WO2015021713A1 - 用于将柔性基板与玻璃基板分离的装置及生产设备 - Google Patents

用于将柔性基板与玻璃基板分离的装置及生产设备 Download PDF

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Publication number
WO2015021713A1
WO2015021713A1 PCT/CN2013/089470 CN2013089470W WO2015021713A1 WO 2015021713 A1 WO2015021713 A1 WO 2015021713A1 CN 2013089470 W CN2013089470 W CN 2013089470W WO 2015021713 A1 WO2015021713 A1 WO 2015021713A1
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WO
WIPO (PCT)
Prior art keywords
roller
flexible substrate
section
driving
recessed area
Prior art date
Application number
PCT/CN2013/089470
Other languages
English (en)
French (fr)
Inventor
毛雪
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to KR1020147012863A priority Critical patent/KR101749795B1/ko
Priority to US14/355,072 priority patent/US9508585B2/en
Priority to JP2016533779A priority patent/JP6437547B2/ja
Priority to EP13848120.5A priority patent/EP3035380B1/en
Publication of WO2015021713A1 publication Critical patent/WO2015021713A1/zh
Priority to US15/238,363 priority patent/US20160358806A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133325—Assembling processes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/68395—Separation by peeling using peeling wheel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1174—Using roller for delamination [e.g., roller pairs operating at differing speeds or directions, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means

Definitions

  • Embodiments of the present invention relate to an apparatus for separating a flexible substrate from a glass substrate, and a production apparatus of the flexible substrate. Background technique
  • a flexible substrate for example, a plastic material
  • the flexible substrate is formed by first fixing the flexible substrate on the glass substrate, and then separating the flexible substrate from the glass substrate after the display assembly is completed and the display panel is formed.
  • Embodiments of the present invention provide an apparatus for separating a flexible substrate from a glass substrate, and a manufacturing apparatus of the flexible substrate, which is configured to prevent a driving wafer on the flexible substrate from being separated during the separation process between the flexible substrate and the glass substrate
  • the roller is squeezed to avoid damage to the flexible substrate during the separation process.
  • An apparatus for separating a flexible substrate from a glass substrate comprising: a cylindrically shaped roller; and a roller connected to the roller for controlling the rotation of the roller to drive the flexible substrate to be separated from the glass substrate by the roller
  • the control unit wherein a recessed area is disposed on the cylindrical surface of the roller, and is configured to embed the driving wafer on the flexible substrate into the recessed area during the rotation of the roller.
  • the roller is provided with one or more recessed regions such that when the roller is rotated to drive the wafer portion, the drive wafer is embedded in the recessed region without being pinched by the roller.
  • corresponding recessed regions are respectively disposed on the rollers for each of the driving wafers.
  • the size of the recessed area matches the size of the corresponding drive wafer.
  • the recessed area is larger in size than the drive wafer.
  • the roller when a plurality of driving wafers are disposed on the flexible substrate, and the plurality of driving wafers are located in the same row, the roller is provided with a recessed area corresponding to the row position, and the recessed area is configured to be The roller is prevented from coming into contact with a plurality of drive wafers located in the row during rotation of the roller.
  • the roller is provided with a recessed area corresponding to the row position, the recessed area is in the shape of a rectangular parallelepiped having a width of about 2 mm and a depth of about 2 mm, and the length of the recessed wafer is not less than a plurality of driving wafers of the same row. Length.
  • the roller includes a first segment, a second segment, and a third segment disposed with a recessed region; the third segment is movably coupled between the first segment and the second segment and is rotatable about the cylinder The axis rotates; during the rotation of the roller to separate the flexible substrate from the glass substrate, the driving wafer on the flexible substrate is embedded in the recessed region by rotating the third segment.
  • a production apparatus for a flexible substrate according to an embodiment of the present invention includes any of the above devices.
  • FIG. 1 is a schematic view of a device for separating a flexible substrate from a glass substrate in the prior art
  • FIG. 2 is a side view of a device structure for separating a flexible substrate from a glass substrate according to an embodiment of the present invention
  • FIG. 3 is a top plan view showing a structure for separating a flexible substrate from a glass substrate according to an embodiment of the present invention
  • FIG. 4 is a perspective view of a roller structure according to an embodiment of the present invention.
  • FIG. 5 is a schematic flow chart of a method for separating a flexible substrate from a glass substrate according to an embodiment of the present invention. detailed description
  • Embodiments of the present invention provide an apparatus for separating a flexible substrate from a glass substrate, and a manufacturing apparatus of the flexible substrate, which is configured to prevent a driving wafer on the flexible substrate from being separated during the separation process between the flexible substrate and the glass substrate
  • the roller is squeezed to avoid damage to the flexible substrate during the separation process.
  • an embodiment of the present invention provides an apparatus for separating a flexible substrate from a glass substrate, the apparatus comprising: a cylindrically shaped roller 15, and a roller connected to the roller for controlling the rotation of the roller to pass the roller A control unit (not shown) that drives the flexible substrate away from the glass substrate, the device further comprising a recessed region 16 provided on the cylindrical surface of the roller 15.
  • the recessed region 16 is configured to embed the drive wafer 14 on the flexible substrate 13 into the recessed region 16 during rotation of the roller 15 to prevent the roller 15 from contacting the raised component such as the drive wafer 14 on the flexible substrate 13.
  • a control unit (not shown) is provided in connection with the roller 15 for driving the roller 15 to rotate to separate the flexible substrate 13 from the glass substrate 11 by the roller 15.
  • the control unit can be a device such as a motor.
  • the recessed area 16 is configured to prevent the roller 15 from coming into contact with the drive wafer 14 on the flexible substrate 13 during the rotation of the roller 15.
  • one or more recessed regions 16 are provided on the roller 15.
  • the size of the recessed region 16 is larger than the size of the drive wafer 14.
  • the roller 15 when a plurality of driving wafers 14 are disposed on the flexible substrate 13, and the plurality of driving wafers 14 are located in the same row, the roller 15 is provided with a recessed region 16 corresponding to the row position, the recessed region 16 is used to prevent the roller 15 from coming into contact with the plurality of drive wafers 14 located in the row during rotation of the roller 15.
  • a recessed area is provided on the roller, which avoids the trouble that the roller is provided with a plurality of recessed regions for each of the driving wafers, and the manufacturing process is completed.
  • the recessed portion 16 provided on the roller 15 has a rectangular parallelepiped shape having a width of 2 mm and a depth of 2 mm, and the length thereof is not less than the length of the plurality of driving wafers 14 of the same row.
  • the cylinder of the roller 15 comprises a first section 1, a second section 2 and a third section 3 provided with a recessed area 16.
  • the third segment 3 is movably coupled between the first segment 1 and the second segment 2 and is rotatable about the axis 5 of the cylinder. Since the positions of the driving wafers 14 disposed on the flexible substrates 13 of different sizes are different, the driving chips on the flexible substrate 13 are rotated by rotating the third segments 3 during the rotation of the rollers 15 to separate the flexible substrate 13 from the glass substrate 11. 14 is embedded in the recessed area 16, so that the separating apparatus provided by the embodiment of the present invention can be applied to the flexible substrate 13 of different sizes.
  • the first section 1 and the second section 2 of the cylindrical roller 15 for fixing the third section 3 can be fixed by inserting the top wire 4 from the side of the first section 1 and the second section 2. It should be noted that the roller structure is only one of the achievable modes, and the present invention is not limited to this structure.
  • a production apparatus for a flexible substrate comprising the above device.
  • the weak contact interface 12 shown in Fig. 2 is a contact interface between the flexible substrate 13 and the glass substrate 11.
  • a method for separating a flexible substrate from a glass substrate is as follows:
  • the control unit rotates the roller to bring up the flexible substrate to realize separation of the flexible substrate from the glass substrate.
  • the control unit cooperates to control the rotation of the roller to drive the flexible substrate and the glass through the roller
  • the substrate is separated, and the control unit can be a device such as a motor.
  • the drive wafer When the roller is rotated to the portion of the drive wafer disposed on the flexible substrate, the drive wafer is embedded in the recessed portion provided in the roller so that the drive wafer is not pressed by the roller, and damage caused by the flexible substrate during the separation process is avoided.
  • the roller includes a first segment, a second segment, and a third segment disposed with a recessed region; the third segment is coupled between the first segment and the second segment and rotatable about an axis of the cylinder. Since the position of the driving wafer disposed on the flexible substrate of different sizes is different, in the process of separating the flexible substrate from the glass substrate by the rotation of the roller, the driving wafer on the flexible substrate is embedded in the recessed region by rotating the third segment, so that the present invention is implemented
  • the separation device provided by the example can be applied to flexible substrates of different sizes.
  • the driving wafers on the flexible substrates of different sizes are different, by rotating the third segment, the driving wafers on the flexible substrate can be embedded in the recessed regions, so that the separating device can be applied to different sizes, and the driving wafers are disposed at different positions.
  • Flexible substrate
  • the first section and the second section of the cylindrical roller for fixing the third section can be fixed by inserting the top wire from the side of the first section and the second section. It should be noted that the roller structure is only one of the achievable modes, and the present invention is not limited to this structure.
  • one or more recessed areas are provided on the roller. This prevents the roller from coming into contact with the driving wafer on the flexible substrate and damaging the protruding member such as the driving wafer.
  • corresponding recessed regions are respectively disposed on the rollers for each of the driving wafers.
  • the roller is rotated to the driving wafer portion, the plurality of driving wafers are respectively embedded in the respective depressed regions without being pressed by the rollers, thereby avoiding damage of the flexible substrate during the separation process.
  • the size of the recessed regions matches the size of the corresponding drive wafer.
  • the size of the depressed region corresponds exactly to the size of the drive wafer, and when the roller is rotated to the position of the drive wafer, the drive wafer is embedded in the recessed region.
  • the size of the recessed area is larger than the size of the drive wafer.
  • the roller when a plurality of driving wafers are disposed on the flexible substrate, and the plurality of driving wafers are located in the same row, the roller is provided with a recessed area corresponding to the row position, the recessed area being configured to be avoided during the rotation of the roller The roller is in contact with a plurality of drive wafers located in the row.
  • the recessed area provided on the roller has a rectangular parallelepiped shape having a width of about 2 mm and a depth of about 2 mm, and the length thereof is not less than the length setting of the plurality of driving wafers of the same row.
  • the size of the recessed regions is just the size of the plurality of drive wafers that should be lined, and when the rollers are rotated to the drive wafer portion, a plurality of drive wafers of the same row are embedded in the recessed regions.
  • Embodiments of the present invention provide flexibility by embedding a drive wafer on a flexible substrate into the recessed region during rotation of the roller to avoid contact between the roller and the drive wafer on the flexible substrate.
  • the driving wafer on the flexible substrate during the separation process between the substrate and the glass substrate is not pressed by the roller, thereby avoiding damage of the flexible substrate during the separation process.

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Abstract

一种用于将柔性基板（13）与玻璃基板（11）分离的装置包括：圆柱体形状的辊子（15），以及与辊子（15）相连的用于控制辊子（15）转动从而通过辊子（15）带动柔性基板（13）与玻璃基板（11）分离的控制单元，辊子（15）的柱面上设置有凹陷区域（16），用于在辊子（15）转动过程中，使柔性基板（13）上的驱动晶片（14）嵌入凹陷区域（16）内，避免驱动晶片（14）被损坏。

Description

用于将柔性基板与玻璃基板分离的装置及生产设备
技术领域
本发明的实施例涉及一种用于将柔性基板与玻璃基板分离的装置， 以及 一种柔性基板的生产设备。 背景技术
柔性基板（例如塑料材料），由于其柔韧性，在制造工序过程中容易变化， 因此， 很难精确进行制造工序。 一般来说， 柔性基板的制作方式是先将柔性 基板固定在玻璃基板上， 待显示组件制造完成并形成显示面板之后， 再将柔 性基板从玻璃基板上分离。
如图 1所示， 在柔性基板与玻璃基板分离时， 通常可采用机械剥离方式： 将柔性基板 13一端固定在具有一定曲率半径的辊子 15上， 转动辊子 15将柔 性基板 13带起， 以实现与玻璃基板 11的分离。 在分离过程中， 由于柔性基 板 13上的驱动晶片 （Driver IC ) 14的部位突起， 辊子 15挤压时容易由于柔 性基板 13所受应力过大造成该器件等的损坏。 发明内容
本发明实施例提供了一种用于将柔性基板与玻璃基板分离的装置， 以及 一种柔性基板的生产设备， 用以实现在柔性基板与玻璃基板分离过程中柔性 基板上的驱动晶片不会受到辊子挤压， 避免了柔性基板在分离过程中造成损 坏。
本发明实施例提供的一种用于将柔性基板与玻璃基板分离的装置， 包括： 圓柱体形状的辊子； 以及与该辊子相连的用于控制该辊子转动从而通过辊子 带动柔性基板与玻璃基板分离的控制单元； 其中在所述辊子的柱面上设置有 凹陷区域， 配置来在辊子转动过程中， 使柔性基板上的驱动晶片嵌入所述凹 陷区域内。
在一个示例中， 该辊子上设置有一个或多个凹陷区域， 这样， 当该辊子 转动到驱动晶片部位时， 驱动晶片嵌入到所述的凹陷区域中， 不会受到该辊 子的挤压。 在一个示例中， 当所述柔性基板上设置有多个驱动晶片时， 对应每一驱 动晶片， 在该辊子上分别设置有相应的凹陷区域。
在一个示例中， 该凹陷区域的尺寸与对应驱动晶片的尺寸相匹配。
在一个示例中， 该凹陷区域的尺寸比驱动晶片的尺寸大。
在一个示例中， 当该柔性基板上设置有多个驱动晶片， 并且所述多个驱 动晶片位于同一行时， 该辊子上设置有与该行位置对应的一个凹陷区域， 该 凹陷区域配置来在该辊子转动过程中避免该辊子与位于该行的多个驱动晶片 相接触。
在一个示例中， 该辊子上设置有与该行位置对应的一个凹陷区域， 该凹 陷区域为长方体形状， 其宽度为约 2mm、 深度为约 2mm, 其长度不小于同 一行的多个驱动晶片所占长度。
在一个示例中，该辊子包括第一段、第二段和设置有凹陷区域的第三段； 该第三段活动连接于该第一段和该第二段之间， 且可绕圓柱体的轴线旋转； 在该辊子转动带动柔性基板与玻璃基板分离的过程中， 通过旋转该第三段， 使该柔性基板上的驱动晶片嵌入所述凹陷区域内。
本发明实施例提供的一种柔性基板的生产设备， 包括上述任一装置。 附图说明
以下将结合附图对本发明的实施例进行更详细的说明， 以使本领域普通 技术人员更加清楚地理解本发明， 其中：
图 1为现有技术用于将柔性基板与玻璃基板分离的装置示意图； 图 2为本发明实施例提供的一种用于将柔性基板与玻璃基板分离的装置 结构的侧视图；
图 3为本发明实施例提供的一种用于将柔性基板与玻璃基板分离装置结 构的俯视图；
图 4为本发明实施例提供的辊子结构的立体图；
图 5为本发明实施例提供的一种用于将柔性基板与玻璃基板分离的方法 流程示意图。 具体实施方式
为使本发明的实施例的目的、 技术方案和优点更加清楚， 下面将结合本 发明实施例的附图对本发明的实施例的技术方案进行清楚、 完整的描述。 显 然， 所描述的实施例仅是本发明的一部分示例性实施例， 而不是全部的实施 例。 基于所描述的本发明的示例性实施例， 本领域普通技术人员在无需创造 性劳动的前提下所获得的所有其它实施例都属于本发明的保护范围。
除非另作定义， 此处使用的技术术语或者科学术语应当为本发明所属领 域内具有一般技能的人士所理解的通常意义。 本发明专利申请说明书以及权 利要求书中使用的 "第一"、 "第二" 以及类似的词语并不表示任何顺序、 数 量或者重要性， 而只是用来区分不同的组成部分。 同样， "一个"、 "一" 或者 "该" 等类似词语也不表示数量限制， 而是表示存在至少一个。 "包括" 或者 "包含" 等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后 面列举的元件或者物件及其等同，而不排除其他元件或者物件。 "上"、 "下"、 等仅用于表示相对位置关系， 当被描述对象的绝对位置改变后， 则该相对位 置关系也可能相应地改变。
本发明实施例提供了一种用于将柔性基板与玻璃基板分离的装置， 以及 一种柔性基板的生产设备， 用以实现在柔性基板与玻璃基板分离过程中柔性 基板上的驱动晶片不会受到辊子挤压， 避免了柔性基板在分离过程中造成损 坏。
参见图 2,本发明实施例提供了一种用于将柔性基板与玻璃基板分离的装 置， 该装置包括： 圓柱体形状的辊子 15, 以及与该辊子相连的用于控制该辊 子转动从而通过辊子带动柔性基板与玻璃基板分离的控制单元（未示出）， 该 装置还包括在所述辊子 15的柱面上设置的凹陷区域 16。 该凹陷区域 16配置 来用于在辊子 15转动过程中， 使柔性基板 13上的驱动晶片 14嵌入所述凹陷 区域 16内， 避免辊子 15与柔性基板 13上的驱动晶片 14等凸起部件相接触。
根据本发明的实施例， 设置有控制单元（未示出）与辊子 15相连， 用于 带动该辊子 15转动从而通过辊子 15带动柔性基板 13与玻璃基板 11分离。 控制单元可以为电机等设备。 凹陷区域 16配置来在辊子 15转动过程中避免 辊子 15与柔性基板 13上的驱动晶片 14相接触。
根据本发明的实施例， 辊子 15上设置有一个或多个凹陷区域 16。
根据本发明的实施例， 当柔性基板 13上设置有多个驱动晶片 14时， 对 应每一驱动晶片 14, 辊子 15上分别设置有相应的凹陷区域 16。
根据本发明的实施例， 每一驱动晶片 14设置的凹陷区域 16的尺寸与对 应的驱动晶片 14的尺寸相匹配。
根据本发明的实施例， 凹陷区域 16的尺寸比驱动晶片 14的尺寸大。 根据本发明的实施例， 当柔性基板 13上设置有多个驱动晶片 14, 并且 多个驱动晶片 14位于同一行时， 辊子 15上设置有与该行位置对应的一个凹 陷区域 16, 该凹陷区域 16用于在辊子 15转动过程中避免辊子 15与位于该 行的多个驱动晶片 14相接触。 这样， 辊子上设置一个凹陷区域，避免了辊子 上分别对应每一驱动晶片设置有多个凹陷区域的麻烦， 筒化了制造工艺。
根据本发明的实施例， 辊子 15上设置的凹陷区域 16为长方体形状， 其 尺寸为宽度 2mm、 深度 2mm, 其长度不小于同一行的多个驱动晶片 14所占 长度。
根据本发明的实施例， 如图 3所示， 辊子 15的圓柱体包括第一段 1、 第 二段 2和设置有凹陷区域 16的第三段 3。 结合图 4, 第三段 3活动连接于第 一段 1和第二段 2之间， 且可绕圓柱体的轴线 5旋转。 由于不同尺寸的柔性 基板 13上设置的驱动晶片 14位置不同， 在辊子 15转动带动柔性基板 13与 玻璃基板 11分离的过程中， 通过旋转所述第三段 3, 使柔性基板 13上的驱 动晶片 14嵌入所述凹陷区域 16内， 这样本发明实施例提供的分离装置能够 适用于不同尺寸的柔性基板 13。
参见图 4, 圓柱体辊子 15上的第一段 1和第二段 2用于固定第三段 3的 固定方式可采用从第一段 1与第二段 2侧面插入顶丝 4的固定方式。 需要说 明的是， 辊子结构只是设想的其中一种可实现方式， 本发明不局限于这一种 结构。
一种柔性基板的生产设备， 包括上述装置。
图 2中所示的弱接触界面 12为柔性基板 13与玻璃基板 11之间的接触界 面。
参见图 5 ,本发明实施例提供的一种用于将柔性基板与玻璃基板分离的方 法步骤如下：
51、 将柔性基板一端固定在设置有凹陷区域的圓柱体形状的辊子上； 以 及
52、 控制单元转动辊子将柔性基板带起， 实现柔性基板与玻璃基板的分 离。
控制单元配合来控制所述辊子转动， 从而通过辊子带动柔性基板与玻璃 基板分离， 控制单元可以是电机等设备。
当辊子转动到设置在柔性基板上的驱动晶片部位时， 驱动晶片嵌入到设 置在辊子的凹陷区域中， 使驱动晶片不会受到辊子的挤压， 避免了柔性基板 在分离过程中造成的损坏。
所述辊子包括第一段、 第二段和设置有凹陷区域的第三段； 第三段活动 连接于第一段和第二段之间， 且可绕圓柱体的轴旋转。 由于不同尺寸的柔性 基板上设置的驱动晶片位置不同， 在辊子转动带动柔性基板与玻璃基板分离 的过程中， 通过旋转第三段， 使柔性基板上的驱动晶片嵌入凹陷区域内， 这 样本发明实施例提供的分离装置能够适用于不同尺寸的柔性基板。 这样， 由 于不同尺寸的柔性基板上驱动晶片所在位置不同， 通过旋转第三段， 可以使 柔性基板上的驱动晶片嵌入凹陷区域内，使得分离装置能够适用于不同尺寸、 驱动晶片设置在不同位置的柔性基板。
圓柱体辊子上的第一段和第二段用于固定第三段的固定方式可采用从第 一段与第二段侧面插入顶丝的固定方式。 需要说明的是， 所述的辊子结构只 是设想的其中一种可实现方式， 本发明不局限于这一种结构。
根据一个示例， 辊子上设置有一个或多个凹陷区域。 这样可以避免辊子 与柔性基板上的驱动晶片相接触， 损坏驱动晶片等凸起部件。
根据一个示例， 当柔性基板上设置有多个驱动晶片时， 对应每一驱动晶 片， 辊子上分别设置有相应的凹陷区域。 这样， 当辊子转动到驱动晶片部位 时， 多个驱动晶片分别嵌入到相应的 陷区域中， 不会受到辊子的挤压， 避 免了柔性基板在分离过程中造成损坏。
根据一个示例， 所述凹陷区域的尺寸与对应的驱动晶片的尺寸相匹配。 这样， 陷区域的尺寸刚好对应驱动晶片的尺寸， 使辊子转动到驱动晶片部 位时， 驱动晶片嵌入到凹陷区域中。 根据一个示例， 凹陷区域的尺寸比驱动 晶片的尺寸大。 使辊子转动到驱动晶片部位时， 驱动晶片可以嵌入到凹陷区 域中。
根据一个示例， 当柔性基板上设置有多个驱动晶片， 并且多个驱动晶片 位于同一行时， 辊子上设置有与该行位置对应的一个凹陷区域， 该凹陷区域 配置来在辊子转动过程中避免辊子与位于该行的多个驱动晶片相接触。
根据一个示例， 辊子上设置的凹陷区域， 为长方体形状， 其尺寸为宽度 约 2mm、 深度约 2mm, 其长度不小于同一行的多个驱动晶片所占长度设置。 这样， 凹陷区域的尺寸刚好对应该行的多个驱动晶片的尺寸， 使辊子转动到 驱动晶片部位时， 同一行的多个驱动晶片嵌入到凹陷区域中。
本发明的实施例通过在辊子上设置用于在辊子转动过程中， 使柔性基板 上的驱动晶片嵌入所述凹陷区域内， 避免辊子与柔性基板上的驱动晶片相接 触的凹陷区域， 使得在柔性基板与玻璃基板分离过程中柔性基板上的驱动晶 片不会受到辊子挤压， 避免了柔性基板在分离过程中造成损坏。
可以理解的是， 上面所述仅仅是为了说明本发明原理的示例性实施例和 实施方式， 然而本发明并不局限于此。 对于本领域的普通技术人员而言， 在 不脱离本发明的精神和实质的情况下， 可以做出各种变型和改进， 这些变型 和改进也应属于本发明的保护范围。

Claims

权利要求书
1、 一种用于将柔性基板与玻璃基板分离的装置， 包括：
圓柱体形状的辊子， 以及
与该辊子相连的用于控制该辊子转动带动柔性基板与玻璃基板分离的控 制单元， 其中所述辊子的柱面上设置有凹陷区域， 配置来在所述辊子转动过 程中， 使柔性基板上的驱动晶片嵌入所述凹陷区域内。
2、如权利要求 1所述的装置，其中所述辊子上设置有一个或多个所述凹 陷区域。
3、如权利要求 1或 2所述的装置， 其中， 当所述柔性基板上设置有多个 驱动晶片时， 对应每一驱动晶片， 所述辊子上分别设置有相应的凹陷区域。
4、 如权利要求 1-3任一项所述的装置， 其中， 所述凹陷区域的尺寸与对 应驱动晶片的尺寸相匹配。
5、如权利要求 1-4任一项所述的装置， 其中所述凹陷区域的尺寸比驱动 晶片的尺寸大。
6、如权利要求 1所述的装置， 其中， 当所述柔性基板上设置有多个驱动 晶片， 并且多个驱动晶片位于同一行时， 所述辊子上设置有与该行位置对应 的一个凹陷区 i或。
7、 如权利要求 6所述的装置， 其中， 所述凹陷区域为长方体形状， 宽度 为约 2mm, 深度为约 2mm, 长度不小于同一行的多个驱动晶片所占长度。
8、 如权利要求 1-7任一权项所述的装置， 其中， 所述辊子包括第一段、 第二段和设置有凹陷区域的第三段； 所述第三段可活动地连接于第一段和第 二段之间， 且可绕圓柱体的轴线旋转； 在辊子转动带动柔性基板与玻璃基板 分离的过程中， 通过旋转所述第三段， 使柔性基板上的驱动晶片嵌入所述凹 陷区域内。
9、 一种柔性基板的生产设备， 包括权利要求 1-8任一权项所述的装置。
PCT/CN2013/089470 2013-08-13 2013-12-16 用于将柔性基板与玻璃基板分离的装置及生产设备 WO2015021713A1 (zh)

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