JP2016105498A - ビルドアップ層に埋め込まれたロジックダイ及びその他コンポーネント - Google Patents
ビルドアップ層に埋め込まれたロジックダイ及びその他コンポーネント Download PDFInfo
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- JP2016105498A JP2016105498A JP2016011536A JP2016011536A JP2016105498A JP 2016105498 A JP2016105498 A JP 2016105498A JP 2016011536 A JP2016011536 A JP 2016011536A JP 2016011536 A JP2016011536 A JP 2016011536A JP 2016105498 A JP2016105498 A JP 2016105498A
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
- H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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Abstract
Description
Claims (11)
- 同一のバンプレスビルドアップレイヤ(BBUL)基板の複数のビルドアップ層であり、ラミネート層である複数のビルドアップ層と、
前記基板の外表面に配設された電気ルーティング機構と、
前記複数のビルドアップ層に埋め込まれた第一ロジックダイであり、当該第一ロジックダイの第1の面と、該第1の面とは反対側の当該第一ロジックダイの第2の面との間に1つ以上のシリコン貫通ビアを含む、第一ロジックダイと、
前記複数のビルドアップ層に埋め込まれた第2のダイと、
前記第2のダイと前記電気ルーティング機構との間で前記複数のビルドアップ層内に画成された第1の電気経路であり、電力又はグランドをルーティングし、且つ前記第一ロジックダイを迂回している第1の電気経路と、
前記第2のダイのアクティブ面から前記第一ロジックダイの前記1つ以上のシリコン貫通ビアまで前記複数のビルドアップ層内に画成された第2の電気経路であり、入力/出力(I/O)信号をルーティングする第2の電気経路と、
前記第一ロジックダイの前記第1の面から前記電気ルーティング機構まで前記複数のビルドアップ層内に画成された第3の電気経路であり、前記第一ロジックダイと前記電気ルーティング機構との間でI/O信号をルーティングするとともに、前記第一ロジックダイと前記電気ルーティング機構との間で電力又はグランドをルーティングする第3の電気経路と
を有し、
前記第1の電気経路は、前記複数のビルドアップ層のうちの2つのビルドアップ層の間に配置され且つ前記第一ロジックダイの前記第2の面と直接的に物理的に結合された導電層を含み、該導電層は、前記第一ロジックダイからファンアウトするように構成され、
前記2つのビルドアップ層は、前記第一ロジックダイが埋め込まれた第1のビルドアップ層と、前記第2のダイが埋め込まれた第2のビルドアップ層とを含み、前記第1のビルドアップ層は前記第2のビルドアップ層と接触しており、
前記第2の電気経路は、前記第2のダイまで前記第2のビルドアップ層を貫いて形成されたインターコネクトビアを含み、該インターコネクトビアは、前記第一ロジックダイを前記第2のダイに直接的に結合し、前記第2の電気経路は完全に、前記第一ロジックダイと前記第2のダイとの間に配置され、且つ
前記第一ロジックダイは、前記第2のダイと前記電気ルーティング機構との間に配置されている、
パッケージアセンブリ。 - 前記第2のダイは第二ロジックダイ又はメモリダイを有する、請求項1に記載のパッケージアセンブリ。
- 前記第2のダイは電力管理ダイを有する、請求項1に記載のパッケージアセンブリ。
- 前記導電層は第1の導電層であり、前記第1の電気経路は、前記第1のビルドアップ層と前記複数のビルドアップ層のうちの第3のビルドアップ層との間の第2の導電層を含み、該第2の導電層は、前記第1の導電層に平行であり、且つ前記電気ルーティング機構に前記第1の導電層より近く、前記第1のビルドアップ層は前記第3のビルドアップ層と直に接触している、請求項1に記載のパッケージアセンブリ。
- 前記第一ロジックダイ及び前記第2のダイは、前記複数のビルドアップ層内に完全に埋め込まれている、請求項1に記載のパッケージアセンブリ。
- 前記基板の前記外表面は第1の外表面であり、前記第一ロジックダイは前記複数のビルドアップ層内に完全に埋め込まれており、前記第2のダイの一方の面は、前記第1の外表面とは反対側の前記基板の第2の外表面と同一平面にある、請求項1に記載のパッケージアセンブリ。
- 前記電気ルーティング機構は、はんだインターコネクト構造を有する、請求項1に記載のパッケージアセンブリ。
- 前記第1の電気経路は、前記BBUL基板のそれぞれのラミネート層内の複数のビアを含み、前記複数のビアのうちの第1のビアは、前記第一ロジックダイの前記第1の面に平行な方向に前記複数のビアのうちの第2のビアからオフセットされている、請求項1に記載のパッケージアセンブリ。
- 印刷回路基板(PCB);並びに
パッケージアセンブリの外表面に配設された電気ルーティング機構により前記PCBと結合されたパッケージアセンブリ;
を有し、
前記パッケージアセンブリは:
同一のバンプレスビルドアップレイヤ(BBUL)基板の複数のビルドアップ層であり、ラミネート層である複数のビルドアップ層と、
前記複数のビルドアップ層に埋め込まれた第一ロジックダイであり、当該第一ロジックダイの第1の面と、該第1の面とは反対側の当該第一ロジックダイの第2の面との間に1つ以上のシリコン貫通ビアを含む、第一ロジックダイと、
前記複数のビルドアップ層に埋め込まれた第2のダイと、
前記第2のダイと前記電気ルーティング機構との間で前記複数のビルドアップ層内に画成された第1の電気経路であり、電力又はグランドをルーティングし、且つ前記第一ロジックダイを迂回している第1の電気経路と、
前記第2のダイのアクティブ面から前記第一ロジックダイの前記1つ以上のシリコン貫通ビアまで前記複数のビルドアップ層内に画成された第2の電気経路であり、入力/出力(I/O)信号をルーティングする第2の電気経路と、
前記第一ロジックダイの前記第1の面から前記電気ルーティング機構まで前記複数のビルドアップ層内に画成された第3の電気経路であり、前記第一ロジックダイと前記電気ルーティング機構との間でI/O信号をルーティングするとともに、前記第一ロジックダイと前記電気ルーティング機構との間で電力又はグランドをルーティングする第3の電気経路と
を有し、
前記第1の電気経路は、前記複数のビルドアップ層のうちの2つのビルドアップ層の間に配置され且つ前記第一ロジックダイの前記第2の面と直接的に物理的に結合された導電層を含み、該導電層は、前記第一ロジックダイからファンアウトするように構成され、
前記2つのビルドアップ層は、前記第一ロジックダイが埋め込まれた第1のビルドアップ層と、前記第2のダイが埋め込まれた第2のビルドアップ層とを含み、前記第1のビルドアップ層は前記第2のビルドアップ層と接触しており、
前記第2の電気経路は、前記第2のダイまで前記第2のビルドアップ層を貫いて形成されたインターコネクトビアを含み、該インターコネクトビアは、前記第一ロジックダイを前記第2のダイに直接的に結合し、前記第2の電気経路は完全に、前記第一ロジックダイと前記第2のダイとの間に配置され、且つ
前記第一ロジックダイは、前記第2のダイと前記電気ルーティング機構との間に配置されている、
システム。 - 前記PCBと結合されたタッチスクリーンディスプレイを更に有する請求項9に記載のシステム。
- 前記第1の電気経路は、前記BBUL基板のそれぞれのラミネート層内の複数のビアを含み、前記複数のビアのうちの第1のビアは、前記第一ロジックダイの前記第1の面に平行な方向に前記複数のビアのうちの第2のビアからオフセットされている、請求項9に記載のシステム。
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US13/684,110 US9496211B2 (en) | 2012-11-21 | 2012-11-21 | Logic die and other components embedded in build-up layers |
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Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10283443B2 (en) * | 2009-11-10 | 2019-05-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chip package having integrated capacitor |
US9202782B2 (en) * | 2013-01-07 | 2015-12-01 | Intel Corporation | Embedded package in PCB build up |
US9331054B2 (en) * | 2013-03-14 | 2016-05-03 | Mediatek Inc. | Semiconductor package assembly with decoupling capacitor |
US9595526B2 (en) * | 2013-08-09 | 2017-03-14 | Apple Inc. | Multi-die fine grain integrated voltage regulation |
US10468381B2 (en) | 2014-09-29 | 2019-11-05 | Apple Inc. | Wafer level integration of passive devices |
JP2017204511A (ja) * | 2016-05-10 | 2017-11-16 | ソニー株式会社 | 半導体装置、半導体装置の製造方法、及び、電子機器 |
US10660208B2 (en) * | 2016-07-13 | 2020-05-19 | General Electric Company | Embedded dry film battery module and method of manufacturing thereof |
JP6692258B2 (ja) | 2016-08-29 | 2020-05-13 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US10489544B2 (en) * | 2016-12-14 | 2019-11-26 | iCometrue Company Ltd. | Logic drive based on standard commodity FPGA IC chips |
JP6936584B2 (ja) * | 2017-02-22 | 2021-09-15 | 株式会社アムコー・テクノロジー・ジャパン | 電子デバイス及びその製造方法 |
US11081448B2 (en) * | 2017-03-29 | 2021-08-03 | Intel Corporation | Embedded die microelectronic device with molded component |
JP2019071393A (ja) * | 2017-10-11 | 2019-05-09 | イビデン株式会社 | プリント配線板 |
KR102450580B1 (ko) | 2017-12-22 | 2022-10-07 | 삼성전자주식회사 | 금속 배선 하부의 절연층 구조를 갖는 반도체 장치 |
JP7157028B2 (ja) * | 2019-09-17 | 2022-10-19 | アオイ電子株式会社 | 半導体装置および半導体装置の製造方法 |
KR102596756B1 (ko) * | 2019-10-04 | 2023-11-02 | 삼성전자주식회사 | PoP 구조의 반도체 패키지 |
CN111293078B (zh) * | 2020-03-17 | 2022-05-27 | 浙江大学 | 一种转接板正反两面空腔嵌入芯片的方法 |
KR20220059722A (ko) | 2020-11-03 | 2022-05-10 | 삼성전자주식회사 | Bs-pdn 구조를 가진 집적회로 칩 |
US11973057B2 (en) * | 2020-12-15 | 2024-04-30 | Analog Devices, Inc. | Through-silicon transmission lines and other structures enabled by same |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006093554A (ja) * | 2004-09-27 | 2006-04-06 | Sanyo Electric Co Ltd | 半導体集積回路装置 |
WO2009048154A1 (ja) * | 2007-10-12 | 2009-04-16 | Nec Corporation | 半導体装置及びその設計方法 |
WO2010101163A1 (ja) * | 2009-03-04 | 2010-09-10 | 日本電気株式会社 | 機能素子内蔵基板及びそれを用いた電子デバイス |
US20100309704A1 (en) * | 2009-06-05 | 2010-12-09 | Sriram Dattaguru | In-pakage microelectronic apparatus, and methods of using same |
JP2011086767A (ja) * | 2009-10-15 | 2011-04-28 | Renesas Electronics Corp | 半導体装置及び半導体装置の製造方法 |
US20120161331A1 (en) * | 2010-12-22 | 2012-06-28 | Javier Soto Gonzalez | Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same |
US20120161316A1 (en) * | 2010-12-22 | 2012-06-28 | Javier Soto Gonzalez | Substrate with embedded stacked through-silicon via die |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5227013A (en) * | 1991-07-25 | 1993-07-13 | Microelectronics And Computer Technology Corporation | Forming via holes in a multilevel substrate in a single step |
JP2001230515A (ja) | 2000-02-15 | 2001-08-24 | Matsushita Electric Ind Co Ltd | 電子部品の実装体、電子部品の実装体の製造方法、および実装体の二次実装構造。 |
JP2002270712A (ja) | 2001-03-14 | 2002-09-20 | Sony Corp | 半導体素子内蔵多層配線基板と半導体素子内蔵装置、およびそれらの製造方法 |
FI115285B (fi) | 2002-01-31 | 2005-03-31 | Imbera Electronics Oy | Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi |
US7615856B2 (en) * | 2004-09-01 | 2009-11-10 | Sanyo Electric Co., Ltd. | Integrated antenna type circuit apparatus |
US20070013080A1 (en) | 2005-06-29 | 2007-01-18 | Intel Corporation | Voltage regulators and systems containing same |
JP5245209B2 (ja) * | 2006-04-24 | 2013-07-24 | ソニー株式会社 | 半導体装置及びその製造方法 |
JP4976840B2 (ja) * | 2006-12-22 | 2012-07-18 | 株式会社東芝 | プリント配線板、プリント配線板の製造方法および電子機器 |
JP5138277B2 (ja) * | 2007-05-31 | 2013-02-06 | 京セラSlcテクノロジー株式会社 | 配線基板およびその製造方法 |
KR100885924B1 (ko) * | 2007-08-10 | 2009-02-26 | 삼성전자주식회사 | 묻혀진 도전성 포스트를 포함하는 반도체 패키지 및 그제조방법 |
US20090072382A1 (en) | 2007-09-18 | 2009-03-19 | Guzek John S | Microelectronic package and method of forming same |
US7834464B2 (en) * | 2007-10-09 | 2010-11-16 | Infineon Technologies Ag | Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device |
KR20100126714A (ko) * | 2008-01-30 | 2010-12-02 | 이노벤트 테크놀로지스, 엘엘씨 | 비아 디스크 제조를 위한 방법 및 장치 |
US8035216B2 (en) | 2008-02-22 | 2011-10-11 | Intel Corporation | Integrated circuit package and method of manufacturing same |
JP2010004028A (ja) | 2008-05-23 | 2010-01-07 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法、及び半導体装置 |
JP5001903B2 (ja) | 2008-05-28 | 2012-08-15 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
US8093704B2 (en) | 2008-06-03 | 2012-01-10 | Intel Corporation | Package on package using a bump-less build up layer (BBUL) package |
US10251273B2 (en) | 2008-09-08 | 2019-04-02 | Intel Corporation | Mainboard assembly including a package overlying a die directly attached to the mainboard |
CN102439719B (zh) | 2009-05-14 | 2015-06-24 | 高通股份有限公司 | 系统级封装 |
US8742561B2 (en) | 2009-12-29 | 2014-06-03 | Intel Corporation | Recessed and embedded die coreless package |
US8810008B2 (en) * | 2010-03-18 | 2014-08-19 | Nec Corporation | Semiconductor element-embedded substrate, and method of manufacturing the substrate |
US8754516B2 (en) | 2010-08-26 | 2014-06-17 | Intel Corporation | Bumpless build-up layer package with pre-stacked microelectronic devices |
US8354297B2 (en) * | 2010-09-03 | 2013-01-15 | Stats Chippac, Ltd. | Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die |
US8786066B2 (en) | 2010-09-24 | 2014-07-22 | Intel Corporation | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same |
US8304913B2 (en) | 2010-09-24 | 2012-11-06 | Intel Corporation | Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby |
US8466559B2 (en) * | 2010-12-17 | 2013-06-18 | Intel Corporation | Forming die backside coating structures with coreless packages |
JP2012248754A (ja) * | 2011-05-30 | 2012-12-13 | Lapis Semiconductor Co Ltd | 半導体装置の製造方法、及び半導体装置 |
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2012
- 2012-11-21 US US13/684,110 patent/US9496211B2/en active Active
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2013
- 2013-06-27 WO PCT/US2013/048355 patent/WO2014081476A1/en active Application Filing
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006093554A (ja) * | 2004-09-27 | 2006-04-06 | Sanyo Electric Co Ltd | 半導体集積回路装置 |
WO2009048154A1 (ja) * | 2007-10-12 | 2009-04-16 | Nec Corporation | 半導体装置及びその設計方法 |
WO2010101163A1 (ja) * | 2009-03-04 | 2010-09-10 | 日本電気株式会社 | 機能素子内蔵基板及びそれを用いた電子デバイス |
US20100309704A1 (en) * | 2009-06-05 | 2010-12-09 | Sriram Dattaguru | In-pakage microelectronic apparatus, and methods of using same |
JP2011086767A (ja) * | 2009-10-15 | 2011-04-28 | Renesas Electronics Corp | 半導体装置及び半導体装置の製造方法 |
US20120161331A1 (en) * | 2010-12-22 | 2012-06-28 | Javier Soto Gonzalez | Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same |
US20120161316A1 (en) * | 2010-12-22 | 2012-06-28 | Javier Soto Gonzalez | Substrate with embedded stacked through-silicon via die |
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CN106876292A (zh) | 2017-06-20 |
CN103839932A (zh) | 2014-06-04 |
WO2014081476A1 (en) | 2014-05-30 |
CN106876292B (zh) | 2019-07-26 |
US20170125351A1 (en) | 2017-05-04 |
GB2509384A (en) | 2014-07-02 |
KR20140065354A (ko) | 2014-05-29 |
JP2014103396A (ja) | 2014-06-05 |
GB2509384B (en) | 2015-02-18 |
DE102013223846B4 (de) | 2020-08-13 |
CN103839932B (zh) | 2017-04-12 |
DE102013223846A1 (de) | 2014-05-22 |
KR101652890B1 (ko) | 2016-09-01 |
GB201320552D0 (en) | 2014-01-08 |
SG2013086038A (en) | 2014-06-27 |
US9496211B2 (en) | 2016-11-15 |
JP6193415B2 (ja) | 2017-09-06 |
US20140138845A1 (en) | 2014-05-22 |
US10453799B2 (en) | 2019-10-22 |
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