JP2016534394A - フレキシブル基板をガラス基板から分離する装置及び生産設備 - Google Patents
フレキシブル基板をガラス基板から分離する装置及び生産設備 Download PDFInfo
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Abstract
Description
S1:フレキシブル基板の一端を窪み領域が設けられた円柱体形状のローラ上に固定し、
S2:制御ユニットが、ローラを回転させることでフレキシブル基板を引き上げ、フレキシブル基板とガラス基板との分離を実現する。
12 接触界面
13 フレキシブル基板
14 駆動チップ
15 ローラ
16 窪み領域
Claims (9)
- 円柱体形状のローラと、
該ローラに接続され、フレキシブル基板がガラス基板から分離されるように該ローラの回転を制御する制御ユニットと、を備え、
前記ローラの柱面に、前記ローラが回転するときに、フレキシブル基板上の駆動チップを嵌め込ませる窪み領域が設けられることを特徴とするフレキシブル基板をガラス基板から分離する装置。 - 前記ローラ上に、1つ又は複数の前記窪み領域が設けられることを特徴とする請求項1に記載のフレキシブル基板をガラス基板から分離する装置。
- 前記フレキシブル基板上に複数の駆動チップが設けられる場合、前記ローラ上に、駆動チップ毎に対応する窪み領域がそれぞれ設けられることを特徴とする請求項1又は2に記載のフレキシブル基板をガラス基板から分離する装置。
- 前記窪み領域のサイズは、対応する駆動チップのサイズにマッチングすることを特徴とする請求項1〜3のいずれか1項に記載のフレキシブル基板をガラス基板から分離する装置。
- 前記窪み領域のサイズは駆動チップのサイズより大きいことを特徴とする請求項1〜4のいずれか1項に記載のフレキシブル基板をガラス基板から分離する装置。
- 前記フレキシブル基板上に複数の駆動チップが設けられ、且複数の駆動チップが同一行に位置する場合、前記ローラ上に、該行の位置に対応する1つの窪み領域が設けられることを特徴とする請求項1に記載のフレキシブル基板をガラス基板から分離する装置。
- 前記窪み領域は、長方体形状であり、幅が約2mmであり、深さが約2mmであり、長さが同一行における複数の駆動チップの長さより小さくないことを特徴とする請求項6に記載のフレキシブル基板をガラス基板から分離する装置。
- 前記ローラは、第1段、第2段及び窪み領域が設けられる第3段を備え、前記第3段は、第1段と第2段との間に移動可能に接続され、円柱体の軸線の周りを回転し、ローラがフレキシブル基板をガラス基板から分離するように回転する場合、前記第3段を回転することでフレキシブル基板上の駆動チップを前記窪み領域内に嵌め込ませることを特徴とする請求項1〜7のいずれか1項に記載のフレキシブル基板をガラス基板から分離する装置。
- 請求項1から8のいずれか1項に記載の装置を備えることを特徴とするフレキシブル基板の生産設備。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310351487.3A CN103456689B (zh) | 2013-08-13 | 2013-08-13 | 用于将柔性基板与玻璃基板分离的装置及生产设备 |
CN201310351487.3 | 2013-08-13 | ||
PCT/CN2013/089470 WO2015021713A1 (zh) | 2013-08-13 | 2013-12-16 | 用于将柔性基板与玻璃基板分离的装置及生产设备 |
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JP2016534394A true JP2016534394A (ja) | 2016-11-04 |
JP6437547B2 JP6437547B2 (ja) | 2018-12-12 |
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JP2016533779A Expired - Fee Related JP6437547B2 (ja) | 2013-08-13 | 2013-12-16 | フレキシブル基板をガラス基板から分離する装置及び生産設備 |
Country Status (6)
Country | Link |
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US (2) | US9508585B2 (ja) |
EP (1) | EP3035380B1 (ja) |
JP (1) | JP6437547B2 (ja) |
KR (1) | KR101749795B1 (ja) |
CN (1) | CN103456689B (ja) |
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CN103753944B (zh) * | 2014-01-15 | 2015-10-14 | 京东方科技集团股份有限公司 | 一种对柔性显示膜进行剥离的方法和装置 |
CN106373917A (zh) * | 2015-07-20 | 2017-02-01 | Tcl集团股份有限公司 | 柔性显示屏的制造方法和柔性显示屏的制造设备 |
KR102526609B1 (ko) * | 2015-07-30 | 2023-04-28 | 엘지디스플레이 주식회사 | 두루마리형 연성표시장치 |
KR102427742B1 (ko) | 2016-04-29 | 2022-08-01 | 엘지디스플레이 주식회사 | 롤러블 연성표시장치 |
CN106356692B (zh) * | 2016-10-28 | 2018-10-16 | 清华大学深圳研究生院 | 一种加工超导导线接头连接体的设备和方法 |
KR102152734B1 (ko) * | 2016-11-17 | 2020-09-08 | 삼성디스플레이 주식회사 | 라미네이트 장치 및 표시 장치의 제조 방법 |
KR102350632B1 (ko) | 2020-10-22 | 2022-01-14 | 주식회사 원광에스앤티 | 태양광 패널 처리 장치 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001318358A (ja) * | 2000-05-12 | 2001-11-16 | Sanyo Electric Co Ltd | 液晶表示基板の製造装置及び製造方法 |
JP2001328039A (ja) * | 2001-03-22 | 2001-11-27 | Sharp Corp | 基板剥離装置 |
JP2002014361A (ja) * | 2000-06-30 | 2002-01-18 | Minolta Co Ltd | 液晶表示パネルの製造方法及び装置 |
JP2004037859A (ja) * | 2002-07-03 | 2004-02-05 | Sony Corp | 表示装置 |
JP2004260146A (ja) * | 2003-02-04 | 2004-09-16 | Toray Ind Inc | 回路基板の製造方法および製造装置 |
US20060131260A1 (en) * | 2003-01-23 | 2006-06-22 | Futoshi Okuyama | Member for circuit board, method and manufacturing circuit board, apparatus for manufacturing circuit board |
JP2008109123A (ja) * | 2006-09-29 | 2008-05-08 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JP2008107373A (ja) * | 2006-10-23 | 2008-05-08 | Sharp Corp | フィルム剥離装置およびフィルム剥離方法 |
US20080132033A1 (en) * | 2006-09-29 | 2008-06-05 | Shingo Eguchi | Method for manufacturing semiconductor device |
JP2009288423A (ja) * | 2008-05-28 | 2009-12-10 | Sowa:Kk | フィルムの貼付ユニット |
US20100277448A1 (en) * | 2009-05-02 | 2010-11-04 | Satohiro Okamoto | Display Device |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4165251A (en) * | 1976-11-22 | 1979-08-21 | Fuji Photo Film Co., Ltd. | Stripping and developing device |
JPH06171823A (ja) * | 1992-12-09 | 1994-06-21 | Canon Inc | ドライフィルムレジスト用保護フィルム除去装置 |
JPH0853264A (ja) * | 1994-08-10 | 1996-02-27 | Seiko Epson Corp | 剥離紙付き粘着テープの剥離紙分離構造 |
JP3100517B2 (ja) * | 1994-11-21 | 2000-10-16 | シャープ株式会社 | 給紙装置 |
US5762330A (en) * | 1996-10-31 | 1998-06-09 | Eastman Kodak Company | Sheet feed apparatus with improved sheet separation and friction feed assist |
DE19702304C2 (de) * | 1997-01-23 | 2000-05-18 | Eastman Kodak Co | Vorrichtung zur Abnahme von flächigen Gegenständen von einem Stapel |
US5891297A (en) * | 1997-10-29 | 1999-04-06 | Sharp Microelectronics Technology, Inc. | System and method for peeling a polarized film |
JP3619058B2 (ja) * | 1998-06-18 | 2005-02-09 | キヤノン株式会社 | 半導体薄膜の製造方法 |
CN100579333C (zh) * | 2003-01-23 | 2010-01-06 | 东丽株式会社 | 电路基板用部件、电路基板的制造方法及电路基板的制造装置 |
WO2005070573A1 (ja) * | 2004-01-21 | 2005-08-04 | Matsushita Electric Industrial Co., Ltd. | ディスプレイパネルのフィルム剥離方法及びフィルム剥離装置 |
TWI336603B (en) * | 2004-12-03 | 2011-01-21 | Ngk Spark Plug Co | Method and apparatus for producing a wiring board, including film-peeling |
KR20080089730A (ko) * | 2007-04-02 | 2008-10-08 | 삼성전자주식회사 | 편광판의 제거 장치 및 그 방법 |
JP2008297095A (ja) * | 2007-06-01 | 2008-12-11 | Toshiba Corp | 紙葉類取り出し装置 |
JP5201490B2 (ja) * | 2008-12-24 | 2013-06-05 | 富士電機株式会社 | 可撓性基板の処理装置および薄膜積層体の製造装置 |
CN103299448B (zh) | 2010-09-29 | 2016-09-07 | Posco公司 | 使用辊形状母基板的柔性电子器件的制造方法、柔性电子器件及柔性基板 |
KR101852190B1 (ko) * | 2011-06-28 | 2018-04-25 | 엘지디스플레이 주식회사 | 플렉서블 표시장치의 제조방법 |
KR101839453B1 (ko) | 2011-08-02 | 2018-03-16 | 엘지디스플레이 주식회사 | 플렉시블 디스플레이 장치의 제조 장비 및 제조 방법 |
CN102790002B (zh) * | 2012-07-27 | 2015-02-11 | 京东方科技集团股份有限公司 | 柔性基板处理装置 |
-
2013
- 2013-08-13 CN CN201310351487.3A patent/CN103456689B/zh not_active Expired - Fee Related
- 2013-12-16 WO PCT/CN2013/089470 patent/WO2015021713A1/zh active Application Filing
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- 2013-12-16 EP EP13848120.5A patent/EP3035380B1/en active Active
- 2013-12-16 KR KR1020147012863A patent/KR101749795B1/ko active IP Right Grant
- 2013-12-16 US US14/355,072 patent/US9508585B2/en active Active
-
2016
- 2016-08-16 US US15/238,363 patent/US20160358806A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001318358A (ja) * | 2000-05-12 | 2001-11-16 | Sanyo Electric Co Ltd | 液晶表示基板の製造装置及び製造方法 |
JP2002014361A (ja) * | 2000-06-30 | 2002-01-18 | Minolta Co Ltd | 液晶表示パネルの製造方法及び装置 |
JP2001328039A (ja) * | 2001-03-22 | 2001-11-27 | Sharp Corp | 基板剥離装置 |
JP2004037859A (ja) * | 2002-07-03 | 2004-02-05 | Sony Corp | 表示装置 |
US20060131260A1 (en) * | 2003-01-23 | 2006-06-22 | Futoshi Okuyama | Member for circuit board, method and manufacturing circuit board, apparatus for manufacturing circuit board |
JP2004260146A (ja) * | 2003-02-04 | 2004-09-16 | Toray Ind Inc | 回路基板の製造方法および製造装置 |
JP2008109123A (ja) * | 2006-09-29 | 2008-05-08 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
US20080132033A1 (en) * | 2006-09-29 | 2008-06-05 | Shingo Eguchi | Method for manufacturing semiconductor device |
JP2008107373A (ja) * | 2006-10-23 | 2008-05-08 | Sharp Corp | フィルム剥離装置およびフィルム剥離方法 |
JP2009288423A (ja) * | 2008-05-28 | 2009-12-10 | Sowa:Kk | フィルムの貼付ユニット |
US20100277448A1 (en) * | 2009-05-02 | 2010-11-04 | Satohiro Okamoto | Display Device |
JP2010282183A (ja) * | 2009-05-02 | 2010-12-16 | Semiconductor Energy Lab Co Ltd | 表示装置 |
Also Published As
Publication number | Publication date |
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WO2015021713A1 (zh) | 2015-02-19 |
CN103456689B (zh) | 2015-02-25 |
EP3035380B1 (en) | 2021-06-30 |
CN103456689A (zh) | 2013-12-18 |
JP6437547B2 (ja) | 2018-12-12 |
KR101749795B1 (ko) | 2017-06-21 |
US9508585B2 (en) | 2016-11-29 |
KR20150029605A (ko) | 2015-03-18 |
US20160358806A1 (en) | 2016-12-08 |
EP3035380A1 (en) | 2016-06-22 |
US20160118286A1 (en) | 2016-04-28 |
EP3035380A4 (en) | 2017-04-05 |
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