JP2016515954A - 埋め込まれたナノ構造を形成するための積層転写フィルム - Google Patents

埋め込まれたナノ構造を形成するための積層転写フィルム Download PDF

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JP2016515954A
JP2016515954A JP2015560207A JP2015560207A JP2016515954A JP 2016515954 A JP2016515954 A JP 2016515954A JP 2015560207 A JP2015560207 A JP 2015560207A JP 2015560207 A JP2015560207 A JP 2015560207A JP 2016515954 A JP2016515954 A JP 2016515954A
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layer
sacrificial
transfer film
template layer
thermally stable
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Japanese (ja)
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JP2016515954A5 (enExample
Inventor
ベントン フリー マイケル
ベントン フリー マイケル
ビー．ウォルク マーティン
ビー．ウォルク マーティン
エム．ボーゲル−マーティン マーガレット
エム．ボーゲル−マーティン マーガレット
エル．シュワルツ エバン
エル．シュワルツ エバン
エイチ．マズルカ ミェチスワフ
エイチ．マズルカ ミェチスワフ
エフ．カムラス ロバート
エフ．カムラス ロバート
オー．コーリアー テリー
オー．コーリアー テリー
ベンソン，ジュニア オレスター
ベンソン，ジュニア オレスター
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2016515954A publication Critical patent/JP2016515954A/ja
Publication of JP2016515954A5 publication Critical patent/JP2016515954A5/ja
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    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24545—Containing metal or metal compound

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  • Engineering & Computer Science (AREA)
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