TWM520480U - A semiconductor module, an electrical device and a vehicle - Google Patents

Description

Semiconductor modules, electronic devices, and vehicles

The present invention relates to a semiconductor module, an electronic device, and a vehicle.

Semiconductor modules are widely used in electronic products. The semiconductor module has a plurality of pins. When mounted, the pins pass through the mounting vias on the printed circuit board (PCB), and the solder is soldered to the printed circuit board, thereby being used in the semiconductor module and the printed circuit board. Form a typical connection.

Typically, the semiconductor module is mounted on a heat sink that dissipates heat from the semiconductor module. A gap is provided between the heat sink and the semiconductor module, and a heat-dissipating insulating material is disposed in the gap to ensure good heat dissipation performance and prevent short circuit between the heat sink and the semiconductor module. The mounting surface between the heat sink and the semiconductor module is generally parallel and coplanar with the printed circuit board, and the pins of the semiconductor module are bent toward the printed circuit board and soldered to the through holes of the printed circuit board.

The bending of the module leads, the mounting position of the pins in the holes of the printed circuit board, the soldering of the module on the printed circuit board, the manufacturing process of the heat sink, the mounting surface of the heat sink and the printed circuit board form an angle Many factors, such as non-parallel coplanarity, can cause manufacturing tolerances that can cause deviations between the actual values of the gaps (between the heat sink and the semiconductor module) and the design values (eg, deviations +/- 0.05 mm to ±1 mm). ). This deviation leads to poor heat dissipation, which in turn affects production. Product performance.

An object of the present invention is to provide a vehicle instrument component, a vehicle instrument, and a vehicle, wherein the indicator body has a complete and uniform illumination effect.

To this end, according to one aspect of the present invention, a semiconductor module is provided, comprising: a body portion and a pin extending from the body portion, the bottom surface of the body portion being defined as a mounting surface, and the pin includes a certain angle with the mounting surface The connecting portion and the buffer portion are configured to establish an electrical connection with the printed circuit board, and the buffer portion is configured to buffer the force received by the body portion and/or the pin.

According to another aspect of the present invention, an electronic device includes the foregoing semiconductor module, a printed circuit board, and a heat dissipation substrate. The mounting surface of the semiconductor module is mounted on the heat dissipation substrate, and the connection portion of the semiconductor module passes through the printed circuit. A through hole is mounted on the board to establish an electrical connection between the semiconductor module and the printed circuit board.

According to another aspect of the present invention, there is also provided a vehicle comprising the aforementioned electronic device, wherein the vehicle may be any short distance, small capacity, etc., such as an electric scooter, an electric bicycle, an electric tricycle, a small electric four-wheeled vehicle, and the like. Low power vehicle.

Since the pins of the semiconductor module of the present invention form a buffer portion, the stress on the semiconductor module is buffered due to manufacturing tolerances, thereby reducing the influence of the semiconductor module due to manufacturing tolerances, and the actual value of the gap. The design value is achieved, the heat dissipation performance of the electronic device of the present invention is stabilized, the stress on the solder joint between the connection portion and the printed circuit board is reduced, the solder joint damage is prevented, and the reliability of the electronic device of the creation is improved.

1‧‧‧Semiconductor Module

10‧‧‧ pin

11‧‧‧ Body Department

20‧‧‧Printed circuit board

30‧‧‧heated substrate

101‧‧‧Connecting Department

102‧‧‧ buffer

110‧‧‧Installation surface

1 is a schematic structural view of a semiconductor module according to an embodiment of the present invention; 2 is a schematic view showing the mounting of the electronic device of FIG. 1 in an electronic device according to an embodiment of the present invention; and FIG. 3 is a schematic view showing the mounting of the semiconductor module of the other embodiment of the present invention in an electronic device.

Preferred embodiments of the present work are described below with reference to the drawings.

As shown in FIG. 1 and FIG. 2, the semiconductor module 1 of the present embodiment is described by taking a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) as an example. In other embodiments, the semiconductor module 1 can also be any semiconductor module, such as an IGBG (Insulated Gate Bipolar Transistor). In the embodiment, the semiconductor module 1 includes a body portion 11 and three pins 10 extending from the body portion 11. The bottom surface of the body portion 11 is defined as a mounting surface 110. The gate, source and drain of the MOSFET are assigned to the three pins 10.

The pin 10 includes a connecting portion 101 and a buffer portion 102 that are bent at an angle to the mounting surface 110. According to the actual situation, the connecting portion 101 is used to establish an electrical connection with the printed circuit board. The angle between the connecting portion 101 and the mounting surface 110 can be selected at any angle within a range of 30 to 150 degrees, and the preferred angle range is 45 to 135 degrees. . In the present embodiment, the angle between the connecting portion 101 and the mounting surface 110 is approximately 90 degrees.

The buffer portion 102 extends from the body portion 11 and is connected to the connecting portion 101. In the embodiment, the U-shaped structure is substantially curved and has a U-shaped structure. The plane of the U-shaped structure is substantially perpendicular to the mounting surface 110 of the body portion 11 for buffering the body portion. The force received by 11 and/or pin 10, such as the transmission of force between body portion 11 and pin 10, the force experienced by body portion 11, and the force experienced by pin 10. Force The direction is, for example, the width direction X, the length direction Y, and/or the height direction Z of the body portion 11, thereby reducing the influence on the body portion 11 and/or the connecting portion 101, increasing the reliability of the product. As shown in FIG. 3, the buffer portion 102 can also be bent into a wave-shaped structure, the plane of which is substantially perpendicular to the mounting surface 110 of the body portion 11. It can be understood that the buffer portion 102 can be any curved structure, the plane of the curved structure can be substantially perpendicular to the mounting surface 110, or can be parallel to the mounting surface 110, or the portion of the buffer portion 102 is perpendicular to the mounting surface 110 and the other portion is parallel to The mounting surface, or the buffer portion 102, is of any shape, in any plane or three-dimensional space, as long as it can be used to cushion the force received by the body portion 11 and/or the connecting portion 101 due to manufacturing tolerances.

The present semiconductor module 1 is used in an electronic device such as an electronic control unit (ECU) of a vehicle, a Power Electronic Unit (PEU), or the like. The vehicle using the electronic device may be any short-distance, small-capacity, low-power vehicle such as an electric scooter, an electric bicycle, an electric tricycle, a small electric four-wheeled vehicle (a golf cart, a park environmental shuttle bus, etc.).

The authoring electronic device includes the semiconductor module 1, the printed circuit board 20, the heat dissipation substrate 30, and a casing (not shown) that houses the printed circuit board 20 and the heat dissipation substrate 30.

When the electronic device of the present invention is assembled, the mounting surface 110 of the semiconductor module 1 is mounted on the heat dissipation substrate 30, and the heat dissipation substrate 30 is used to dissipate heat generated by the semiconductor module 1. A gap (not shown) is provided between the heat dissipation substrate 30 and the semiconductor module 1. According to actual needs, the gap is usually designed to be 0.05 to 0.5 mm, and sometimes exceed 1 mm, and an insulating material having good heat dissipation is provided in the gap for The value of the gap is maintained to a desired minimum or design value, thereby ensuring good heat dissipation performance and preventing short circuit between the heat dissipation substrate 30 and the semiconductor module 1.

The plane of the printed circuit board (PCB) 20 and the mounting surface of the semiconductor module 1 110 is substantially parallel and coplanar, and the connecting portion 101 passes through a mounting through hole (not shown) on the printed circuit board 20, and the connecting portion 101 is connected to the printed circuit board 20 by a connecting material, thereby printing on the semiconductor module 1 and Electrical connections are made between the circuit boards 20, and the connecting material is, for example, solder, and the connecting portion 101 is soldered to the printed circuit board 20. In other embodiments, the plane of the printed circuit board (PCB) 20 may be non-parallel to the mounting surface 110 of the semiconductor module 1 as long as the shape of the buffer portion 102 and the bending angle of the pins 10 are changed accordingly.

The mounting holes of the pins 10 and the printed circuit board 20 are not well aligned, the semiconductor module 1 is improperly soldered on the printed circuit board 20, and the manufacturing process of the heat dissipation substrate 30 is poor (for example, surface bending or tilting, etc.) A number of factors, such as the angle between the plane of the printed circuit board 20 and the mounting surface 110 of the semiconductor module 1 and not parallel coplanar, can cause manufacturing tolerances that cause the body portion 11 of the semiconductor module 1 to be subjected to additional forces. Being pressed or lifted causes the gap between the heat dissipation substrate 30 and the semiconductor module 1 to be reduced or increased, so that the actual value of the gap deviates from the design value (for example, the deviation is +/- 0.05 mm to ± 1 mm). This deviation will result in poor heat dissipation, which in turn affects the heat dissipation performance of the product. These manufacturing tolerances also cause additional stress or even disconnection of the solder joints of the pins 10 and the printed circuit board 20, affecting the reliability of the electrical connections between the two and even shortening the life of the product.

Since the pin 10 of the semiconductor module 1 of the present invention forms the buffer portion 102, the stress applied to the semiconductor module 1 due to manufacturing tolerances is buffered, thereby reducing the influence of the semiconductor module 1 due to manufacturing tolerances. The actual value of the gap is brought to the design value, the heat dissipation performance of the electronic device of the present invention is stabilized, the stress on the solder joint between the connecting portion 101 and the printed circuit board 20 is reduced, the solder joint is prevented from being damaged, and the reliability of the electronic device is improved. Sex.

Although a few embodiments have been described above, these embodiments are by way of example only. Given, and is not intended to limit the scope of this creation. The appended claims are intended to cover all such modifications, alternatives and modifications

1‧‧‧Semiconductor Module

10‧‧‧ pin

11‧‧‧ Body Department

101‧‧‧Connecting Department

102‧‧‧ buffer

110‧‧‧Installation surface

Claims (9)

A semiconductor module includes: a body portion and a lead extending from the body portion; a bottom surface of the body portion is defined as a mounting surface, and the pin includes a bent angle at a certain angle with the mounting surface and is used to establish electrical properties with the printed circuit board A connected connection portion and a buffer portion for buffering the force received by the body portion and/or the pin. The semiconductor module according to claim 1, wherein the force received by the body portion and/or the pin includes a force transmission between the body portion and the pin, a force received by the body portion, and a pin receiving Force. The semiconductor module according to claim 1, wherein the direction of the force is, for example, the width direction X, the length direction Y, and/or the height direction Z of the body portion. The semiconductor module according to claim 1, wherein an angle between the connecting portion and the mounting surface of the body portion can be any angle within a range of 30 to 150 degrees, and a preferred angle range is 45 to 135 degrees. An electronic device comprising: the semiconductor module, the printed circuit board, and the heat dissipation substrate according to any one of claims 1 to 4, wherein a mounting surface of the semiconductor module is mounted on the heat dissipation substrate, and the semiconductor module The connecting portion passes through the mounting through hole on the printed circuit board to establish an electrical connection between the semiconductor module and the printed circuit board. The electronic device of claim 5, wherein the semiconductor module and the printed circuit board are electrically connected by a connecting material. The electronic device of claim 6, wherein the connecting material is solder. The electronic device of claim 5, wherein the electronic device is a car Electronic control unit or electric power controller. A vehicle comprising: the electronic device according to any one of claims 5 to 8, wherein the vehicle may be any short distance such as an electric scooter, an electric bicycle, an electric tricycle, a small electric four-wheeled vehicle, or the like. , small capacity, low power vehicles.