JP2016054288A - Connection body, manufacturing method therefor, electronic component connection method and electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve, in a connection body to which an electronic component is connected to a flexible substrate, conductivity with a bump and adhesive strength with an electronic component.SOLUTION: The connection body includes: an electronic component 3 having a plurality of bumps 6 arrayed on a substrate 4; a flexible substrate having a plurality of electrodes connected to the bumps 6; and an adhesive agent for connecting the electronic component 3 to the flexible substrate. Each bump 6 includes an elastic member 6a disposed on the substrate 4 of the electronic component 3 and a terminal part 6b laminated on the elastic member 6a and connected in conduction with the electrode of the flexible substrate.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a connection body in which an electronic component and a circuit board are connected, and in particular, a connection body in which an electronic component is connected to a flexible substrate as a circuit board, a method of manufacturing the connection body, a connection method of the electronic component, And electronic parts.

  Conventionally, liquid crystal display devices and organic EL panels have been used as various display means such as televisions, PC monitors, mobile phones, smart phones, portable game machines, tablet terminals, wearable terminals, and in-vehicle monitors. In recent years, in such display devices, so-called COG (chip on glass) in which a driving IC is directly mounted on a glass substrate of a display panel has been adopted from the viewpoints of fine pitch, light weight and thickness reduction.

  For example, in a liquid crystal display panel employing the COG mounting method, as shown in FIGS. 8A and 8B, a transparent electrode 102 made of ITO (indium tin oxide) or the like is provided on a transparent substrate 101 made of a glass substrate or the like. A plurality of such electronic components such as a liquid crystal driving IC 103 are connected on the transparent electrode 102. The liquid crystal driving IC 103 is formed with a plurality of electrode terminals 104 corresponding to the transparent electrodes 102 on the mounting surface, and thermocompression-bonded on the transparent substrate 101 via the anisotropic conductive film 105, thereby the electrode terminals 104. And the transparent electrode 102 are connected.

  The anisotropic conductive film 105 is a film formed by mixing conductive particles in a binder resin, and heat conduction is performed between the two conductors so that electrical conduction between the conductors is achieved with the conductive particles. The binder resin maintains the mechanical connection between the conductors. As the adhesive constituting the anisotropic conductive film 105, a highly reliable thermosetting binder resin is usually used, but a photocurable binder resin or a photothermal binder resin may be used.

  When the liquid crystal driving IC 103 is connected to the transparent electrode 102 via the anisotropic conductive film 105, first, the anisotropic conductive film 105 is first attached to the transparent electrode 102 of the transparent substrate 101 by a temporary pressure bonding means (not shown). Temporarily stick. Subsequently, after mounting the liquid crystal driving IC 103 on the transparent substrate 101 via the anisotropic conductive film 105 to form a temporary connection body, the liquid crystal driving IC 103 is anisotropically formed by thermocompression bonding means such as a thermocompression bonding head 106. Heated and pressed to the transparent electrode 102 side together with the conductive film 105. By the heating by the thermocompression bonding head 106, the anisotropic conductive film 105 undergoes a thermosetting reaction, whereby the liquid crystal driving IC 103 is bonded onto the transparent electrode 102.

JP-A-3-231437 JP 2005-203758 A JP 2003-303852 A JP 2008-258494 A

  In recent years, displays having curved surfaces have been proposed and partially put into practical use. In this type of flexible display, a plastic substrate having flexibility instead of glass is used as a base material, and various electronic components such as a driving IC are mounted on the plastic substrate. As a method for mounting an electronic component such as a driving IC on a plastic substrate, COP (chip on plastic) using an anisotropic conductive film has been studied.

  However, since IC bumps such as driving ICs are formed with metal bumps as connection terminals to the substrate, in the process of mounting electronic components on a plastic substrate using an anisotropic conductive film, the same crimping as COG When anisotropic conductive connection is performed under conditions, a high pressing force is locally applied from the metal bump. For this reason, as shown in FIG. 9, the flexible plastic substrate 110 is bent with the metal bumps 112 of the driving IC 111 sandwiching the conductive particles 107 as apexes. At this time, the plastic substrate 110 is bent more than the height of the metal bump 112 due to the stiffness of the substrate itself, the position facing the metal bump 112 is lifted, and is formed on the metal bump 112 and the plastic substrate 110. The conductive particles cannot be sufficiently sandwiched between the transparent electrodes.

  Further, when the metal bump 112 is pressed against the plastic substrate 110 to increase the bending with respect to the height of the metal bump 112, the region of the driving IC 111 where the metal bump 112 is not provided and the plastic substrate 110. And the binder resin is excessively excluded. For this reason, the connection strength between the plastic substrate 110 and the driving IC 111 as a whole decreases.

  Further, as shown in FIG. 10A, when the metal bump rows 114A to 114C in which a plurality of metal bumps 112 are arranged in parallel on the IC substrate 113 of the driving IC 111, the plastic substrate 110 is bent. As a result, as shown in FIG. 10B, the plastic substrate 110 is lifted between the outer metal bump row 114A and the inner metal bump row 114C, and the conductivity with the middle metal bump row 114B is impaired. There is a fear.

  Further, in the process of mounting the electronic component on the plastic substrate using the anisotropic conductive film, the metal bumps 112 are locally formed on the plastic substrate as shown in FIGS. The plastic substrate 110 may be bent greatly due to being pushed into the 110. In this case, the plastic substrate 110 at the portion corresponding to the metal bump row 114C arranged on the most central side of the IC substrate 113 is likely to be cracked or peeled off, and this impairs the electrical conductivity of the obtained connection body. There is a fear.

  Here, as a method of suppressing the bending of the plastic substrate as described above, for example, a method using a driving IC in which dummy bumps are formed as in the technique described in Patent Document 2, a low pressure is applied between the plastic substrate and the driving IC. When the plastic substrate has a configuration in which a PET film, an adhesive layer, and a PI film are laminated, a method of thinning and hardening the adhesive layer is conceivable.

  However, when a driving IC on which dummy bumps are formed is used, the metal part of the dummy bumps is often made of a noble metal material (for example, gold), which increases costs. Further, when a driving IC having dummy bumps is used, it is necessary to increase the pressing force (thrust) at the time of pressure bonding as compared with the case of using a driving IC without dummy bumps. The bending of the substrate becomes larger, and as a result, the plastic substrate is likely to be cracked or peeled off.

  In addition, when the plastic substrate and the driving IC are pressure-bonded at a low pressure, it is required to use soft conductive particles. In this case, since the conductive particles are soft, the conductive particles are less likely to bite into the terminal of the plastic substrate and the terminal of the driving IC. As a result, the conductivity may not be improved. Moreover, since it is calculated | required to use a soft electroconductive particle, the characteristic of binder resin used for an electroconductive film will be limited.

  Moreover, when the adhesive layer of the plastic substrate is thinned, the PET film and the PI film are easily peeled off. Further, when the adhesive layer of the plastic substrate is hardened, the flexibility of the plastic substrate may be impaired.

  Therefore, the present invention relates to a connection body in which an electronic component is connected to a flexible substrate, a connection body that can improve electrical conductivity with a bump and adhesive strength with the electronic component, a method for manufacturing the connection body, And it aims at providing the connection method of an electronic component.

  In addition, the present invention suppresses cracking and peeling of the flexible substrate and improves electrical conductivity between the flexible substrate and the substrate of the electronic component in a connection body in which the electronic component is connected to the flexible substrate. It is an object of the present invention to provide an electronic component, a connecting body, a manufacturing method of the connecting body, and a connecting method of the electronic component.

  In order to solve the above-described problem, a connection body according to the present invention includes an electronic component in which a plurality of bumps are arranged on a substrate, a flexible substrate in which a plurality of electrodes connected to the bumps are arranged, An adhesive for connecting the electronic component and the flexible substrate, and the bump is formed on an elastic member provided on the substrate of the electronic component, and the electrode of the flexible substrate stacked on the elastic member. And a terminal portion that is conductively connected.

  In addition, the method for manufacturing a connection body according to the present invention includes an electronic component in which a plurality of bumps are arranged on a substrate and a flexible substrate in which a plurality of electrodes connected to the bumps are arranged using an adhesive. The bump and the electrode are disposed so as to face each other, and the electronic component and the flexible substrate are crimped by a crimping tool, and the adhesive is cured. It has an elastic member provided on the substrate of the electronic component, and a terminal portion laminated on the elastic member and electrically connected to the electrode of the flexible substrate.

  Further, the electronic component connecting method according to the present invention includes an adhesive comprising: an electronic component having a plurality of bumps arranged on a substrate; and a flexible substrate having a plurality of electrodes connected to the bumps. The bump and the electrode are disposed so as to face each other, and the electronic component and the flexible substrate are crimped by a crimping tool, and the adhesive is cured. It has an elastic member provided on the substrate of the electronic component, and a terminal portion laminated on the elastic member and electrically connected to the electrode of the flexible substrate.

  The electronic component according to the present invention is an electronic component including a bump row in which a plurality of bumps are arranged along the side edge of the electronic component, and the bump row is in a direction orthogonal to the arrangement direction of the bumps. When the bump row is singular or plural, the plurality of bumps constituting the single bump row are alternately arranged in a direction in which adjacent bumps are orthogonal to the arrangement direction. When there are a plurality of bump rows, the plurality of bumps constituting one bump row arranged on the most central side of the electronic component are alternately arranged in a direction in which adjacent bumps are orthogonal to the arrangement direction. Has been placed.

  In addition, the connection body according to the present invention includes an electronic component including a bump row on which a plurality of bumps are arranged on a substrate, a flexible substrate on which a plurality of electrodes connected to the bumps are arranged, and the electronic component And an adhesive for connecting the flexible substrate, the bump has a terminal portion that is electrically connected to the electrode of the flexible substrate, and the bump row is a side edge of the electronic component. If the bump row is singular, the plurality of bumps constituting the single bump row are alternately arranged in the direction in which adjacent bumps are orthogonal to the arrangement direction. In the case where there are a plurality of bump rows, the plurality of bumps constituting one bump row arranged on the most central side of the electronic component are in a direction in which adjacent bumps are orthogonal to the arrangement direction. Staggered It has been.

  The connection body manufacturing method according to the present invention includes an electronic component including a bump array on which a plurality of bumps are arranged on a substrate, and a flexible substrate on which a plurality of electrodes connected to the bumps are arranged. The step of arranging the bump and the electrode so as to face each other through an adhesive, and crimping the electronic component and the flexible substrate with a crimping tool and curing the adhesive, The bump has a terminal portion that is electrically connected to the electrode of the flexible substrate, and the bump row is arranged singly or in plural along the side edge of the electronic component, and the bump row is singular. The plurality of bumps constituting the single bump row are arranged alternately in the direction perpendicular to the arrangement direction, and when the bump row is plural, Most central A plurality of bumps constituting one of said bump rows arranged in adjacent bumps are staggered in a direction perpendicular to the arrangement direction.

  The electronic component connection method according to the present invention includes: an electronic component including a bump array on which a plurality of bumps are arranged; and a flexible substrate on which a plurality of electrodes connected to the bumps are arranged. The step of arranging the bump and the electrode so as to face each other through an adhesive, and crimping the electronic component and the flexible substrate with a crimping tool and curing the adhesive, The bump has a terminal portion that is electrically connected to the electrode of the flexible substrate, and the bump row is arranged singly or in plural along the side edge of the electronic component, and the bump row is singular. The plurality of bumps constituting the single bump row are arranged alternately in the direction perpendicular to the arrangement direction, and when the bump row is plural, Most central A plurality of bumps constituting one of said bump rows arranged in side is adjacent bumps are staggered in a direction perpendicular to the arrangement direction.

  According to the present invention, when pressed against the flexible substrate, the bump is elastically deformed, and the bending of the flexible substrate due to a high pressure force being locally applied by the bump is alleviated. Therefore, according to the present invention, the electrodes formed on the flexible substrate do not float with respect to the bumps of the electronic component, and the conductive particles are sufficiently sandwiched to have good conductivity.

  In addition, according to the present invention, it is possible to disperse the pressing force when the electronic component and the flexible substrate are crimped, and to relax the bending of the flexible substrate, thereby suppressing cracking and peeling of the flexible substrate. can do. In addition, according to the present invention, since the bending of the flexible substrate can be relaxed, it is possible to suppress the electrode formed on the flexible substrate from being lifted with respect to the bump of the electronic component, and to sufficiently sandwich the conductive particles. The electrical conductivity between the flexible substrate and the substrate of the electronic component can be improved.

FIG. 1 is a schematic diagram showing a configuration of an organic EL display shown as an example of a connection body to which the present invention is applied. FIG. 2 is a plan view showing a mounting surface of a drive circuit element shown as an example of an electronic component to which the present invention is applied. FIG. 3 is a cross-sectional view of a drive circuit element shown as an example of an electronic component to which the present invention is applied. FIG. 4 is a cross-sectional view of an organic EL display shown as an example of a connection body to which the present invention is applied. 5A and 5B are diagrams showing another drive circuit element shown as an example of an electronic component to which the present invention is applied. FIG. 5A is a plan view, FIG. 5B is a side view, and FIG. It is A 'sectional drawing. FIG. 6 is a cross-sectional view showing an anisotropic conductive film. FIG. 7 is a cross-sectional view of an organic EL display shown as an example of a connection body to which the present invention is applied. 8A and 8B are views showing a conventional COG connection process, FIG. 8A is a cross-sectional view showing a state before the connection process, and FIG. 8B is a cross-sectional view showing a state during the connection process. FIG. 9 is a cross-sectional view showing a connection body in which a driving IC having metal bumps is connected to a plastic substrate. 10A and 10B are diagrams showing a connection body in which a driving IC having three metal bump rows formed is connected to a plastic substrate, where FIG. 10A is a plan view and FIG. 10B is a cross-sectional view. FIG. 11 is a plan view showing a mounting surface of a drive circuit element shown as an example of an electronic component to which the present invention is applied. 12 is a plan view showing the positional relationship between a plurality of electrode terminals constituting the output terminal array arranged on the most central side of the mounting surface of the drive circuit element shown in FIG. FIG. 13 is a plan view showing a mounting surface of a drive circuit element shown as an example of an electronic component to which the present invention is applied. FIG. 14 is a plan view showing another example of the positional relationship between a plurality of electrode terminals constituting the output terminal array arranged on the most central side of the mounting surface of the drive circuit element. 15 is a cross-sectional view taken along line A-A ′ of FIG. 11.

  Hereinafter, an electronic component to which the present invention is applied, a connection body, a manufacturing method of the connection body, and a connection method of the electronic component will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

[First Embodiment]
[Connected body]
The connection body to which the present invention is applied can be used for any connection body in which a flexible substrate such as a plastic substrate and an electronic component are connected. For example, as shown in FIG. A flexible organic electroluminescent color display (organic EL display) 1 in which a driving circuit element 3 as a video display driver is mounted on a regularly arranged plastic substrate 2 can be exemplified. The connection body may be a so-called touch panel in which a display element such as an organic EL display and a position input device such as a touch pad are combined. In addition, the present invention can be applied to any connection body to which an electronic component is connected if it has flexibility. In addition, regardless of the use of the connection body to which the present invention is applied, various monitors such as a smart phone, a tablet, a TV, a vehicle navigation system, a wearable terminal, etc. As long as it has a body, it can be used for furniture, home appliances, daily necessities, etc.

[Plastic substrate]
The plastic substrate 2 has a pixel driving circuit 9 such as an organic TFT and a plurality of organic EL elements 2R, 2G, and 2B regularly arranged in a matrix on a substrate made of a flexible material such as PET or PEN. Thus, a display area 5 is formed, and video display signal lines and scanning lines are formed in the display area 5 in directions orthogonal to each other. In the organic EL display 1, for example, a set of organic EL elements 2R, 2G, and 2B that emit light of red, green, and blue respectively constitute one pixel. The organic layer on which the organic EL element is formed is covered with a protective layer and sealed with a sealing substrate via an adhesive layer.

  Further, the plastic substrate 2 has the video display signal line and scanning line electrodes drawn out of the display area 5 and connected to the drive circuit element 3 serving as a video display driver. The electrodes of the signal lines and the scanning lines connected to the drive circuit element 3 are arranged according to the arrangement of bumps provided on the drive circuit element 3.

  In addition, the plastic substrate 2 can take out the light of an organic EL element from the back side of a board | substrate by using the material which has a light transmittance, and is photocured as an adhesive agent which connects the drive circuit element 3 mentioned later. By using a mold adhesive, connection at low temperature and low pressure becomes possible.

  Further, when a resin having poor heat resistance such as PET is used for the plastic substrate 2, a PI film having excellent heat resistance may be laminated with an adhesive, and an organic EL element may be formed on the PI film.

  The elastic modulus of the plastic substrate 2 is determined in consideration of factors such as the flexibility required for the connection body and the relationship between the flexibility and the connection strength with the electronic components such as the drive circuit element 3 described later. -4100 MPa. Further, when an adhesive layer is interposed as the plastic substrate 2, the elastic modulus of the adhesive layer is generally 0.1 MPa to 1.0 MPa, and the adhesive layer is the most of the layers constituting the plastic substrate 2. soft. For this reason, the adhesive layer is easily affected by the bending of the plastic substrate 2, and the deformation of the adhesive layer is directly connected to the deformation of the entire plastic substrate 2.

[Electronic parts]
The drive circuit element 3 can perform a desired display by selectively applying a drive voltage to the pixels. Further, as shown in FIG. 2, the drive circuit element 3 includes a plurality of electrode terminals 6 (bumps) electrically connected to each electrode of the signal line and the scanning line on the mounting surface 4a of the substrate 4 mounted on the plastic substrate 2. ) Is formed. The mounting surface 4a of the substrate 4 has, for example, an input terminal array 7 in which electrode terminals 6 are arrayed along one side edge of the mounting surface 4a. The output terminal rows 8 in which the electrode terminals 6 are arranged along the plurality of rows, for example, three rows (8A, 8B, 8C) are arranged in a staggered manner. The electrode terminals 6 and the electrodes provided on the plastic substrate 2 are formed at the same number and pitch, respectively, and are connected by aligning and connecting the plastic substrate 2 and the drive circuit element 3.

  As shown in FIG. 3, the electrode terminal 6 has an elastic member 6a provided on the substrate 4 of the drive circuit element 3, and a terminal portion 6b laminated on the elastic member 6a. As a result, as shown in FIG. 4, when the driving circuit element 3 is pressed against the plastic substrate 2, the electrode terminal 6 is elastically deformed, and the plastic terminal 2 is subjected to a high pressure force locally by the electrode terminal 6. Relieves bending. Therefore, the organic EL display 1 has good conductivity by sufficiently sandwiching the conductive particles without the electrode formed on the plastic substrate 2 being lifted with respect to the electrode terminal 6 of the drive circuit element 3.

  Further, in the organic EL display 1, since the bending of the plastic substrate 2 is suppressed, the distance between the plastic substrate 2 and the substrate 4 of the drive circuit element 3 in the inter-terminal region where the electrode terminal 6 is not provided is kept moderate. The binder resin has a strong connection strength without being excessively excluded.

  The elastic member 6 a constituting the electrode terminal 6 is formed of a resin or rubber material that is elastically deformed when the drive circuit element 3 is mounted. Moreover, the terminal part 6b laminated | stacked on the elastic member 6a and connected with each electrode of the plastic substrate 2 consists of well-known electrode materials, such as Cu, Ag, Au. In the case of a wiring material such as Cu that is easily oxidized, a protective layer such as Sn plating may be provided on the surface as an anti-oxidation measure.

  Here, in the electrode terminal 6, if the elastic modulus of the elastic member 6a is too high, the bending of the plastic substrate 2 becomes large, leading to a decrease in electrical conductivity and connection strength, and the plastic substrate 2 is made of an adhesive between a PI film and a PET film. In the case of being connected through a layer, the adhesive layer is deformed, and connection failure occurs at the electrode terminal 6. Further, when the elastic modulus of the elastic member 6a is too low, the electrode terminal 6 cannot compress the conductive particles 11 to an extent that ensures sufficient electrical conductivity, and the conductive particles 11 are covered with insulation. In this case, it is impossible to break through the insulating film, and the conductivity is impaired. Therefore, the elastic modulus of the elastic member 6a is set in consideration of relaxation of the bending of the plastic substrate 2, conductivity, and connection strength, and is set to, for example, 2 to 8 GPa, preferably 3 to 7 GPa.

  As shown in FIG. 3, the plurality of electrode terminals 6 are formed by laminating terminal portions 6b on elastic members 6a independently of each other. The electrode terminal 6 shown in FIG. 3 has a known film forming method such as plating or printing after the elastic member 6a is formed on the mounting surface 4a of the substrate 4 of the drive circuit element 3 by supplying a rubber material by a dispenser. Can be formed by laminating the terminal portions 6b.

  Note that when the plastic substrate 2 and the drive circuit element 3 are ACF-connected, the electrode terminal 6 shown in FIG. 3 receives the pressure of a thermocompression bonding head (not shown) and elastically displaces the elastic member 6a, so that the adjacent electrode Since the distance to the terminal 6 is narrowed, it is desirable that the distance between the terminals 6 be parallel with a distance necessary to prevent a short circuit between the terminals.

  In addition, as shown in FIG. 5, the electrode terminal 6 may be formed by laminating a plurality of terminal portions 6 b on a rectangular elastic member 6 a formed on the substrate 4. 5B is a side view of the drive circuit element 3 shown in FIG. 5A, and FIG. 5C is a cross-sectional view taken along the line A-A ′ of the drive circuit element 3 shown in FIG. The terminal portions 6b are stacked in stripes at predetermined intervals in the longitudinal direction of the elastic member 6a formed in a rectangular shape. The electrode terminal 6 shown in FIG. 5 is also formed by laminating the terminal portion 6b by a known film formation method such as plating or printing after the elastic member 6a is formed on the mounting surface 4a of the substrate 4 of the drive circuit element 3. Can be formed.

  Further, in the electrode terminal 6 shown in FIG. 5, even when the terminal portions 6b are formed at a narrow pitch, the adjacent terminal portions 6b do not come into contact with each other due to the elastic displacement of the elastic member 6a. Can be prevented.

[Anisotropic conductive film]
The drive circuit element 3 is provided with an anisotropic conductive film (ACF) 10 as an adhesive for circuit connection in an area outside the display area 5 of the plastic substrate 2 on which the electrodes of the signal lines and the scanning lines are provided. Is connected. The anisotropic conductive film 10 contains conductive particles 11, and electrically connects the electrode terminals 6 of the drive circuit element 3 and the electrodes formed on the plastic substrate 2 via the conductive particles 11. Is. The anisotropic conductive film 10 is thermocompression bonded by a thermocompression bonding head to fluidize the binder resin, and the conductive particles 11 are crushed between the electrode of the plastic substrate 2 and the electrode terminal 6 of the drive circuit element 3. In this state, the binder resin is cured. Thereby, the anisotropic conductive film 10 electrically and mechanically connects the plastic substrate 2 and the drive circuit element 3.

  As shown in FIG. 6, the anisotropic conductive film 10 is generally formed by forming a binder resin layer (adhesive layer) 13 containing conductive particles 11 on a release film 12 serving as a base material. The anisotropic conductive film 10 is a thermosetting type or a photo-curing type adhesive such as ultraviolet rays, and is attached on the electrode formed on the plastic substrate 2 of the organic EL display 1 and mounted with the drive circuit element 3. The conductive particles 11 are fluidized by being thermally pressed by the thermocompression bonding head, and are crushed between the electrodes of the plastic substrate 2 and the electrode terminals 6 of the drive circuit element 3 which face each other, and are heated or irradiated with ultraviolet rays. Thus, the conductive particles 11 are cured in a crushed state. Thereby, the anisotropic conductive film 10 can connect the plastic substrate 2 and the drive circuit element 3 and make them conductive.

  In the anisotropic conductive film 10, conductive particles 11 are dispersed in a normal binder resin layer 13 containing a film-forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, and the like.

  The release film 12 that supports the binder resin layer 13 is made of, for example, a release agent such as silicone on PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), and the like. It is applied and prevents the anisotropic conductive film 10 from being dried, and maintains the shape of the anisotropic conductive film 10.

  The film-forming resin contained in the binder resin layer 13 is preferably a resin having an average molecular weight of about 10,000 to 80,000. Examples of the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.

  It does not specifically limit as a thermosetting resin, For example, a commercially available epoxy resin, an acrylic resin, etc. are mentioned.

  The epoxy resin is not particularly limited. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin. Naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. These may be used alone or in combination of two or more.

  There is no restriction | limiting in particular as an acrylic resin, According to the objective, an acrylic compound, liquid acrylate, etc. can be selected suitably. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what made acrylate the methacrylate can also be used. These may be used individually by 1 type and may use 2 or more types together.

  The latent curing agent is not particularly limited, and examples thereof include various curing agents such as a heat curing type and a UV curing type. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The activation method of the thermal activation type latent curing agent includes a method of generating active species (cation, anion, radical) by a dissociation reaction by heating, etc., and it is stably dispersed in the epoxy resin near room temperature, and epoxy at high temperature There are a method of initiating a curing reaction by dissolving and dissolving with a resin, a method of initiating a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, and an elution / curing method using microcapsules. Thermally active latent curing agents include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof. The above mixture may be sufficient. Among these, a microcapsule type imidazole-based latent curing agent is preferable.

  Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

[Conductive particles]
Examples of the conductive particles 11 include any known conductive particles used in the anisotropic conductive film 10. Examples of the conductive particles 11 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.

  The shape of the anisotropic conductive film 10 is not particularly limited. For example, as shown in FIG. 6, the anisotropic conductive film 10 is cut by a predetermined length by forming a long tape that can be wound around the take-up reel 14. Can be used.

  Moreover, although the above-mentioned embodiment demonstrated as an example the adhesive film which shape | molded the thermosetting resin composition containing the electroconductive particle 11 in the binder resin layer 13 as the anisotropic conductive film 10, The adhesive according to the present invention is not limited to this, for example, a configuration in which an insulating adhesive layer made of only a binder resin and a conductive particle-containing layer made of a binder resin layer 13 containing conductive particles 11 are laminated. can do. In addition to the anisotropic conductive film 10 formed into a film shape, the adhesive for connecting the drive circuit element 3 includes an anisotropic conductive paste in which conductive particles 11 are dispersed in a paste binder resin. But you can.

[Connection process]
Next, a connection process for connecting the drive circuit element 3 to the plastic substrate 2 will be described. First, the anisotropic conductive film 10 is temporarily pasted on the connection region provided with the respective signal line and scanning line electrodes outside the display region 5 of the plastic substrate 2. Next, the plastic substrate 2 is placed on the stage of the connection device, and the drive circuit element 3 is disposed on each electrode of the plastic substrate 2 via the anisotropic conductive film 1.

  Subsequently, the thermocompression bonding head heated to a predetermined temperature for curing the binder resin layer 13 is hot-pressed from above the drive circuit element 3 at a predetermined pressure and time. Thereby, the binder resin layer 13 of the anisotropic conductive film 10 exhibits fluidity and flows out from between the substrate 4 and the plastic substrate 2 of the drive circuit element 3, and the conductive particles 11 in the binder resin layer 13 are It is sandwiched between the electrode terminal 6 of the drive circuit element 3 and the electrode of the plastic substrate 2 and is crushed.

  As a result, the conductive particles 11 are electrically connected between the electrode terminal 6 of the drive circuit element 3 and the electrode of the plastic substrate 2, and the binder resin heated by the thermocompression bonding head is cured in this state. To do. Thereby, the organic EL display 1 in which electrical conductivity is ensured between the drive circuit element 3 and the plastic substrate 2 can be manufactured.

  The conductive particles 11 not between the electrode terminal 6 of the drive circuit element 3 and the electrode of the plastic substrate 2 are dispersed in the binder resin between the adjacent electrode terminals 6, and maintain an electrically insulated state. Yes. Thereby, electrical conduction is achieved only between the electrode terminal 6 of the drive circuit element 3 and the electrode of the plastic substrate 2. In addition, by using a fast curing type radical polymerization reaction system as the binder resin, the binder resin can be rapidly cured even with a short heating time. Further, the anisotropic conductive film 10 is not limited to the thermosetting type, and a photocurable or photothermal combination type adhesive may be used.

  Further, as described above, the plastic substrate 2 is bent when the electrode terminal 6 of the drive circuit element 3 is elastically displaced by the pressing of the thermocompression bonding head, and a high pressure is locally applied by the electrode terminal 6. Has been relaxed. Therefore, the organic EL display 1 has good conductivity by sufficiently sandwiching the conductive particles 11 without the electrode formed on the plastic substrate 2 being lifted with respect to the electrode terminal 6 of the drive circuit element 3.

  Further, in the organic EL display 1, since the bending of the plastic substrate 2 is suppressed, the distance between the plastic substrate 2 and the substrate 4 of the drive circuit element 3 in the inter-terminal region where the electrode terminal 6 is not provided is kept moderate. The binder resin has a strong connection strength without being excessively excluded.

[Minimum distance between terminal rows]
Here, as described above, in the drive circuit element 3, a plurality of output terminal arrays 8 in which a plurality of electrode terminals 6 are arranged are formed in a direction orthogonal to the arrangement direction of the electrode terminals 6. As shown in FIG. 7, the organic EL display 1 includes a region between one output terminal row 8 and the output terminal row 8 adjacent to the one output terminal row 8 or the opposite input terminal row 7. The minimum distance D between the substrate 4 of the drive circuit element 3 and the plastic substrate 2 is preferably 80% or more of the height H of the electrode terminal 6 from the substrate 4 after connection, and more preferably greater than 80%. preferable. Thereby, in the organic EL display 1, the bending of the plastic substrate 2 is relaxed, and the distance between the plastic substrate 2 and the substrate 4 of the drive circuit element 3 is kept moderate, so that the binder resin is excessively excluded. Strong connection strength.

  The organic EL display 1 has a minimum distance D between the substrate 4 of the drive circuit element 3 and the plastic substrate 2 between the adjacent output terminal rows 8 and 8 or between the input / output terminal rows 7 and 8, and It is preferable to have 80% or more of the height H of the electrode terminal 6 from the substrate 4 after connection. Between the output terminal rows 8 and 8 of the drive circuit element 3 or between the input and output terminal rows 7 and 8 is a position where the plastic substrate 2 is most easily bent and the removal of the binder resin is most likely to proceed. The minimum distance D between the substrate 4 of the drive circuit element 3 and the plastic substrate 2 between the output terminal rows 8 and 8 or between the input / output terminal rows 7 and 8 is the distance from the substrate 4 of the electrode terminal 6 after connection. When the height H is 80% or more, preferably greater than 80%, the binder resin can be prevented from being eliminated, and strong connection strength can be provided.

[Second Embodiment]
[Connected body]
The connection body according to the second embodiment can be used for a connection body in which a flexible substrate such as a plastic substrate and an electronic component are connected. As a connection body according to the second embodiment, for example, as shown in FIG. 1, a flexible organic electroluminescent color display 1 in which a drive circuit element 20 as an electronic component is mounted on a plastic substrate 2 can be exemplified.

  The plastic substrate 2 is synonymous with the plastic substrate 2 described in the connection body according to the first embodiment described above, and the preferred range is also the same.

  The drive circuit element 20 can perform a desired display by selectively applying a drive voltage to the pixels. As shown in FIG. 11, the drive circuit element 20 includes an input terminal array 21 and an output terminal array 22 (in which a plurality of electrode terminals (bumps) 6 are arranged on the mounting surface 4a of the substrate 4 mounted on the plastic substrate 2. 22A-22C). As the electrode terminal 6, for example, a copper bump, a gold bump, a copper bump with gold plating, or the like can be used.

  In the input terminal row 21, a plurality of electrode terminals 6 are arranged along one side edge 4b of the mounting surface 4a of the substrate 4, and the adjacent electrode terminals 6 are arranged in the arrangement direction of the electrode terminals 6 (in FIG. 11). Are alternately arranged in a direction (a direction in FIG. 11, hereinafter also referred to as a bump row direction) orthogonal to the (b direction). The plurality of electrode terminals 6 constituting the input terminal array 21 are arranged so that a part of the electrode terminals 6 adjacent to each other in the arrangement direction of the electrode terminals 6 overlap.

  In the output terminal row 22, a plurality of electrode terminals 6 are arranged along the other side edge 4 c facing the one side edge 4 b of the mounting surface 4 a of the substrate 4. The output terminal row 22 is formed as a single or a plurality in the direction orthogonal to the arrangement direction of the electrode terminals 6. For example, as shown in FIG. 11, when a plurality of output terminal rows 22 are formed (3 rows; 22A, 22B, 22C), the output terminal row 22C (hereinafter referred to as the output terminal row 22C arranged on the most central side of the drive circuit element 20). The plurality of electrode terminals 6 constituting the specific bump row are alternately arranged in the direction perpendicular to the arrangement direction of the electrode terminals 6. The plurality of electrode terminals 6 constituting the output terminal row 22C are arranged so that a part of the adjacent electrode terminals 6 overlaps in the arrangement direction of the electrode terminals 6.

  In the plurality of electrode terminals 6 constituting the specific bump row, it is preferable that the overlap in the bump row direction between the electrode terminals 6 adjacent to each other in the arrangement direction of the electrode terminals 6 is not too small. That is, it is preferable that the distance in the direction orthogonal to the arrangement direction of the electrode terminals 6 adjacent to each other in the arrangement direction of the electrode terminals 6 is not too large. When the distance between the plurality of electrode terminals 6 constituting the specific bump row in the bump row direction is too large (for example, when there is no overlap between the adjacent electrode terminals 6 in the bump row direction), There is a concern that the pressing force of the material becomes uneven.

  The plurality of electrode terminals 6 constituting the specific bump row are overlapped in the bump row direction between the electrode terminals 6 adjacent to each other in the arrangement direction of the electrode terminals 6 from the viewpoint of more effectively mitigating the bending of the plastic substrate 2. It is preferably not too large.

  Thus, by using the drive circuit element 20 including the input terminal row 21 and the output terminal row 22C formed so that the bump region to be actually connected becomes larger in the bump row direction, the bending base point of the plastic substrate 2 is obtained. The position of the conductive particles captured by each bump becomes moderately dispersed in the bump row direction. Thereby, the pressing force at the time of press-bonding between the driving element 20 and the plastic substrate 2 can be dispersed, the bending of the plastic substrate 2 can be relaxed, and cracking and peeling of the plastic substrate 2 can be suppressed. In addition, since the bending of the plastic substrate 2 can be relaxed, it is possible to suppress the electrode formed on the plastic substrate 2 from floating with respect to the electrode terminal 6 of the drive circuit element 20. Accordingly, the conductive particles can be sufficiently sandwiched, and the electrical conductivity between the plastic substrate 2 and the substrate 4 of the driving element 20 can be improved.

In particular, it is preferable that the plurality of electrode terminals 6 constituting the specific bump row satisfy the following formula (1). If the overlap of the electrode terminals 6 in the bump row direction is too large, it tends to be difficult to relax the bending of the plastic substrate 2. Therefore, the distance in the direction orthogonal to the arrangement direction of the electrode terminals 6 adjacent to each other in the arrangement direction of the electrode terminals 6 is preferably equal to or greater than the distance between the electrode terminals 6. Thereby, while suppressing the crack and peeling of the plastic substrate 2 more effectively, the electrical connection between the plastic substrate 2 and the substrate 4 of the driving element 20 can be improved.
(1) S ≦ L

  In formula (1), S represents the distance in the arrangement direction of the electrode terminal 6 between one electrode terminal 6 constituting the specific bump row and another electrode terminal 6 adjacent to the one electrode terminal. For example, in the output terminal row 22C shown in FIG. 12, the distance S in the arrangement direction between the electrode terminal 6A and the electrode terminal 6B adjacent to the electrode terminal 6A or the electrode terminal 6C is S in the expression (1). Equivalent to.

  If the distance S in the arrangement direction of the electrode terminals 6 is too small, the distance between the bumps becomes too small, and there is a risk of inducing a short circuit between the terminals due to the connection of the conductive particles. For the same reason, it is preferable to provide a certain distance or more in any direction, not just the distance in the arrangement direction of the electrode terminals 6. In the specific bump row, there is a concern about the shortest occurrence. Therefore, in the specific bump row, the direction orthogonal to the arrangement direction of the electrode terminals 6 of one electrode terminal 6 and the other electrode terminal 6 adjacent to the one electrode terminal 6 rather than the distance S in the arrangement direction of the electrode terminals 6. By increasing the shift distance L, it is possible to easily avoid a short (inter-terminal short) at the distance S in the specific bump row.

  In the formula (1), L is a deviation in a direction perpendicular to the arrangement direction of the electrode terminals 6 between one electrode terminal 6 constituting the specific bump row and another electrode terminal 6 adjacent to the one electrode terminal 6. Represents distance. For example, in the output terminal row 22C shown in FIG. 12, the distance L between the one end of the electrode terminal 6A and the electrode terminal 6B adjacent to the electrode terminal 6A or one end of the electrode terminal 6C is perpendicular to the arrangement direction of the electrode terminals. , Corresponding to L in formula (1).

  As described above, when the plurality of electrode terminals 6 constituting the specific bump row satisfy the formula (1), the length of the bump region in the bump row direction is increased, so that each of the bending base points of the plastic substrate 2 is obtained. The positions of the conductive particles captured by the bumps are easily dispersed moderately in the bump row direction. Here, when there are a plurality of bump rows as in the output terminal rows 22A to 22C shown in FIG. Thereby, the pressing force at the time of the crimping | compression-bonding with the drive circuit element 20 and the plastic substrate 2 can be disperse | distributed more uniformly, and the bending of the plastic substrate 2 can be relieve | moderated more effectively. Further, since the bending of the plastic substrate 2 can be relaxed, it is possible to more effectively prevent the electrode formed on the plastic substrate 2 from being lifted with respect to the electrode terminal 6 of the drive circuit element 20. The particles can be held sufficiently. Therefore, cracking and peeling of the plastic substrate 2 can be more effectively suppressed, and electrical conductivity between the plastic substrate 2 and the substrate 4 of the drive circuit element 20 can be improved.

  The output terminal rows 22A and 22B other than the output terminal row 22C arranged on the most central side of the drive circuit element 20 may be arranged in a line in the arrangement direction of the electrode terminals 6, for example, as shown in FIG. it can. Further, in the output terminal rows 22A to 22C, for example, as shown in FIG. 11, the intervals between the output terminal rows in the direction orthogonal to the arrangement direction of the electrode terminals 6 are substantially the same.

  Further, as shown in FIG. 13, the drive circuit element 20 has a signal or the like between the input terminal row 21 and the output terminal row 22 within a range where constraints such as bump layout, manufacturing man-hours, and cost are allowed. A dummy bump row 24 in which a plurality of dummy bumps 23 not used for input / output are arranged may be formed.

  The configuration of the drive circuit element 20 may be appropriately changed within a range in which cracking and peeling of the plastic substrate 2 are suppressed and electrical conductivity between the plastic substrate 2 and the substrate 4 of the drive element 20 can be improved. For example, the number of output terminal rows 22 formed in the drive circuit element 20 may be singular. In this case, the single output terminal row 22 corresponds to the specific bump row described above. Further, the input terminal row 21 may be arranged in a single row as in the case of the output terminal rows 22A and 22B without arranging the plurality of electrode terminals 6 alternately as shown in FIG. Further, the arrangement of the output terminal rows 22A and 22B may be a staggered arrangement similar to the output terminal row 22C.

  As shown in FIG. 12, for example, the bump rows arranged alternately are one electrode terminal (electrode terminal 6A) and another electrode terminal further adjacent to one electrode terminal (electrode terminal 6C). The position in the bump row direction with respect to (electrode terminal 6D) may be the same. Further, as shown in FIG. 14, for example, the bump rows arranged alternately are adjacent to one electrode terminal (electrode terminal 6E) and one electrode terminal so as to have a wave shape in a range satisfying the expression (1). The position in the bump row direction may be different from another electrode terminal (electrode terminal 6G) further adjacent to the electrode terminal (electrode terminal 6F) to be performed. That is, L1 and L2 shown in FIG. 14 may be different within a range satisfying the formula (1).

  Further, as shown in FIG. 15, for example, the bump rows arranged alternately are further adjacent to the height of one electrode terminal (electrode terminal 6H) and the electrode terminal adjacent to one electrode terminal (electrode terminal 6I). The heights of the other electrode terminals (electrode terminals 6J) may be the same or different.

  When there are a plurality of bump rows, it is preferable that the alternating bump rows protrude inward in the width direction (center side) of the driving element 20 (IC chip). By setting the distance between the plurality of bump rows to a certain value or more, occurrence of a short circuit can be more effectively suppressed. In the anisotropic connection, generally, the substantially central portion in the width direction of the driving element 20 (IC chip) is pressed, and thus the resin flows from the substantially central portion in the width direction to the outside. That is, by arranging the bumps in the bump row that receives the resin flow relatively strongly, it is possible to easily avoid the connection of the conductive particles (that is, the occurrence of a short circuit) due to the resin flow. In other words, in one bump constituting the bump row and another bump adjacent to this one bump, the conductive particles are connected by reducing the area overlapping in the bump row direction (overlap in the bump row direction). It can be easier to avoid.

  For the same reason, it is preferable that the distance between an arbitrary bump and the bump in all directions adjacent to the arbitrary bump is kept at a certain level or more. This distance is not particularly limited. For example, it is preferable that the distance between the bumps between the narrowest bump rows is the shortest distance between the bumps in all directions.

  Furthermore, the arrangement of the bump rows may be regular or irregular as long as it is satisfied that the stress from the pressure tool received on the back of the electronic component is uniformly transmitted to the bumps during anisotropic connection. There may be. Since the bump arrangement is regular, the design is simplified, and the cost can be reduced from the viewpoint of suppressing the manufacturing yield. Further, since the bump arrangement is irregular, a bump layout that easily meets the demand for higher integration becomes possible. Such high integration is required when there is a strong demand for downsizing, such as a wearable terminal.

  For example, as shown in FIG. 1, the drive circuit element 20 is connected to a region outside the display region 5 of the plastic substrate 2 using an anisotropic conductive adhesive. As the anisotropic conductive adhesive, for example, an anisotropic conductive film containing conductive particles can be used. The anisotropic conductive film and the conductive particles are synonymous with the anisotropic conductive film 10 and the conductive particles 11 described in the connection body according to the first embodiment described above, and the preferred range is also the same.

  The electrode terminals 6 provided on the drive circuit element 20 and the electrodes provided on the plastic substrate 2 are formed with the same number and the same pitch, respectively, and the plastic substrate 2 and the drive circuit element 20 are aligned and connected. Is done.

[Manufacturing method of connected body]
The connection body manufacturing method according to the second embodiment includes, for example, a drive circuit element 20 provided on the substrate 4 with an output terminal array 22 in which a plurality of electrode terminals 6 are arranged, and a plurality of electrode terminals 6 connected thereto. The plastic substrate 2 on which the electrodes are arranged is arranged so that the electrode terminal 6 and the electrode of the plastic substrate 2 face each other with an adhesive, and the drive circuit element 20 and the plastic substrate 2 are crimped by a crimping tool. A step of curing the adhesive is also included. The connection process for connecting the drive circuit element 20 to the plastic substrate 2 can be performed in the same manner as the connection process described in the first embodiment.

  According to the manufacturing method of the connection body according to the second embodiment, by using the drive circuit element 20 including the output terminal row 22C, the pressing force at the time of crimping between the drive circuit element 20 and the plastic substrate 2 is dispersed. The bending of the plastic substrate 2 can be relaxed. Thereby, the crack and peeling of the plastic substrate 2 can be suppressed. In addition, since the bending of the plastic substrate 2 can be relaxed, it is possible to suppress the electrode formed on the plastic substrate 2 from floating with respect to the electrode terminal 6 of the drive circuit element 20. Accordingly, the conductive particles can be sufficiently sandwiched, and the electrical conductivity between the plastic substrate 2 and the substrate 4 of the driving element 20 can be improved.

  Next, examples of the present invention will be described. In this example, a sample of a connection body in which an evaluation element is connected to a plastic substrate using an anisotropic conductive film is formed, and the minimum distance between the plastic substrate and the evaluation element substrate, electrical conductivity, and short between terminals are formed. The occurrence rate (ppm) of was measured and evaluated. As the anisotropic conductive film, a general-purpose anionic film in which conductive particles having an average particle diameter of 3.0 μm were dispersed was used. The crimping conditions of the evaluation element are 200 ° C., 10 and 100 MPa, and 5 seconds.

  The plastic substrate to which the element for evaluation is ACF-connected has a PI film excellent in heat resistance bonded to a PET film having transparency with an insulating adhesive. The thickness of each layer of the plastic substrate is PI film: 10 μm, adhesive: 30 μm, and PET film: 75 μm. In the plastic substrate, an electrode connected to the electrode terminal of the evaluation element is formed on the PI film. The elastic modulus of the entire plastic substrate is 3500 MPa, and the elastic modulus of the adhesive layer is 0.13 MPa.

  The evaluation element has an input terminal array in which electrode terminals are arrayed along one side edge of the mounting surface on the plastic substrate, and the electrode terminals along the other side edge facing one side edge. Are arranged in a zigzag pattern with three rows. The wiring pitch of the electrode terminals is L / S = 16/14 (μm).

[Example 1]
In Example 1, as an electrode terminal constituting the terminal row, an evaluation element in which a plurality of terminal portions are laminated in a stripe shape by applying Ag plating to the surface of a rectangular rubber member along the longitudinal direction is used. (See FIG. 5). The electrode terminal of the evaluation element according to Example 1 has an elastic modulus of 5 GPa, the height before pressing is 17 μm, the height when pressed at 10 MPa is 16 μm, and the height when pressed at 100 MPa is 13 μm. there were.

[Example 2]
In Example 2, as an electrode terminal constituting the terminal row, an evaluation element in which terminal portions were laminated by applying Ag plating to the surface of each rubber member was used (see FIG. 3). The electrode terminal of the evaluation element according to Example 2 has an elastic modulus of 5 GPa, the height before pressing is 17 μm, the height when pressed at 10 MPa is 16 μm, and the height when pressed at 100 MPa is 13 μm. there were.

[Comparative Example 1]
In Comparative Example 1, an evaluation element on which an Au stud bump was formed was used as an electrode terminal constituting the terminal row (see FIG. 9). The electrode terminal of the evaluation element according to Comparative Example 1 has an elastic modulus of 82 GPa, the height before pressing is 15 μm, the height when pressed at 10 MPa is 15 μm, and the height when pressed at 100 MPa is 15 μm. there were.

  After temporarily attaching an anisotropic conductive film to a plastic substrate, the evaluation element was mounted while alignment was performed, and a connected body sample was prepared by thermocompression bonding under the above conditions using a thermocompression bonding head. About each connection body sample, the minimum distance of the plastic substrate and the board | substrate of the element for evaluation, electrical conductivity, and the incidence rate (ppm) of the short circuit between terminals were measured and evaluated.

  The minimum distance between the plastic substrate and the substrate of the evaluation element was determined by observing a cross section of the connection body sample by cutting it between the input terminal row and the output terminal row. In the continuity evaluation, an average conduction resistance value of less than 2.0Ω was ◯ (good), 2.0Ω or more and less than 5.0Ω was Δ (normal), and 5Ω or more was x (defect).

  As shown in Table 1, in the connection body samples according to Examples 1 and 2, even when pressed at 100 MPa, the minimum distance between the plastic substrate and the substrate of the evaluation element was 12 μm or more. This is because the bending of the plastic substrate is alleviated by the elastic deformation of the electrode terminals of the evaluation elements according to Examples 1 and 2. Further, in the connection body samples according to Examples 1 and 2, the minimum distance is 80% or more of the height of the electrode terminal after connection (Example 1: 13 μm, Example 2: 13 μm). It can be seen that is relaxed. For this reason, in the connection body sample which concerns on Example 1, 2, the electrode formed in the plastic substrate can hold | grip electroconductive particle, without floating from the electrode terminal of the element for evaluation, and has favorable electroconductivity. .

  Further, in the connection body samples according to Examples 1 and 2, even when pressed at 10 MPa, the minimum distance between the plastic substrate and the substrate of the evaluation element is 14 μm, and the height (16 μm) of the electrode terminal is 80 μm. % Or more, the bending was relaxed and the conduction resistance value was suppressed to less than 5Ω.

  Moreover, in the connection body sample which concerns on Example 1, 2, since the minimum distance of a plastic substrate and the board | substrate of an evaluation element is 12 micrometers or more, binder resin is not excluded more than necessary, but good connection strength It was something that played.

  On the other hand, in the connection body sample according to Comparative Example 1, even when pressed at 10 MPa, the minimum distance between the plastic substrate and the substrate of the evaluation element was 12 μm. This is because the distance between the two substrates is narrowed because the plastic substrate is greatly bent by the Au bumps. And since the plastic substrate was largely bent, the electrode of the plastic substrate was lifted from the Au bump, and the conductive particles could not be sufficiently sandwiched. For this reason, in the connection body sample which concerns on the comparative example 1, the conduction | electrical_connection resistance value became 5 ohms or more.

  Further, in the connection body sample according to Comparative Example 1, when the pressing force is increased to 100 MPa, the plastic substrate is further bent, and the adhesive layer of the plastic substrate is deformed, so that the connection with the evaluation element is achieved. It became difficult to take.

  In addition, when Example 1 and Example 2 are compared, the direction of Example 1 which laminated | stacked the terminal part in stripe form over the longitudinal direction of a rectangular-shaped elastic member provided an elastic member each independently, and is a terminal. Compared with Example 2 in which the portions were laminated, the incidence of short-circuiting between the electrode terminals was low. This is because the conductive particles are rarely continuous between the terminal portions because the electrode terminals are buried in the elastic member in the first embodiment, whereas in the second embodiment, the conductive particles are provided independently. Since the electrode terminal portion is expanded in the width direction by being pressed and the space between the terminals is narrowed, a situation in which the conductive particles continue in the narrowed inter-terminal region is likely to occur as compared with the first embodiment. Because it became.

DESCRIPTION OF SYMBOLS 1 Organic EL display, 2 Plastic substrate, 3 Drive circuit element, 4 Substrate, 5 Display area, 6 Electrode terminal, 6a Elastic member, 6b Terminal part, 7 Input terminal row, 8 Output terminal row, 10 Anisotropic conductive film, 11 conductive particles, 12 release film, 13 binder resin, 20 drive circuit element, 21 input terminal row, 22 output terminal row, 23
Dummy bump, 24 Dummy bump row

Claims (20)

An electronic component having a plurality of bumps arranged on a substrate;
A flexible substrate on which a plurality of electrodes connected to the bumps are arranged;
An adhesive for connecting the electronic component and the flexible substrate;
The bump has a connection body having an elastic member provided on the substrate of the electronic component and a terminal portion laminated on the elastic member and electrically connected to the electrode of the flexible substrate.   The connection body according to claim 1, wherein the plurality of bumps are laminated on the elastic member independently.   The connection body according to claim 1, wherein a plurality of the bumps are laminated on a rectangular elastic member formed on the substrate. In the electronic component, a plurality of bump rows in which a plurality of the bumps are arranged are formed in a direction orthogonal to the arrangement direction of the bumps,
The minimum distance between the substrate and the flexible substrate between the first bump row and the second bump row adjacent to the first bump row is the height of the bump after the electronic component is connected. The connection body according to any one of claims 1 to 3, wherein the connection body is 80% or more.   The minimum distance between the substrate and the flexible substrate between the first bump row and the second bump row is 80% or more of the height of the bump after the electronic component is connected. The connection body according to claim 4.   The connection body according to claim 1, wherein the flexible substrate is light transmissive.   The connection body according to claim 1, wherein the flexible substrate is a plastic substrate.   The connection body according to any one of claims 1 to 7, wherein the flexible substrate has a plurality of substrates laminated via an adhesive.   The connection body according to claim 1, wherein the adhesive is an anisotropic conductive adhesive. An electronic component in which a plurality of bumps are arranged on a substrate and a flexible substrate in which a plurality of electrodes connected to the bumps are arranged so that the bumps and the electrodes face each other through an adhesive. Place and
A step of crimping the electronic component and the flexible substrate with a crimping tool and curing the adhesive;
The bump is a method of manufacturing a connection body having an elastic member provided on a substrate of the electronic component and a terminal portion laminated on the elastic member and electrically connected to the electrode of the flexible substrate. An electronic component in which a plurality of bumps are arranged on a substrate and a flexible substrate in which a plurality of electrodes connected to the bumps are arranged so that the bumps and the electrodes face each other through an adhesive. Place and
A step of crimping the electronic component and the flexible substrate with a crimping tool and curing the adhesive;
The bump is a method for connecting an electronic component, comprising: an elastic member provided on the substrate of the electronic component; and a terminal portion laminated on the elastic member and electrically connected to the electrode of the flexible substrate. An electronic component comprising a bump row in which a plurality of bumps are arranged along a side edge of the electronic component,
The bump row is formed by one or a plurality in the direction orthogonal to the arrangement direction of the bumps,
When the bump row is singular, the plurality of bumps constituting the single bump row are alternately arranged in a direction in which adjacent bumps are orthogonal to the arrangement direction,
When there are a plurality of bump rows, a plurality of bumps constituting one bump row arranged on the most central side of the electronic component are alternately arranged in a direction in which adjacent bumps are orthogonal to the arrangement direction. Electronic parts that are being. The electronic component according to claim 12, wherein the bump rows in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction satisfy the following formula (1).
(1) S ≦ L
(In the formula (1), S is a relationship between one bump constituting a bump array in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction, and another bump adjacent to the one bump. (L represents the distance in the direction perpendicular to the arrangement direction between the one bump and the other bump.)   The plurality of bumps constituting the bump row in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction are arranged so that a part of the bumps adjacent in the arrangement direction overlap each other. Or the electronic component of 13. An electronic component provided on a substrate with a bump array in which a plurality of bumps are arranged;
A flexible substrate on which a plurality of electrodes connected to the bumps are arranged;
An adhesive for connecting the electronic component and the flexible substrate;
The bump has a terminal portion that is electrically connected to the electrode of the flexible substrate,
The bump row is arranged in one or more along the side edge of the electronic component,
When the bump row is singular, the plurality of bumps constituting the single bump row are alternately arranged in a direction in which adjacent bumps are orthogonal to the arrangement direction,
When there are a plurality of the bump rows, the plurality of bumps constituting the one bump row arranged at the most central portion side of the electronic component are alternately arranged in a direction in which adjacent bumps are orthogonal to the arrangement direction. Connected body. The connected body according to claim 15, wherein the bump rows in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction satisfy the following formula (1).
(1) S ≦ L
(In the formula (1), S is a relationship between one bump constituting a bump array in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction, and another bump adjacent to the one bump. (L represents the distance in the direction perpendicular to the arrangement direction between the one bump and the other bump.)   The plurality of bumps constituting the bump row in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction are arranged so that a part of the bumps adjacent in the arrangement direction overlap each other. Or the connection body of 16.   The connection body according to claim 15, wherein the adhesive is an anisotropic conductive adhesive. An electronic component having a bump array on which a plurality of bumps are arranged on a substrate, and a flexible substrate on which a plurality of electrodes connected to the bumps are arranged, and the bumps and the electrodes are bonded via an adhesive. Arrange to face each other,
A step of crimping the electronic component and the flexible substrate with a crimping tool and curing the adhesive;
The bump has a terminal portion that is electrically connected to the electrode of the flexible substrate,
The bump row is arranged in one or more along the side edge of the electronic component,
When the bump row is singular, the plurality of bumps constituting the single bump row are alternately arranged in a direction in which adjacent bumps are orthogonal to the arrangement direction,
When there are a plurality of the bump rows, the plurality of bumps constituting the one bump row arranged at the most central portion side of the electronic component are alternately arranged in a direction in which adjacent bumps are orthogonal to the arrangement direction. A connected body manufacturing method. An electronic component having a bump array on which a plurality of bumps are arranged on a substrate, and a flexible substrate on which a plurality of electrodes connected to the bumps are arranged, and the bumps and the electrodes are bonded via an adhesive. Arrange to face each other,
A step of crimping the electronic component and the flexible substrate with a crimping tool and curing the adhesive;
The bump has a terminal portion that is electrically connected to the electrode of the flexible substrate,
The bump row is arranged in one or more along the side edge of the electronic component,
When the bump row is singular, the plurality of bumps constituting the single bump row are alternately arranged in a direction in which adjacent bumps are orthogonal to the arrangement direction,
When there are a plurality of the bump rows, the plurality of bumps constituting the one bump row arranged at the most central portion side of the electronic component are alternately arranged in a direction in which adjacent bumps are orthogonal to the arrangement direction. A method for connecting electronic components.

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