JP2016074086A5 - - Google Patents

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Publication number
JP2016074086A5
JP2016074086A5 JP2016014125A JP2016014125A JP2016074086A5 JP 2016074086 A5 JP2016074086 A5 JP 2016074086A5 JP 2016014125 A JP2016014125 A JP 2016014125A JP 2016014125 A JP2016014125 A JP 2016014125A JP 2016074086 A5 JP2016074086 A5 JP 2016074086A5
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JP
Japan
Prior art keywords
polishing
layer
polishing pad
surface layer
pad
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Application number
JP2016014125A
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English (en)
Japanese (ja)
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JP2016074086A (ja
JP6209628B2 (ja
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Priority claimed from US13/488,149 external-priority patent/US9597769B2/en
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Publication of JP2016074086A5 publication Critical patent/JP2016074086A5/ja
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JP2016014125A 2012-06-04 2016-01-28 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド Active JP6209628B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/488,149 2012-06-04
US13/488,149 US9597769B2 (en) 2012-06-04 2012-06-04 Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2015515155A Division JP5908169B2 (ja) 2012-06-04 2013-05-29 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド

Publications (3)

Publication Number Publication Date
JP2016074086A JP2016074086A (ja) 2016-05-12
JP2016074086A5 true JP2016074086A5 (enExample) 2016-11-24
JP6209628B2 JP6209628B2 (ja) 2017-10-04

Family

ID=48607367

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015515155A Active JP5908169B2 (ja) 2012-06-04 2013-05-29 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド
JP2016014125A Active JP6209628B2 (ja) 2012-06-04 2016-01-28 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2015515155A Active JP5908169B2 (ja) 2012-06-04 2013-05-29 透明下地層の上方に開口部または開放部を有する研磨表面層を伴う研磨パッド

Country Status (8)

Country Link
US (1) US9597769B2 (enExample)
EP (1) EP2872291B1 (enExample)
JP (2) JP5908169B2 (enExample)
KR (3) KR101700863B1 (enExample)
CN (1) CN104520068B (enExample)
SG (2) SG11201407839PA (enExample)
TW (2) TWI634968B (enExample)
WO (1) WO2013184465A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8657653B2 (en) * 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
KR102232039B1 (ko) * 2012-07-23 2021-03-26 제이에이치 로드스 컴퍼니, 인크 비평면 유리 연마 패드 및 상기 연마 패드 제작 방법
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
EP3126093B1 (en) * 2014-04-03 2022-08-17 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
WO2015171419A1 (en) * 2014-05-07 2015-11-12 Cabot Microelectronics Corporation Multi-layer polishing pad for cmp
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
JP6354432B2 (ja) * 2014-08-04 2018-07-11 日本電気硝子株式会社 研磨パッド
US10086500B2 (en) * 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
US10946495B2 (en) 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
TWI549781B (zh) * 2015-08-07 2016-09-21 智勝科技股份有限公司 研磨墊、研磨系統及研磨方法
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
JP7227137B2 (ja) * 2017-01-20 2023-02-21 アプライド マテリアルズ インコーポレイテッド Ｃｍｐ用途向けの薄いプラスチック研磨物品
CN106926116B (zh) * 2017-01-23 2018-07-13 安徽禾臣新材料有限公司 Stn玻璃抛光用吸附垫
KR101945869B1 (ko) * 2017-08-07 2019-02-11 에스케이씨 주식회사 우수한 기밀성을 갖는 연마패드
CN109333386A (zh) * 2018-11-07 2019-02-15 智慧双创(深圳)科技有限公司 一种自锐性金刚石砂轮及其制备工艺
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
KR102248338B1 (ko) * 2019-10-01 2021-05-06 (주)앰스코 연마 대상물의 요철부에 삽입 가능한 연마부재
JP7348860B2 (ja) * 2020-02-26 2023-09-21 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
KR102488101B1 (ko) * 2021-05-04 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
JP7441916B2 (ja) 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
USD1022364S1 (en) 2022-06-03 2024-04-09 Entegris, Inc. Polyvinyl alcohol pad
KR20250018540A (ko) * 2022-06-03 2025-02-06 엔테그리스, 아이엔씨. 기판을 세정하기 위한 디바이스 및 관련 방법
USD1027345S1 (en) 2022-06-03 2024-05-14 Entegris, Inc. Polyvinyl alcohol pad
CN118418036A (zh) * 2023-01-31 2024-08-02 罗门哈斯电子材料Cmp控股股份有限公司 具有端点窗口的抛光垫

Family Cites Families (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1953983A (en) 1928-02-07 1934-04-10 Carborundum Co Manufacture of rubber bonded abrasive articles
IE61697B1 (en) 1987-12-22 1994-11-16 De Beers Ind Diamond Abrasive product
US5190568B1 (en) 1989-01-30 1996-03-12 Ultimate Abrasive Syst Inc Abrasive tool with contoured surface
US5212910A (en) 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5609517A (en) 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
US5624303A (en) 1996-01-22 1997-04-29 Micron Technology, Inc. Polishing pad and a method for making a polishing pad with covalently bonded particles
US6019666A (en) 1997-05-09 2000-02-01 Rodel Holdings Inc. Mosaic polishing pads and methods relating thereto
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JP2918883B1 (ja) 1998-07-15 1999-07-12 日本ピラー工業株式会社 研磨パッド
US6183346B1 (en) 1998-08-05 2001-02-06 3M Innovative Properties Company Abrasive article with embossed isolation layer and methods of making and using
US6413153B1 (en) 1999-04-26 2002-07-02 Beaver Creek Concepts Inc Finishing element including discrete finishing members
US6179887B1 (en) 1999-02-17 2001-01-30 3M Innovative Properties Company Method for making an abrasive article and abrasive articles thereof
EP1176630B1 (en) 1999-03-31 2007-06-27 Nikon Corporation Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
WO2001043920A1 (en) 1999-12-14 2001-06-21 Rodel Holdings, Inc. Method of manufacturing a polymer or polymer composite polishing pad
US6498101B1 (en) 2000-02-28 2002-12-24 Micron Technology, Inc. Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
EP1284841B1 (en) 2000-05-27 2005-03-23 Rohm and Haas Electronic Materials CMP Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6454634B1 (en) * 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
US6860802B1 (en) * 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6685537B1 (en) 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
JP2002172563A (ja) 2000-11-24 2002-06-18 Three M Innovative Properties Co 研磨テープ
KR100867339B1 (ko) 2000-12-01 2008-11-06 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US6523215B2 (en) 2001-04-04 2003-02-25 Saint-Gobain Abrasives Technology Company Polishing pad and system
US6855034B2 (en) 2001-04-25 2005-02-15 Jsr Corporation Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer
US6544373B2 (en) 2001-07-26 2003-04-08 United Microelectronics Corp. Polishing pad for a chemical mechanical polishing process
JP3851135B2 (ja) 2001-10-17 2006-11-29 ニッタ・ハース株式会社 研磨パッド
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
US6722249B2 (en) 2001-11-06 2004-04-20 Rodel Holdings, Inc Method of fabricating a polishing pad having an optical window
JP3658591B2 (ja) * 2002-04-03 2005-06-08 東邦エンジニアリング株式会社 研磨パッドおよび該研磨パッドを用いた半導体基板の製造方法
TWI221105B (en) 2002-05-13 2004-09-21 Jsr Corp Polishing pad for semiconductor wafer, polishing laminate comprising the same for semiconductor wafer, and method for polishing semiconductor wafer
US8602851B2 (en) 2003-06-09 2013-12-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled penetration subpad
US7201647B2 (en) 2002-06-07 2007-04-10 Praxair Technology, Inc. Subpad having robust, sealed edges
US6838169B2 (en) 2002-09-11 2005-01-04 Psiloquest, Inc. Polishing pad resistant to delamination
KR100465649B1 (ko) 2002-09-17 2005-01-13 한국포리올 주식회사 일체형 연마 패드 및 그 제조 방법
KR101047933B1 (ko) 2002-11-27 2011-07-11 도요 고무 고교 가부시키가이샤 연마 패드 및 반도체 장치의 제조 방법
JP2004243428A (ja) 2003-02-12 2004-09-02 Rodel Nitta Co 研磨パッド
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
EP1498222B1 (en) 2003-07-17 2014-12-17 JSR Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US7160178B2 (en) 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US7195539B2 (en) 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US8066552B2 (en) 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7204742B2 (en) 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US7198549B2 (en) 2004-06-16 2007-04-03 Cabot Microelectronics Corporation Continuous contour polishing of a multi-material surface
US7097542B2 (en) 2004-07-26 2006-08-29 Intel Corporation Method and apparatus for conditioning a polishing pad
US7530880B2 (en) 2004-11-29 2009-05-12 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US7846008B2 (en) 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
US7169029B2 (en) 2004-12-16 2007-01-30 3M Innovative Properties Company Resilient structured sanding article
CA2598272A1 (en) 2005-02-18 2006-08-24 Neopad Technologies Corporation Customized polishing pads for cmp and methods of fabrication and use thereof
TWI385050B (zh) 2005-02-18 2013-02-11 奈平科技股份有限公司 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
JP4620501B2 (ja) 2005-03-04 2011-01-26 ニッタ・ハース株式会社 研磨パッド
JP4904027B2 (ja) 2005-08-10 2012-03-28 ニッタ・ハース株式会社 研磨パッド
US7210980B2 (en) 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
US20070212979A1 (en) 2006-03-09 2007-09-13 Rimpad Tech Ltd. Composite polishing pad
US7235114B1 (en) 2006-03-16 2007-06-26 3M Innovative Properties Company Flexible abrasive article
JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
US8083820B2 (en) 2006-12-22 2011-12-27 3M Innovative Properties Company Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
JP2008226911A (ja) * 2007-03-08 2008-09-25 Jsr Corp 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法
JP4931133B2 (ja) * 2007-03-15 2012-05-16 東洋ゴム工業株式会社 研磨パッド
JP5363470B2 (ja) 2007-06-08 2013-12-11 アプライド マテリアルズ インコーポレイテッド 窓付きの薄い研磨パッド及び成形プロセス
JP2009060044A (ja) 2007-09-03 2009-03-19 Tokyo Seimitsu Co Ltd Ｃｍｐ装置の研磨モニタ窓
TWI388402B (en) 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
JP2010029996A (ja) 2008-07-30 2010-02-12 Toray Ind Inc 研磨パッド
US8157614B2 (en) 2009-04-30 2012-04-17 Applied Materials, Inc. Method of making and apparatus having windowless polishing pad and protected fiber
WO2011008499A2 (en) * 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
CN101905448B (zh) * 2010-06-23 2013-05-22 清华大学 一种用于化学机械平坦化的抛光垫及其制造方法
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US20120302148A1 (en) 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
US8920219B2 (en) 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
US9067298B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
KR101825734B1 (ko) 2011-11-29 2018-02-05 캐보트 마이크로일렉트로닉스 코포레이션 기초 레이어 및 연마면 레이어를 가진 연마 패드
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer

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