JP2016513335A - 照明アセンブリ、及び照明アセンブリを製造する方法 - Google Patents
照明アセンブリ、及び照明アセンブリを製造する方法 Download PDFInfo
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
- B29C2045/14327—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles anchoring by forcing the material to pass through a hole in the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/10—Construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (15)
- 照明アセンブリを製造する方法であって、
リードフレームを用意し、
前記リードフレームの上に少なくとも1つの発光ダイオード(LED)素子を配置し、前記少なくとも1つのLED素子は、前記リードフレームによって電力を供給されるときに光を放出するように構成され、
前記少なくとも1つのLED素子から放出された光の少なくとも一部を反射するとともに、前記リードフレームの少なくとも一部を電気的に絶縁する、ように構成された光反射性且つ電気絶縁性の材料を、前記リードフレームの少なくとも一部に設ける、
ことを有する方法。 - 前記リードフレームの前記少なくとも一部は、前記リードフレームの上に前記少なくとも1つのLED素子を配置することの後に、前記光反射性且つ電気絶縁性の材料を設けられる、請求項1に記載の方法。
- 前記リードフレームの前記少なくとも一部は、前記リードフレームの上に前記少なくとも1つのLED素子を配置することに先立って、前記光反射性且つ電気絶縁性の材料を設けられる、請求項1に記載の方法。
- 前記光反射性且つ電気絶縁性の材料は、モールド成形によって、前記リードフレームの前記少なくとも一部に設けられる、請求項1乃至3の何れか一項に記載の方法。
- 前記少なくとも1つのLED素子は、前記リードフレームの第1の表面の上に配置され、前記光反射性且つ電気絶縁性の材料は、前記リードフレームの第2の表面に設けられ、前記リードフレームの前記第1の表面は、前記リードフレームの前記第2の表面が上に配置される第2の面とは反対側の、前記リードフレームの第1の面に配置される、請求項1乃至4の何れか一項に記載の方法。
- 前記少なくとも1つのLED素子は、少なくとも1つのはんだ接合によって、前記リードフレームの上に配置される、請求項1乃至5の何れか一項に記載の方法。
- 前記少なくとも1つのはんだ接合は、スクリーン印刷又はジェット印刷されたはんだペーストをリフローすることによって提供される、請求項6に記載の方法。
- 前記リードフレームの少なくとも一部が、前記放出された光の少なくとも一部を反射するように構成された光反射器、及び/又は動作時に前記少なくとも1つのLED素子によって生成される熱の少なくとも一部を放散するように構成されたヒートシンクを提供するよう、前記リードフレームを曲げる、
ことを有する請求項1乃至7の何れか一項に記載の方法。 - 前記リードフレームを曲げる工程は、前記リードフレームの前記少なくとも一部を前記光反射性且つ電気絶縁性の材料で覆うことに先立って行われる、請求項8に記載の方法。
- 前記シート材を曲げる工程は、前記リードフレームの前記少なくとも一部を前記光反射性且つ電気絶縁性の材料で覆う工程と統合される、請求項8に記載の方法。
- リードフレームと、
前記リードフレームの上に配置された少なくとも1つの発光ダイオード(LED)素子であり、前記リードフレームによって電力を供給されるときに光を放出するように構成される少なくとも1つのLED素子と
を有し、
前記少なくとも1つのLED素子から放出された光の少なくとも一部を反射するとともに、前記リードフレームの少なくとも一部を電気的に絶縁する、ように構成された光反射性且つ電気絶縁性の材料を、前記リードフレームの少なくとも一部が備える、
照明アセンブリ。 - 前記光反射性且つ電気絶縁性の材料は、モールド成形された材料である、請求項11に記載の照明アセンブリ。
- 前記少なくとも1つのLED素子は、少なくとも1つのはんだ接合によって前記リードフレームに固定されている、請求項11又は12に記載の照明アセンブリ。
- 前記リードフレームの一部が、前記放出された光の少なくとも一部を反射するように構成された光反射器と、動作時に前記少なくとも1つのLED素子によって生成される熱の少なくとも一部を放散するように構成されたヒートシンクとを提供する、請求項11乃至13の何れか一項に記載の照明アセンブリ。
- 前記リードフレームは実質的に凹面形状を有する、請求項11乃至14の何れか一項に記載の照明アセンブリ。
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US201361756512P | 2013-01-25 | 2013-01-25 | |
US61/756,512 | 2013-01-25 | ||
PCT/IB2014/058310 WO2014115064A1 (en) | 2013-01-25 | 2014-01-16 | Lighting assembly and method for manufacturing a lighting assembly |
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JP2016513335A true JP2016513335A (ja) | 2016-05-12 |
JP6335923B2 JP6335923B2 (ja) | 2018-05-30 |
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US (1) | US10551011B2 (ja) |
EP (1) | EP2948709B1 (ja) |
JP (1) | JP6335923B2 (ja) |
KR (1) | KR102099814B1 (ja) |
CN (1) | CN104937326B (ja) |
TW (2) | TWI713882B (ja) |
WO (1) | WO2014115064A1 (ja) |
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JP2018107285A (ja) * | 2016-12-27 | 2018-07-05 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP2019053879A (ja) * | 2017-09-14 | 2019-04-04 | アイリスオーヤマ株式会社 | 光源モジュール及び照明装置 |
Families Citing this family (10)
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CN104900638B (zh) * | 2015-05-27 | 2017-10-24 | 深圳市华星光电技术有限公司 | 发光元件组装结构 |
WO2017115862A1 (ja) * | 2015-12-28 | 2017-07-06 | アイリスオーヤマ株式会社 | Led照明装置 |
DE102016103047A1 (de) * | 2016-02-22 | 2017-08-24 | Itz Innovations- Und Technologiezentrum Gmbh | Herstellungsverfahren für eine Leuchtenkomponente und mit dem Verfahren hergestellte Leuchtenkomponente |
EP3459124B1 (en) | 2016-05-18 | 2020-02-05 | Lumileds Holding B.V. | Lighting assembly and method for manufacturing a lighting assembly |
EP3526515A1 (en) * | 2016-10-11 | 2019-08-21 | Lumileds Holding B.V. | Led lighting unit |
DE102017106734A1 (de) | 2017-03-29 | 2018-10-04 | Vossloh-Schwabe Lighting Solutions GmbH & Co. KG | Trägeranordnung für wenigstens ein elektrisches und/oder elektronisches Bauteil, Verfahren zu deren Herstellung sowie Leuchtenbaugruppe mit einer Trägeranordnung |
JP6637003B2 (ja) * | 2017-09-08 | 2020-01-29 | サンコール株式会社 | バスバーアッセンブリ |
DE102017131063A1 (de) * | 2017-12-22 | 2019-06-27 | Ledvance Gmbh | LED-Modul mit einem stabilisierten Leadframe |
DE102018125645B3 (de) * | 2018-10-16 | 2020-01-23 | Ledvance Gmbh | Verfahren zur Herstellung einer Röhrenlampe und entsprechende Röhrenlampe |
EP3892070A1 (en) * | 2018-12-05 | 2021-10-13 | Lumileds LLC | Carrier base module for a lighting module |
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KR102099814B1 (ko) | 2020-04-13 |
JP6335923B2 (ja) | 2018-05-30 |
KR20150113061A (ko) | 2015-10-07 |
US20150362136A1 (en) | 2015-12-17 |
TW201921741A (zh) | 2019-06-01 |
WO2014115064A1 (en) | 2014-07-31 |
US20220364688A1 (en) | 2022-11-17 |
US10551011B2 (en) | 2020-02-04 |
EP2948709B1 (en) | 2016-10-05 |
CN104937326A (zh) | 2015-09-23 |
CN104937326B (zh) | 2018-10-26 |
TWI713882B (zh) | 2020-12-21 |
TWI713437B (zh) | 2020-12-21 |
EP2948709A1 (en) | 2015-12-02 |
TW201438298A (zh) | 2014-10-01 |
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