JP2016076513A - 電子モジュール - Google Patents
電子モジュール Download PDFInfo
- Publication number
- JP2016076513A JP2016076513A JP2014203989A JP2014203989A JP2016076513A JP 2016076513 A JP2016076513 A JP 2016076513A JP 2014203989 A JP2014203989 A JP 2014203989A JP 2014203989 A JP2014203989 A JP 2014203989A JP 2016076513 A JP2016076513 A JP 2016076513A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- main surface
- electronic component
- electronic
- electronic module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (7)
- 第1の主面と該第1の主面とは反対側の面である第2の主面とを有し;かつ該第1、第2の主面のうちの一方の主面上に設けられた、部品実装用のランドを有する配線パターンと;該配線パターンと電気的に導通するようにかつ前記第1の主面と前記第2の主面と接続する面である端面に露出するように設けられた縦方向導電体と;を備えた配線板と、
前記配線パターンへのプロービングを一切不可能にするように前記配線板の前記一方の主面上に重なって、前記ランドを介し前記配線板に実装された電子部品と
を具備する電子モジュール。 - 前記電子部品が、前記配線板の前記一方の主面上において、ひとつのみである請求項1記載の電子モジュール。
- 前記電子部品が、前記配線板と平面形状として同形である請求項2記載の電子モジュール。
- 前記電子部品が、前記配線板の前記一方の主面と前記端面との境界線が形成する閉じた図形に内包された平面形状を有し、
前記配線板の前記一方の主面上であって前記電子部品が重ならない領域上をすべて覆うように該電子部品と該配線板との間からはみ出し設けられ
た、該電子部品を該配線板に固定するための樹脂をさらに具備する
請求項2記載の電子モジュール。 - 前記縦方向導電体を覆うように前記配線板の前記端面上に設けられた保護膜をさらに具備する請求項1記載の電子モジュール。
- 前記電子部品が、前記配線板の前記一方の主面上において、複数で構成されている請求項1記載の電子モジュール。
- 前記配線板の前記一方の主面上であって前記電子部品が重ならない領域上をすべて覆うように該電子部品と該配線板との間からはみ出し設けられた、該電子部品を該配線板に固定するための樹脂をさらに具備する請求項6記載の電子モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014203989A JP2016076513A (ja) | 2014-10-02 | 2014-10-02 | 電子モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014203989A JP2016076513A (ja) | 2014-10-02 | 2014-10-02 | 電子モジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016076513A true JP2016076513A (ja) | 2016-05-12 |
Family
ID=55951595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014203989A Pending JP2016076513A (ja) | 2014-10-02 | 2014-10-02 | 電子モジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2016076513A (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09260528A (ja) * | 1996-03-21 | 1997-10-03 | Matsushita Electric Ind Co Ltd | 半導体装置とその製造方法 |
JPH11145375A (ja) * | 1997-11-12 | 1999-05-28 | Matsushita Electron Corp | 半導体装置及びその製造方法 |
JP2000133740A (ja) * | 1998-10-22 | 2000-05-12 | Hitachi Ltd | 半導体装置 |
JP2000357757A (ja) * | 1999-06-15 | 2000-12-26 | Toshiba Corp | 半導体装置および電子回路装置 |
JP2003329726A (ja) * | 2002-05-10 | 2003-11-19 | Nec Corp | 中継基板 |
-
2014
- 2014-10-02 JP JP2014203989A patent/JP2016076513A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09260528A (ja) * | 1996-03-21 | 1997-10-03 | Matsushita Electric Ind Co Ltd | 半導体装置とその製造方法 |
JPH11145375A (ja) * | 1997-11-12 | 1999-05-28 | Matsushita Electron Corp | 半導体装置及びその製造方法 |
JP2000133740A (ja) * | 1998-10-22 | 2000-05-12 | Hitachi Ltd | 半導体装置 |
JP2000357757A (ja) * | 1999-06-15 | 2000-12-26 | Toshiba Corp | 半導体装置および電子回路装置 |
JP2003329726A (ja) * | 2002-05-10 | 2003-11-19 | Nec Corp | 中継基板 |
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