JP2016225377A5 - - Google Patents

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Publication number
JP2016225377A5
JP2016225377A5 JP2015108104A JP2015108104A JP2016225377A5 JP 2016225377 A5 JP2016225377 A5 JP 2016225377A5 JP 2015108104 A JP2015108104 A JP 2015108104A JP 2015108104 A JP2015108104 A JP 2015108104A JP 2016225377 A5 JP2016225377 A5 JP 2016225377A5
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JP
Japan
Prior art keywords
control board
control
circuit board
resin
printed circuit
Prior art date
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Granted
Application number
JP2015108104A
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English (en)
Japanese (ja)
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JP6509043B2 (ja
JP2016225377A (ja
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Priority to JP2015108104A priority Critical patent/JP6509043B2/ja
Priority claimed from JP2015108104A external-priority patent/JP6509043B2/ja
Publication of JP2016225377A publication Critical patent/JP2016225377A/ja
Publication of JP2016225377A5 publication Critical patent/JP2016225377A5/ja
Application granted granted Critical
Publication of JP6509043B2 publication Critical patent/JP6509043B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015108104A 2015-05-28 2015-05-28 車載用電子制御装置 Active JP6509043B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015108104A JP6509043B2 (ja) 2015-05-28 2015-05-28 車載用電子制御装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015108104A JP6509043B2 (ja) 2015-05-28 2015-05-28 車載用電子制御装置

Publications (3)

Publication Number Publication Date
JP2016225377A JP2016225377A (ja) 2016-12-28
JP2016225377A5 true JP2016225377A5 (enExample) 2018-05-10
JP6509043B2 JP6509043B2 (ja) 2019-05-08

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ID=57748498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015108104A Active JP6509043B2 (ja) 2015-05-28 2015-05-28 車載用電子制御装置

Country Status (1)

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JP (1) JP6509043B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023060487A (ja) * 2021-10-18 2023-04-28 富士電機株式会社 半導体モジュール

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3484916B2 (ja) * 1997-04-03 2004-01-06 松下電器産業株式会社 回路基板とその製造方法
JP3619708B2 (ja) * 1999-06-02 2005-02-16 株式会社日立製作所 パワー半導体モジュール
JP2004296954A (ja) * 2003-03-28 2004-10-21 Mitsubishi Electric Corp リードフレーム基板
JP2006121861A (ja) * 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
JP2007115987A (ja) * 2005-10-21 2007-05-10 Toyota Motor Corp 半導体装置と半導体装置の組立方法
JP5135525B2 (ja) * 2009-09-30 2013-02-06 ニチコン株式会社 樹脂封止型モジュール
JP6044412B2 (ja) * 2013-03-26 2016-12-14 株式会社オートネットワーク技術研究所 リード端子と回路基板との接続構造、回路構成体及び電気接続箱

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