JP2016171108A - 半導体製造装置 - Google Patents
半導体製造装置 Download PDFInfo
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Abstract
Description
図1は、第1実施形態の半導体パッケージ1の構造を示す断面図である。
図7は、第2実施形態の半導体製造装置の構造を示す上面図である。
図8は、第3実施形態の半導体製造装置の動作を説明するための断面図である。
3:ターゲット、3a:第1ターゲット、3b:第2ターゲット、
11:回路基板、11a:絶縁基板、11b:第1配線層、11c:第2配線層、
11d:第1絶縁膜、11e:第2絶縁膜、11f:パッド部、11g:パッド部、
12:半導体チップ、12a:パッド部、
13:制御チップ、13a:パッド部、14:封止層、
15:シールド層、15a:第1シールド層、15b:第2シールド層、
16:接着剤、17:ボンディングワイヤ、18:ソルダーボール、
21:ロードロック室、22:エッチング室、23:スパッタ室、24:仕切り板、
31:キャリア、32:ターゲット保持部、
32a:S極部分、32b:N極部分、32c:本体部、
33:移動ステージ、34:ベルト搬送部、35:モーター、36:制御部
Claims (5)
- 第1方向に延びる第1および第2端部と、前記第1方向と異なる第2方向に延び、前記第1および第2端部よりも長い第3および第4端部とを有し、成膜対象物を搭載可能なキャリアと、
第1極性を有する1つ以上の第1磁極部分と、前記第1極性と異なる第2極性を有する1つ以上の第2磁極部分とが配置されたマグネット配置面を有し、前記マグネット配置面は、前記第1方向に延びる第5および第6端部と、前記第2方向に延び、前記第5および第6端部よりも長い第7および第8端部とを有し、前記成膜対象物に膜を形成する材料となる部材を前記第1および第2磁極部分の付近に保持可能な部材保持部と、
前記部材保持部の下方において、前記キャリアを前記第1方向に沿って搬送するキャリア搬送部とを備え、
前記第5および第6端部は、前記第1および第2端部よりも短く、
前記第7および第8端部は、前記第3および第4端部よりも長く、
前記キャリア搬送部は、前記第3および第4端部が、前記マグネット配置面の前記第2方向に平行な中心線の下を通過するように前記キャリアを搬送可能である、
半導体製造装置。 - 前記部材保持部は、前記マグネット配置面として、N個(Nは2以上の整数)の部材を保持可能なN個のマグネット配置面を有する、請求項1に記載の半導体製造装置。
- 前記キャリア搬送部は、前記部材から前記成膜対象物に粒子が飛散する際に、前記第3および第4端部の一方のみが前記第7端部の下を通過し、前記第3および第4端部の他方のみが前記第8端部の下を通過するように、前記キャリアを往復移動させる、請求項1または2に記載の半導体製造装置。
- 前記キャリアは、前記成膜対象物としての複数の半導体パッケージが搭載された複数のトレイを搭載可能である、請求項1から3のいずれか1項に記載の半導体製造装置。
- 前記トレイは、前記トレイの長辺が前記第1方向と平行になるように前記キャリアに搭載される、請求項4に記載の半導体製造装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015048200A JP6313250B2 (ja) | 2015-03-11 | 2015-03-11 | 半導体製造装置 |
TW104122065A TWI570827B (zh) | 2015-03-11 | 2015-07-07 | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
US14/799,798 US9758863B2 (en) | 2015-03-11 | 2015-07-15 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
CN201510425277.3A CN105977247B (zh) | 2015-03-11 | 2015-07-17 | 半导体制造装置及半导体装置的制造方法 |
US15/699,704 US10487393B2 (en) | 2015-03-11 | 2017-09-08 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
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JP2015048200A JP6313250B2 (ja) | 2015-03-11 | 2015-03-11 | 半導体製造装置 |
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JP2016171108A true JP2016171108A (ja) | 2016-09-23 |
JP6313250B2 JP6313250B2 (ja) | 2018-04-18 |
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JP2015048200A Active JP6313250B2 (ja) | 2015-03-11 | 2015-03-11 | 半導体製造装置 |
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US (2) | US9758863B2 (ja) |
JP (1) | JP6313250B2 (ja) |
CN (1) | CN105977247B (ja) |
TW (1) | TWI570827B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20180042800A (ko) * | 2016-10-18 | 2018-04-26 | 가부시키가이샤 무라타 세이사쿠쇼 | 회로모듈의 제조 방법 및 성막 장치 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US20160265101A1 (en) | 2016-09-15 |
TWI570827B (zh) | 2017-02-11 |
TW201633421A (zh) | 2016-09-16 |
US10487393B2 (en) | 2019-11-26 |
JP6313250B2 (ja) | 2018-04-18 |
CN105977247B (zh) | 2018-07-10 |
US9758863B2 (en) | 2017-09-12 |
CN105977247A (zh) | 2016-09-28 |
US20170369988A1 (en) | 2017-12-28 |
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