JP2016515954A5 - - Google Patents

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Publication number
JP2016515954A5
JP2016515954A5 JP2015560207A JP2015560207A JP2016515954A5 JP 2016515954 A5 JP2016515954 A5 JP 2016515954A5 JP 2015560207 A JP2015560207 A JP 2015560207A JP 2015560207 A JP2015560207 A JP 2015560207A JP 2016515954 A5 JP2016515954 A5 JP 2016515954A5
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JP
Japan
Prior art keywords
sacrificial
layer
thermally stable
transfer film
template layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015560207A
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English (en)
Japanese (ja)
Other versions
JP2016515954A (ja
Filing date
Publication date
Priority claimed from US13/778,276 external-priority patent/US20140242343A1/en
Application filed filed Critical
Publication of JP2016515954A publication Critical patent/JP2016515954A/ja
Publication of JP2016515954A5 publication Critical patent/JP2016515954A5/ja
Pending legal-status Critical Current

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JP2015560207A 2013-02-27 2014-02-17 埋め込まれたナノ構造を形成するための積層転写フィルム Pending JP2016515954A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/778,276 US20140242343A1 (en) 2013-02-27 2013-02-27 Lamination transfer films for forming embedded nanostructures
US13/778,276 2013-02-27
PCT/US2014/016668 WO2014133799A1 (en) 2013-02-27 2014-02-17 Lamination transfer films for forming embedded nanostructures

Publications (2)

Publication Number Publication Date
JP2016515954A JP2016515954A (ja) 2016-06-02
JP2016515954A5 true JP2016515954A5 (enExample) 2017-03-16

Family

ID=51388438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015560207A Pending JP2016515954A (ja) 2013-02-27 2014-02-17 埋め込まれたナノ構造を形成するための積層転写フィルム

Country Status (7)

Country Link
US (1) US20140242343A1 (enExample)
EP (2) EP2961601B1 (enExample)
JP (1) JP2016515954A (enExample)
KR (1) KR20150123251A (enExample)
CN (1) CN105899359B (enExample)
TW (1) TW201446524A (enExample)
WO (1) WO2014133799A1 (enExample)

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TWI645973B (zh) * 2017-12-15 2019-01-01 律勝科技股份有限公司 聚醯亞胺薄化軟性基板及其製造方法
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WO2020066338A1 (ja) * 2018-09-28 2020-04-02 富士フイルム株式会社 転写材料、積層体、及び、積層体の製造方法
CN109700440A (zh) * 2018-12-18 2019-05-03 中北大学 柔性可穿戴传感器及其相应的可穿戴设备及制备方法
KR102342295B1 (ko) * 2018-12-31 2021-12-22 한양대학교 산학협력단 기판 탈착 방법 및 전자 소자의 제조 방법
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