JP2016225377A5 - - Google Patents
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- Publication number
- JP2016225377A5 JP2016225377A5 JP2015108104A JP2015108104A JP2016225377A5 JP 2016225377 A5 JP2016225377 A5 JP 2016225377A5 JP 2015108104 A JP2015108104 A JP 2015108104A JP 2015108104 A JP2015108104 A JP 2015108104A JP 2016225377 A5 JP2016225377 A5 JP 2016225377A5
- Authority
- JP
- Japan
- Prior art keywords
- control board
- control
- circuit board
- resin
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000006011 modification reaction Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
また、制御基板は、一般的なガラスエポキシ製のプリント回路基板の場合について述べたが、同様の構成をとることで耐熱性及び、強度を確保するため、図４に示す変形例のようにプリント回路基板を制御基板から伸びる制御端子の一部分（制御端子の表面の一部）を除いて封止樹脂９により樹脂封止した構成、例えば、エポキシ樹脂によりトランスファモールドやポッティングしたものであっても、同様の効果が得られる。 The control board is a general printed circuit board made of glass epoxy. However, in order to secure heat resistance and strength by adopting the same configuration, the control board is printed as in the modification shown in FIG. configuration in which the resin sealing by the sealing resin 9, except a portion of the control terminal extending circuit board from the control board (part of the surface of the control terminal), for example, be one which is transfer molding or potting with an epoxy resin, Similar effects can be obtained.
また、制御基板は、一般的なガラスエポキシ製のプリント回路基板の場合について述べたが、同様の構成をとることで耐熱性及び、強度を確保するため、図８に示す変形例のように、プリント回路基板を制御基板から伸びる制御端子の一部分（制御端子の表面の一部）を除いて封止樹脂９により樹脂封止した構成、例えば、エポキシ樹脂によりトランスファモールドやポッティングしたものであっても、同様の効果が得られる。 In addition, the control board has been described for the case of a general printed circuit board made of glass epoxy, but in order to ensure heat resistance and strength by taking the same configuration, as in the modification shown in FIG. configuration in which the resin sealing by the sealing resin 9, except a portion of the control terminals extending a printed circuit board from the control board (part of the surface of the control terminal), for example, be one which is transfer molding or potting with an epoxy resin A similar effect can be obtained.
制御基板から伸びる制御端子５は、図１０に示すようにパワーモジュール側の方向に円形状の貫通孔６を、ドリル加工後にプレス加工を施す、所謂バーリング加工により形成した後、バーリング加工部に対して、プレス加工を施して、貫通孔６には同心円状にバーリング後加工部５ｃが形成されている。パワーモジュールから伸びる制御端子４と同じCu製リードであり、制御基板３とはんだ付けにより、電気的に接続されている。 The control terminal 5 which extends from the control board, the circular through-hole 6 in the direction of the power module side as shown in FIG. 10, subjected to press working after drilling, was formed by a so-called burring, against the burring portion Te, is subjected to press working, after burring portion 5 c is formed concentrically to the through-hole 6. The lead made of Cu is the same as the control terminal 4 extending from the power module, and is electrically connected to the control board 3 by soldering.
また、実施の形態２と同様に図１１に示すようにバーリング後加工により発生した部分も、はんだ接合される。従って、実施の形態２と同様に接合面積を、バーリング後加工部５ｃだけ増やすことが可能となるため、接合部の寿命を飛躍的に伸ばすことができる。これによって、信頼性が高い車載用電子制御装置を得ることができる。 Similarly to the second embodiment, as shown in FIG. 11, the portion generated by the post-burring process is also soldered. Therefore, the bonding area as in the second embodiment, since it is possible to increase only the machining unit 5 c after burring can prolong the life of the joint dramatically. As a result, an on-vehicle electronic control device with high reliability can be obtained.
また、制御基板は、一般的なガラスエポキシ製のプリント回路基板の場合について述べたが、同様の構成をとることで耐熱性及び、強度を確保するため、図１２に示す変形例のように、プリント回路基板を制御基板から伸びる制御端子の一部分（制御端子の表面の一部）を除いて封止樹脂９により樹脂封止した構成、例えば、エポキシ樹脂によりトランスファモールドやポッティングしたものであっても、同様の効果が得られる。 Further, the control board has been described for the case of a general printed circuit board made of glass epoxy, but in order to ensure heat resistance and strength by taking the same configuration, as in the modification shown in FIG. configuration in which the resin sealing by the sealing resin 9, except a portion of the control terminals extending a printed circuit board from the control board (part of the surface of the control terminal), for example, be one which is transfer molding or potting with an epoxy resin A similar effect can be obtained.
また、実施の形態１と同様に貫通孔６と貫通孔以上の大きさとなる同心円を除いて、レジスト部７を施すことで製造性および、製品の歩留まりを向上することができる。
Further, the productivity and the product yield can be improved by applying the resist portion 7 except for the concentric circle having a size larger than the through hole 6 and the through hole as in the first embodiment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015108104A JP6509043B2 (en) | 2015-05-28 | 2015-05-28 | Automotive electronic control unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015108104A JP6509043B2 (en) | 2015-05-28 | 2015-05-28 | Automotive electronic control unit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016225377A JP2016225377A (en) | 2016-12-28 |
| JP2016225377A5 true JP2016225377A5 (en) | 2018-05-10 |
| JP6509043B2 JP6509043B2 (en) | 2019-05-08 |
Family
ID=57748498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015108104A Active JP6509043B2 (en) | 2015-05-28 | 2015-05-28 | Automotive electronic control unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6509043B2 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3484916B2 (en) * | 1997-04-03 | 2004-01-06 | 松下電器産業株式会社 | Circuit board and its manufacturing method |
| JP3619708B2 (en) * | 1999-06-02 | 2005-02-16 | 株式会社日立製作所 | Power semiconductor module |
| JP2004296954A (en) * | 2003-03-28 | 2004-10-21 | Mitsubishi Electric Corp | Lead frame substrate |
| JP2006121861A (en) * | 2004-10-25 | 2006-05-11 | Fuji Electric Fa Components & Systems Co Ltd | Power converter |
| JP2007115987A (en) * | 2005-10-21 | 2007-05-10 | Toyota Motor Corp | Semiconductor device and method of assembling same |
| JP5135525B2 (en) * | 2009-09-30 | 2013-02-06 | ニチコン株式会社 | Resin-sealed module |
| JP6044412B2 (en) * | 2013-03-26 | 2016-12-14 | 株式会社オートネットワーク技術研究所 | Connection structure between lead terminal and circuit board, circuit structure and electrical connection box |
-
2015
- 2015-05-28 JP JP2015108104A patent/JP6509043B2/en active Active
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