JP2016508075A - Mems部品を有するオーバーモールドされたデバイスおよび製造方法 - Google Patents
Mems部品を有するオーバーモールドされたデバイスおよび製造方法 Download PDFInfo
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Abstract
Description
したがって協働して1つの機能を果たすように構成された部品(複数)を含んでいてよい。
そこでデバイスあるいはMEMS部品の、開口のために予定された表面の領域を露出したままとするために、これを利用することができる。
この際、上に向かって設置面が小さくなるのが有利であるが、これは積層体内で下に位置するチップ部品に接続することがより容易にできるからである。
T : 基板
AFI,AFA : 内側電気接続面および外側電気接続面
CK : チップ部品
MK : MEMS部品
HS : 半殻
MM : 成形材
VE : 配線面
DK1 : (基板を貫通する)第1の貫通接続部
DK2 : (半殻を貫通する)第2の貫通接続部
KI,KA : 内側接続部および外側接続部
WB : ボンディングワイヤ
FE : 金属バネ部材
OE : 基板または半殻に設けられた開口
LF : リードフレーム
AL : 接着剤層
LFI : 島
CV : (半殻の下の)空洞
BU : バンプ接続部
Claims (14)
- 電気的な内側接続面(AFI)と電気的な外側接続面(AFA)とを有する1つの基板(T)上に、1つのチップ部品(CK)と1つのMEMS部品(MK)とが配設されて電気的な前記内側接続面(AFI)と導電的に接続されており、前記MEMS部品(MK)が、前記基板上に載置された1つの半殻の下に配設されているデバイスであって、
前記デバイス(1)全体が1つの成形材でカプセル封止されて、少なくとも前記基板の上面と前記チップ部品および前記MEMS部品の側面が成形材で覆われ、前記外側接続面は露出されていることを特徴とするデバイス。 - 請求項1に記載のデバイスにおいて、
前記基板(T)が、1つの電気的絶縁材料から多層に形成されており、上を向いた前記内側接続面(AFI)と、下を向いた前記外側接続面(AFA)と、少なくとも1つの配線面(VE)とを備え、
前記内側接続面は、前記配線面および/または前記外側接続面に、第1の貫通接続部(DK1)によって接続されている、
ことを特徴とするデバイス。 - 請求項1または2に記載のデバイスにおいて、
前記半殻(HS)は1つのハウジングキャップとなっており、当該ハウジングキャップはそのハウジング底部に相互に電気的に接続された内側接続部(KI)および外側接続部(KA)を有しており、
前記MEMS部品(MM)は前記ハウジングキャップ内に取り付けられ、かつ前記内側接続部(KI)と電気的に導通して接続されており、
前記ハウジングキャップの前記外側接続部(KA)はボンディングワイヤ(WB)によって前記基板(T)の前記内側接続面(AFI)と接続されている、
ことを特徴とするデバイス。 - 請求項3に記載のデバイスにおいて、
前記MEMS部品(MK)が、弾性の金属バネ部材(FE)により前記ハウジング底部と接続されている - 請求項1乃至4のいずれか1項に記載のデバイスにおいて、
前記デバイス(1)が、前記半殻(HS)の下の前記MEMS部品(MK)への媒質のアクセスを可能とする開口(OE)を備え、
当該開口は下から前記基板(T)を貫通して、または上から前記半殻(HS)を貫通して、または上から前記成形材(MM)と前記半殻(HS)を貫通して設けられている、
ことを特徴とするデバイス。 - 請求項1乃至5のいずれか1項に記載のデバイスにおいて、
前記成形材(MM)が、前記半殻の上を向いた主面が成形材で覆われないままとなるように取り付けられていることを特徴とするデバイス。 - 請求項1乃至6のいずれか1項に記載のデバイスにおいて、
前記半殻(HS)が、セラミック、半導体材料、金属、ガラス、プラスチック、またはこれらの材料の1つから成る少なくとも1つの層を含む複合材料から成ることを特徴とするデバイス。 - 請求項1乃至7のいずれか1項に記載のデバイスにおいて、
前記半殻(HS)がパターニングされた接着剤層を用いて前記基板上に接着されて、前記半殻と前記基板との間に、前記基板に対して閉じた空洞が形成されるようにされていることを特徴とするデバイス。 - 請求項3乃至8のいずれか1項に記載のデバイスにおいて、
前記基板(T)が、平坦に形成された1つの島を備えるリードフレーム(LF)として形成されており、
前記半殻(HS)が前記島上に接着されて、前記半殻と前記リードフレーム(LF)の前記島との間に前記リードフレームに対して閉じた空洞(CV)が形成されるようにされている、
ことを特徴とするデバイス。 - 請求項1乃至9のいずれか1項に記載のデバイスにおいて、
前記MEMS部品(MK)が、前記基板(T)の前記内側接続面(AFI)上に直に取り付けられていることを特徴とするデバイス。 - 請求項1乃至10のいずれか1項に記載のデバイスにおいて、
前記MEMS部品(MK)がセンサまたはマイクロフォンとして形成されていることを特徴とするデバイス。 - 請求項1乃至11のいずれか1項に記載のデバイスにおいて、
前記チップ部品(CK)が、1つのベアダイ、1つのハウジングされた能動デバイスまたは受動デバイス、または成形処理に耐える別の電気的デバイスであることを特徴とするデバイス。 - 請求項1乃至12のいずれか1項に記載のデバイスの製造方法であって、
基板(T)に電気的な内側接続面(AFI)と電気的な外側接続面(AFA)とが設けられ、
1つのSMDハウジングのハウジングキャップとして形成された半殻(HS)を備え、当該半殻はその底部に内側接続部(KI)と外側接続部(KA)とを備え、
1つのMEMS部品(MK)が前記ハウジングキャップ内に取り付けられ、かつ前記内側接続部(KIK)と電気的に接続され、
前記MEMS部品が前記ハウジングキャップと前記基板との間の1つの空洞(CV)内に封止されるように、前記ハウジングキャップが前記基板上に接着され、
さらに1つのチップ部品(CK)が前記基板上に取り付けられ、
前記外側接続部(KA)と前記内側の接続面(AFI)とがボンディングワイヤ(WB)で接続され、
前記デバイス(1)が、1つの成形処理を用いた成形(Molden)により、1つの成形材(MM)でオーバーモールドされて、少なくとも前記基板の表面とチップ部品およびMEMS部品の側壁が前記成形材で覆われ、しかしながら前記外側接続面(AFA)は前記成形材で覆われないままとなる、
ことを特徴とする方法。 - 請求項13に記載の方法において、
前記MEMS部品(MK)が1つのセンサまたは1つのマイクロフォンであって、前記成形(Molden)の前または後に、前記基板(T)、または前記ハウジングキャップ、またはその上に塗布された成形材とともに前記ハウジングキャップを貫通し、前記ハウジングキャップの下の空洞(CV)内のMEMS部品への媒質のアクセスを可能とする開口(OE)が生成されることを特徴とする方法。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12000857B2 (en) | 2021-02-25 | 2024-06-04 | Seiko Epson Corporation | Sensor module having conductive bonding members with varying melting points and young's moduli |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102437673B1 (ko) * | 2015-09-09 | 2022-08-26 | 삼성전자주식회사 | 반도체 장치 |
KR102513080B1 (ko) | 2016-04-04 | 2023-03-24 | 삼성전자주식회사 | Led 광원 모듈 및 디스플레이 장치 |
US10861796B2 (en) * | 2016-05-10 | 2020-12-08 | Texas Instruments Incorporated | Floating die package |
US20180134546A1 (en) * | 2016-11-14 | 2018-05-17 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
US10150667B2 (en) * | 2017-02-13 | 2018-12-11 | Obsidian Sensors, Inc. | Panel level packaging for MEMS application |
KR101949594B1 (ko) * | 2017-05-30 | 2019-04-29 | 서울대학교산학협력단 | 멤스 트랜스듀서 패키지 및 이를 포함하는 멤스 장치 |
CN107991509B (zh) * | 2017-12-21 | 2024-02-20 | 成都工业学院 | 一种层结构质量块及其制作方法、加速度传感器及其制作方法 |
DE102018122515B4 (de) * | 2018-09-14 | 2020-03-26 | Infineon Technologies Ag | Verfahren zum Herstellen eines Halbleiteroxid- oder Glas-basierten Verbindungskörpers mit Verdrahtungsstruktur |
CN110972045B (zh) * | 2019-11-18 | 2021-11-16 | 潍坊歌尔微电子有限公司 | 一种振动感测装置以及电子设备 |
US11702335B2 (en) | 2020-12-04 | 2023-07-18 | Analog Devices, Inc. | Low stress integrated device package |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080083957A1 (en) * | 2006-10-05 | 2008-04-10 | Wen-Chieh Wei | Micro-electromechanical system package |
FR2907632A1 (fr) * | 2006-10-20 | 2008-04-25 | Merry Electronics Co Ltd | Boitier de systeme micro-electromecanique |
CN101325823A (zh) * | 2007-06-11 | 2008-12-17 | 美律实业股份有限公司 | 硅晶麦克风的封装构造 |
JP2009514691A (ja) * | 2005-11-10 | 2009-04-09 | エプコス アクチエンゲゼルシャフト | Memsパッケージおよび製造方法 |
JP2009226571A (ja) * | 2008-02-28 | 2009-10-08 | Nippon Kayaku Co Ltd | マイクロデバイス及びその製造方法 |
US20110229375A1 (en) * | 2010-03-18 | 2011-09-22 | Robert Bosch Gmbh | Microfluidic System for Purposes of Analysis and Diagnosis and Corresponding Method for Producing a Microfluidic System |
JP2012195417A (ja) * | 2011-03-16 | 2012-10-11 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10152343B4 (de) * | 2001-10-24 | 2011-08-11 | Epcos Ag, 81669 | Verfahren zur Verkapselung eines elektrischen Bauelementes und verkapseltes Oberflächenwellenbauelement |
US7262509B2 (en) * | 2004-05-11 | 2007-08-28 | Intel Corporation | Microelectronic assembly having a perimeter around a MEMS device |
DE102005050398A1 (de) * | 2005-10-20 | 2007-04-26 | Epcos Ag | Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung |
US7436054B2 (en) * | 2006-03-03 | 2008-10-14 | Silicon Matrix, Pte. Ltd. | MEMS microphone with a stacked PCB package and method of producing the same |
US20090057885A1 (en) * | 2007-08-30 | 2009-03-05 | Infineon Technologies Ag | Semiconductor device |
US7847387B2 (en) * | 2007-11-16 | 2010-12-07 | Infineon Technologies Ag | Electrical device and method |
JP5374716B2 (ja) * | 2008-03-18 | 2013-12-25 | エプコス アクチエンゲゼルシャフト | マイクロフォンとその製造方法 |
JP4837708B2 (ja) * | 2008-07-09 | 2011-12-14 | シャープ株式会社 | 電子部品およびその製造方法、並びに、電子部品を備えた電子装置 |
DE102009007837A1 (de) * | 2009-02-06 | 2010-08-19 | Epcos Ag | Sensormodul und Verfahren zum Herstellen von Sensormodulen |
US8359927B2 (en) * | 2009-08-12 | 2013-01-29 | Freescale Semiconductor, Inc. | Molded differential PRT pressure sensor |
DE102011102266B4 (de) * | 2011-05-23 | 2013-04-11 | Epcos Ag | Anordnung mit einem MEMS-Bauelement mit einer PFPE Schicht und Verfahren zur Herstellung |
TWI431732B (zh) * | 2011-09-22 | 2014-03-21 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
US8941223B2 (en) * | 2012-09-10 | 2015-01-27 | Invensense, Inc. | MEMS device package with conductive shell |
US9040335B2 (en) * | 2013-09-17 | 2015-05-26 | Freescale Semiconductor, Inc. | Side vented pressure sensor device |
-
2013
- 2013-01-15 DE DE102013100388.5A patent/DE102013100388B4/de active Active
- 2013-10-23 JP JP2015552000A patent/JP6105087B2/ja not_active Expired - Fee Related
- 2013-10-23 WO PCT/EP2013/072183 patent/WO2014111178A1/de active Application Filing
- 2013-10-23 US US14/759,602 patent/US9481565B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009514691A (ja) * | 2005-11-10 | 2009-04-09 | エプコス アクチエンゲゼルシャフト | Memsパッケージおよび製造方法 |
US20080083957A1 (en) * | 2006-10-05 | 2008-04-10 | Wen-Chieh Wei | Micro-electromechanical system package |
FR2907632A1 (fr) * | 2006-10-20 | 2008-04-25 | Merry Electronics Co Ltd | Boitier de systeme micro-electromecanique |
CN101325823A (zh) * | 2007-06-11 | 2008-12-17 | 美律实业股份有限公司 | 硅晶麦克风的封装构造 |
JP2009226571A (ja) * | 2008-02-28 | 2009-10-08 | Nippon Kayaku Co Ltd | マイクロデバイス及びその製造方法 |
US20110229375A1 (en) * | 2010-03-18 | 2011-09-22 | Robert Bosch Gmbh | Microfluidic System for Purposes of Analysis and Diagnosis and Corresponding Method for Producing a Microfluidic System |
JP2012195417A (ja) * | 2011-03-16 | 2012-10-11 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12000857B2 (en) | 2021-02-25 | 2024-06-04 | Seiko Epson Corporation | Sensor module having conductive bonding members with varying melting points and young's moduli |
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