JP2016122800A - 配線層形成方法、配線層形成システムおよび記憶媒体 - Google Patents
配線層形成方法、配線層形成システムおよび記憶媒体 Download PDFInfo
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- 239000002184 metal Substances 0.000 claims abstract description 68
- 238000007747 plating Methods 0.000 claims abstract description 56
- 238000005530 etching Methods 0.000 claims abstract description 35
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910000531 Co alloy Inorganic materials 0.000 claims description 3
- 238000004590 computer program Methods 0.000 claims description 2
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- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
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- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
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- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
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- 239000005750 Copper hydroxide Substances 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
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- 230000004931 aggregating effect Effects 0.000 description 1
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
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- 150000001879 copper Chemical class 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
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- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
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- 230000006872 improvement Effects 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
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- 229910021645 metal ion Inorganic materials 0.000 description 1
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- 150000002941 palladium compounds Chemical class 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
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- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- C—CHEMISTRY; METALLURGY
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
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Abstract
Description
図1乃至図5により本発明の一実施の形態について説明する。
このうち基板回転保持機構110は、図4および図5に示すように、ケーシング101内で上下に伸延する中空円筒状の回転軸111と、回転軸111の上端部に取り付けられたターンテーブル112と、ターンテーブル112の上面外周部に設けられ、基板2を支持するウエハチャック113と、回転軸111を回転駆動する回転機構162と、を有している。このうち回転機構162は、制御機構160により制御され、回転機構162によって回転軸111が回転駆動され、これによって、ウエハチャック113により支持されている基板2が回転される。
次に、基板2から飛散しためっき液や洗浄液などを排出する液排出機構120,125,130について、図4を参照して説明する。図4に示すように、ケーシング101内には、昇降機構164により上下方向に駆動され、排出口124,129,134を有するカップ105が配置されている。液排出機構120,125,130は、それぞれ排出口124,129,134に集められる液を排出するものとなっている。
次にこのような構成からなる本実施の形態の作用について、図2および図3により説明する。
以下、本実施の形態の変形例について説明する。
2a 凹部
10 配線層形成システム
11 基板搬送アーム
12 密着層形成部
13 触媒層形成部
14 バリア層形成部
15 焼きしめ部
16 シード層形成部
17 配線層形成部
18 カセットステーション
19 制御部
19A 記憶媒体
21 密着層
22 触媒層
23 バリア層
24 シード層
25 メタル層
26 レジストパターン
26a 開口
27 配線層
30 レジストパターン形成部
31 レジストパターン除去部
32 エッチング処理部
Claims (9)
- 基板に対して配線層を形成する配線層形成方法において、
凹部を有する基板を準備する工程と、
前記基板の表面および前記凹部内面にバリア層およびシード層からなるメタル層を形成する工程と、
前記基板のメタル層上に前記凹部を囲む開口を有するレジストパターンを形成する工程と、
前記レジストパターンの開口からめっき液を供給するめっき処理により前記凹部内に配線層を設ける工程と、
前記基板上の前記メタル層のうち、前記配線層の外方に位置するメタル層をエッチング処理により除去する工程とを備え、
前記メタル層のシード層は、無電解めっき処理により形成されていることを特徴とする配線層形成方法。 - 前記メタル層のバリア層は、無電解めっき処理により形成されていることを特徴とする請求項1記載の配線層形成方法。
- 前記メタル層のバリア層は、CVD又はPVDによる成膜処理により形成されていることを特徴とする請求項1記載の配線層形成方法。
- 前記メタル層の厚みは、200nm以下となっていることを特徴とする請求項1乃至3のいずれか記載の配線層形成方法。
- 前記バリア層はコバルト又はコバルト合金を含むことを特徴とする請求項1乃至4のいずれか記載の配線層形成方法。
- 前記シード層は銅又は銅合金を含むことを特徴とする請求項1乃至5のいずれか記載の配線層形成方法。
- 前記配線層は銅を含むめっき液を用いた電解めっき処理により形成されていることを特徴とする請求項1乃至6のいずれか記載の配線層形成方法。
- 基板に対して配線層を形成する配線層形成システムにおいて、
凹部を有する基板の表面および凹部内面にバリア層およびシード層からなるメタル層を形成するメタル形成部と、
前記基板上に前記凹部を囲む開口を有するレジストパターンを形成するレジストパターン形成部と、
前記レジストパターンの開口からめっき液を供給するめっき処理により前記凹部内に配線層を設ける配線層形成部と、
前記基板上の前記メタル層のうち、前記配線層の外方に位置するメタル層をエッチング処理により除去するエッチング処理部とを備え、
前記メタル層のシード層は、無電解めっき処理により形成されていることを特徴とする配線層形成システム。 - 配線層形成システムに配線層形成方法を実行させるためのコンピュータプログラムを格納した記憶媒体において、
前記配線層形成方法は、
凹部を有する基板を準備する工程と、
前記基板の表面および前記凹部内面にバリア層およびシード層からなるメタル層を形成する工程と、
前記基板のメタル層上に前記凹部を囲む開口を有するレジストパターンを形成する工程と、
前記レジストパターンの開口からめっき液を供給するめっき処理により前記凹部内に配線層を設ける工程と、
前記基板上の前記メタル層のうち、前記配線層の外方に位置するメタル層をエッチング処理により除去する工程とを備え、
前記メタル層のシード層は、無電解めっき処理により形成されていることを特徴とする記憶媒体。
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