JP2016054288A - 接続体、接続体の製造方法、電子部品の接続方法、及び電子部品 - Google Patents

接続体、接続体の製造方法、電子部品の接続方法、及び電子部品 Download PDF

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JP2016054288A
JP2016054288A JP2015160596A JP2015160596A JP2016054288A JP 2016054288 A JP2016054288 A JP 2016054288A JP 2015160596 A JP2015160596 A JP 2015160596A JP 2015160596 A JP2015160596 A JP 2015160596A JP 2016054288 A JP2016054288 A JP 2016054288A
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bump
bumps
electronic component
substrate
flexible substrate
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Japanese (ja)
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裕美 久保出
Hiromi Kubode
裕美 久保出
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Dexerials Corp
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Dexerials Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP2015160596A 2014-09-02 2015-08-17 接続体、接続体の製造方法、電子部品の接続方法、及び電子部品 Pending JP2016054288A (ja)

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JP2014178356 2014-09-02
JP2014178356 2014-09-02

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JP2019115881A Division JP7096210B2 (ja) 2014-09-02 2019-06-21 接続体、接続体の製造方法、電子部品の接続方法、及び電子部品

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JP2016054288A true JP2016054288A (ja) 2016-04-14

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JP2015160596A Pending JP2016054288A (ja) 2014-09-02 2015-08-17 接続体、接続体の製造方法、電子部品の接続方法、及び電子部品
JP2019115881A Active JP7096210B2 (ja) 2014-09-02 2019-06-21 接続体、接続体の製造方法、電子部品の接続方法、及び電子部品
JP2022062529A Active JP7324334B2 (ja) 2014-09-02 2022-04-04 プラスチック基板接続用電子部品、接続体、接続体の製造方法、及び電子部品の接続方法

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JP2022062529A Active JP7324334B2 (ja) 2014-09-02 2022-04-04 プラスチック基板接続用電子部品、接続体、接続体の製造方法、及び電子部品の接続方法

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210033513A (ko) 2018-10-03 2021-03-26 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 구조체, 접속 구조체의 제조 방법
WO2021251386A1 (ja) 2020-06-11 2021-12-16 昭和電工マテリアルズ株式会社 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法
KR20230034223A (ko) 2020-07-07 2023-03-09 레조낙 가부시끼가이샤 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
KR20230043894A (ko) 2020-07-31 2023-03-31 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 회로 접속용 접착제 조성물, 및 회로 접속 구조체 및 그 제조 방법
KR20230075473A (ko) 2020-09-28 2023-05-31 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 무기 필러 함유 조성물, 및, 회로 접속 구조체 및 그 제조 방법
KR20240118833A (ko) 2021-12-10 2024-08-05 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
KR20240118834A (ko) 2021-12-10 2024-08-05 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
KR20250044733A (ko) 2022-08-10 2025-04-01 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
KR20250163900A (ko) 2023-04-13 2025-11-21 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7680305B2 (ja) * 2021-08-06 2025-05-20 デクセリアルズ株式会社 樹脂フィルム積層材、接続構造体および接続構造体の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139134A (ja) * 1994-11-11 1996-05-31 Kanegafuchi Chem Ind Co Ltd Ｔａｂ用テープの製造方法
JP2005142490A (ja) 2003-11-10 2005-06-02 Seiko Epson Corp 半導体装置、電気光学装置及び電子機器
JP2006210809A (ja) 2005-01-31 2006-08-10 Seiko Epson Corp 配線基板および実装構造体、電気光学装置および電子機器
JP2006237364A (ja) 2005-02-25 2006-09-07 Seiko Instruments Inc 半導体装置
JP2008135468A (ja) 2006-11-27 2008-06-12 Nec Lcd Technologies Ltd 半導体素子及び該半導体素子を備える表示装置
JP2009151315A (ja) * 2008-12-25 2009-07-09 Toshiba Mobile Display Co Ltd Ｅｌ表示装置
JP2012060029A (ja) 2010-09-10 2012-03-22 Seiko Instruments Inc 電子機器

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210033513A (ko) 2018-10-03 2021-03-26 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 구조체, 접속 구조체의 제조 방법
WO2021251386A1 (ja) 2020-06-11 2021-12-16 昭和電工マテリアルズ株式会社 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法
KR20230023621A (ko) 2020-06-11 2023-02-17 레조낙 가부시끼가이샤 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
KR20230034223A (ko) 2020-07-07 2023-03-09 레조낙 가부시끼가이샤 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
KR20230043894A (ko) 2020-07-31 2023-03-31 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 회로 접속용 접착제 조성물, 및 회로 접속 구조체 및 그 제조 방법
CN116419959A (zh) * 2020-07-31 2023-07-11 株式会社力森诺科 电路连接用黏合剂薄膜、电路连接用黏合剂组合物以及电路连接结构体及其制造方法
KR20230075473A (ko) 2020-09-28 2023-05-31 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 무기 필러 함유 조성물, 및, 회로 접속 구조체 및 그 제조 방법
KR20240118833A (ko) 2021-12-10 2024-08-05 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
KR20240118834A (ko) 2021-12-10 2024-08-05 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
KR20250044733A (ko) 2022-08-10 2025-04-01 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
KR20250163900A (ko) 2023-04-13 2025-11-21 가부시끼가이샤 레조낙 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법

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JP7096210B2 (ja) 2022-07-05
JP2022095802A (ja) 2022-06-28
JP2019197900A (ja) 2019-11-14
JP7324334B2 (ja) 2023-08-09

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