JP2016171150A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2016171150A JP2016171150A JP2015048890A JP2015048890A JP2016171150A JP 2016171150 A JP2016171150 A JP 2016171150A JP 2015048890 A JP2015048890 A JP 2015048890A JP 2015048890 A JP2015048890 A JP 2015048890A JP 2016171150 A JP2016171150 A JP 2016171150A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 136
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 14
- 229910052721 tungsten Inorganic materials 0.000 claims description 14
- 239000010937 tungsten Substances 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 6
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- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
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- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 6
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- 230000015572 biosynthetic process Effects 0.000 description 5
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- 238000005229 chemical vapour deposition Methods 0.000 description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- 238000002161 passivation Methods 0.000 description 2
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- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
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- 229910052796 boron Inorganic materials 0.000 description 1
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Abstract
Description
本実施形態の半導体装置は、半導体層と、半導体層上に設けられる第1の絶縁膜と、第1の絶縁膜上に設けられる第1の導電層と、半導体層上及び第1の導電層上に設けられる第2の絶縁膜と、第2の絶縁膜上に設けられる第2の導電層と、半導体層と第2の導電層とを接続する第1のコンタクト部と、第1の導電層と第2の導電層とを接続する第2のコンタクト部と、を備え、半導体層と第1のコンタクト部に隣接する第2の絶縁膜の上部との距離よりも半導体層と第2のコンタクト部に隣接する第2の絶縁膜の上部との距離が大きく、第2のコンタクト部の幅が第1のコンタクト部の幅よりも幅が広い。
エミッタ電極26が、バリアメタルを含む場合、ダミーゲート配線層(第1の導電層)30とエミッタ電極(第2の導電層)26が、バリアメタルで接することになる。
本実施形態の半導体装置は、第2のコンタクト部に設けられ、コンタクトプラグと同一の材料の側壁を、更に備えること以外は、第1の実施形態と同様である。したがって、第1の実施形態と重複する内容については一部記述を省略する。
図10は、本実施形態の第1の変形例のセル内のコンタクト部のパターンを示す平面図である。本変形例では、第2のコンタクト部52がY方向に隣接して複数存在する。
図11は、本実施形態の第2の変形例のコンタクト部のパターンを示す平面図である。本変形例では、第2のコンタクト部52の端部の半導体層の表面と平行な面(XY平面)における形状が凹凸状である。
図12は、本実施形態の第3の変形例のコンタクト部のパターンを示す平面図である。本変形例では、第2のコンタクト部52の端部の半導体層の表面と平行な面(XY平面)における形状が波状である。
(第3の実施形態)
本実施形態の半導体装置は、物理的に独立した第2の導電層と第3の導電層とを備える点で、第2の実施形態と異なる。以下、第2の実施形態と重複する内容については一部記述を省略する。
本実施形態の半導体装置は、半導体層と第1のコンタクト部に隣接する層間絶縁膜(第2の絶縁膜)の上部との距離と、半導体層と第2のコンタクト部に隣接する層間絶縁膜(第2の絶縁膜)の上部との距離が略同一であること以外は、第2の実施形態と同様である。したがって、第2の実施形態と重複する内容については一部記述を省略する。
本実施形態の半導体装置は、物理的に独立した第2の導電層と第3の導電層とを備える点で、第3の実施形態と異なる。以下、第3の実施形態と重複する内容については一部記述を省略する。
24 n+型エミッタ層(半導体層)
26 エミッタ電極(第2の導電層)
28 絶縁膜(第1の絶縁膜)
30 ダミーゲート配線層(第1の導電層)
32 層間絶縁膜(第2の絶縁膜)
44 ゲート配線層(第1の導電層)
46 ゲート配線電極(第3の導電層)
50 第1のコンタクト部
52 第2のコンタクト部
54 コンタクトプラグ
60 側壁
100 IGBT(半導体装置)
200 IGBT(半導体装置)
300 IGBT(半導体装置)
400 IGBT(半導体装置)
Claims (16)
- 半導体層と、
前記半導体層上に設けられる第1の絶縁膜と、
前記第1の絶縁膜上に設けられる第1の導電層と、
前記半導体層上及び前記第1の導電層上に設けられる第2の絶縁膜と、
前記第2の絶縁膜上に設けられる第2の導電層と、
前記半導体層と前記第2の導電層とを接続する第1のコンタクト部と、
前記第1の導電層と前記第2の導電層とを接続する第2のコンタクト部と、を備え、
前記半導体層と前記第1のコンタクト部に隣接する前記第2の絶縁膜の上部との距離よりも、前記半導体層と前記第2のコンタクト部に隣接する前記第2の絶縁膜の上部との距離が大きく、
前記第2のコンタクト部の幅が前記第1のコンタクト部の幅よりも幅が広い半導体装置。 - 前記第1のコンタクト部に設けられ、前記第2の導電層と異なる材料のコンタクトプラグを、更に備える請求項1記載の半導体装置。
- 前記第2のコンタクト部に設けられ、前記コンタクトプラグと同一の材料の側壁を、更に備える請求項2記載の半導体装置。
- 前記第2のコンタクト部の前記第1の導電層側で、前記第2の導電層が前記第1の導電層に接する請求項3記載の半導体装置。
- 前記第1の導電層が多結晶シリコンであり、前記コンタクトプラグがタングステン(W)を含み、前記第2の導電層がアルミニウム(Al)を含む請求項4記載の半導体装置。
- 前記第2のコンタクト部が隣接して複数存在する請求項4又は請求項5記載の半導体装置。
- 前記第2のコンタクト部の端部の前記半導体層の表面と平行な面における形状が凹凸状である請求項4又は請求項5記載の半導体装置。
- 前記第2のコンタクト部の端部の前記半導体層の表面と平行な面における形状が波状である請求項4又は請求項5記載の半導体装置。
- 半導体層と、
前記半導体層上に設けられる第1の絶縁膜と、
前記第1の絶縁膜上に設けられる第1の導電層と、
前記半導体層上に設けられる第2の絶縁膜と、
前記第1の導電層上に設けられる第3の絶縁膜と、
前記第2の絶縁膜上に設けられる第2の導電層と、
前記第3の絶縁膜上に設けられる第3の導電層と、
前記半導体層と前記第2の導電層とを接続する第1のコンタクト部と、
前記第1の導電層と前記第3の導電層とを接続し、前記第1のコンタクト部の幅よりも幅が広い、第2のコンタクト部と、
前記第1のコンタクト部に設けられ、前記第2の導電層及び前記第3の導電層と異なる材料のコンタクトプラグと、
前記第2のコンタクト部に設けられ、前記コンタクトプラグと同一の材料の側壁と、
を備える半導体装置。 - 前記第2のコンタクト部の前記第1の導電層側で、前記第3の導電層が前記第1の導電層に接する請求項9記載の半導体装置。
- 前記第1の導電層が多結晶シリコンであり、前記コンタクトプラグがタングステン(W)を含み、前記第2の導電層及び前記第3の導電層がアルミニウム(Al)を含む請求項9又は請求項10記載の半導体装置。
- 前記第2のコンタクト部が隣接して複数存在する請求項10又は請求項11記載の半導体装置。
- 前記第2のコンタクト部の端部の前記半導体層の表面と平行な面における形状が凹凸状である請求項10又は請求項11記載の半導体装置。
- 前記第2のコンタクト部の端部の前記半導体層の表面と平行な面における形状が波状である請求項10又は請求項11記載の半導体装置。
- 前記半導体層と前記第1のコンタクト部に隣接する前記第2の絶縁膜の上部との距離よりも、前記半導体層と前記第2のコンタクト部に隣接する前記第3の絶縁膜の上部との距離が大きい請求項9乃至請求項14いずれか一項記載の半導体装置。
- 前記第2の導電層と前記第3の導電層が物理的に連続する請求項9乃至請求項15いずれか一項記載の半導体装置。
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CN109524396B (zh) * | 2017-09-20 | 2023-05-12 | 株式会社东芝 | 半导体装置 |
CN108428740B (zh) * | 2018-02-13 | 2020-09-04 | 株洲中车时代电气股份有限公司 | 一种具有含虚栅的复合栅结构的igbt芯片 |
CN108987398B (zh) * | 2018-09-11 | 2023-09-12 | 长鑫存储技术有限公司 | 半导体器件及其制备方法 |
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US20160268193A1 (en) | 2016-09-15 |
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