JP2016181563A - 熱処理装置 - Google Patents
熱処理装置 Download PDFInfo
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- JP2016181563A JP2016181563A JP2015060130A JP2015060130A JP2016181563A JP 2016181563 A JP2016181563 A JP 2016181563A JP 2015060130 A JP2015060130 A JP 2015060130A JP 2015060130 A JP2015060130 A JP 2015060130A JP 2016181563 A JP2016181563 A JP 2016181563A
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- Prior art keywords
- heat treatment
- treatment apparatus
- gas introduction
- processing container
- processing
- Prior art date
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 48
- 238000012545 processing Methods 0.000 claims abstract description 100
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 12
- 239000010935 stainless steel Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 6
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 3
- 230000009975 flexible effect Effects 0.000 abstract description 19
- 238000005260 corrosion Methods 0.000 abstract description 12
- 230000007797 corrosion Effects 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 131
- 235000012431 wafers Nutrition 0.000 description 15
- 239000007769 metal material Substances 0.000 description 9
- 238000010926 purge Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000011144 upstream manufacturing Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
該処理容器と離間して設けられたバルブユニットと、
該バルブユニットと前記処理容器の所定のガス導入部との間に変形可能に連結され、前記バルブユニットを介して処理ガスを前記処理容器内に導入可能なフッ素樹脂チューブと、を有する。
27 ウエハボート
50 ガス導入配管
51 フッ素樹脂チューブ
52、53 カバー部材
55 インジェクタ
60、61、62、63、64 継手
70 バルブユニット
71 バルブモジュール
72、73 バルブ
80 ガス配管
90 ガス供給源
Claims (17)
- 熱処理を行う処理容器と、
該処理容器と離間して設けられたバルブユニットと、
該バルブユニットと前記処理容器の所定のガス導入部との間に変形可能に連結され、前記バルブユニットを介して処理ガスを前記処理容器内に導入可能なフッ素樹脂チューブと、を有する熱処理装置。 - 前記フッ素樹脂チューブは、前記処理容器及び前記バルブユニットと、少なくとも1つの継手を介して着脱可能に連結されている請求項1に記載の熱処理装置。
- 前記フッ素樹脂チューブと前記処理容器との間には、前記継手を介して、金属からなる短管が接続された請求項2に記載の熱処理装置。
- 前記処理容器と前記フッ素樹脂チューブとの間の前記短管は、複数の短管からなり、各々が前記継手を介して接続されている請求項3に記載の熱処理装置。
- 前記処理容器を貫通し、前記処理容器内に前記処理ガスを供給するインジェクタを有し、
該インジェクタは、前記所定のガス導入部に連結され、
前記複数の短管の1つは、前記継手を介して前記所定のガス導入部に直接接続されている請求項4に記載の熱処理装置。 - 前記フッ素樹脂チューブと前記バルブユニットとの間には、前記継手を介して、金属からなる短管が接続された請求項2乃至5のいずれか一項に記載の熱処理装置。
- 前記処理容器の前記所定のガス導入部は、前記処理容器の下端付近の外側面に設けられている請求項1乃至6のいずれか一項に記載の熱処理装置。
- 前記フッ素樹脂チューブは、テトラフルオロエチレン・パーフルオロアルキルビニルエーテル共重合体又はテトラフルオロエチレンからなる請求項1乃至7のいずれか一項に記載の熱処理装置。
- 前記フッ素樹脂チューブの外周面を覆うカバー部材を更に有する請求項1乃至8のいずれか一項に記載の熱処理装置。
- 前記カバー部材は、前記フッ素樹脂チューブと同一材料からなる請求項9に記載の熱処理装置。
- 前記カバー部材は、前記フッ素樹脂チューブと異なる材料からなる請求項9に記載の熱処理装置。
- 前記カバー部材は、金属からなる請求項11に記載の熱処理装置。
- 前記カバー部材は、金属箔又は金属テープである請求項12に記載の熱処理装置。
- 前記金属箔又は金属テープはアルミニウム箔又はアルミニウムテープである請求項13に記載の熱処理装置。
- 前記カバー部材は、金属管である請求項12に記載の熱処理装置。
- 前記金属管はステンレス鋼からなる請求項15に記載の熱処理装置。
- 前記バルブユニットには、複数の前記フッ素樹脂チューブが集約的に接続された請求項1乃至16のいずれか一項に記載の熱処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015060130A JP6486160B2 (ja) | 2015-03-23 | 2015-03-23 | 熱処理装置 |
KR1020160032534A KR102105225B1 (ko) | 2015-03-23 | 2016-03-18 | 열처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2015060130A JP6486160B2 (ja) | 2015-03-23 | 2015-03-23 | 熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016181563A true JP2016181563A (ja) | 2016-10-13 |
JP6486160B2 JP6486160B2 (ja) | 2019-03-20 |
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JP2015060130A Active JP6486160B2 (ja) | 2015-03-23 | 2015-03-23 | 熱処理装置 |
Country Status (2)
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JP (1) | JP6486160B2 (ja) |
KR (1) | KR102105225B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018178236A (ja) * | 2017-04-21 | 2018-11-15 | 東京エレクトロン株式会社 | 基板処理装置、処理ガスノズル内のパーティクルコーティング方法及び基板処理方法 |
Families Citing this family (1)
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JP6925214B2 (ja) * | 2017-09-22 | 2021-08-25 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6158786U (ja) * | 1984-09-21 | 1986-04-19 | ||
JPS6294922A (ja) * | 1985-10-22 | 1987-05-01 | Fuji Photo Film Co Ltd | プラズマcvd法による製膜装置 |
JPH06232080A (ja) * | 1993-02-01 | 1994-08-19 | Matsushita Electric Ind Co Ltd | プラズマ加工装置 |
JP2000081200A (ja) * | 1998-09-07 | 2000-03-21 | Tokyo Electron Ltd | ガス供給システム |
JP2001126998A (ja) * | 1999-10-28 | 2001-05-11 | Tokyo Electron Ltd | 処理装置 |
JP2002299327A (ja) * | 2001-03-30 | 2002-10-11 | Tokyo Electron Ltd | 熱処理装置及び熱処理方法 |
JP2006112507A (ja) * | 2004-10-14 | 2006-04-27 | Tohoku Univ | フッ素樹脂2層チューブ及びその製造方法 |
JP2007088166A (ja) * | 2005-09-21 | 2007-04-05 | Hitachi Kokusai Electric Inc | 基板処理装置 |
WO2010113946A1 (ja) * | 2009-03-31 | 2010-10-07 | 東京エレクトロン株式会社 | 処理装置 |
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2015
- 2015-03-23 JP JP2015060130A patent/JP6486160B2/ja active Active
-
2016
- 2016-03-18 KR KR1020160032534A patent/KR102105225B1/ko active IP Right Grant
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6158786U (ja) * | 1984-09-21 | 1986-04-19 | ||
JPS6294922A (ja) * | 1985-10-22 | 1987-05-01 | Fuji Photo Film Co Ltd | プラズマcvd法による製膜装置 |
JPH06232080A (ja) * | 1993-02-01 | 1994-08-19 | Matsushita Electric Ind Co Ltd | プラズマ加工装置 |
JP2000081200A (ja) * | 1998-09-07 | 2000-03-21 | Tokyo Electron Ltd | ガス供給システム |
JP2001126998A (ja) * | 1999-10-28 | 2001-05-11 | Tokyo Electron Ltd | 処理装置 |
JP2002299327A (ja) * | 2001-03-30 | 2002-10-11 | Tokyo Electron Ltd | 熱処理装置及び熱処理方法 |
JP2006112507A (ja) * | 2004-10-14 | 2006-04-27 | Tohoku Univ | フッ素樹脂2層チューブ及びその製造方法 |
JP2007088166A (ja) * | 2005-09-21 | 2007-04-05 | Hitachi Kokusai Electric Inc | 基板処理装置 |
WO2010113946A1 (ja) * | 2009-03-31 | 2010-10-07 | 東京エレクトロン株式会社 | 処理装置 |
JP2010255103A (ja) * | 2009-03-31 | 2010-11-11 | Tokyo Electron Ltd | 処理装置 |
US20120055402A1 (en) * | 2009-03-31 | 2012-03-08 | Tokyo Electron Limited | Processing apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018178236A (ja) * | 2017-04-21 | 2018-11-15 | 東京エレクトロン株式会社 | 基板処理装置、処理ガスノズル内のパーティクルコーティング方法及び基板処理方法 |
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Publication number | Publication date |
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KR102105225B1 (ko) | 2020-04-27 |
KR20160113977A (ko) | 2016-10-04 |
JP6486160B2 (ja) | 2019-03-20 |
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