11-10 |
Family
ID=51383707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016541855A Pending JP2016535457A (ja) | 2013-09-13 | 2014-08-05 | イオン注入によってドーピングし、外方拡散バリアを堆積することを含む太陽電池の製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10263135B2 (de) |
EP (1) | EP3044813A1 (de) |
JP (1) | JP2016535457A (de) |
KR (1) | KR20160071373A (de) |
CN (1) | CN106104755A (de) |
DE (1) | DE102013218351A1 (de) |
MY (1) | MY173528A (de) |
WO (1) | WO2015036181A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111640804A (zh) * | 2020-06-01 | 2020-09-08 | 国家电投集团西安太阳能电力有限公司 | 一种氧化硅/氮化硅叠层膜的n-pert双面电池结构 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101680036B1 (ko) * | 2015-07-07 | 2016-12-12 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
WO2017072758A1 (en) | 2015-10-25 | 2017-05-04 | Solaround Ltd. | Method of bifacial cell fabrication |
DE102016125316B4 (de) * | 2016-12-22 | 2021-07-22 | Infineon Technologies Austria Ag | Herstellen von rekombinationszentren in einem halbleiterbauelement |
CN107425086A (zh) * | 2017-05-18 | 2017-12-01 | 阳光中科(福建)能源股份有限公司 | 一种离子注入法制作n型pert双面太阳电池的制备工艺 |
DE102019104249A1 (de) * | 2019-02-20 | 2020-08-20 | Hanwha Q Cells Gmbh | Verfahren zur Herstellung einer PERC-Solarzelle und PERC-Solarzelle |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5363993A (en) * | 1976-11-19 | 1978-06-07 | Matsushita Electric Ind Co Ltd | Production of semiconductor device |
JP2003152205A (ja) * | 2001-11-12 | 2003-05-23 | Sharp Corp | 光電変換素子及びその製造方法 |
JP2005223080A (ja) * | 2004-02-04 | 2005-08-18 | Sharp Corp | 太陽電池の製造方法 |
WO2005076960A2 (en) * | 2004-02-05 | 2005-08-25 | Advent Solar, Inc. | Back-contact solar cells and methods for fabrication |
JP2006066765A (ja) * | 2004-08-30 | 2006-03-09 | Sharp Corp | 多接合型化合物太陽電池およびその製造方法 |
JP2006310389A (ja) * | 2005-04-26 | 2006-11-09 | Sharp Corp | 太陽電池の製造方法 |
JP2012199517A (ja) * | 2011-02-03 | 2012-10-18 | Imec | 太陽電池の製造方法 |
US20130171767A1 (en) * | 2009-05-05 | 2013-07-04 | Solexel, Inc. | Ion implantation and annealing for high efficiency back-contact back-junction solar cells |
JP2013165160A (ja) * | 2012-02-10 | 2013-08-22 | Shin Etsu Chem Co Ltd | 太陽電池の製造方法及び太陽電池 |
US20130224938A1 (en) * | 2012-02-24 | 2013-08-29 | Varian Semiconductor Equipment Associates, Inc. | Passivation layer for workpieces formed from a polymer |
US20140261666A1 (en) * | 2013-03-13 | 2014-09-18 | Applied Materials, Inc. | Methods of manufacturing a low cost solar cell device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3340874A1 (de) | 1983-11-11 | 1985-05-23 | Telefunken electronic GmbH, 7100 Heilbronn | Verfahren zum herstellen einer solarzelle |
JP2004193350A (ja) * | 2002-12-11 | 2004-07-08 | Sharp Corp | 太陽電池セルおよびその製造方法 |
US20050172996A1 (en) * | 2004-02-05 | 2005-08-11 | Advent Solar, Inc. | Contact fabrication of emitter wrap-through back contact silicon solar cells |
US20060060238A1 (en) * | 2004-02-05 | 2006-03-23 | Advent Solar, Inc. | Process and fabrication methods for emitter wrap through back contact solar cells |
DE102010003784A1 (de) * | 2010-04-09 | 2011-10-13 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Solarzelle |
EP2805334A4 (de) | 2012-01-16 | 2015-10-28 | Heraeus Precious Metals North America Conshohocken Llc | Aluminiumleitpaste für rückseitenoberflächenpassivierte zellen mit lokal geöffneten durchkontaktierungen |
KR101872786B1 (ko) * | 2012-06-22 | 2018-06-29 | 엘지전자 주식회사 | 태양 전지의 불순물층 형성 방법 및 태양 전지의 제조 방법 |
CN102856436A (zh) * | 2012-09-05 | 2013-01-02 | 友达光电股份有限公司 | 太阳能电池及其制作方法 |
DE102012217078B4 (de) * | 2012-09-21 | 2015-03-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Herstellen einer photovoltaischen Solarzelle |
US9515217B2 (en) * | 2012-11-05 | 2016-12-06 | Solexel, Inc. | Monolithically isled back contact back junction solar cells |
-
2013
- 2013-09-13 DE DE102013218351.8A patent/DE102013218351A1/de not_active Withdrawn
-
2014
- 2014-08-05 US US15/021,077 patent/US10263135B2/en active Active
- 2014-08-05 JP JP2016541855A patent/JP2016535457A/ja active Pending
- 2014-08-05 KR KR1020167008592A patent/KR20160071373A/ko not_active Application Discontinuation
- 2014-08-05 CN CN201480058077.2A patent/CN106104755A/zh active Pending
- 2014-08-05 WO PCT/EP2014/066856 patent/WO2015036181A1/de active Application Filing
- 2014-08-05 EP EP14753037.2A patent/EP3044813A1/de not_active Withdrawn
- 2014-08-05 MY MYPI2016700869A patent/MY173528A/en unknown
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5363993A (en) * | 1976-11-19 | 1978-06-07 | Matsushita Electric Ind Co Ltd | Production of semiconductor device |
JP2003152205A (ja) * | 2001-11-12 | 2003-05-23 | Sharp Corp | 光電変換素子及びその製造方法 |
JP2005223080A (ja) * | 2004-02-04 | 2005-08-18 | Sharp Corp | 太陽電池の製造方法 |
WO2005076960A2 (en) * | 2004-02-05 | 2005-08-25 | Advent Solar, Inc. | Back-contact solar cells and methods for fabrication |
JP2006066765A (ja) * | 2004-08-30 | 2006-03-09 | Sharp Corp | 多接合型化合物太陽電池およびその製造方法 |
JP2006310389A (ja) * | 2005-04-26 | 2006-11-09 | Sharp Corp | 太陽電池の製造方法 |
US20130171767A1 (en) * | 2009-05-05 | 2013-07-04 | Solexel, Inc. | Ion implantation and annealing for high efficiency back-contact back-junction solar cells |
JP2012199517A (ja) * | 2011-02-03 | 2012-10-18 | Imec | 太陽電池の製造方法 |
JP2013165160A (ja) * | 2012-02-10 | 2013-08-22 | Shin Etsu Chem Co Ltd | 太陽電池の製造方法及び太陽電池 |
US20130224938A1 (en) * | 2012-02-24 | 2013-08-29 | Varian Semiconductor Equipment Associates, Inc. | Passivation layer for workpieces formed from a polymer |
US20140261666A1 (en) * | 2013-03-13 | 2014-09-18 | Applied Materials, Inc. | Methods of manufacturing a low cost solar cell device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111640804A (zh) * | 2020-06-01 | 2020-09-08 | 国家电投集团西安太阳能电力有限公司 | 一种氧化硅/氮化硅叠层膜的n-pert双面电池结构 |
Also Published As
Publication number | Publication date |
---|---|
MY173528A (en) | 2020-01-31 |
DE102013218351A1 (de) | 2015-03-19 |
CN106104755A (zh) | 2016-11-09 |
KR20160071373A (ko) | 2016-06-21 |
WO2015036181A1 (de) | 2015-03-19 |
US20160233372A1 (en) | 2016-08-11 |
EP3044813A1 (de) | 2016-07-20 |
US10263135B2 (en) | 2019-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2016535457A (ja) | イオン注入によってドーピングし、外方拡散バリアを堆積することを含む太陽電池の製造方法 | |
US20200279970A1 (en) | Method of Manufacturing a Passivated Solar Cell and Resulting Passivated Solar Cell | |
US8664015B2 (en) | Method of manufacturing photoelectric device | |
CN110838536A (zh) | 具有多种隧道结结构的背接触太阳能电池及其制备方法 | |
JP6392385B2 (ja) | 太陽電池の製造方法 | |
TW201007956A (en) | Nitrided barrier layers for solar cells | |
CN111354838B (zh) | 太阳能电池及其制备方法、n型掺杂硅膜的处理方法 | |
CN111244230B (zh) | 一种钝化金属接触的背结太阳能电池的制备方法 | |
US20130344647A1 (en) | Method for manufacturing solar cell and dopant layer thereof | |
CN112542521A (zh) | 一种p型背面定域掺杂电池及制备方法 | |
Tao et al. | 730 mV implied Voc enabled by tunnel oxide passivated contact with PECVD grown and crystallized n+ polycrystalline Si | |
WO2019021545A1 (ja) | 太陽電池、及び、その製造方法 | |
KR20130129929A (ko) | Lid 현상을 감쇠시키는 태양전지의 제조 방법 | |
CN113851555A (zh) | 一种N型TOPCon太阳能电池及其制作方法 | |
US20100210060A1 (en) | Double anneal process for an improved rapid thermal oxide passivated solar cell | |
JP5830147B1 (ja) | 太陽電池及び太陽電池の製造方法 | |
CN111509054A (zh) | 一种topcon钝化结构及其制备方法 | |
CN114256385A (zh) | 一种tbc背接触太阳能电池及其制备方法 | |
KR20160061409A (ko) | 태양 전지를 생성하는 방법 | |
CN114597267B (zh) | 一种TOPCon电池及其制备方法 | |
NL2021449B1 (en) | A method of manufacturing a passivated solar cell and resulting passivated solar cell | |
US10923618B2 (en) | Method for manufacturing a photovoltaic device | |
JP2004327675A (ja) | 半導体デバイスおよびその製造方法 | |
JP2004128438A (ja) | 半導体デバイスおよびその製造方法 | |
CN216563157U (zh) | 太阳能电池背面结构及tbc背接触太阳能电池 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170620 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180327 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180621 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180710 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20181002 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20181130 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190110 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190620 |