JP2016149531A - 積層セラミック電子部品及びその実装基板 - Google Patents
積層セラミック電子部品及びその実装基板 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 152
- 239000010410 layer Substances 0.000 claims abstract description 75
- 239000011241 protective layer Substances 0.000 claims abstract description 19
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000003985 ceramic capacitor Substances 0.000 description 17
- 238000005452 bending Methods 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 238000007747 plating Methods 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000005534 acoustic noise Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/242—Terminals the capacitive element surrounding the terminal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
図3は図1の積層セラミック電子部品が印刷回路基板に実装された形状を示す斜視図である。
110 セラミック本体
111 誘電体層
112 第1保護層
113 第2保護層
121 第1内部電極
122 第2内部電極
123 第1フローティング電極
124 第2フローティング電極
131 第1外部電極
132 第2外部電極
141 第1ダミー電極
142 第2ダミー電極
143 第3ダミー電極
144 第4ダミー電極
145 第5ダミー電極
200 実装基板
210 印刷回路基板
221 第1電極パッド
222 第2電極パッド
230 半田
Claims (14)
- 複数の第1誘電体層及び複数の第2誘電体層が交互に配置される容量形成層を含むセラミック本体と、
前記セラミック本体の長さ方向の両側面に配置される外部電極と、を含み、
前記容量形成層は、前記複数の第1誘電体層上に互いに離れて配置され、前記セラミック本体の長さ方向の両側面に露出して前記外部電極と連結される第1及び第2内部電極、前記第1及び第2内部電極と離れて配置された第1フローティング電極(floating electrode)、及び前記複数の第2誘電体層上に配置され、前記第1及び第2内部電極の一部と重なる第2フローティング電極を含み、
前記セラミック本体は、前記セラミック本体の上面及び下面の少なくとも一面と前記容量形成層の間に配置され、前記セラミック本体の長さ方向の両側面に露出する第1及び第2ダミー電極が配置され、前記第1及び第2ダミー電極の間に互いに離れて配置された複数の第3ダミー電極が配置された複数の第3誘電体層を有する保護層をさらに含む、積層セラミック電子部品。 - 前記複数の第3ダミー電極は、前記セラミック本体の長さ方向の中心に位置し、前記第1及び第2ダミー電極と離れて配置される、請求項1に記載の積層セラミック電子部品。
- 前記複数の第3ダミー電極は、前記第2フローティング電極に対応する位置に配置される、請求項1に記載の積層セラミック電子部品。
- 前記容量形成層は、前記セラミック本体の長さ方向の両側面にそれぞれ露出し、前記複数の第2誘電体層上に配置される第4及び第5ダミー電極をさらに含み、
前記第2フローティング電極は、前記セラミック本体の長さ方向の中心に位置し、前記第4及び第5ダミー電極と離れて配置される、請求項1から3のいずれか一項に記載の積層セラミック電子部品。 - 前記セラミック本体の厚さ方向における前記複数の第3ダミー電極間の間隔は、前記セラミック本体の厚さ方向における前記第1フローティング電極と第2フローティング電極の間の間隔より小さい、請求項1から4のいずれか一項に記載の積層セラミック電子部品。
- 前記セラミック本体の厚さ方向における前記複数の第3ダミー電極間の間隔T1と、前記セラミック本体の厚さ方向における前記第1フローティング電極と第2フローティング電極の間の間隔T2が、0.01×T2<T1<0.5×T2を満たす、請求項1から5のいずれか一項に記載の積層セラミック電子部品。
- 前記複数の第3誘電体層のうち一つの誘電体層上に配置された前記複数の第3ダミー電極の個数は2個以上10個以下である、請求項1から6のいずれか一項に記載の積層セラミック電子部品。
- 前記セラミック本体の上面及び下面の少なくとも一面と前記容量形成層の間に配置された保護層の厚さTcと、前記第1及び第2ダミー電極が配置された領域の全体の厚さTdが、0.1×Tc≦Td<0.99×Tcを満たす、請求項1から7のいずれか一項に記載の積層セラミック電子部品。
- 前記外部電極は、前記セラミック本体の長さ方向の両側面から前記セラミック本体の上面、下面及び幅方向の両側面の少なくとも一面に延長されて配置される、請求項1から8のいずれか一項に記載の積層セラミック電子部品。
- 前記セラミック本体の長さ方向における前記複数の第3ダミー電極の最外側の両端部の間の長さLpと、前記セラミック本体の上面、下面及び幅方向の両側面の少なくとも一面に延長されて配置される前記外部電極の間の間隔Lc'と、前記セラミック本体の長さ方向の長さLcが、1.1×Lc'≦Lp<0.95×Lcを満たす、請求項9に記載の積層セラミック電子部品。
- 前記セラミック本体の長さ方向の一側面から前記複数の第3ダミー電極のうち最外側の第3ダミー電極の端部までの間隔Lmと、前記セラミック本体の長さ方向の一側面から前記セラミック本体の上面、下面及び幅方向の両側面に延長されて配置された前記外部電極の端部までの長さLbが、Lm≦0.95×Lbを満たす、請求項9または10に記載の積層セラミック電子部品。
- 前記セラミック本体の長さ方向における前記第1及び第2内部電極の少なくとも一つの長さLp'と、前記セラミック本体の長さ方向の一側面から前記セラミック本体の上面、下面及び幅方向の両側面の少なくとも一面に延長されて配置された前記外部電極の端部までの長さLbが、1.1×Lb≦Lp'を満たす、請求項9から11のいずれか一項に記載の積層セラミック電子部品。
- 前記セラミック本体の長さ方向の一側面から前記複数の第3ダミー電極のうち最外側の第3ダミー電極の端部までの間隔Lmと前記セラミック本体の長さ方向における前記第1及び第2ダミー電極の少なくとも一つの長さLdとの差(Lm−Ld)と、前記セラミック本体の長さ方向の長さLcが、0.01×Lc<Lm−Ldを満たす、請求項1から12のいずれか一項に記載の積層セラミック電子部品。
- 上部に第1及び第2電極パッドを有する印刷回路基板と、
前記印刷回路基板上に設置された請求項1から13のいずれか一項に記載の積層セラミック電子部品と、を含む、積層セラミック電子部品の実装基板。
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KR1020150022131A KR102149790B1 (ko) | 2015-02-13 | 2015-02-13 | 적층 세라믹 전자부품 및 그 실장 기판 |
KR10-2015-0022131 | 2015-02-13 |
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JP2016149531A true JP2016149531A (ja) | 2016-08-18 |
JP6828955B2 JP6828955B2 (ja) | 2021-02-10 |
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US (1) | US9490068B2 (ja) |
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Cited By (1)
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JP6378122B2 (ja) * | 2014-12-05 | 2018-08-22 | 太陽誘電株式会社 | 積層セラミック電子部品 |
KR102149791B1 (ko) * | 2015-02-13 | 2020-08-31 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 실장 기판 |
JP2017103375A (ja) * | 2015-12-03 | 2017-06-08 | 株式会社村田製作所 | 積層セラミック電子部品 |
US10410794B2 (en) * | 2016-07-11 | 2019-09-10 | Kemet Electronics Corporation | Multilayer ceramic structure |
KR102499465B1 (ko) * | 2017-12-06 | 2023-02-14 | 삼성전기주식회사 | 적층형 커패시터 |
KR102703774B1 (ko) * | 2018-10-10 | 2024-09-04 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR20190116176A (ko) * | 2019-09-19 | 2019-10-14 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
US20230080124A1 (en) * | 2020-02-11 | 2023-03-16 | Amotech Co., Ltd. | Broadband capacitor |
US20210327646A1 (en) * | 2020-04-20 | 2021-10-21 | Kemet Electronics Corporation | Multi-Terminal MLCC for Improved Heat Dissipation |
KR20210129357A (ko) * | 2020-04-20 | 2021-10-28 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
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- 2015-12-30 US US14/984,328 patent/US9490068B2/en active Active
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WO2006129783A1 (ja) * | 2005-06-03 | 2006-12-07 | Murata Manufacturing Co., Ltd. | 積層セラミックコンデンサ |
JP2014165492A (ja) * | 2013-02-26 | 2014-09-08 | Samsung Electro-Mechanics Co Ltd | 多層セラミック素子 |
US20140293500A1 (en) * | 2013-03-29 | 2014-10-02 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111029140A (zh) * | 2018-10-10 | 2020-04-17 | 三星电机株式会社 | 多层陶瓷电子组件 |
CN111029140B (zh) * | 2018-10-10 | 2022-09-23 | 三星电机株式会社 | 多层陶瓷电子组件 |
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JP6828955B2 (ja) | 2021-02-10 |
US9490068B2 (en) | 2016-11-08 |
KR20160099881A (ko) | 2016-08-23 |
US20160240310A1 (en) | 2016-08-18 |
KR102149790B1 (ko) | 2020-08-31 |
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