KR20230043894A - Adhesive film for circuit connection, adhesive composition for circuit connection, circuit connection structure, and manufacturing method thereof - Google Patents

Abstract

The adhesive film for circuit connection includes a region A containing conductive particles and containing a cationically polymerizable compound, a thermal cationic polymerization initiator, and an ion trapping agent in the thickness direction of the film, the cationically polymerizable compound Including this epoxy compound, the thermal cationic polymerization initiator contains an anilinium salt, the ion trapping agent is aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, calcium hydroxide, At least one metal compound selected from the group consisting of calcium oxide, tin hydroxide, tin oxide, manganese hydroxide, manganese oxide, antimony hydroxide, antimony oxide, silicon hydroxide, silicon oxide, titanium hydroxide, and titanium oxide do.

Description

Adhesive film for circuit connection, adhesive composition for circuit connection, circuit connection structure, and manufacturing method thereof

The present disclosure relates to an adhesive film for circuit connection, an adhesive composition for circuit connection, a circuit connection structure, and a manufacturing method thereof.

BACKGROUND ART In recent years, in the display industry, a paradigm shift from liquid crystal displays to organic LEDs (Light Emitting Diodes) has occurred in modules of display means, and accordingly, changes have occurred in constituent materials of panels.

In a conventional liquid crystal display, a glass substrate is used as a substrate, and as a circuit material formed on the glass substrate, a metal such as aluminum is used for circuits of a base layer, and ITO (Indium Tin Oxide) is used for electrodes of a surface layer. It is becoming. On the other hand, in organic LEDs, a plastic substrate having flexibility such as a polyimide substrate is used as a substrate, and Ti is used as a circuit material formed on the plastic substrate. In addition, a flexible member such as an adhesive layer and a polyethylene terephthalate (PET) substrate is usually disposed on the lower surface of the polyimide substrate for the purpose of imparting flexibility (see Patent Document 1, for example).

By the way, in liquid crystal displays, so-called COG (chip on glass) mounting in which various electronic components such as driving ICs are directly mounted on a glass substrate of a display panel is employed from the viewpoint of fine pitch reduction, light weight reduction, and the like. In addition, as a COG mounting method, for example, a circuit connection structure is formed by thermally compressing a liquid crystal drive IC onto a glass substrate through an adhesive film for circuit connection having anisotropic conductivity in which conductive particles are dispersed in the adhesive. method of obtaining is being used.

Patent Document 1: Japanese Unexamined Patent Publication No. 2016-054288

Also in organic LEDs, a COP (chip on plastic) mounting method in which driving ICs and the like are directly mounted on a plastic substrate is employed. However, when excessive pressure is applied to the plastic substrate, problems due to deformation of the plastic substrate, for example, Ti circuits provided on the polyimide substrate are deformed, cracks occur, and problems such as disconnection occur. there is. Therefore, in COG mounting using an adhesive film for circuit connection, it is common to apply a pressure of 50 to 100 MPa in terms of area conversion pressure at the bump electrode of the IC chip, but in COP mounting in organic LED, circuit breakage is prevented. For this reason, mounting by low pressure of 40 MPa or less, for example, is considered desirable. Mounting bodies fabricated under such low-pressure conditions tend to have high connection resistance between opposing electrodes, making it difficult to obtain sufficient conduction characteristics.

On the other hand, bumps in IC chips are being densified, and it is required to ensure high insulation between adjacent circuits. , In the case where the curing system of the adhesive is a cationic-epoxy curing system or the like, the present inventors have found that the insulation resistance between adjacent circuits after a high-temperature, high-humidity test tends to decrease.

The present disclosure provides an adhesive film for circuit connection capable of sufficiently ensuring conduction between opposing electrodes of a circuit connection structure and sufficiently maintaining insulation between adjacent circuits even when circuit members are connected to each other at a low pressure. Its main purpose is to

In order to solve the above problems, one aspect of the present disclosure provides an adhesive film for circuit connection including conductive particles. The adhesive film includes a region A containing a cationically polymerizable compound, a thermal cationic polymerization initiator, and an ion trapping agent in the thickness direction of the film, and the cationically polymerizable compound contains a ring-opening polymerizable cyclic ether group in a molecule. The thermal cationic polymerization initiator includes an anilinium salt, the ion trapping agent is aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, hydroxide At least one metal compound selected from the group consisting of calcium, calcium oxide, tin hydroxide, tin oxide, manganese hydroxide, manganese oxide, antimony hydroxide, antimony oxide, silicon hydroxide, silicon oxide, titanium hydroxide, and titanium oxide includes

According to this adhesive film for circuit connection, even if it is a case where circuit members are connected by low pressure, while being fully securable between the electrodes which oppose circuit connection structure, insulation between adjacent circuits can fully be maintained. The reason why such an effect is obtained is not necessarily clear, but the present inventors speculate as follows. The adhesive film for circuit connection according to the present disclosure has a cationic polymerization system region containing a compound having at least one ring-opening polymerizable cyclic ether group in its molecule, and the adhesive component is excluded from between opposing electrodes and from the vicinity of the conductive particles. In addition to being able to obtain exclusivity that tends to occur, the combination of the specific thermal cation polymerization initiator can express curing characteristics excellent in resistance to curing inhibition compared to other thermal cation polymerization initiators such as sulfonium salts, It is thought that the conduction characteristics were sufficiently secured by suppressing the flow of conductive particles between the electrodes. Further, when the adhesive film for circuit connection has a region A containing the specific ion trapping agent, even when ions such as chloride ions that reduce insulation are generated from conductive particles or the like in the circuit connection structure, the ions are captured Therefore, it is considered that the insulation between adjacent circuits could be sufficiently maintained.

The conductive particles may have palladium plating. An adhesive film for circuit connection containing such conductive particles tends to exhibit low resistance to a circuit having a Ti surface.

The anilinium salt may be an anilinium salt having an anion containing boron as a constituent element from the viewpoint of pot life.

The conductive particles may be unevenly distributed on one surface side of the film. In this case, it becomes easy to improve the trapping efficiency of conductive particles at the time of circuit connection.

The region A may include a region P further containing a cured product of the photocurable resin component in the thickness direction of the film, and conductive particles may be dispersed in the region P. In this case, the flow of conductive particles at the time of circuit connection can be suppressed, and it is possible to prevent the flowed conductive particles from intervening between adjacent circuits to prevent insulation from deteriorating, and the conductive particle trapping efficiency can be further increased.

Another aspect of the present disclosure is a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second thermosetting resin component provided on the first adhesive layer. An adhesive film for circuit connection provided with a second adhesive layer is provided. In the adhesive film for circuit connection, either or both of the first adhesive layer and the second adhesive layer further contain an ion trapping agent, and either or both of the first thermosetting resin component and the second thermosetting resin component are cationic polymerization. The cationically polymerizable compound contains a compound having at least one ring-opening polymerizable cyclic ether group in its molecule, the thermal cationic polymerization initiator contains an anilinium salt, and the ion trapping agent contains , aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, calcium hydroxide, calcium oxide, tin hydroxide, tin oxide, manganese hydroxide, manganese oxide, antimony hydroxide, oxide At least one metal compound selected from the group consisting of antimony, silicon hydroxide, silicon oxide, titanium hydroxide, and titanium oxide is included.

According to this adhesive film for circuit connection, even if it is a case where circuit members are connected by low pressure, while being fully securable between the electrodes which oppose circuit connection structure, insulation between adjacent circuits can fully be maintained. In addition, since the first adhesive layer containing conductive particles contains a cured product of a photocurable resin component, the flow of conductive particles at the time of circuit connection can be suppressed, and the flowed conductive particles mediate between adjacent circuits, resulting in insulation properties. While being able to prevent a decrease, the trapping efficiency of conductive particles can be further increased.

The conductive particles may have palladium plating. An adhesive film for circuit connection containing such conductive particles tends to exhibit low resistance to a circuit having a Ti surface.

The anilinium salt may be an anilinium salt having an anion containing boron as a constituent element from the viewpoint of pot life.

Another aspect of the present disclosure provides an adhesive composition for circuit connection containing a cationically polymerizable compound, a thermal cationic polymerization initiator, and an ion trapping agent. In the adhesive composition for circuit connection, the cationically polymerizable compound contains a compound having one or more ring-opening polymerizable cyclic ether groups in its molecule, the thermal cationic polymerization initiator contains an anilinium salt, the ion trapping agent contains aluminum hydroxide, Aluminum oxide, magnesium hydroxide, magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, calcium hydroxide, calcium oxide, tin hydroxide, tin oxide, manganese hydroxide, manganese oxide, antimony hydroxide, antimony oxide, hydroxide At least one metal compound selected from the group consisting of silicon, silicon oxide, titanium hydroxide, and titanium oxide is included.

According to this adhesive composition for circuit connection, the area|region A in the above-mentioned adhesive film for circuit connection or the 1st adhesive bond layer and/or the 2nd adhesive bond layer can be formed.

The anilinium salt may be an anilinium salt having an anion containing boron as a constituent element from the viewpoint of pot life.

The adhesive composition for circuit connection may further contain conductive particles and may further contain a photocurable resin component. Such an adhesive composition for circuit connection can form the area|region P in the above-mentioned adhesive film for circuit connection or the 1st adhesive bond layer.

The conductive particles may have palladium plating.

Another aspect of the present disclosure is to interpose the above-described adhesive film for circuit connection between a first circuit member having a first electrode and a second circuit member having a second electrode, and the first circuit member and the second circuit member. A method for manufacturing a circuit connection structure comprising a step of electrically connecting a first electrode and a second electrode to each other by thermocompression bonding of a circuit member is provided.

One of the first circuit member and the second circuit member may be an IC chip, and the other may be a plastic substrate having an electrode containing Ti.

Another aspect of the present disclosure is a first circuit member having a first electrode, a second circuit member having a second electrode, and disposed between the first circuit member and the second circuit member, the first electrode and the second circuit member. Provided is a circuit connection structure comprising a circuit connection portion electrically connecting two electrodes to each other, wherein the circuit connection portion contains a cured product of the above-described adhesive film for circuit connection.

One of the first circuit member and the second circuit member may be an IC chip, and the other may be a plastic substrate having an electrode containing Ti.

According to the present disclosure, even when circuit members are connected to each other at a low pressure, an adhesive film for circuit connection capable of sufficiently ensuring conduction between opposing electrodes of a circuit connection structure and sufficiently maintaining insulation between adjacent circuits. can provide Such an adhesive film for circuit connection can be used suitably for COP mounting. Moreover, according to this indication, the adhesive composition for circuit connection suitable for formation of such an adhesive film for circuit connection can be provided. Moreover, according to this indication, the circuit connection structure using the said adhesive film for circuit connection, and its manufacturing method can be provided.

1 : is a schematic cross-sectional view which shows one Embodiment of the adhesive film for circuit connection.
2 is a schematic cross-sectional view showing one embodiment of a circuit connection structure.
3 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection structure. Fig. 3(a) and Fig. 3(b) are schematic cross-sectional views showing each step.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this indication is described in detail, referring drawings. In the following description, the same code|symbol is attached|subjected to the same or an equivalent part, and overlapping description is abbreviate|omitted. In addition, this invention is not limited to the following embodiment. In this specification, a (meth)acryloyl group means an acryloyl group or a methacryloyl group, and other similar expressions, such as a (meth)acrylate, are also the same. In the numerical range described in this specification, the upper limit value or lower limit value of the numerical range may be substituted with the value shown in the Example. In addition, the lower limit and upper limit of a numerical range are arbitrarily combined with the lower limit or upper limit of each other numerical range. In the representation of the numerical range "A to B", the numerical values A and B at both ends are included in the numerical range as the lower limit value and the upper limit value, respectively. In this specification, for example, "10 or more" means 10 and a numerical value exceeding 10, and when a numerical value differs, it follows this. In addition, for example, description "10 or less" means 10 and a numerical value less than 10, and it conforms to this also when a numerical value differs. Moreover, each component and material exemplified in this specification may be used individually by 1 type, and may use 2 or more types together, unless there is a special explanation. In the present specification, the content of each component in the composition means the total amount of the plurality of substances present in the composition when there are a plurality of substances corresponding to each component in the composition, unless otherwise specified.

[Adhesive film for circuit connection]

The adhesive film for circuit connection of the present embodiment includes a region A containing conductive particles and containing a cationically polymerizable compound, a thermal cationic polymerization initiator, and an ion trapping agent in the thickness direction of the film. The conductive particles may be unevenly distributed on one side of the film, and the region A includes a region P further containing a cured product of a photocurable resin component in the thickness direction of the film, and the region P contains the conductive particles. may be dispersed. Further, the region A may include a region S containing a cationically polymerizable compound, a thermal cationic polymerization initiator, and an ion trapping agent, and containing no cured product of a photocurable resin component, in the thickness direction of the film. .

1 is a schematic cross-sectional view showing an embodiment of an adhesive film for circuit connection according to this embodiment. The adhesive film 10 for circuit connection shown in FIG. 1 (hereinafter sometimes simply referred to as “adhesive film 10”) includes conductive particles 4, a cured product of a photocurable resin component, and 1) A first adhesive layer 1 containing an adhesive component 5 containing a thermosetting resin component, and a second adhesive layer containing a (second) thermosetting resin component provided on the first adhesive layer 1 (2) is provided.

Hereinafter, the adhesive film for circuit connection of this embodiment is demonstrated, referring FIG.

In the adhesive film 10 , conductive particles 4 are dispersed in the first adhesive layer 1 . Therefore, the adhesive film 10 may be an adhesive film for circuit connection having anisotropic conductivity (anisotropic conductive adhesive film). The adhesive film 10 is interposed between a first circuit member having a first electrode and a second circuit member having a second electrode, the first circuit member and the second circuit member are bonded by thermal compression, and the first electrode and those used to electrically connect the second electrodes to each other.

<First adhesive layer>

The first adhesive layer 1 includes conductive particles 4 (hereinafter sometimes referred to as “component (A)”), and a photocurable resin component (hereinafter sometimes referred to as “component (B)”). ), and a thermosetting resin component (hereinafter sometimes referred to as “component (C)”). The first adhesive layer 1 irradiates light energy to a composition layer composed of a composition containing, for example, (A) component, (B) component, and (C) component, and (B) It can be obtained by polymerizing the components contained in the components and curing the component (B). The 1st adhesive layer 1 contains the adhesive component 5 containing (A) component, the hardened|cured material of (B) component, and (C) component. The cured product of component (B) may be a cured product obtained by completely curing component (B) or a cured product obtained by partially curing component (B). Component (C) is a component that can flow during circuit connection, and is, for example, an uncured curable resin component.

(A) Component: Conductive Particles

Component (A) is not particularly limited as long as it is conductive particles, and may be metal particles composed of metals such as Au, Ag, Pd, Ni, Cu, solder, or conductive carbon particles composed of conductive carbon. Component (A) may be coated conductive particles comprising a core made of non-conductive glass, ceramic, plastic (such as polystyrene), and a coating layer containing the metal or conductive carbon covering the core. Among these, the component (A) is preferably a metal particle formed of a heat-meltable metal or a coated conductive particle having a core made of plastic and a coating layer made of metal or conductive carbon to cover the core. Since such coated conductive particles can easily deform the cured product of the thermosetting resin component by heating or pressurizing, when electrically connecting the electrodes, the contact area between the electrodes and the component (A) is increased, thereby improving conductivity between the electrodes. can be further improved.

As the conductive particles, those having palladium plating can be used from the viewpoint of making it easy to develop low resistance in a circuit having a Ti surface. In this case, palladium plating can be provided on the outermost surface of the conductive particles. Specifically, conductive particles obtained by plating the surface of a plastic core body with Ni and substituting Pd for the outermost surface can be used, and such conductive particles have insulating properties on the surface from the viewpoint of preventing short circuits between the conductive particles. You may use what has microparticles|fine-particles supported. In addition, from the viewpoint of facilitating the development of low resistance, in the process of performing Ni plating, a ceramic core material of 100 nm to 200 nm may be introduced during plating, then Pd plating may be performed, and insulating fine particles may be supported as necessary. .

Component (A) may be insulated-coated conductive particles comprising the above-described metal particles, conductive carbon particles, or coated conductive particles and an insulating material such as resin, and provided with an insulating layer covering the surface of the particles. If component (A) is insulated-coated conductive particles, even when the content of component (A) is high, since the surface of the particles is provided with an insulating layer, occurrence of short circuit due to contact between components (A) is prevented. can be suppressed, and also the insulation between neighboring electrode circuits can be improved. Component (A) is used singly or in combination of two or more of the various types of conductive particles described above.

The maximum particle diameter of component (A) needs to be smaller than the minimum distance between electrodes (the shortest distance between adjacent electrodes). The maximum particle diameter of component (A) may be 1.0 μm or more, 2.0 μm or more, or 2.5 μm or more from the viewpoint of excellent dispersibility and conductivity. The maximum particle diameter of component (A) may be 20 μm or less, 10 μm or less, or 5 μm or less from the viewpoint of excellent dispersibility and conductivity. In this specification, the particle diameter of 300 random conductive particles is measured by observation using a scanning electron microscope (SEM), and the largest value obtained is taken as the maximum particle diameter of component (A). do. In addition, when component (A) is not spherical, such as when component (A) has protrusions, the particle diameter of component (A) is the diameter of a circle circumscribing the conductive particle in the SEM image.

The average particle diameter of component (A) may be 1.0 μm or more, 2.0 μm or more, or 2.5 μm or more from the viewpoint of excellent dispersibility and conductivity. The average particle diameter of component (A) may be 20 μm or less, 10 μm or less, or 5 μm or less from the viewpoint of excellent dispersibility and conductivity. In this specification, the particle diameter of 300 random conductive particles is measured by observation using a scanning electron microscope (SEM), and the average value of the obtained particle diameters is taken as the average particle diameter.

In the first adhesive layer 1, it is preferable that component (A) is uniformly dispersed. The particle density of component (A) in the adhesive film 10 is 100 particles/mm ² or more, 1000 particles/mm 2 or more, 3000 particles/mm ^{2 or} more, or 5000 particles/mm ² or more, from the viewpoint of obtaining stable connection resistance. It may be mm ² or more. The particle density of the component (A) in the adhesive film 10 is 100000 particles/mm 2 or less, 70000 particles/mm ² or less, 50000 particles/mm ^{2 or} less, or less, from the viewpoint of improving insulation between adjacent electrodes. It may be 30000 pieces/mm ² or less.

The content of component (A) may be 1% by mass or more, 5% by mass or more, or 10% by mass or more based on the total mass of the first adhesive layer from the viewpoint of further improving conductivity. The content of component (A) may be 60% by mass or less, 50% by mass or less, or 40% by mass or less based on the total mass of the first adhesive layer from the viewpoint of easy suppression of short circuit. When the content of the component (A) is within the above range, the effect of the present invention tends to appear remarkably. In addition, the content of the component (A) in the composition or composition layer (based on the total mass of the composition or composition layer) may be the same as the above range.

(B) component: photocurable resin component

The component (B) is not particularly limited as long as it is a resin component that is cured by light irradiation, but may be a resin component having radical curability from the viewpoint of better connection resistance. Component (B) is, for example, a radically polymerizable compound (hereinafter sometimes referred to as “component (B1)”) and an optical radical polymerization initiator (hereinafter sometimes referred to as “component (B2)”). ) may be included. Component (C) may be a component composed of component (C1) and component (C2).

Component (B1): Radical polymerizable compound

Component (B1) is a compound that is polymerized by radicals generated from component (B2) by irradiation with light (for example, ultraviolet light). The component (B1) may be a monomer or a polymer (or oligomer) obtained by polymerization of one or two or more monomers. (B1) component may be used individually by 1 type, and may be used combining plurality.

Component (B1) is a compound having a radical polymerizable group that reacts with a radical. As a radical polymerizable group, a (meth)acryloyl group, a vinyl group, an allyl group, a styryl group, an alkenyl group, an alkenylene group, maleimide group etc. are mentioned, for example. The number of radically polymerizable groups (the number of functional groups) of the component (B1) may be 2 or more from the viewpoint of easily obtaining a desired melt viscosity after polymerization, further improving the effect of reducing connection resistance, and further improving connection reliability. , from the viewpoint of suppressing curing shrinkage during polymerization, it may be 10 or less. Further, in order to balance the crosslinking density and curing shrinkage, a compound having a number of radical polymerizable groups outside the above range may be used in addition to a compound having a number of radical polymerizable groups within the above range.

The component (B1) may contain, for example, a polyfunctional (bifunctional or higher) (meth)acrylate from the viewpoint of suppressing the flow of conductive particles. A bifunctional (meth)acrylate may be sufficient as the polyfunctional (bifunctional or more functional) (meth)acrylate, and a bifunctional aromatic (meth)acrylate may be sufficient as the bifunctional (meth)acrylate.

Examples of the polyfunctional (meth)acrylate include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, and tetraethylene glycol di(meth)acrylate. Ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol Di(meth)acrylate, tetrapropylene glycoldi(meth)acrylate, polypropylene glycoldi(meth)acrylate, ethoxylated polypropylene glycoldi(meth)acrylate, 1,3-view Tanedioldi(meth)acrylate, 1,4-butanedioldi(meth)acrylate, neopentylglycoldi(meth)acrylate, 3-methyl-1,5-pentanedioldi (meth)acrylate, 1,6-hexanedioldi(meth)acrylate, 2-butyl-2-ethyl-1,3-propanedioldi(meth)acrylate, 1,9-nonane Dioldi(meth)acrylate, 1,10-decanedioldi(meth)acrylate, glycerindi(meth)acrylate, tricyclodecanedimethanol(meth)acrylate, ethoxylated 2-methyl- aliphatic (meth)acrylates such as 1,3-propanedioldi(meth)acrylate; Ethoxylated bisphenol A type di(meth)acrylate, propoxylated bisphenol A type di(meth)acrylate, ethoxylated bisphenol A type di(meth)acrylate, ethoxylated bisphenol F type di(meth)acrylate rate, propoxylated bisphenol F-type di(meth)acrylate, ethoxylated propoxylated bisphenol F-type di(meth)acrylate, ethoxylated fluorene-type di(meth)acrylate, propoxylated fluorene-type di(meth)acrylate ( Aromatic (meth)acrylates such as meth)acrylate, ethoxylated propoxylated fluorene type di(meth)acrylate, trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate )Acrylate, propoxylated trimethylolpropane tri(meth)acrylate, ethoxylated propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ethoxylated pentaeryth Lithol tri(meth)acrylate, propoxylated pentaerythritol tri(meth)acrylate, ethoxylated propoxylated pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ethoxylated pentaeryth Litol tetra(meth)acrylate, propoxylated pentaerythritol tetra(meth)acrylate, ethoxylated propoxylated pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetraacrylate, dipentaerythritol aliphatic (meth)acrylates such as hexa(meth)acrylate; Aromatic epoxy (meth)acrylates, such as bisphenol-type epoxy (meth)acrylate, phenol novolac-type epoxy (meth)acrylate, and cresol novolak-type epoxy (meth)acrylate, etc. are mentioned.

The content of the polyfunctional (bifunctional or higher) (meth)acrylate is, for example, 40 -100 mass %, 50-100 mass %, or 60-100 mass % may be sufficient.

The component (B1) may further contain a monofunctional (meth)acrylate in addition to the polyfunctional (bifunctional or higher) (meth)acrylate. Examples of the monofunctional (meth)acrylate include (meth)acrylic acid; Methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, butoxyethyl (meth)acrylate, isoamyl ( meth)acrylate, hexyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, heptyl(meth)acrylate, octylheptyl(meth)acrylate, nonyl(meth)acrylate, decyl(meth)acrylate , 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, Toxypolyethylene glycol (meth)acrylate, ethoxypolyethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate, ethoxypolypropylene glycol (meth)acrylate, mono aliphatic (meth)acrylates such as (2-(meth)acryloyloxyethyl)succinate; Benzyl(meth)acrylate, phenyl(meth)acrylate, o-biphenyl(meth)acrylate, 1-naphthyl(meth)acrylate, 2-naphthyl(meth)acrylate, phenoxyethyl(meth)acrylate Acrylate, p-cumylphenoxyethyl (meth)acrylate, o-phenylphenoxyethyl (meth)acrylate, 1-naphthoxyethyl (meth)acrylate, 2-naphthoxyethyl (meth)acrylate, phenoxy Polyethylene glycol (meth)acrylate, nonylphenoxypolyethylene glycol (meth)acrylate, phenoxypolypropylene glycol (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate Acrylate, 2-hydroxy-3-(o-phenylphenoxy)propyl(meth)acrylate, 2-hydroxy-3-(1-naphthoxy)propyl(meth)acrylate, 2-hydroxy-3 -Aromatic (meth)acrylates such as (2-naphthoxy)propyl (meth)acrylate; (meth)acrylates having an epoxy group such as glycidyl (meth)acrylate, (meth)acrylates having an alicyclic epoxy group such as 3,4-epoxycyclohexylmethyl (meth)acrylate, and (3-ethyloxa) (meth)acrylates having an oxetanyl group, such as cetan-3-yl)methyl (meth)acrylate; and the like.

The content of the monofunctional (meth)acrylate may be, for example, 0 to 60% by mass, 0 to 50% by mass, or 0 to 40% by mass based on the total mass of the component (B1).

(B) The hardened|cured material of component may have a polymeric group which reacts by other than a radical, for example. The polymerizable group that reacts by means other than a radical may be, for example, a cationic polymerizable group that reacts by means of a cation. Examples of the cationic polymerizable group include oxetanyl groups such as epoxy groups such as glycidyl groups, alicyclic epoxy groups such as epoxycyclohexylmethyl groups, and ethyloxetanylmethyl groups. The cured product of component (B) having a polymerizable group that reacts by means other than a radical includes, for example, (meth)acrylate having an epoxy group, (meth)acrylate having an alicyclic epoxy group, and (meth)acrylate having an oxetanyl group. It can be introduced by using (meth)acrylates having polymerizable groups other than radicals such as acrylates as component (B). (B1) Mass ratio of (meth)acrylate having a polymerizable group that reacts by other than a radical to the total mass of the component (mass (introduced amount) of (meth)acrylate having a polymerizable group that reacts by other than a radical/component (B1) The total mass (introduction amount) of ) may be, for example, 0 to 0.7, 0 to 0.5, or 0 to 0.3 from the viewpoint of improving reliability.

The component (B1) may contain other radically polymerizable compounds in addition to polyfunctional (bifunctional or more) and monofunctional (meth)acrylates. Examples of other radically polymerizable compounds include maleimide compounds, vinyl ether compounds, allyl compounds, styrene derivatives, acrylamide derivatives, and nadimide derivatives. The content of the other radically polymerizable compounds may be, for example, 0 to 40% by mass based on the total mass of the component (B1).

Component (B2): Photoradical polymerization initiator

Component (B2) is light having a wavelength within a range of 150 to 750 nm, preferably light having a wavelength within a range of 254 to 405 nm, and more preferably light having a wavelength of 365 nm (for example, ultraviolet light). ) It is a photopolymerization initiator that generates radicals by irradiation. (B2) component may be used individually by 1 type, and may be used combining plurality.

Component (B2) is decomposed by light to generate free radicals. That is, component (B2) is a compound that generates radicals by application of light energy from the outside. (B2) component is an oxime ester structure, a biimidazole structure, an acridine structure, an α-aminoalkylphenone structure, an aminobenzophenone structure, an N-phenylglycine structure, an acylphosphine oxide structure, a benzyldimethylketal structure, It may be a compound having a structure such as an α-hydroxyalkylphenone structure. (B2) component may be used individually by 1 type, and may be used combining plurality. The component (B2) is selected from the group consisting of an oxime ester structure, an α-aminoalkylphenone structure, and an acylphosphine oxide structure, from the viewpoint of easily obtaining a desired melt viscosity and a more excellent reduction effect of connection resistance. It may be a compound having at least one type of structure.

Specific examples of the compound having an oxime ester structure include 1-phenyl-1,2-butanedione-2-(o-methoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2- (o-methoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2- o-benzoyloxime, 1,3-diphenylpropanetrione-2-(o-ethoxycarbonyl)oxime, 1-phenyl-3-ethoxypropanetrione-2-(o-benzoyl)oxime, 1, 2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(o-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H -carbazol-3-yl]-, 1-(o-acetyloxime), etc. are mentioned.

Specific examples of the compound having an α-aminoalkylphenone structure include 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino -1-morpholinophenyl)-butanone-1 etc. are mentioned.

Specific examples of the compound having an acylphosphine oxide structure include bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide and bis(2,4,6-trimethylbenzoyl). )-phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, and the like.

The content of component (B2) is, for example, 0.1 to 10 parts by mass, 0.3 to 7 parts by mass, or 0.5 to 5 parts by mass, based on 100 parts by mass of component (B1), from the viewpoint of suppressing the flow of conductive particles. can also

The content of the cured product of component (B) may be 1% by mass or more, 5% by mass or more, or 10% by mass or more based on the total mass of the first adhesive layer from the viewpoint of suppressing the flow of conductive particles. The content of the cured product of component (B) is 50% by mass or less, 40% by mass or less, or even 30% by mass or less based on the total mass of the first adhesive layer from the viewpoint of developing low resistance in low-voltage mounting. do. When the content of the cured product of the component (B) is within the above range, the effect of the present invention tends to appear remarkably. In addition, the content of the component (B) in the composition or composition layer (based on the total mass of the composition or composition layer) may be the same as the above range.

(C) component: thermosetting resin component

Component (C) is, for example, a cationic polymerizable compound (hereinafter sometimes referred to as "component (C1)") and a thermal cationic polymerization initiator (hereinafter referred to as "component (C2)" in some cases. ) may be included. Component (C) may be a component composed of component (C1) and component (C2). In addition, the 1st thermosetting resin component and the 2nd thermosetting resin component mean the thermosetting resin component contained in the 1st adhesive layer and the 2nd adhesive layer, respectively. The type, combination, and content of the components (eg, component (C1), component (C2), etc.) contained in the first thermosetting resin component and the second thermosetting resin component may be the same or different.

(C1) component: cationic polymerizable compound

Component (C1) is a compound that crosslinks by reacting with component (C2) by heat. In addition, the component (C1) means a compound that does not have a radical polymerizable group that reacts with a radical, and the component (C1) is not included in the component (B1). Component (C1) may be a compound having at least one ring-opening polymerizable cyclic ether group in the molecule from the viewpoint of further improving the effect of reducing connection resistance and improving connection reliability. (C1) Component may be used individually by 1 type, and may be used combining plurality. The compound having at least one ring-opening polymerizable cyclic ether group in the molecule may be, for example, at least one selected from the group consisting of oxetane compounds and alicyclic epoxy compounds. It is preferable that component (C1) contains both at least 1 sort(s) of oxetane compound, and at least 1 sort(s) of alicyclic epoxy compound from a viewpoint of being easy to obtain a desired melt viscosity.

The oxetane compound as component (C1) can be used without particular limitation as long as it is a compound having an oxetanyl group and not having a radical polymerizable group. Commercially available products of the oxetane compound include, for example, ETERNACOLL OXBP (trade name, manufactured by Ube Industries Co., Ltd.), OXSQ, OXT-121, OXT-221, OXT-101, and OXT-212 (trade name, manufactured by Toagosei Co., Ltd.). can These may be used individually as 1 type of compound, and may be used combining plurality.

As the alicyclic epoxy compound as component (C1), any compound having an alicyclic epoxy group (eg, epoxycyclohexyl group) and not having a radical polymerizable group can be used without particular limitation. As a commercial item of an alicyclic epoxy compound, EHPE3150, EHPE3150CE, CEL8010, CEL2021P, CEL2081 (a brand name, Daicel Co., Ltd. product) etc. are mentioned, for example. These may be used individually as 1 type of compound, and may be used combining plurality.

(C2) Component: Thermal Cationic Polymerization Initiator

Component (C2) is a thermal polymerization initiator that initiates polymerization by generating an acid or the like by heating. (C2) Component may be a salt compound composed of a cation and an anion. Component (C2) includes, for example, BF ₄ ^- , BR ₄ ^- (R represents a phenyl group substituted with two or more fluorine atoms or two or more trifluoromethyl groups), PF ₆ ^- , SbF ₆ ^- , AsF ^and onium salts such as sulfonium salts, phosphonium salts, ammonium salts, diazonium salts, iodonium salts, and anilinium salts having anions such as _6- . These may be used individually by 1 type, and may be used combining plurality.

Component (C2) is, from the viewpoint of storage stability, for example, an anion containing boron as a constituent element, ie, BF ₄ ^- or BR ₄ ^- (R is two or more fluorine atoms or two or more trifluoromethyl groups, represents a substituted phenyl group). The anion containing boron as a constituent element may be BR ₄ ^- , and more specifically, may be tetrakis(pentafluorophenyl)borate.

The onium salt as component (C2) may be, for example, an anilinium salt because it has resistance to substances that may cause curing inhibition with respect to cationic curing. Examples of the anilinium salt compound include N,N-dialkylanilinium salts such as N,N-dimethylanilinium salts and N,N-diethylanilinium salts.

Component (C2) may be an anilinium salt having an anion containing boron as a constituent element. As a commercial item of such a salt compound, CXC-1821 (a brand name, made by King Industries) etc. is mentioned, for example.

The content of the component (C2) is, for example, 0.1 to 25 parts by mass, based on 100 parts by mass of the component (C1), from the viewpoint of ensuring the formability and curability of the adhesive film for forming the first adhesive layer. You may provide 1-20 mass parts, 3-18 mass parts, or 5-15 mass parts.

The content of component (C) is 5% by mass or more, 10% by mass or more, 15% by mass or more based on the total mass of the first adhesive layer from the viewpoint of ensuring the curability of the adhesive film for forming the first adhesive layer. % or more, or 20 mass % or more may be sufficient. The content of component (C) is 70% by mass or less, 60% by mass or less, 50% by mass or less, based on the total mass of the first adhesive layer, from the viewpoint of ensuring the formation of the adhesive film for forming the first adhesive layer. It may be mass % or less, or 40 mass % or less may be sufficient. When the content of component (C) is within the above range, the effect of the present invention tends to appear remarkably. In addition, the content of component (C) in the composition or composition layer (based on the total mass of the composition or composition layer) may be the same as the above range.

[Other Ingredients]

The 1st adhesive bond layer 1 may further contain other components other than the hardened|cured material of (A) component, (B) component, and (C) component. As other components, for example, a thermoplastic resin (hereinafter sometimes referred to as “component (D)”), a coupling agent (hereinafter sometimes referred to as “component (E)”), a filler (hereinafter sometimes referred to as “component (E)”) , sometimes referred to as “component (F)”), sometimes referred to as an ion trapping agent (hereinafter referred to as “component G”)), and the like.

Examples of the component (D) include phenoxy resins, polyester resins, polyamide resins, polyurethane resins, polyester urethane resins, acrylic rubbers, and epoxy resins (solid at 25°C). there is. These may be used individually by 1 type, and may be used combining plurality. When the composition containing component (A), component (B), and component (C) further contains component (D), it is possible to easily form a composition layer (and by extension, the first adhesive layer 1) from the composition. can Among these, the component (D) may be, for example, a phenoxy resin.

The weight average molecular weight (Mw) of component (D) may be, for example, 5000 to 200000, 10000 to 100000, 20000 to 80000, or 40000 to 60000 from the viewpoint of resin exclusion property at the time of mounting. In addition, Mw means the value measured by gel permeation chromatography (GPC) and converted using the calibration curve by standard polystyrene.

The content of component (D) may be 1% by mass or more, 5% by mass or more, 10% by mass or more, or 20% by mass or more, based on the total mass of the first adhesive layer, 70% by mass or less, 60% by mass % or less, 50 mass % or less, or 40 mass % or less may be sufficient. In addition, the content of the component (D) in the composition or composition layer (based on the total mass of the composition or composition layer) may be the same as the above range.

As the component (E), for example, a silane coupling agent having an organic functional group such as a (meth)acryloyl group, a mercapto group, an amino group, an imidazole group, an epoxy group, a silane compound such as tetraalkoxysilane, and a tetraalkoxy titanate derivatives, polydialkyl titanate derivatives, and the like. These may be used individually by 1 type, and may be used combining plurality. Adhesiveness can further be improved because the 1st adhesive bond layer 1 contains (E) component. (E) Component may be, for example, a silane coupling agent. (E) The content of the component may be 0.1 to 10% by mass based on the total mass of the first adhesive layer. In addition, the content of the component (E) in the composition or composition layer (based on the total mass of the composition or composition layer) may be the same as the above range.

(F) As a component, a non-conductive filler (for example, non-conductive particle) is mentioned, for example. (F) Component may be any of an inorganic filler and an organic filler. Examples of the inorganic filler include metal oxide fine particles such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles; and inorganic fine particles such as metal nitride fine particles. Examples of the organic filler include organic fine particles such as silicon fine particles, methacrylate/butadiene/styrene fine particles, acryl/silicon fine particles, polyamide fine particles, and polyimide fine particles. These may be used individually by 1 type, and may be used combining plurality. (F) Component may be silica fine particles, for example. (F) The content of the component may be 0.1 to 10% by mass based on the total mass of the first adhesive layer. In addition, the content of the component (F) in the composition or composition layer (based on the total mass of the composition or composition layer) may be the same as the above range.

(G) As a component, a metal hydroxide or metal oxide is mentioned. Component (G) includes, for example, aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, calcium hydroxide, calcium oxide, tin hydroxide, tin oxide, manganese hydroxide, It may contain at least one metal compound selected from the group consisting of manganese oxide, antimony hydroxide, antimony oxide, silicon hydroxide, silicon oxide, titanium hydroxide, and titanium oxide. These metal compounds may be surface-treated from the viewpoint of improving dispersibility in organic solvents.

From the viewpoint of insulation retention, component (G) may contain at least one selected from the group consisting of aluminum hydroxide, magnesium hydroxide, and calcium hydroxide. The metal oxide is preferably at least one selected from the group consisting of silicon oxide, aluminum oxide, magnesium oxide, antimony oxide, tin oxide, titanium oxide, manganese oxide, and zirconium oxide, from the viewpoint of obtaining better insulation retention. . (G) Component may be used individually by 1 type, and may be used in combination of 2 or more type.

Examples of commercially available ion trapping agents include "IXEPLAS-A1", "IXEPLAS-A2", "IXEPLAS-A3" (trade name, manufactured by Toagosei Co., Ltd.), and "DHT-4A-2" (trade name, Kyowa Chemical Co., Ltd.). manufactured by Kogyo Co., Ltd.) and "DHT-4A" (trade name, manufactured by Kyowa Kagaku Kogyo Co., Ltd.).

Component (G) may be particles containing the above metal compound. The primary particle size of component (G) may be 10 nm or more, 20 nm or more, 1000 nm or less, or 600 nm or less. (G) The average primary particle diameter of component can be measured with a scanning electron microscope, for example.

A commercially available ion trapping agent can be used after removing aggregates and the like so as to be suitable for thin film coating. For example, D95 of the particle size distribution after solvent dispersion can be made less than 5 μm by air classification or fine pulverization. When the D95 is less than 5 μm, the particles of the ion trapping agent are easily dispersed, and the insulation retention between adjacent circuits can be further improved. Moreover, D95 can also be made less than 3 micrometers, and the above-mentioned effect can be further heightened.

The content of component (G) may be 0.1 to 10% by mass or 0.3 to 5% by mass based on the total mass of the first adhesive layer (excluding conductive particles and inorganic fillers). When the content of component (G) is 0.1% by mass or more, it becomes easy to ensure insulation retention between adjacent circuits, and when it is 10% by mass or less, it becomes difficult to increase the connection resistance between opposing electrodes.

[Other additives]

The first adhesive layer 1 may further contain other additives such as a softener, an accelerator, an anti-deterioration agent, a colorant, a flame retardant, and a thixotropic agent. The content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the first adhesive layer. In addition, the content of other additives in the composition or composition layer (based on the total mass of the composition or composition layer) may be the same as the above range.

The thickness d1 of the first adhesive layer 1 may be, for example, 5 µm or less. The thickness d1 of the first adhesive layer 1 may be 4.5 μm or less or 4.0 μm or less. When the thickness d1 of the first adhesive layer 1 is 5 μm or less, the conductive particles at the time of circuit connection can be more efficiently captured. The thickness d1 of the first adhesive layer 1 may be, for example, 0.1 μm or more, 0.5 μm or more, or 0.7 μm or more. In addition, the thickness d1 of the first adhesive layer 1 is determined by, for example, sandwiching an adhesive film between two sheets of glass (thickness: about 1 mm), bisphenol A type epoxy resin (trade name: JER811, Mitsubishi Chemical Co., Ltd.) and a curing agent (trade name: Epomount curing agent, manufactured by Refintech Co., Ltd.) 10 g after casting with a resin composition, cross-section polishing is performed using a polishing machine, and scanning electron microscope (SEM, trade name: It can obtain|require by measuring using SE-8020, Hitachi High-Tech Science Co., Ltd. product). In addition, as shown in FIG. 1 , when a part of the conductive particles 4 is exposed from the surface of the first adhesive layer 1 (eg, protrudes toward the second adhesive layer 2), the first adhesive 1st adhesive layer 1 located in the space|separation part of the adjacent conductive particle 4, 4 from the surface 2a on the opposite side to the 2nd adhesive layer 2 side in layer 1 ) and the distance to the boundary S of the second adhesive layer 2 (distance indicated by d1 in FIG. 1) is the thickness of the first adhesive layer 1, and the exposed portion of the conductive particles 4 is the first adhesive layer. It is not included in the thickness of (1). The length of the exposed portion of the conductive particles 4 may be, for example, 0.1 μm or more and 5 μm or less.

<Second adhesive layer>

The second adhesive layer 2 contains component (C). The (C1) component and the (C2) component used in the (C) component (ie, the second thermosetting resin component) in the second adhesive layer 2 are (C) in the first adhesive layer 1 Since it is the same as the component (C1) and component (C2) used in the component (namely, the first thermosetting resin component), detailed description is omitted here. The second thermosetting resin component may be the same as or different from the first thermosetting resin component.

From the viewpoint of maintaining reliability, the content of component (C) may be 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more based on the total mass of the second adhesive layer. The content of component (C) is 70% by mass or less, 60% by mass or less, 50% by mass or less, based on the total mass of the second adhesive layer, from the viewpoint of preventing resin bleeding trouble in the reel, which is one aspect of the supply mode. It may be mass % or less, or 40 mass % or less may be sufficient.

The second adhesive layer 2 may further contain other components and other additives in the first adhesive layer 1 . Preferable aspects of other components and other additives are the same as those of the first adhesive layer 1 .

(D) The content of the component, based on the total mass of the second adhesive layer, may be 1 mass% or more, 5 mass% or more, or 10 mass% or more, 80 mass% or less, 60 mass% or less, or 40 It may be less than mass %.

(E) The content of the component may be 0.1 to 10% by mass based on the total mass of the second adhesive layer.

(F) The content of the component, based on the total mass of the second adhesive layer, may be 1% by mass or more, 5% by mass or more, or 10% by mass or more, 70% by mass or less, 50% by mass or less, or 30% by mass or less It may be less than mass %.

The content of component (G) may be 0.1 to 10% by mass or 0.3 to 5% by mass based on the total mass of the second adhesive layer (excluding conductive particles and inorganic fillers). When the content of component (G) is 0.1% by mass or more, it becomes easy to ensure insulation retention between adjacent circuits, and when it is 10% by mass or less, it becomes difficult to increase the connection resistance between opposing electrodes.

The content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the second adhesive layer.

You may set the thickness d2 of the 2nd adhesive bond layer 2 suitably according to the height of the electrode of the circuit member to adhere, etc. The thickness d2 of the second adhesive layer 2 may be 5 μm or more or 7 μm or more, and may be 15 μm or less or 11 μm or less from the viewpoint of sufficiently filling the space between the electrodes and sealing the electrodes and obtaining better connection reliability. may be In addition, the thickness d2 of the 2nd adhesive bond layer 2 can be calculated|required by the same method as the measuring method of the thickness d1 of the 1st adhesive bond layer 1, for example. In addition, when a part of the conductive particles 4 is exposed from the surface of the first adhesive layer 1 (for example, protrudes toward the second adhesive layer 2 side), in the second adhesive layer 2 of the first adhesive layer 1 and the second adhesive layer 2 located at the part between the adjacent conductive particles 4 and 4 from the surface 3a on the opposite side to the first adhesive layer 1 side. The distance to the boundary S (the distance indicated by d2 in FIG. 1) is the thickness of the second adhesive layer 2.

The thickness of the adhesive film 10 (the sum of the thicknesses of all layers constituting the adhesive film 10, in FIG. 1, the thickness d1 of the first adhesive layer 1 and the thickness of the second adhesive layer 2) The sum of (d2)) may be, for example, 5 μm or more or 8 μm or more, and may be 30 μm or less or 20 μm or less.

The adhesive film for circuit connection of the present embodiment includes a region A containing conductive particles and further containing a component (C1), a component (C2), and a component (G). In the region A, Component (C1) contains a compound having at least one ring-opening polymerizable cyclic ether group in its molecule, component (C2) contains an anilinium salt, component (G) contains aluminum hydroxide, aluminum oxide, magnesium hydroxide, Magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, calcium hydroxide, calcium oxide, tin hydroxide, tin oxide, manganese hydroxide, manganese oxide, antimony hydroxide, antimony oxide, silicon hydroxide, silicon oxide, hydroxide It may contain at least one metal compound selected from the group consisting of titanium and titanium oxide. According to the adhesive film for circuit connection which has such an area|region A, while being fully securable between the electrodes which the circuit connection structure opposes, it becomes possible to fully maintain the insulation between adjacent circuits. In the adhesive film 10, the above-mentioned area A may be sufficient as the 1st adhesive layer and the 2nd adhesive bond layer, and either of the 1st adhesive layer and the 2nd adhesive layer may be the above-mentioned area A, for example.

When the first adhesive layer and the second adhesive layer are region A, the range in the thickness direction of the film of region A is the thickness d1 of the first adhesive layer 1 and the thickness d1 of the second adhesive layer 2 described above. It can be the same as the sum of the thicknesses d2.

Further, when the region A includes a region P further containing a cured product of the component (B) in the thickness direction of the film, the first adhesive layer may be the region P. In this case, conductive particles may be dispersed in the region P. In addition, the range in the thickness direction of the film of region P can be set to be the same as the thickness of the above-mentioned first adhesive layer. The content of each component in the region P can also be set in the same way as in the first adhesive layer.

Further, the region A contains the specific (C1) component, the specific (C2) component, and the specific (G) component in the thickness direction of the film, and does not contain a cured product of component (B). When the area S is included, the second adhesive layer may be the area S. In this case, the range of the area S in the thickness direction of the film can be set to be the same as the thickness of the second adhesive layer described above. The content of each component in the region S can also be set in the same way as in the second adhesive layer.

The minimum melt viscosity of the adhesive film 10 is 450-1600 Pa.s. The lowest melt viscosity of the adhesive film 10 may be 500 Pa·s or more, 600 Pa·s or more, 700 Pa·s or more, or 800 Pa·s or more. If the minimum melt viscosity of the adhesive film 10 is 450 Pa·s or more, it becomes possible to suppress deformation of the plastic substrate during thermal compression bonding and to prevent occurrence of circuit disconnection. The lowest melt viscosity of the adhesive film 10 may be 1500 Pa·s or less, 1400 Pa·s or less, 1300 Pa·s or less, 1200 Pa·s or less, 1100 Pa·s or less, or 1000 Pa·s or less. If the minimum melt viscosity of the adhesive film 10 is 1600 Pa·s or less, the decrease in the repellency of the resin at the time of circuit connection can be suppressed, and the connection resistance between the electrodes facing each other in the circuit connection structure can be reduced. It becomes possible to ensure the conduction characteristic. In addition, the minimum melt viscosity of an adhesive film can be calculated|required by the following method, for example.

(Method of measuring the lowest melt viscosity)

Each adhesive film was laminated with a laminator so as to have a thickness of 500 µm or more to obtain a laminate. The PET subjected to the mold release treatment is peeled off from the obtained laminate, and cut into 10.0 mm x 10.0 mm to obtain a measurement sample. The minimum melt viscosity of the obtained measurement sample is measured using a viscoelasticity measuring device (trade name: ARES-G2, manufactured by TA Instruments, heating rate: 10°C/min).

In the adhesive film 10, the second adhesive layer 2 usually has a thickness greater than the first adhesive layer 1. Therefore, the lowest melt viscosity of the adhesive film 10 tends to fluctuate depending on the second adhesive layer 2 . Adjustment of the lowest melt viscosity of the adhesive film 10 can be performed, for example, by adjusting the kind, content, etc. of the component (particularly component (D)) contained in the second adhesive layer 2. Moreover, the lowest melt viscosity of the adhesive film 10 can be adjusted also by using what has a small particle diameter as component (F), for example. (F) The minimum melt viscosity of the adhesive film 10 tends to rise by using a small particle diameter as component.

In the adhesive film 10 , conductive particles 4 are dispersed in the first adhesive layer 1 . Therefore, the adhesive film 10 is an anisotropically conductive adhesive film having anisotropic conductivity. The adhesive film 10 is interposed between a first circuit member having a first electrode and a second circuit member having a second electrode, and thermally compressing the first circuit member and the second circuit member to form a first It is used to electrically connect the electrode and the second electrode to each other.

According to the adhesive film 10, even if it is a case where circuit members are connected by low pressure, it becomes possible to fully maintain the insulation between adjacent circuits while being able to fully ensure conduction between the opposing electrodes of a circuit connection structure. Such an adhesive film for circuit connection can be used suitably for COP mounting. More specifically, it can be suitably used for connection between a plastic substrate on which circuit electrodes in an organic EL display are formed and an IC chip such as a driving IC.

As mentioned above, although the adhesive film of this embodiment was demonstrated, this invention is not limited to the said embodiment.

The adhesive film may be, for example, composed of two layers of a first adhesive layer and a second adhesive layer, or may be composed of three or more layers including two layers of a first adhesive layer and a second adhesive layer. The adhesive film may have a configuration further comprising a third adhesive layer provided on the side opposite to the second adhesive layer of the first adhesive layer, for example.

A 3rd adhesive bond layer contains (C)component. The (C1) component and the (C2) component used in the (C) component in the third adhesive layer (ie, the third thermosetting resin component) are the (C) component in the first adhesive layer 1 (namely, the third thermosetting resin component). , 1st thermosetting resin component), since it is the same as the component (C1) and the component (C2) used, detailed description is omitted here. The third thermosetting resin component may be the same as or different from the first thermosetting resin component. The third thermosetting resin component may be the same as or different from the second thermosetting resin component.

The content of component (C) is 5% by mass or more, 10% by mass or more, 15% by mass based on the total mass of the third adhesive layer, from the viewpoint of imparting good transferability and peeling resistance. or more, or 20% by mass or more may be sufficient. The content of component (C) is 70% by mass or less and 60% by mass or less based on the total mass of the third adhesive layer from the viewpoint of imparting good half-cutting properties and blocking resistance (suppression of resin bleeding on the reel) , 50% by mass or less, or 40% by mass or less may be sufficient.

The 3rd adhesive bond layer may further contain other components and other additives in the 1st adhesive bond layer 1. The third adhesive layer may have the configuration of the region A described above or may have the configuration of the region S from the viewpoint of achieving both the conduction property between opposing electrodes and the insulation maintenance property between adjacent circuits. Preferable aspects of other components and other additives are the same as those of the first adhesive layer 1 .

(D) The content of the component, based on the total mass of the third adhesive layer, may be 10 mass% or more, 20 mass% or more, or 30 mass% or more, 80 mass% or less, 70 mass% or less, or 60 It may be less than mass %.

(E) The content of the component may be 0.1 to 10% by mass based on the total mass of the third adhesive layer.

The content of component (F) may be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and 50% by mass or less, 40% by mass or less, or 30% by mass or less, based on the total mass of the third adhesive layer. It may be less than mass %.

The content of component (G) may be 0.1 to 10% by mass or 0.3 to 5% by mass based on the total mass of the third adhesive layer (excluding conductive particles and inorganic fillers). When the content of component (G) is 0.1% by mass or more, it becomes easy to ensure insulation retention between adjacent circuits, and when it is 10% by mass or less, it becomes difficult to increase the connection resistance between opposing electrodes.

The content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the third adhesive layer.

The thickness of the third adhesive layer may be appropriately set according to the lowest melt viscosity of the adhesive film, the height of the electrode of the circuit member to be bonded, and the like. The thickness of the third adhesive layer is preferably smaller than the thickness d2 of the second adhesive layer 2 . The thickness of the third adhesive layer may be 0.2 μm or more and 3.0 μm or less from the viewpoint of sufficiently filling the space between the electrodes to seal the electrodes and obtaining better connection reliability. In addition, the thickness of the 3rd adhesive bond layer can be calculated|required by the same method as the measuring method of the thickness d1 of the 1st adhesive bond layer 1, for example.

When the first adhesive layer, the second adhesive layer, and the third adhesive layer are region A, the ranges in the thickness direction of the film of region A are the thickness of the first adhesive layer, the thickness of the second adhesive layer, and the third adhesive layer. It can be the same as the sum of the thicknesses of the layers. In the case where the third adhesive layer is the region S, the range of the region S in the thickness direction can be the same as the thickness of the third adhesive layer.

The conductive adhesive film which does not have anisotropic conductivity may be sufficient as the adhesive film for circuit connection of the said embodiment.

<Method for Manufacturing Adhesive Film for Circuit Connection>

The manufacturing method of the adhesive film for circuit connection of one embodiment, For example, (A) component, (B) component, and (C) component (1st thermosetting resin component), and (G) component as needed The step of irradiating light to the composition layer composed of the containing composition to form a first adhesive layer (step 1), and on the first adhesive layer, component (C) (second thermosetting resin component), and necessary You may be equipped with the process (2nd process) of laminating|stacking the 2nd adhesive bond layer containing (G) component according to this. The said manufacturing method is a 3rd adhesive layer containing (C) component (3rd thermosetting resin component), and (G) component as needed on the layer on the side opposite to the 2nd adhesive bond layer of a 1st adhesive layer. You may further be provided with the process (3rd process) of laminating|stacking. In this case, the 2nd process may be performed first, and the 3rd process may be performed first. When performing the third step first, the third adhesive layer is laminated on the opposite side of the first adhesive layer to the side on which the second adhesive layer is to be laminated.

In the first step, first, for example, a composition containing (A) component, (B) component, and (C) component, and other components such as (G) component added as needed and other additives. is dissolved or dispersed in an organic solvent by stirring, mixing, kneading, etc. to prepare a varnish composition (varnish-like first adhesive composition). After that, the varnish composition is applied on the base material subjected to the release treatment using a knife coater, roll coater, applicator, comma coater, die coater, etc., and then the organic solvent is volatilized by heating, to form a composition layer made of the composition. At this time, the thickness of the finally obtained first adhesive layer (first adhesive film) can be adjusted by adjusting the application amount of the varnish composition. Subsequently, the composition layer made of the composition is irradiated with light to cure the component (B) in the composition layer to form a first adhesive layer on the substrate. The first adhesive layer can be referred to as a first adhesive film.

The organic solvent used in the preparation of the varnish composition is not particularly limited as long as it has properties capable of uniformly dissolving or dispersing each component. As such an organic solvent, toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, propyl acetate, butyl acetate etc. are mentioned, for example. These organic solvents can be used individually or in combination of 2 or more types. Stirring and mixing or kneading at the time of preparation of the varnish composition can be performed using, for example, a stirrer, a drum grinder, a 3-roll, a ball mill, a bead mill, a homodisperser or the like.

The substrate is not particularly limited as long as it has heat resistance capable of withstanding the heating conditions for volatilizing the organic solvent. Examples of such a substrate include stretched polypropylene (OPP), polyethylene terephthalate (PET), polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, Substrates (eg, films) made of polyamide, polyimide, cellulose, ethylene/vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber, liquid crystal polymer, or the like can be used.

Heating conditions for volatilizing the organic solvent from the varnish composition applied to the substrate can be appropriately set according to the organic solvent used. Heating conditions may be, for example, 0.1 to 10 minutes at 40 to 120°C.

A part of the solvent may remain in the first adhesive layer without being removed. The content of the solvent in the first adhesive layer may be, for example, 10% by mass or less based on the total mass of the first adhesive layer.

For the light irradiation in the curing step, it is preferable to use irradiation light (for example, ultraviolet light) having a wavelength within a range of 150 to 750 nm. Irradiation of light can be performed using, for example, a low-pressure mercury-vapor lamp, a medium-pressure mercury-vapor lamp, a high-pressure mercury-vapor lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a metal halide lamp, an LED light source, or the like. Although the cumulative light quantity of light irradiation can be set suitably, it may be, for example, 500 to 3000 mJ/cm ² .

A 2nd process is a process of laminating|stacking a 2nd adhesive bond layer on a 1st adhesive bond layer. In the second step, first, for example, the first step except for using the component (C) and other components such as component (G) added as needed and other additives and not irradiating with light. In the same manner as above, a second adhesive layer is formed on the substrate to obtain a second adhesive film. Next, the second adhesive layer can be laminated on the first adhesive layer by bonding the first adhesive film and the second adhesive film together. Moreover, in a 2nd process, for example, the varnish composition obtained using the (C) component and other components, such as (G) component added as needed, and other additives on the 1st adhesive layer (varnish The second adhesive layer may be laminated on the first adhesive layer also by applying the second adhesive composition) and volatilizing the organic solvent.

As a method of bonding the 1st adhesive film and the 2nd adhesive film together, methods, such as a hot press, roll lamination, and vacuum lamination, are mentioned, for example. Lamination can be performed under temperature conditions of, for example, 0 to 80°C.

A part of the solvent may remain in the second adhesive layer without being removed. The content of the solvent in the second adhesive layer may be, for example, 10% by mass or less based on the total mass of the second adhesive layer.

A 3rd process is a process of laminating|stacking a 3rd adhesive bond layer on the layer on the side opposite to the 2nd adhesive bond layer of a 1st adhesive bond layer. In a 3rd process, first, for example, it carries out similarly to a 2nd process, forms a 3rd adhesive bond layer on a base material, and obtains a 3rd adhesive film. Then, the third adhesive layer can be laminated on the layer opposite to the second adhesive layer of the first adhesive layer by bonding the third adhesive film to the side opposite to the second adhesive film of the first adhesive film. there is. Further, in the third step, for example, in the same manner as in the second step, the varnish composition (varnish-like third adhesive composition) is applied on the layer on the opposite side of the first adhesive layer to the second adhesive layer, , The third adhesive layer can be laminated on the first adhesive layer even by volatilizing the organic solvent. The bonding method and the conditions are the same as those in the second step.

A part of the solvent may remain in the third adhesive layer without being removed. The content of the solvent in the third adhesive layer may be, for example, 10% by mass or less based on the total mass of the third adhesive layer.

<Adhesive composition for circuit connection>

The adhesive composition for circuit connection of this embodiment contains a cationically polymerizable compound, a thermal cationic polymerization initiator, and an ion trapping agent, and a compound in which the cationically polymerizable compound has one or more ring-opening polymerizable cyclic ether groups in its molecule. The thermal cationic polymerization initiator includes an anilinium salt, the ion trapping agent is aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, calcium hydroxide, calcium oxide, hydroxide and at least one metal compound selected from the group consisting of tin, tin oxide, manganese hydroxide, manganese oxide, antimony hydroxide, antimony oxide, silicon hydroxide, silicon oxide, titanium hydroxide, and titanium oxide.

According to the adhesive composition for circuit connection of the present embodiment, the area A, area P, area S, the first adhesive layer, the second adhesive layer, the third adhesive layer, etc. in the above-described adhesive film for circuit connection can be formed. there is.

The adhesive composition for circuit connection of the present embodiment may further contain conductive particles and may further contain a photocurable resin component. Such an adhesive composition for circuit connection can form the area|region P or the 1st adhesive bond layer in the above-mentioned adhesive film for circuit connection.

The composition of the adhesive composition for circuit connection of this embodiment can be set similarly to the composition in the above-mentioned 1st adhesive bond layer, 2nd adhesive bond layer, or 3rd adhesive bond layer.

<Circuit connection structure and manufacturing method thereof>

Hereinafter, the circuit connection structure using the above-mentioned adhesive film 10 for circuit connection as a circuit connection material, and its manufacturing method are demonstrated.

2 is a schematic cross-sectional view showing one embodiment of a circuit connection structure. As shown in FIG. 2 , the circuit connection structure 20 has a first circuit board 11 and a first electrode 12 formed on a main surface 11a of the first circuit board 11 . a second circuit member (16) having a first circuit member (13), a second circuit board (14) and a second electrode (15) formed on the main surface (14a) of the second circuit board (14); A circuit connecting portion 17 disposed between the first circuit member 13 and the second circuit member 16 and electrically connecting the first electrode 12 and the second electrode 15 to each other is provided.

The first circuit member 13 and the second circuit member 16 may be the same as or different from each other. The first circuit member 13 and the second circuit member 16 may include a glass substrate or a plastic substrate on which circuit electrodes are formed; printed wiring board; ceramic wiring board; flexible wiring board; An IC chip such as a drive IC may be used. The first circuit board 11 and the second circuit board 14 may be formed of an inorganic material such as semiconductor, glass, or ceramic, an organic material such as polyimide or polycarbonate, or a composite material such as glass/epoxy. The first circuit board 11 may be a plastic substrate. The first circuit member 13 may be, for example, a plastic substrate on which circuit electrodes are formed (a plastic substrate made of an organic material such as polyimide, polycarbonate, polyethylene terephthalate, or cycloolefin polymer), or a second circuit member. 16 may be, for example, an IC chip such as a driving IC. The plastic substrate on which electrodes are formed may be one in which a display area is formed by, for example, a pixel drive circuit such as an organic TFT or a plurality of organic EL elements R, G, and B arranged regularly in a matrix form on the plastic substrate. .

The first electrode 12 and the second electrode 15 are made of metals such as gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, aluminum, molybdenum, and titanium, indium tin oxide ( ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. may be used as an electrode. The first electrode 12 and the second electrode 15 may be electrodes formed by laminating two or more of these metals, oxides, and the like. Two or more layers may be sufficient as the electrode formed by laminating 2 or more types, and 3 or more layers may be sufficient as it. When the first circuit member 13 is a plastic substrate, the first electrode 12 may be an electrode having a titanium layer on the outermost surface. The first electrode 12 and the second electrode 15 may be circuit electrodes or bump electrodes. At least one of the first electrode 12 and the second electrode 15 may be a bump electrode. In FIG. 2 , the first electrode 12 is a circuit electrode and the second electrode 15 is a bump electrode.

The circuit connection part 17 contains the hardened|cured material of the adhesive film 10 mentioned above. The circuit connection part 17 may consist of the hardened|cured material of the adhesive film 10 mentioned above. The circuit connecting portion 17 is, for example, on the side of the first circuit member 13 in the direction in which the first circuit member 13 and the second circuit member 16 oppose each other (hereinafter "opposite direction"). and the first region 18 made of a cured product of component (B) and a cured product of component (C) other than the conductive particles 4 in the first adhesive layer described above, and in the opposite direction Located on the side of the second circuit member 16, the second region 19 made of a cured material such as component (C) in the above-described second adhesive layer, and at least the first electrode 12 and the second electrode It has conductive particles 4 interposed between 15 and electrically connecting the first electrode 12 and the second electrode 15 to each other. As shown in FIG. 2 , the circuit connection portion 17 does not have to have two distinct regions between the first region 18 and the second region 19, and is a cured product derived from the first adhesive layer. and the cured product derived from the second adhesive layer may be mixed to form one region.

The circuit connection structure is, for example, a flexible organic electroluminescent color display (organic EL display) in which a plastic substrate on which organic EL elements are regularly arranged and a driving circuit element serving as a driver for image display is connected, and organic EL elements are regularly arranged. and a touch panel in which a plastic substrate disposed in the above and a position input element such as a touch pad are connected. Circuit connection structure is various monitors, such as a smart phone, a tablet, a television, a navigation system of a transportation institution, and a wearable terminal; furniture; Home Appliances; It can be applied to daily necessities, etc.

3 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection structure. Fig. 3(a) and Fig. 3(b) are schematic cross-sectional views showing each step. As shown in FIG. 3 , the manufacturing method of the circuit connection structure 20 includes a first circuit member 13 having a first electrode 12 and a second circuit member 16 having a second electrode 15 In between, the first circuit member 13 and the second circuit member 16 are bonded by thermocompression with the above-described adhesive film 10 interposed therebetween, and the first electrode 12 and the second electrode 15 are bonded to each other. It is provided with the process of electrically connecting.

Specifically, as shown in (a) of FIG. 3 , first, the first circuit board 11 and the first electrode 12 formed on the main surface 11a of the first circuit board 11 are provided. First, a second circuit member 16 having a circuit member 13, a second circuit board 14, and a second electrode 15 formed on the main surface 14a of the second circuit board 14 is prepared. .

Next, the first circuit member 13 and the second circuit member 16 are disposed so that the first electrode 12 and the second electrode 15 face each other, and the first circuit member 13 and the second An adhesive film (10) is placed between the circuit members (16). For example, as shown in Fig. 3(a), the adhesive film 10 is formed so that the side of the first adhesive layer 1 faces the main surface 11a of the first circuit board 11, and the first circuit member Laminate on (13). Next, a first circuit in which the adhesive film 10 is laminated so that the first electrode 12 on the first circuit board 11 and the second electrode 15 on the second circuit board 14 face each other. A second circuit member 16 is disposed on the member 13 .

And as shown in (b) of FIG. 3, while heating the 1st circuit member 13, the adhesive film 10, and the 2nd circuit member 16, the 1st circuit member 13 and the 2nd circuit By pressing the member 16 in the thickness direction, the first circuit member 13 and the second circuit member 16 are thermally compressed to each other. At this time, as indicated by arrows in FIG. 3(b), the second adhesive layer 2 has a flowable, uncured thermosetting component, so that the gap between the second electrodes 15 is filled. It is hardened by the heating while being flowed so as to be. In this way, the first electrode 12 and the second electrode 15 are electrically connected to each other via the conductive particles 4, and the first circuit member 13 and the second circuit member 16 are bonded to each other. Thus, the circuit connection structure 20 shown in FIG. 2 can be obtained. In the manufacturing method of the circuit connection structure 20 of the present embodiment, since a part of the first adhesive layer 1 can be said to be a layer cured by light irradiation, the conductive particles in the first adhesive layer 1 are fluidized. Since this is suppressed, the first adhesive layer 1 hardly flows during the thermal compression bonding, and conductive particles are efficiently captured between the opposing electrodes, the opposing first electrode 12 and the second electrode 15 ) The connection resistance between them is reduced. In addition, when the thickness of the first adhesive layer is 5 µm or less, there is a tendency that conductive particles at the time of circuit connection can be captured more efficiently.

Although the heating temperature in the case of thermocompression bonding can be set suitably, it may be 50-190 degreeC, for example. Pressurization is not particularly limited as long as it does not damage the adherend, but in the case of COP mounting, for example, the area conversion pressure at the bump electrode may be 0.1 to 50 MPa, 40 MPa or less, or 0.1 to 40 MPa. Moreover, in the case of COG mounting, for example, the area conversion pressure in the bump electrode may be 10 to 100 MPa. These heating and pressurization times may be in the range of 0.5 to 120 seconds.

Example

Hereinafter, examples of the present invention will be described in more detail. However, the present invention is not limited to these examples.

[Production of first adhesive layer and second adhesive layer]

In preparation of the 1st adhesive bond layer and the 2nd adhesive bond layer, the material shown below was used.

(A) Component: Conductive Particles

A-1: Use of conductive particles with an average particle diameter of 3.2 μm in which the surface of the plastic core is plated with Ni and the outermost surface is plated with Pd.

(B) component: photocurable resin component

Component (B1): Radical polymerizable compound

B1-1: A-BPEF70T (ethoxylated fluorene-type di(meth)acrylate (bifunctional), manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), using what was diluted with toluene to 70% by mass of non-volatile matter

B1-2: Lipoxy VR-90 (bisphenol A type epoxy (meth)acrylate (bifunctional) (vinyl ester resin), Showa Denko Co., Ltd.)

Component (B2): Photoradical polymerization initiator

B2-1: Irgacure 907 (a compound having an α-aminoalkylphenone structure, manufactured by BASF) diluted with 10% by mass of non-volatile matter in MEK was used.

(C) component: thermosetting resin component

(C1) component: cationically polymerizable compound

C1-1: ETERNACOLL OXBP (3-ethyl-3-hydroxymethyloxetane, manufactured by Ube Industries Co., Ltd.)

C1-2: EHPE3150 (a 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, manufactured by Daicel Corporation)

C1-3: Celloxide 8010 (bi-7-oxabicyclo[4.1.0]heptane, manufactured by Daicel Co., Ltd.)

C1-4: OX-SQ TX-100 (poly({3-[(3-ethyl-3-oxetanyl)methoxy]propyl}silsesquioxane) derivative, manufactured by Toagosei Co., Ltd.)

(C2) Component: Thermal Cationic Polymerization Initiator

C2-1: CXC-1821 (manufactured by King Industries)

(D) component: thermoplastic resin

D-1: Phenoltoth YP-50S (bisphenol A phenoxy resin, weight average molecular weight: 60,000, glass transition temperature: 84 ° C., manufactured by Nittetsu Chemical & Materials Co., Ltd.), MEK diluted to 40% by mass of non-volatile content use

D-2: TOPR-300 (high Tg type epoxy resin, epoxy equivalent: 900 to 1,000, softening point: 120 ° C, manufactured by Nittetsu Chemical & Materials Co., Ltd.), MEK diluted to 60% by mass of non-volatile content is used

D-3: Phenoltoth ZX1356-2 (bisphenol A type and bisphenol F type copolymerized phenoxy resin, weight average molecular weight: 70000, glass transition temperature: 71 ° C., manufactured by Nittetsu Chemical & Materials Co., Ltd.), non-volatile content in MEK Use what was diluted to 40% by mass

Component (E): coupling agent

E-1: SH-6040 (3-glycidoxypropyltrimethoxysilane, manufactured by Toray Dow Corning Co., Ltd.)

(F) Component: Filler

F-1: Admapine SE2050 (silica fine particles, manufactured by Admatex Co., Ltd.)

Ingredient (G): ion trapping agent

G-1: IXEPLAS-A1 (Zr, Mg, Al-based ion trapping agent, manufactured by Toagosei Co., Ltd., primary particle diameter 500 nm)

G-2: IXEPLAS-A2 (Zr, Mg, Al-based ion trapping agent, manufactured by Toagosei Co., Ltd., primary particle size 200 nm)

G-3: IXEPLAS-A3 (Surface treatment type of IXEPLAS-Al, manufactured by Toagosei Co., Ltd.)

G-4: DHT-4A-2 (Mg, Al-based ion trapping agent, manufactured by Kyowa Chemical Industry Co., Ltd.)

In addition, the above-mentioned ion trapping agent was subjected to a pulverization treatment to adjust D95 to less than 5 μm.

<Preparation of the first adhesive layer>

After obtaining a composition obtained by mixing the materials shown in Table 1 in the composition ratios shown in Table 1 (the numbers in Table 1 mean the amount of non-volatile content), a magnetic field was applied to the release-treated PET (polyethylene terephthalate) film. The coating was applied while adding, and the organic solvent or the like was dried with hot air at 70°C for 5 minutes to obtain a composition layer composed of a composition containing each component, respectively. The composition layer was applied so that the thickness after drying was 3 to 4 μm, respectively. Thereafter, each of the composition layers was irradiated with light (UV irradiation: metal halide lamp, cumulative light amount: 1800 to 2300 mJ/cm ² ) to prepare a first adhesive layer in which conductive particles were dispersed. The thickness here was measured using a contact type thickness meter.

In addition, when the thickness of the layer made of the first adhesive composition or the adhesive layer is smaller than the thickness (diameter) of the conductive particles, when the thickness of the layer is measured using a contact thickness meter, the thickness of the conductive particles is reflected and the conductive particles are The thickness of the region where the particles are present is measured. Therefore, after producing an adhesive film having a two-layer structure in which the first adhesive layer and the second adhesive layer are laminated, the method described above (paragraph 0083) is used to separate adjacent conductive particles using a scanning electron microscope. The thickness of the first adhesive layer located on the part was measured.

[Table 1]

<Preparation of the second adhesive layer>

After obtaining a composition obtained by mixing the materials shown in Table 2 in the composition ratio shown in Table 2 (the numerical values in Table 2 mean the amount of non-volatile content), it was coated on a release-treated PET (polyethylene terephthalate) film, and organic solvent By hot-air drying the back at 70°C for 5 minutes, the second composition layers each composed of a composition containing each component were produced. The composition layer was applied so that the thickness after drying was 8 to 9 μm, respectively. The thickness here was measured using a contact type thickness meter.

[Table 2]

(Examples 1 to 4 and Comparative Examples 1 to 2)

[Production of adhesive film]

The adhesive film of the structure shown in Table 3 was produced using the 1st adhesive bond layer and the 2nd adhesive bond layer produced above. For example, in the adhesive film of Example 1, the first adhesive layer formed by the composition P-1 is bonded to the second adhesive layer formed by the composition S-1 while applying a temperature of 50 to 60 ° C., An adhesive film of Example 1 was obtained. About the adhesive films of Examples 2-4 and Comparative Examples 1-2, it carried out similarly to Example 1, and produced the adhesive film of the structure shown in Table 3.

About the adhesive films obtained in Examples 1-4 and Comparative Examples 1-2, as a result of measuring the projection particle density, all were about 18000 piece/mm ^<2> .

[Evaluation of Circuit Connection Structure]

<Production of Circuit Connection Structure-1>

As a first circuit member, an IC chip in which bump electrodes are arranged in a zigzag pattern in two rows (0.9 mm × 20.3 mm, thickness: 0.3 mm, size of bump electrodes: 70 μm × 12 μm, space between bump electrodes: 12 μm, thickness of bump electrodes: 9 μm) was prepared. Further, as a second circuit member, a wiring pattern of Ti: 50 nm/Al: 400 nm (pattern width: 17 μm, Space between electrodes: 7 μm) was prepared.

Circuit connection structure was produced using each adhesive film of Examples 1-4 and Comparative Examples 1-2. The adhesive film was cut out to 2.0 mm width, and the adhesive film was arrange|positioned on the 1st circuit member so that the 1st adhesive layer and the 1st circuit member may contact|connect. Using a thermal compression device (BS-17U, manufactured by Ohashi Seisakusho Co., Ltd.) composed of a stage made of a ceramic heater and a tool (8 mm × 50 mm), it was held for 2 seconds under conditions of 70°C and 0.98 MPa (10 kgf/cm ² ). It heated and pressurized, the adhesive film was affixed to the 1st circuit member, and the release film on the side opposite to the 1st circuit member of the adhesive film was peeled off. Next, after positioning the bump electrode of the first circuit member and the wiring pattern of the second circuit member, a heat tool of 8 mm x 45 mm was used, and Teflon (registered trademark) having a thickness of 50 μm was interposed as a buffer material, and the connection condition was The second adhesive layer of the adhesive film was affixed to the second circuit member by heating and pressurizing for 5 seconds under conditions of 170° C. and an area conversion pressure of 30 MPa in the bump electrode to prepare circuit connection structures-1, respectively.

<Production of Circuit Connection Structure-2>

As a first circuit member, an IC chip in which bump electrodes are arranged in a zigzag pattern in two rows (0.9 mm × 20.3 mm, thickness: 0.3 mm, size of bump electrodes: 70 μm × 12 μm, space between bump electrodes: 12 μm, thickness of bump electrodes: 9 μm) was prepared. Further, as the second circuit member, an ITO wiring pattern (pattern width: 19 μm, space between electrodes: 5 μm) was formed on the surface of a glass substrate (#1737, manufactured by Corning, 38 mm × 28 mm, thickness: 0.05 mm). prepared

Circuit connection structure was produced using each adhesive film of Examples 1-4 and Comparative Examples 1-2. The adhesive film was cut out to 2.0 mm width, and the adhesive film was arrange|positioned on the 1st circuit member so that the 1st adhesive layer and the 1st circuit member may contact|connect. Using a thermal compression device (BS-17U, manufactured by Ohashi Seisakusho Co., Ltd.) composed of a stage made of a ceramic heater and a tool (8 mm × 50 mm), it was held for 2 seconds under conditions of 70°C and 0.98 MPa (10 kgf/cm ² ). It heated and pressurized, the adhesive film was affixed to the 1st circuit member, and the release film on the side opposite to the 1st circuit member of the adhesive film was peeled off. Next, after positioning the bump electrode of the first circuit member and the wiring pattern of the second circuit member, a heat tool of 8 mm x 45 mm was used, and Teflon (registered trademark) having a thickness of 50 μm was interposed as a buffer material, and the connection condition was The second adhesive layer of the adhesive film was affixed to the second circuit member by heating and pressurizing for 5 seconds under conditions of 170°C and an area conversion pressure of 30 MPa in the bump electrode to prepare circuit connection structures -2, respectively.

(Evaluation of connection resistance)

About the fabricated circuit connection structure-1, the initial connection resistance (conduction resistance) was measured by the 4-terminal method. For the measurement, a multimeter MLR21 manufactured by ETAC was used. The potential difference was measured at 14 arbitrary points, and the average value was calculated|required. The average value of the potential difference was converted into a connection resistance value, and evaluated according to the following criteria. The results are shown in Table 3.

A: The connection resistance value is less than 1.0Ω

B: Connection resistance value is 1.0Ω or more

(Evaluation of connection resistance)

After a high-temperature, high-humidity test (storage for 500 hours under conditions of a temperature of 85 ° C and a humidity of 85% RH) for the manufactured circuit connection structure-2, a voltage of 50 V was applied to the wiring pattern, and a total of 1440 points of insulation resistance between circuit electrodes were measured. was measured collectively. This measurement was performed on 20 samples, and the number of samples having an insulation resistance value of 10 ^{9 Ω} or more was confirmed among all 20 samples. Insulation resistance was evaluated according to the following criteria from the number obtained. The results are shown in Table 3.

A: 20 insulation resistance values of 10 ^{9 Ω} or more

B: 19 to 17 insulation resistance values of 10 ^{9 Ω} or more

C: 16 to 13 insulation resistance values of 10 ^{9 Ω} or more

[Table 3]

As shown in Table 3, the adhesive films of Examples 1 to 4 containing the cationically polymerizable compound described above, the thermal cationic polymerization initiator, and the ion trapping agent were judged A in both connection resistance and insulation resistance. On the other hand, in the adhesive film of Comparative Example 1 containing no ion trapping agent, the connection resistance was judged A, but the insulation resistance was judged C. In addition, the adhesive film of Comparative Example 2 containing no ion trapping agent and increasing the blending amount of the acrylate component was rated B for insulation resistance, but rated B due to high connection resistance .

One… 1st adhesive layer
2… Second adhesive layer
4… conductive particle
5... adhesive component
10... Adhesive film for circuit connection (adhesive film)
11... 1st circuit board
12... 1st electrode (circuit electrode)
13... 1st circuit member
14... 2nd circuit board
15... Second electrode (bump electrode)
16... 2nd circuit member
17... circuit connection

Claims (17)

An adhesive film for circuit connection containing conductive particles,
The adhesive film includes a region A containing a cationically polymerizable compound, a thermal cationic polymerization initiator, and an ion trapping agent in the thickness direction of the film,
The cationically polymerizable compound includes a compound having at least one ring-opening polymerizable cyclic ether group in the molecule,
The thermal cation polymerization initiator contains an anilinium salt,
The ion trapping agent is aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, calcium hydroxide, calcium oxide, tin hydroxide, tin oxide, manganese hydroxide, manganese oxide, hydroxide An adhesive film for circuit connection comprising at least one metal compound selected from the group consisting of antimony, antimony oxide, silicon hydroxide, silicon oxide, titanium hydroxide, and titanium oxide. The method of claim 1,
The adhesive film for circuit connection in which the said conductive particle has palladium plating. According to claim 1 or claim 2,
The adhesive film for circuit connection in which the said anilinium salt is an anilinium salt which has an anion containing boron as a constituent element. The method according to any one of claims 1 to 3,
The adhesive film for circuit connection in which the said conductive particle is unevenly distributed on one surface side of a film. The method according to any one of claims 1 to 4,
The region A includes a region P further containing a cured product of a photocurable resin component in the thickness direction of the film,
The adhesive film for circuit connection, wherein the conductive particles are dispersed in the region P. A first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer containing a second thermosetting resin component provided on the first adhesive layer,
One or both of the first adhesive layer and the second adhesive layer further contain an ion trapping agent,
One or both of the first thermosetting resin component and the second thermosetting resin component contain a cationically polymerizable compound and a thermal cationic polymerization initiator,
The cationically polymerizable compound includes a compound having at least one ring-opening polymerizable cyclic ether group in the molecule,
The thermal cation polymerization initiator contains an anilinium salt,
The ion trapping agent is aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, calcium hydroxide, calcium oxide, tin hydroxide, tin oxide, manganese hydroxide, manganese oxide, hydroxide An adhesive film for circuit connection comprising at least one metal compound selected from the group consisting of antimony, antimony oxide, silicon hydroxide, silicon oxide, titanium hydroxide, and titanium oxide. The method of claim 6,
The adhesive film for circuit connection in which the said conductive particle has palladium plating. According to claim 6 or claim 7,
The adhesive film for circuit connection in which the said anilinium salt is an anilinium salt which has an anion containing boron as a constituent element. Containing a cationic polymerizable compound, a thermal cationic polymerization initiator, and an ion trapping agent,
The cationically polymerizable compound includes a compound having at least one ring-opening polymerizable cyclic ether group in the molecule,
The thermal cation polymerization initiator contains an anilinium salt,
The ion trapping agent is aluminum hydroxide, aluminum oxide, magnesium hydroxide, magnesium oxide, zirconium hydroxide, zirconium oxide, bismuth hydroxide, bismuth oxide, calcium hydroxide, calcium oxide, tin hydroxide, tin oxide, manganese hydroxide, manganese oxide, hydroxide An adhesive composition for circuit connection comprising at least one metal compound selected from the group consisting of antimony, antimony oxide, silicon hydroxide, silicon oxide, titanium hydroxide, and titanium oxide. The method of claim 9,
The adhesive composition for circuit connection in which the said anilinium salt is an anilinium salt which has an anion containing boron as a constituent element. According to claim 9 or claim 10,
An adhesive composition for circuit connection, further comprising conductive particles. The method of claim 11,
The adhesive composition for circuit connection in which the said conductive particle has palladium plating. According to claim 11 or claim 12,
The adhesive composition for circuit connection which further contains a photocurable resin component. The adhesive film for circuit connection according to any one of claims 1 to 8 is interposed between a first circuit member having a first electrode and a second circuit member having a second electrode, and the first circuit member and A method for manufacturing a circuit connection structure, comprising a step of thermally compressing the second circuit member to electrically connect the first electrode and the second electrode to each other. The method of claim 14,
The method for manufacturing a circuit connection structure, wherein one of the first circuit member and the second circuit member is an IC chip, and the other is a plastic substrate having an electrode containing Ti. a first circuit member having a first electrode;
a second circuit member having a second electrode;
a circuit connecting portion disposed between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other;
The circuit connection structure in which the said circuit connection part contains the hardened|cured material of the adhesive film for circuit connection in any one of Claims 1-8. The method of claim 16
A circuit connection structure in which one of the first circuit member and the second circuit member is an IC chip, and the other is a plastic substrate having an electrode containing Ti.

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