KR102631317B1 - Adhesive film for circuit connection and manufacturing method thereof, manufacturing method of circuit connection structure, and adhesive film accommodation set - Google Patents

Abstract

It has a first adhesive layer (2) and a second adhesive layer (3) laminated on the first adhesive layer (2), wherein the first adhesive layer (2) contains a cured product of a photocurable composition, The second adhesive layer 3 includes a thermosetting composition, and the photocurable composition includes a polymerizable compound, conductive particles 4, a structure represented by the following formula (I), a structure represented by the following formula (II), and the following formula: An adhesive film (1) for circuit connection containing a photopolymerization initiator having at least one structure selected from the group consisting of the structure represented by (III).

Description

Adhesive film for circuit connection and manufacturing method thereof, manufacturing method of circuit connection structure, and adhesive film accommodation set

The present invention relates to an adhesive film for circuit connection and its manufacturing method, a manufacturing method of a circuit connection structure, and an adhesive film housing set.

Conventionally, various adhesive materials have been used to make circuit connections. For example, as an adhesive material for connecting a liquid crystal display and a tape carrier package (TCP), connecting a flexible printed wiring board (FPC) and TCP, or connecting an FPC and a printed wiring board, an anisotropic conductive material in which conductive particles are dispersed in the adhesive is used. An adhesive film for circuit connection having is used.

In the field of precision electronic devices where adhesive films for circuit connection with anisotropic conductivity are used, circuit densities are increasing, and electrode widths and electrode spacings are becoming very narrow. For this reason, it is not necessarily easy to efficiently capture conductive particles on the microelectrode and obtain high connection reliability.

In contrast, for example, in Patent Document 1, a method is proposed in which conductive particles are distributed on one side of an anisotropic conductive adhesive sheet and the conductive particles are spaced apart from each other.

International Publication No. 2005/54388

However, in the method of Patent Document 1, since the conductive particles flow when the circuit is connected, there is a possibility that the conductive particles aggregate between the electrodes and cause a short circuit. In addition, the density distribution of the conductive particles accompanying the flow of the conductive particles has the risk of not only deteriorating the insulating properties but also causing fluctuations in the connection resistance value, so there is still room for improvement.

Therefore, the present invention provides a circuit connection adhesive film capable of reducing the connection resistance between opposing electrodes of the circuit connection structure, a manufacturing method thereof, a manufacturing method of a circuit connection structure using the adhesive film, and a circuit connection structure comprising the adhesive film. The object is to provide an adhesive film receiving set.

The adhesive film for circuit connection of one aspect of the present invention includes a first adhesive layer and a second adhesive layer laminated on the first adhesive layer, and the first adhesive layer includes a cured product of a photocurable composition; , the second adhesive layer includes a thermosetting composition, and the photocurable composition includes a polymerizable compound, conductive particles, a structure represented by the following formula (I), a structure represented by the following formula (II), and a structure represented by the following formula (III) It contains a photopolymerization initiator having at least one structure selected from the group consisting of structures.

According to this adhesive film for circuit connection, the connection resistance between opposing electrodes of the circuit connection structure can be reduced. Moreover, according to this adhesive film for circuit connection, low connection resistance can be maintained even under a high temperature, high humidity environment (for example, 85°C, 85%RH). That is, according to this adhesive film for circuit connection, the connection reliability of the circuit connection structure can be improved.

The method for producing an adhesive film for circuit connection of one aspect of the present invention includes a preparation step of preparing a first adhesive layer, and a laminating step of laminating a second adhesive layer containing a thermosetting composition on the first adhesive layer, , the preparation step includes a step of curing the photocurable composition by irradiating light to the layer containing the photocurable composition to obtain a first adhesive layer, wherein the photocurable composition includes a polymerizable compound, conductive particles, and the above It contains a photopolymerization initiator having at least one structure selected from the group consisting of a structure represented by formula (I), a structure represented by formula (II), and a structure represented by formula (III). According to this method, an adhesive film for circuit connection that can reduce the connection resistance between opposing electrodes of the circuit connection structure can be obtained.

The photopolymerization initiator is a structure represented by the formula (II), and may have at least one structure selected from the group consisting of a structure represented by the formula (IV) below and a structure represented by the formula (V) below.

[In formula (IV), R ¹ and R ² each independently represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms.]

The polymerizable compound may be a radically polymerizable compound having a radically polymerizable group.

The photopolymerization initiator is a structure represented by the above formulas (I) to (III), and may have at least one structure selected from the group consisting of an oxime ester structure, an α-aminoalkylphenone structure, and an acylphosphine oxide structure.

The thermosetting composition may contain a radically polymerizable compound having a radically polymerizable group.

The thickness of the first adhesive layer may be 0.2 to 0.8 times the average particle diameter of the conductive particles.

The manufacturing method of the circuit connection structure of one aspect of the present invention includes interposing the above-described adhesive film for circuit connection between a first circuit member having a first electrode and a second circuit member having a second electrode, A step of thermocompressing the circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other is provided. According to this method, a circuit connection structure with reduced connection resistance between opposing electrodes can be obtained.

The adhesive film accommodating set of one aspect of the present invention includes the above-described adhesive film for circuit connection and an accommodating member for accommodating the adhesive film, and the accommodating member has a visibility portion that allows the inside of the accommodating member to be viewed from the outside. and the transmittance of light with a wavelength of 365 nm in the visible portion is 10% or less.

However, generally, the environment in which the adhesive film for circuit connection is used is a room called a clean room, where the indoor temperature, humidity, and cleanliness are controlled at a certain level. When the adhesive film for circuit connection is shipped from the production site, the adhesive film for circuit connection is placed in a receiving member such as a packaging bag so as not to be exposed directly to the outside air and cause quality deterioration due to dust and moisture. Usually, this housing member is provided with a visibility portion formed of a transparent material so that various information such as the product name, lot number, and expiration date attached to the adhesive film inside can be confirmed from outside the housing member.

However, examination by the present inventors has revealed that when the adhesive film for circuit connection described above is accommodated in a conventional housing member and used after being stored or transported, the effect of reducing the connection resistance of the adhesive film may not be obtained. Based on these examination results, the present inventors conducted further studies and found that, when a compound capable of reacting with the photopolymerization initiator in the photocurable composition was used as the polymerizable compound in the second adhesive layer, during storage of the adhesive film. And it was found that the thermosetting composition hardens during transportation, and the effect of reducing connection resistance decreases. Therefore, the present inventors conducted further studies based on the assumption that polymerization of the polymerizable compound in the thermosetting composition is progressing due to radicals derived from the photopolymerization initiator remaining in the first adhesive layer, and found that the adhesive provided with the above-mentioned specific receiving member It was discovered that by using a film housing set, curing of the thermosetting composition during storage or transportation could be suppressed, and the effect of reducing the connection resistance of the adhesive film could be maintained.

That is, according to the adhesive film accommodation set of one aspect of the present invention, when a compound capable of reacting with a photopolymerization initiator in a photocurable composition is used as a polymerizable compound in the thermosetting composition, the adhesive film can be stored or transported. Curing of the thermosetting composition can be suppressed, and the effect of reducing the connection resistance of the adhesive film can be maintained.

ADVANTAGE OF THE INVENTION According to this invention, the adhesive film for circuit connection which can reduce the connection resistance between opposing electrodes of a circuit connection structure, and its manufacturing method can be provided. Furthermore, according to the present invention, a method for manufacturing a circuit connection structure using such an adhesive film can be provided. Additionally, according to the present invention, it is possible to provide an adhesive film accommodating set provided with such an adhesive film.

1 is a schematic cross-sectional view showing an adhesive film for circuit connection according to one embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view showing the circuit connection structure of one embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view showing the manufacturing process of the circuit connection structure according to one embodiment of the present invention.
Figure 4 is a perspective view showing an adhesive film housing set according to one embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail, referring to the drawings as the case may be. In addition, in this specification, the upper and lower limits individually described can be arbitrarily combined. In addition, in this specification, “(meth)acrylate” means at least one of acrylate and the corresponding methacrylate. The same applies to other similar expressions such as “(meth)acryloyl”.

<Adhesive film for circuit connection>

1 is a schematic cross-sectional view showing an adhesive film for circuit connection of one embodiment. As shown in FIG. 1, the adhesive film 1 for circuit connection (hereinafter also simply referred to as the “adhesive film 1”) is formed on the first adhesive layer 2 and the first adhesive layer 2. It is provided with a second adhesive layer (3) laminated on.

(First adhesive layer)

The first adhesive layer 2 contains a cured product (photocured product) of the photocurable composition. The photocurable composition includes (A) a polymerizable compound (hereinafter also referred to as “component (A)”), (B) a photopolymerization initiator (hereinafter also referred to as “component (B)”), and (C) conductive particles (4) (hereinafter also referred to as “(C) component”). The photocurable composition may further contain (D) a thermosetting resin (hereinafter also referred to as “(D) component”) and/or (E) a thermal polymerization initiator (hereinafter also referred to as “(E) component”). The first adhesive layer 2 is obtained, for example, by irradiating light energy to the layer containing the photocurable composition to polymerize component (A) and curing the photocurable composition. That is, the first adhesive layer 2 contains the conductive particles 4 and the adhesive component 5 formed by curing components other than the conductive particles 4 of the photocurable composition. The first adhesive layer 2 may be a cured product obtained by completely curing the photocurable composition, or may be a cured product obtained by partially curing the photocurable composition. That is, the adhesive component (5) may or may not contain unreacted component (A) and component (B) (further (D) component and (E) component).

[(A) Component: Polymerizable Compound]

Component (A) is a compound that polymerizes, for example, by radicals, cations, or anions generated by a photopolymerization initiator when irradiated with light (for example, ultraviolet light). (A) The component may be any of monomers, oligomers, or polymers. (A) As a component, one type of compound may be used individually, or multiple types of compounds may be used in combination.

(A) Component has at least one polymerizable group. A polymerizable group is, for example, a group containing a polymerizable unsaturated double bond (ethylenically unsaturated bond). The polymerizable group is preferably a radically polymerizable group that reacts with radicals from the viewpoint of further improving the effect of reducing connection resistance and improving connection reliability. That is, it is preferable that component (A) is a radically polymerizable compound. Examples of radically polymerizable groups include vinyl group, allyl group, styryl group, alkenyl group, alkenylene group, (meth)acryloyl group, maleimide group, etc. The number of polymerizable groups in component (A) may be 2 or more from the viewpoint of easily obtaining the physical properties and crosslinking density necessary to reduce connection resistance after polymerization, and from the viewpoint of suppressing cure shrinkage during polymerization, It can be less than 10. Suppressing curing shrinkage during polymerization is desirable because a uniform and stable film (first adhesive layer) is obtained after light irradiation. In this embodiment, in order to obtain a balance between crosslinking density and cure shrinkage, a polymerizable compound having a number of polymerizable groups within the above range may be used, and then a polymerizable compound having a number of polymerizable groups outside the above range may be further used.

Specific examples of the component (A) include (meth)acrylate compounds, maleimide compounds, vinyl ether compounds, allyl compounds, styrene derivatives, acrylamide derivatives, nadiimide derivatives, natural rubber, isoprene rubber, butyl rubber, nitrile rubber, butadiene. Rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, carboxylated nitrile rubber, etc. can be mentioned.

Examples of (meth)acrylate compounds include epoxy (meth)acrylate, (poly)urethane (meth)acrylate, methyl (meth)acrylate, polyether (meth)acrylate, polyester (meth)acrylate, and polybutadiene. (meth)acrylate, silicone acrylate, ethyl (meth)acrylate, 2-cyanoethyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-hexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, isopropyl (meth)acrylate, hydroxypropyl (meth) Acrylate, isobutyl (meth)acrylate, isobornyl (meth)acrylate, isodecyl (meth)acrylate, isooctyl (meth)acrylate, n-lauryl (meth)acrylate, 2-methoxy Ethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-(meth)acryloyloxyethyl phosphate, N,N-dimethylaminoethyl (meth) Acrylate, N,N-dimethylaminopropyl (meth)acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, Polyethylene glycol di(meth)acrylate, polyalkylene glycol di(meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, Neopentyl glycol di(meth)acrylate, pentaerythritol (meth)acrylate, dipentaerythritol hexa(meth)acrylate, isocyanuric acid-modified bifunctional (meth)acrylate, isocyanuric acid-modified trifunctional (meth)acrylate, tricyclodecanyl acrylate, dimethylol-tricyclodecane diacrylate, 2-hydroxy-1,3-diacryloxypropane, 2,2-bis[4-(acryloxymethoxy) )phenyl]propane, 2,2-bis[4-(acryloxypolyethoxy)phenyl]propane, 2,2-di(meth)acryloyloxydiethyl phosphate, 2-(meth)acryloyloxyethyl acid Phosphate, etc. can be mentioned.

As maleimide compounds, 1-methyl-2,4-bismaleimide benzene, N,N'-m-phenylenebismaleimide, N,N'-p-phenylenebismaleimide, N,N'-m -Toluylenebismaleimide, N,N'-4,4-biphenylenebismaleimide, N,N'-4,4-(3,3'-dimethyl-biphenylene)bismaleimide, N, N'-4,4-(3,3'-dimethyldiphenylmethane)bismaleimide, N,N'-4,4-(3,3'-diethyldiphenylmethane)bismaleimide, N,N '-4,4-Diphenylmethane bismaleimide, N,N'-4,4-diphenylpropanebismaleimide, N,N'-4,4-diphenyletherbismaleimide, N,N'- 3,3-diphenylsulfonebismaleimide, 2,2-bis(4-(4-maleimidephenoxy)phenyl)propane, 2,2-bis(3-s-butyl-4-8(4-maleimide) Midphenoxy)phenyl)propane, 1,1-bis(4-(4-maleimidephenoxy)phenyl)decane, 4,4'-cyclohexylidene-bis(1-(4maleimidephenoxy)- 2-cyclohexylbenzene, 2,2'-bis(4-(4-maleimidephenoxy)phenyl)hexafluoropropane, etc. are mentioned.

Examples of vinyl ether compounds include diethylene glycol divinyl ether, dipropylene glycol divinyl ether, cyclohexanedimethanol divinyl ether, and trimethylolpropane trivinyl ether.

Examples of allyl compounds include 1,3-diallyl phthalate, 1,2-diallyl phthalate, and triallyl isocyanurate.

The component (A) is preferably a (meth)acrylate compound from the viewpoint of excellent balance between the curing reaction rate and the physical properties after curing. Component (A) is a (poly)urethane (meth)acrylate compound (urethane (meth)acrylate) from the viewpoint of achieving both cohesion to reduce connection resistance and elongation to improve adhesion and to obtain better adhesive properties. It may be a late compound or a polyurethane (meth)acrylate compound). Additionally, the component (A) may be a (meth)acrylate compound having a high Tg skeleton such as a dicyclopentadiene skeleton from the viewpoint of improving cohesion and further reducing connection resistance.

Component (A) is added to the terminal or side chain of a thermoplastic resin such as an acrylic resin, phenoxy resin, or polyurethane resin from the viewpoint of balancing crosslink density and cure shrinkage, further reducing connection resistance, and improving connection reliability. Any compound (for example, polyurethane (meth)acrylate) into which a polymerizable group such as vinyl group, allyl group, or (meth)acryloyl group has been introduced may be used. In this case, the weight average molecular weight of component (A) may be 3,000 or more, 5,000 or more, or 10,000 or more from the viewpoint of excellent balance between crosslink density and cure shrinkage. In addition, the weight average molecular weight of component (A) may be 1 million or less, 500,000 or less, or 250,000 or less from the viewpoint of excellent compatibility with other components. In addition, the weight average molecular weight refers to a value measured using a calibration curve using standard polystyrene from gel permeation chromatography (GPC) according to the conditions described in the examples.

The component (A) is a (meth)acrylate compound, which preferably contains a radically polymerizable compound having a phosphoric acid ester structure represented by the following general formula (1). In this case, since the adhesive strength to the surface of an inorganic material (metal, etc.) is improved, it is suitable for adhesion between electrodes (for example, circuit electrodes).

In formula (1), n represents an integer of 1 to 3, and R represents a hydrogen atom or a methyl group.

The radically polymerizable compound having the phosphoric acid ester structure is obtained, for example, by reacting phosphoric acid anhydride with 2-hydroxyethyl (meth)acrylate. Specific examples of radically polymerizable compounds having a phosphoric acid ester structure include mono(2-(meth)acryloyloxyethyl)acid phosphate, di(2-(meth)acryloyloxyethyl)acid phosphate, and the like.

The content of component (A) may be 5% by mass or more, and may be 10% by mass or more, based on the total mass of the photocurable composition, from the viewpoint of easily obtaining the crosslinking density necessary to reduce connection resistance and improve connection reliability. It may be 20% by mass or more. The content of component (A) may be 90% by mass or less, 80% by mass or less, or 70% by mass or less, based on the total mass of the photocurable composition, from the viewpoint of suppressing cure shrinkage during polymerization.

[(B) Component: Photopolymerization initiator]

(B) Component has at least one structure selected from the group consisting of a structure represented by the following formula (I), a structure represented by the following formula (II), and a structure represented by the following formula (III).

(B) Component may have multiple structures represented by the above formulas (I) to (III). The plurality of structures may be the same or different from each other. (B) As a component, one type of compound may be used individually, or multiple types of compounds may be used in combination.

Component (B) is light containing a wavelength in the range of 150 to 750 nm, preferably light containing a wavelength in the range of 254 to 405 nm, more preferably light containing a wavelength of 365 nm (for example, ultraviolet light ) Any photopolymerization initiator (photoradical polymerization initiator, photocationic polymerization initiator, or photoanionic polymerization initiator) that generates radicals, cations, or anions upon irradiation is sufficient, and the effect of reducing connection resistance is further improved and connection reliability is improved. And from the viewpoint of making curing at low temperature and in a short time easier, it is preferable that it is a radical photopolymerization initiator.

The structure represented by the formula (I) may be an oxime ester structure, a bisimidazole structure, or an acridine structure. That is, component (B) is a structure represented by the formula (I) and may have at least one structure selected from the group consisting of an oxime ester structure, a bisimidazole structure, and an acridine structure.

As a compound having an oxime ester structure, a compound having a structure represented by the following formula (VI) is preferably used.

In formula (VI), R ¹¹ , R ¹² and R ¹³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an organic group containing an aromatic hydrocarbon group.

Specific examples of compounds having an oxime ester structure include 1-phenyl-1,2-butanedione-2-(o-methoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-(o-meth Toxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-o-benzoyloxime, 1,3 -Diphenylpropanetrione-2-(o-ethoxycarbonyl)oxime, 1-phenyl-3-ethoxypropanetrione-2-(o-benzoyl)oxime, 1,2-octanedione, 1-[ 4-(phenylthio)phenyl-, 2-(o-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1 -(o-acetyloxime) etc. can be mentioned.

Compounds having a bisimidazole structure include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(m-methoxyphenyl) ) Imidazole dimer, 2-(o-fluorophenyl)-4,5-phenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2 -(p-methoxyphenyl)-4,5-diphenylimidazole dimer, 2,4-di(p-methoxyphenyl)-5-phenylimidazole dimer, 2-(2,4- 2,4,5-triarylimidazole dimers such as dimethoxy phenyl)-4,5-diphenylimidazole dimer.

Compounds having an acridine structure include 9-phenylacridine, 1,7-bis(9,9'-acridinyl)heptane, and the like.

The structure represented by the formula (II) may be, for example, a structure represented by the formula (IV) below or a structure represented by the formula (V) below. That is, component (B) is a structure represented by the formula (II), and may have at least one structure selected from the group consisting of a structure represented by the formula (IV) below and a structure represented by the formula (V) below. It is preferable that the component (B) has at least one of the structure represented by the following formula (IV) and the structure represented by the following formula (V) from the viewpoint of further improving the effect of reducing connection resistance and improving connection reliability.

In formula (IV), R ¹ and R ² each independently represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms.

The structure represented by the formula (II) may be an α-aminoalkylphenone structure, an aminobenzophenone structure, or an N-phenylglycine structure. That is, component (B) may have at least one structure selected from the group consisting of an α-aminoalkylphenone structure, an aminobenzophenone structure, and an N-phenylglycine structure.

As a compound having an α-aminoalkylphenone structure, a compound having a structure represented by the following formula (VII) is preferably used.

In formula (VII), R ²¹ , R ²² , R ²³ and R ²⁴ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an organic group containing an aromatic hydrocarbon group, or a structure represented by the above formula (IV). represents a functional group or a functional group containing the structure represented by the above formula (V). At least one of R ²² , R ²³ and R ²⁴ is a functional group containing a structure represented by the above formula (IV) or a functional group containing a structure represented by the above formula (V).

Specific examples of compounds having an α-aminoalkylphenone structure include 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1 -morpholinophenyl)-butanone-1, etc. can be mentioned.

Compounds having an aminobenzophenone structure include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, and 4-methoxy-4'-dimethylaminobenzophenone. I can hear it.

Examples of compounds having an N-phenylglycine structure include N-phenylglycine.

The structure represented by the formula (III) may be an acylphosphine oxide structure. That is, component (B) is a structure represented by the above formula (III) and may have an acylphosphine oxide structure.

As a compound having an acylphosphine oxide structure, a compound having a structure represented by the following formula (VIII) is preferably used.

In formula (VIII), R ³¹ , R ³² and R ³³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an organic group containing a carbonyl group or an aromatic hydrocarbon group.

Specific examples of compounds having an acylphosphine oxide structure include bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, bis(2,4,6,-trimethylbenzoyl)-phenyl Phosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, etc. can be mentioned.

(B) The component is at least one selected from the group consisting of an oxime ester structure, an α-aminoalkylphenone structure, and an acylphosphine oxide structure, from the viewpoint of further improving the effect of reducing connection resistance and improving connection reliability. It is desirable to have a structure.

The content of component (B) is preferably 0.1% by mass or more, based on the total mass of the photocurable composition, from the viewpoint of excellent fast curing properties, further improved connection resistance reduction effect, and superior connection reliability, More preferably, it is 0.3 mass% or more. The content of component (B) may be 1% by mass or more, 1.5% by mass or more, 2% by mass or more, or 2.5% by mass or more, based on the total mass of the photocurable composition. The content of component (B) is preferably 15% by mass or less, based on the total mass of the photocurable composition, from the viewpoint of improved storage stability, further improved connection resistance reduction effect, and superior connection reliability. , more preferably 10 mass% or less, further preferably 5 mass% or less. The content of component (B) is 3.5 mass% or less, 3 mass% or less, 2.5 mass% or less, 2 mass% or less, 1.5 mass% or less, 1 mass% or less, or 0.7 mass%, based on the total mass of the photocurable composition. The following may be acceptable. From these viewpoints, the content of component (B) is preferably 0.1 to 15% by mass, more preferably 0.1 to 10% by mass, and still more preferably 0.3 to 5% by mass, based on the total mass of the photocurable composition. . The content of component (B) may be, for example, 0.1 to 1% by mass, 0.3 to 0.7% by mass, 1.5 to 3.5% by mass, or 2 to 3% by mass, based on the total mass of the photocurable composition.

[(C) Component: Conductive particles]

The component (C) is not particularly limited as long as it is a conductive particle, and may be a metal particle made of a metal such as Au, Ag, Ni, Cu, or solder, or a conductive carbon particle made of conductive carbon. The component (C) may be a covered conductive particle including a core containing non-conductive glass, ceramic, plastic (polystyrene, etc.), and a coating layer containing the metal or conductive carbon and covering the core. Among these, metal particles formed of a heat-meltable metal, or covered conductive particles having a core containing plastic and a coating layer containing metal or conductive carbon and covering the core are preferably used. In this case, since it is easy to deform the cured product of the photocurable composition by heating or pressurizing, when electrically connecting the electrodes, the contact area between the electrodes and component (C) is increased, and the conductivity between the electrodes is further improved. You can do it.

The component (C) may be an insulating coated conductive particle that contains the metal particles, conductive carbon particles, or coated conductive particles and an insulating material such as resin, and has an insulating layer that covers the surface of the particles. If the component (C) is an insulating coated conductive particle, even when the content of the component (C) is high, the surface of the particle is covered with resin, so the occurrence of short circuit due to contact between the components (C) can be suppressed. , It is also possible to improve insulation between adjacent electrode circuits. (C) Component is used individually or in combination of 2 or more types of the various electrically conductive particles mentioned above.

The maximum particle size of component (C) must be smaller than the minimum spacing between electrodes (shortest distance between adjacent electrodes). The maximum particle diameter of component (C) may be 1.0 μm or more, 2.0 μm or more, and 2.5 μm or more from the viewpoint of excellent dispersibility and conductivity. The maximum particle size of component (C) may be 50 μm or less, 30 μm or less, and 20 μm or less from the viewpoint of excellent dispersibility and conductivity. In this specification, the particle size of 300 arbitrary conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the largest value obtained is taken as the maximum particle size of component (C). In addition, when component (C) is not spherical, such as when component (C) has protrusions, the particle size of component (C) is set to be the diameter of a circle circumscribed by the conductive particles in the SEM image.

The average particle diameter of component (C) may be 1.0 μm or more, 2.0 μm or more, and 2.5 μm or more from the viewpoint of excellent dispersibility and conductivity. The average particle diameter of component (C) may be 50 μm or less, 30 μm or less, and 20 μm or less from the viewpoint of excellent dispersibility and conductivity. In this specification, the particle diameter of 300 arbitrary conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the average value of the obtained particle diameters is taken as the average particle diameter.

In the first adhesive layer 2, component (C) is preferably dispersed uniformly. The particle density of component (C) in the first adhesive layer 2 may be 100 pcs/mm 2 or more, 1000 pcs/mm ² or more, or 2000 pcs/mm ^{2 or} more from the viewpoint of easily obtaining stable connection resistance. You can continue. The particle density of component (C) in the first adhesive layer 2 may be 100,000 pcs/mm ² or less, 50,000 pcs/mm ² or less, or 10,000 pcs/mm ² from the viewpoint of improving the insulation between adjacent electrodes. The following may be acceptable.

The content of component (C) may be 0.1 volume% or more, 1 volume% or more, or 5 volume% or more, based on the total volume in the first adhesive layer, from the viewpoint of further improving conductivity. The content of component (C) may be 50 volume% or less, 30 volume% or less, or 20 volume% or less, based on the total volume in the first adhesive layer, from the viewpoint of easily suppressing short circuit. Additionally, the content of component (C) based on the total volume of the photocurable composition may be the same as the above range.

[(D) Ingredient: Thermosetting resin]

(D) Component is a resin that hardens by heat and has at least one thermosetting group. (D) Component is a compound that crosslinks by reacting with a curing agent by heat, for example. (D) As a component, one type of compound may be used individually, or multiple types of compounds may be used in combination.

The thermosetting group may be, for example, an epoxy group or an oxetane group from the viewpoint of further improving the effect of reducing connection resistance and improving connection reliability.

Specific examples of the component (D) include bisphenol-type epoxy resin, which is a reaction product of epichlorohydrin and bisphenol A, F, AD, etc., and epoxy resin, which is a reaction product of epichlorohydrin and phenol novolak, cresol novolac, etc. Epoxy resins include rockfish resin, naphthalene-based epoxy resins having a skeleton containing a naphthalene ring, and various epoxy compounds having two or more glycidyl groups in one molecule, such as glycidylamine and glycidyl ether.

The content of component (D) may be 30% by mass or more and may be 70% by mass or less, based on the total mass of the first adhesive layer.

When the first adhesive layer contains a thermosetting resin, the first adhesive layer may further contain a curing agent used to cure the thermosetting resin. The curing agent is not particularly limited as long as it generates cationic species by heat, and can be appropriately selected depending on the purpose. Examples of the curing agent include sulfonium salts and iodonium salts. The content of the curing agent may be, for example, 0.1 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the thermosetting resin.

[(E) Component: Thermal polymerization initiator]

The component (E) may be a thermal polymerization initiator (thermal radical polymerization initiator, thermal cationic polymerization initiator, or thermal anionic polymerization initiator) that generates radicals, cations, or anions by heat, and the effect of reducing connection resistance is further improved, and connection reliability is further improved. From this superior viewpoint, it is preferable that it is a thermal radical polymerization initiator. (E) As a component, one type of compound may be used individually, or multiple types of compounds may be used in combination.

The thermal radical polymerization initiator is decomposed by heat and generates free radicals. That is, a thermal radical polymerization initiator is a compound that generates radicals by applying heat energy from the outside. As a thermal radical polymerization initiator, it can be arbitrarily selected from conventionally known organic peroxides and azo compounds. As a thermal radical polymerization initiator, from the viewpoint of stability, reactivity and compatibility, an organic peroxide having a 1-minute half-life temperature of 90 to 175°C and a weight average molecular weight of 180 to 1000 is preferably used. When the 1-minute half-life temperature is within this range, storage stability is further excellent, radical polymerizability is sufficiently high, and curing is possible in a short time.

Specific examples of the component (E) include 1,1,3,3-tetramethylbutylperoxyneodecanoate, di(4-t-butylcyclohexyl)peroxydicarbonate, and di(2-ethylhexyl)per. Oxydicarbonate, cumyl peroxyneodecanoate, dilauroyl peroxide, 1-cyclohexyl-1-methylethylperoxyneodecanoate, t-hexyl peroxyneodecanoate, t-butyl peroxy Neodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di(2-ethylhexa) (noylperoxy)hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyneoheptanoate, t-amylperoxy-2- Ethylhexanoate, di-t-butylperoxyhexahydroterephthalate, t-amylperoxy-3,5,5-trimethylhexanoate, 3-hydroxy-1,1-dimethylbutylperoxyneodecano ate, t-amylperoxyneodecanoate, t-amylperoxy-2-ethylhexanoate, di(3-methylbenzoyl)peroxide, dibenzoyl peroxide, di(4-methylbenzoyl)peroxide, t-hexylperoxyisopropylmonocarbonate, t-butylperoxymaleic acid, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, 2,5-dimethyl -2,5-di(3-methylbenzoylperoxy)hexane, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-di (benzoyl peroxy)hexane, t-butyl peroxybenzoate, dibutyl peroxytrimethyl adipate, t-amyl peroxy normal octoate, t-amyl peroxyisononanoate, t-amyl peroxybenzoate, etc. organic peroxides; 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'-azobis(1-acetoxy-1-phenylethane), 2,2'-azobisisobutyronitrile, 2, Azo compounds such as 2'-azobis(2-methylbutyronitrile), 4,4'-azobis(4-cyanovaleric acid), 1,1'-azobis(1-cyclohexanecarbonitrile), etc. can be mentioned.

The content of component (E) may be 0.1% by mass or more, or 0.5% by mass or more, based on the total mass of the first adhesive layer, from the viewpoint of further improving the effect of reducing connection resistance and improving connection reliability, It may be 1% by mass or more. The content of component (E) may be 20% by mass or less, 10% by mass or less, or 5% by mass or less, based on the total mass of the first adhesive layer, from the viewpoint of pot life. The first adhesive layer 2 does not need to contain component (E). Additionally, the content of component (E) based on the total mass of the photocurable composition may be the same as the above range.

[Other ingredients]

The photocurable composition may further contain other components other than component (A), component (B), component (C), component (D), and component (E). Other components include, for example, a photopolymerization initiator other than component (B), a thermoplastic resin, a coupling agent, a filler, and the above-mentioned curing agent. These components may be contained in the first adhesive layer 2.

Examples of photopolymerization initiators other than the component (B) include a photopolymerization initiator with a benzyldimethylketal structure, a photopolymerization initiator with an α-hydroxyalkylphenone structure, and the like. The content of photopolymerization initiators other than the component (B) may be, for example, 1 part by mass or more and 1000 parts by mass or less per 100 parts by mass of the component (B).

Examples of thermoplastic resins include phenoxy resin, polyester resin, polyamide resin, polyurethane resin, polyester urethane resin, and acrylic rubber. When the photocurable composition contains a thermoplastic resin, the first adhesive layer can be easily formed. Additionally, when the photocurable composition contains a thermoplastic resin, the stress in the first adhesive layer that occurs during curing of the photocurable composition can be alleviated. Additionally, when the thermoplastic resin has a functional group such as a hydroxyl group, the adhesiveness of the first adhesive layer is likely to improve. The content of the thermoplastic resin may be, for example, 5% by mass or more and 80% by mass or less, based on the total mass of the photocurable composition.

As coupling agents, silane coupling agents having organic functional groups such as (meth)acryloyl group, mercapto group, amino group, imidazole group, and epoxy group, silane compounds such as tetraalkoxysilane, tetraalkoxy titanate derivatives, and polydialkyl titanate. Derivatives, etc. can be mentioned. When the photocurable composition contains a coupling agent, adhesiveness can be further improved. The content of the coupling agent may be, for example, 0.1% by mass or more and 20% by mass or less based on the total mass of the photocurable composition.

Examples of fillers include non-conductive fillers (eg, non-conductive particles). When the photocurable composition contains a filler, further improvement in connection reliability can be expected. The filler may be either an inorganic filler or an organic filler. Examples of the inorganic filler include metal oxide fine particles such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles; Inorganic fine particles such as nitride fine particles can be mentioned. Examples of the organic filler include organic fine particles such as silicon fine particles, methacrylate-butadiene-styrene fine particles, acrylic-silicone fine particles, polyamide fine particles, and polyimide fine particles. These fine particles may have a uniform structure or a core-shell type structure. The maximum diameter of the filler is preferably less than the minimum particle size of the conductive particles 4. For example, the content of the filler may be 1 volume% or more and 30 volume% or less based on the total volume of the photocurable composition.

The photocurable composition may contain other additives such as softeners, accelerators, anti-deterioration agents, colorants, flame retardants, and thixotropic agents. The content of these additives may be, for example, 0.1 to 10 mass% based on the total mass of the photocurable composition. These additives may be contained in the first adhesive layer 2.

The first adhesive layer 2 may contain components derived from the photocurable composition, such as unreacted component (A) and component (B). When the adhesive film 1 of the present embodiment is stored and transported by storing it in a conventional housing member, unreacted component (B) remains in the first adhesive layer 2, so that during storage and transport, It is presumed that a part of the thermosetting composition in the second adhesive layer 3 is cured, and the effect of reducing the connection resistance of the adhesive film 1 is reduced. Therefore, when the first adhesive layer 2 contains the component (B), a decrease in the effect of reducing connection resistance can be prevented by housing the adhesive film 1 in a receiving member described later. The content of component (B) in the first adhesive layer 2 is 15 based on the total mass of the first adhesive layer, from the viewpoint of making it difficult for the thermosetting composition to harden and sufficiently obtaining the effect of reducing connection resistance. It may be % by mass or less, may be 10 mass % or less, and may be 5 mass % or less. The content of component (B) in the first adhesive layer 2 may be 0.1% by mass or more based on the total mass of the first adhesive layer.

The thickness d1 of the first adhesive layer 2 is 0.2 times the average particle diameter of the conductive particles 4 from the viewpoint that the conductive particles 4 are easy to be captured between opposing electrodes and the connection resistance can be further reduced. It may be more than 0.3 times or more. The thickness d1 of the first adhesive layer 2 is set so that the conductive particles are more likely to be crushed when they are sandwiched between opposing electrodes during thermal compression, and the connection resistance can be further reduced, so that the conductive particles are It may be 0.8 times or less, or 0.7 times or less, of the average particle diameter in (4). From these viewpoints, the thickness d1 of the first adhesive layer 2 may be 0.2 to 0.8 times or 0.3 to 0.7 times the average particle diameter of the conductive particles 4. When the thickness d1 of the first adhesive layer 2 and the average particle diameter of the conductive particles 4 satisfy the above relationship, for example, as shown in FIG. 1, the conductive particles in the first adhesive layer 2 A part of (4) may protrude from the first adhesive layer (2) toward the second adhesive layer (3). In this case, the boundary S between the first adhesive layer 2 and the second adhesive layer 3 is located at the spaced apart portion of the adjacent conductive particles 4, 4. The conductive particles 4 are not exposed on the surface 2a of the first adhesive layer 2 opposite to the second adhesive layer 3 side, and the opposite surface 2a is a flat surface. do.

The thickness d1 of the first adhesive layer 2 may be set appropriately depending on the height of the electrode of the circuit member to be bonded, etc. The thickness d1 of the first adhesive layer 2 may be, for example, 0.5 μm or more and 20 μm or less. In addition, when a part of the conductive particles 4 is exposed from the surface of the first adhesive layer 2 (for example, protruding toward the second adhesive layer 3), the The boundary between the first adhesive layer 2 and the second adhesive layer 3 located at the spaced portion between the adjacent conductive particles 4, 4 from the surface 2a on the opposite side to the second adhesive layer 3 side. The distance to S (the distance indicated by d1 in FIG. 1) is the thickness of the first adhesive layer 2, and the exposed portion of the conductive particles 4 is not included in the thickness of the first adhesive layer 2. The length of the exposed portion of the conductive particles 4 may be, for example, 0.1 μm or more and 20 μm or less.

(Second adhesive layer)

The second adhesive layer 3 is thermosetting, containing, for example, (a) a polymerizable compound (hereinafter also referred to as component (a)) and (b) a thermal polymerization initiator (hereinafter also referred to as component (b)). Contains a composition. The thermosetting composition constituting the second adhesive layer 3 is a thermosetting composition that can flow during circuit connection, for example, an uncured thermosetting composition.

[(a) Ingredient: Polymerizable compound]

Component (a) is a compound that polymerizes, for example, by radicals, cations, or anions generated by a thermal polymerization initiator through heat. As the component (a), the compounds exemplified as the component (A) can be used. The component (a) is preferably a radically polymerizable compound having a radically polymerizable group that reacts with a radical from the viewpoint of facilitating connection at low temperatures and for a short time, further improving the effect of reducing connection resistance, and providing superior connection reliability. do. Examples of preferred radically polymerizable compounds and combinations of preferred radically polymerizable compounds in component (a) are the same as those for component (A). When the component (a) is a radically polymerizable compound and the component (B) in the first adhesive layer is a radical photopolymerization initiator, the adhesive film is accommodated in a receiving member described later during storage or transportation of the adhesive film. Curing of the thermosetting composition tends to be significantly suppressed.

(a) The component may be any of monomers, oligomers, or polymers. (a) As a component, one type of compound may be used individually, or multiple types of compounds may be used in combination. (a) Component may be the same as or different from (A) component.

The content of component (a) may be 10% by mass or more, and may be 20% by mass or more, based on the total mass of the thermosetting composition, from the viewpoint of easily obtaining the crosslinking density necessary to reduce connection resistance and improve connection reliability. It may be 30% by mass or more. The content of component (a) may be 90% by mass or less, 80% by mass or less, or 70% by mass, based on the total mass of the thermosetting composition, from the viewpoint of suppressing curing shrinkage during polymerization and obtaining good reliability. It may be % or less.

[(b) Ingredient: thermal polymerization initiator]

As the component (b), the same thermal polymerization initiator as the component (E) can be used. (b) As a component, one type of compound may be used individually, or multiple types of compounds may be used in combination. (b) It is preferable that the component is a thermal radical polymerization initiator. Examples of preferable thermal radical polymerization initiators in component (b) are the same as those in component (E).

The content of component (b) may be 0.1% by mass or more, 0.5% by mass or more, or 1% by mass, based on the total mass of the thermosetting composition, from the viewpoint of further improving the effect of reducing connection resistance and improving connection reliability. It may be % or more. The content of the component (b) may be 30% by mass or less, 20% by mass or less, or 10% by mass or less based on the total mass of the thermosetting composition from the viewpoint of pot life.

[Other ingredients]

The thermosetting composition may further contain other components other than components (a) and (b). Other components include, for example, thermoplastic resins, coupling agents, fillers, softeners, accelerators, anti-deterioration agents, colorants, flame retardants, thixotropic agents, etc. The details of other components are the same as those of the other components in the first adhesive layer 2.

The thermosetting composition may contain the same thermosetting resin as the above-described component (D) instead of components (a) and (b) or in addition to components (a) and (b). In this case, the thermosetting composition may contain a curing agent used to cure the thermosetting resin described above. When a thermosetting resin is used instead of component (a) and (b), the content of the thermosetting resin in the thermosetting composition may be, for example, 20% by mass or more, based on the total mass of the thermosetting composition, and may be 80% by mass. It may be less than mass%. When a thermosetting resin is used in addition to component (a) and (b), the content of the thermosetting resin in the thermosetting composition may be, for example, 20% by mass or more, based on the total mass of the thermosetting composition, and may be 80% by mass. It may be less than mass%. The content of the curing agent may be the same as the range described as the content of the curing agent in the photocurable composition.

The content of the conductive particles 4 in the second adhesive layer 3 may be, for example, 1% by mass or less or 0% by mass based on the total mass of the second adhesive layer. It is preferable that the second adhesive layer 3 does not contain conductive particles 4.

The thickness d2 of the second adhesive layer 3 may be appropriately set depending on the height of the electrode of the circuit member to be bonded, etc. The thickness d2 of the second adhesive layer 3 may be 5 μm or more and 200 μm or less from the viewpoint of sufficiently filling the space between electrodes to seal the electrodes and obtaining better connection reliability. In addition, when a part of the conductive particles 4 is exposed from the surface of the first adhesive layer 2 (for example, protruding toward the second adhesive layer 3), The boundary between the first adhesive layer 2 and the second adhesive layer 3 located at a spaced apart portion of the adjacent conductive particles 4, 4 from the surface 3a on the opposite side to the first adhesive layer 2 side. The distance to S (distance indicated by d2 in FIG. 1) is the thickness of the second adhesive layer 3.

The ratio of the thickness d1 of the first adhesive layer 2 to the thickness d2 of the second adhesive layer 3 (thickness d1 of the first adhesive layer 2/thickness d2 of the second adhesive layer 3) is the electrode From the viewpoint of sufficiently filling the space between electrodes to seal the electrode and obtaining better reliability, the number may be 1 or more and may be 100 or less.

Thickness of the adhesive film 1 (sum of the thicknesses of all layers constituting the adhesive film 1. In FIG. 1, the thickness d1 of the first adhesive layer 2 and the thickness d2 of the second adhesive layer 3 (Total) can be, for example, 5 ㎛ or more and 200 ㎛ or less.

In the adhesive film 1, conductive particles 4 are dispersed in the first adhesive layer 2. Therefore, the adhesive film 1 is an anisotropically conductive adhesive film having anisotropic conductivity. The adhesive film 1 is sandwiched between a first circuit member having a first electrode and a second circuit member having a second electrode, and the first circuit member and the second circuit member are heat-compressed to form the first electrode. and to electrically connect the second electrodes to each other.

According to the adhesive film 1, connection resistance between opposing electrodes can be reduced and connection reliability can be improved. Although the reason why this effect is obtained is not clear, the present inventors estimate as follows. First, in the adhesive film 1, since the conductive particles 4 are fixed by a cured product of the photocurable composition, the flow of the conductive particles 4 during connection can be suppressed. Therefore, the trapping efficiency of the conductive particles 4 in the electrode can be improved. Additionally, in this embodiment, the photopolymerization initiator has at least one type of structure among the structures represented by the above formulas (I) to (III). This photopolymerization initiator changes the reactivity of the resin (for example, the reactivity of the resin in the vicinity of the conductive particle), and changes the crosslinking state and surface state of the resin, thereby causing a change in the surface of the conductive particle and the electrode surface during compression. Contact becomes easier to obtain. Therefore, in this embodiment, connection resistance can be reduced compared to the case of using a photopolymerization initiator that does not have the structure represented by the above formulas (I) to (III). The present inventors estimate that the above effect is obtained for the above reasons.

Although the adhesive film for circuit connection of the present embodiment has been described above, the present invention is not limited to the above-described embodiment.

For example, the adhesive film for circuit connection may be composed of two layers, a first adhesive layer and a second adhesive layer, and a layer other than the first adhesive layer and the second adhesive layer (for example, a third adhesive layer). It may be composed of three or more layers, including: The third adhesive layer may be a layer having the same composition as the composition described above for the first adhesive layer or the second adhesive layer, and may be a layer having the same thickness as the thickness described above for the first adhesive layer or the second adhesive layer. . The adhesive film for circuit connection may further include, for example, a third adhesive layer on the surface opposite to the second adhesive layer in the first adhesive layer. That is, the adhesive film for circuit connection is formed by, for example, laminating a second adhesive layer, a first adhesive layer, and a third adhesive layer in this order. In this case, the third adhesive layer includes, for example, the same thermosetting composition as the second adhesive layer.

In addition, the adhesive film for circuit connection of the above embodiment is an anisotropically conductive adhesive film that has anisotropic conductivity, but the adhesive film for circuit connection may be a conductive adhesive film that does not have anisotropic conductivity.

<Method for manufacturing adhesive film for circuit connection>

The manufacturing method of the adhesive film 1 for circuit connection of this embodiment includes, for example, a preparation step (first preparation step) of preparing the above-mentioned first adhesive layer 2, and the first adhesive layer 2 A laminating process is provided for laminating the second adhesive layer 3 described above. The manufacturing method of the adhesive film 1 for circuit connection may further include a preparation process (second preparation process) for preparing the second adhesive layer 3.

In the first preparation step, the first adhesive layer 2 is prepared, for example, by forming the first adhesive layer 2 on a base material to obtain a first adhesive film. Specifically, first, component (A), component (B), and component (C), and other components such as component (D) and (E) added as necessary, are added into an organic solvent, stirred and mixed, A varnish composition is prepared by dissolving or dispersing by kneading or the like. Thereafter, the varnish composition is applied onto the substrate that has undergone release treatment using a knife coater, roll coater, applicator, comma coater, die coater, etc., and then the organic solvent is volatilized by heating to form a photocurable composition on the substrate. forms a layer containing Subsequently, by irradiating light to the layer containing the photocurable composition, the photocurable composition is cured to form the first adhesive layer 2 on the substrate (curing process). Thereby, the first adhesive film is obtained.

The organic solvent used in preparing the varnish composition preferably has the property of dissolving or dispersing each component uniformly, for example, toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, and propyl acetate. , butyl acetate, etc. These organic solvents can be used individually or in combination of two or more types. Stirring mixing and kneading during preparation of the varnish composition can be performed using, for example, a stirrer, grinder, three-axis roll, ball mill, bead mill, or homo disper.

The base material is not particularly limited as long as it has heat resistance that can withstand the heating conditions when volatilizing the organic solvent, and examples include stretched polypropylene (OPP), polyethylene terephthalate (PET), polyethylene naphthalate, polyethylene isophthalate, Polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, polyimide, cellulose, ethylene/vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber, liquid crystal polymer. A substrate (for example, a film) containing such a material may be used.

The heating conditions for volatilizing the organic solvent from the varnish composition applied to the substrate are preferably such that the organic solvent is sufficiently volatilized. Heating conditions may be, for example, 40°C or higher and 120°C or lower for 0.1 minute or more and 10 minutes or less.

For light irradiation in the curing process, it is preferable to use irradiated light (for example, ultraviolet light) containing a wavelength within the range of 150 to 750 nm. Irradiation of light can be performed using, for example, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high pressure mercury lamp, a xenon lamp, a metal halide lamp, or an LED light source. The amount of light irradiated is not particularly limited, and may be, for example, an integrated light amount of light with a wavelength of 365 nm, which may be 0.01 to 10 J/cm ² .

In the second preparation process, the second preparation process is carried out on the substrate in the same manner as the first preparation process, except that component (a) and component (b), and other components added as necessary, are used and no light irradiation is performed. The second adhesive layer 3 is prepared by forming the adhesive layer 3 to obtain a second adhesive film.

In the lamination process, the second adhesive layer 3 may be laminated on the first adhesive layer 2 by bonding the first adhesive film and the second adhesive film, or (a) on the first adhesive layer 2. ) component and (b) component, and other components added as necessary, apply a varnish composition obtained, and evaporate the organic solvent, thereby laminating the second adhesive layer (3) on the first adhesive layer (2). You can do it.

Examples of methods for bonding the first adhesive film and the second adhesive film include heat press, roll lamination, and vacuum lamination. Laminating may be performed under temperature conditions of 0 to 80°C, for example.

<Circuit connection structure and manufacturing method thereof>

Hereinafter, a circuit connection structure using the above-mentioned circuit connection adhesive film 1 as a circuit connection material and its manufacturing method will be described.

Fig. 2 is a schematic cross-sectional view showing the circuit connection structure of one embodiment. As shown in FIG. 2, the circuit connection structure 10 is a first circuit having a first circuit board 11 and a first electrode 12 formed on the main surface 11a of the first circuit board 11. A second circuit member 16 having a member 13, a second circuit board 14, and a second electrode 15 formed on the main surface 14a of the second circuit board 14, and a first circuit member It is provided between (13) and the second circuit member 16, and has a circuit connecting portion 17 that electrically connects the first electrode 12 and the second electrode 15 to each other.

The first circuit member 13 and the second circuit member 16 may be the same or different from each other. The first circuit member 13 and the second circuit member 16 may be a glass substrate or plastic substrate on which electrodes are formed, a printed wiring board, a ceramic wiring board, a flexible wiring board, or a semiconductor silicon IC chip. The first circuit board 11 and the second circuit board 14 may be formed of an inorganic material such as a semiconductor, glass, or ceramic, an organic material such as polyimide or polycarbonate, or a composite such as glass/epoxy. The first electrode 12 and the second electrode 15 are gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, aluminum, molybdenum, titanium, indium tin oxide (ITO), and indium zinc. It may be formed of oxide (IZO), indium gallium zinc oxide (IGZO), etc. The first electrode 12 and the second electrode 15 may be circuit electrodes or may be bump electrodes. At least one of the first electrode 12 and the second electrode 15 may be a bump electrode. In Figure 2, the second electrode 15 is a bump electrode.

The circuit connection portion 17 includes a cured product of the adhesive film 1 described above. The circuit connection portion 17 is located, for example, on the side of the first circuit member 13 in the direction in which the first circuit member 13 and the second circuit member 16 face each other (hereinafter referred to as “opposite direction”). , a first region 18 containing a cured product of components such as component (A) and component (B) other than the conductive particles 4 of the photocurable composition described above, and a second circuit member in the opposite direction ( A second region 19 located on the 16) side and containing a cured product of the above-described thermosetting composition containing component (a), component (b), etc., and at least the first electrode 12 and the second electrode 15. ) and electrically conductive particles 4 interposed therebetween to electrically connect the first electrode 12 and the second electrode 15 to each other. The circuit connection portion does not need to have two regions such as the first region 18 and the second region 19, and may, for example, be comprised of a cured product of components other than the conductive particles 4 of the photocurable composition described above and the above-described It may contain a mixed cured product of a thermosetting composition.

FIG. 3 is a schematic cross-sectional view showing the manufacturing method of the circuit connection structure 10. As shown in FIG. 3, the method of manufacturing the circuit connection structure 10 includes, for example, a first circuit member 13 having a first electrode 12, and a second circuit having a second electrode 15. The adhesive film 1 described above is interposed between the members 16, and the first circuit member 13 and the second circuit member 16 are heat-compressed to form the first electrode 12 and the second electrode 15. ) is provided with a process for electrically connecting them to each other.

Specifically, as shown in FIG. 3(a), first, a first circuit board 11 and a first electrode 12 formed on the main surface 11a of the first circuit board 11 are provided. 1 Prepare a second circuit member 16 including a circuit member 13, a second circuit board 14, and a second electrode 15 formed on the main surface 14a of the second circuit board 14. .

Next, the first circuit member 13 and the second circuit member 16 are arranged so that the first electrode 12 and the second electrode 15 face each other, and the first circuit member 13 and the second circuit An adhesive film (1) is placed between the members (16). For example, as shown in FIG. 3(a), the adhesive film 1 is attached to the first circuit so that the first adhesive layer 2 side faces the mounting surface 11a of the first circuit member 13. Laminate on member 13. Next, a first circuit member on which the adhesive film 1 is laminated so that the first electrode 12 on the first circuit board 11 and the second electrode 15 on the second circuit board 14 face each other ( 13) Place the second circuit member 16 on it.

And, as shown in FIG. 3(b), the first circuit member 13, the adhesive film 1, and the second circuit member 16 are heated while the first circuit member 13 and the second circuit member 16 are heated. By pressing 16 in the thickness direction, the first circuit member 13 and the second circuit member 16 are thermally compressed to each other. At this time, as indicated by the arrow in Figure 3 (b), since the second adhesive layer 3 contains a flowable uncured thermosetting composition, the gap between the second electrodes 15 and 15 is formed. It flows to be embedded and hardens by the above-mentioned heating. As a result, the first electrode 12 and the second electrode 15 are electrically connected to each other through the conductive particles 4, and the first circuit member 13 and the second circuit member 16 are adhered to each other. , the circuit connection structure 10 shown in FIG. 2 is obtained. In the manufacturing method of the circuit connection structure 10 of this embodiment, since the first adhesive layer 2 is a pre-cured layer, the conductive particles 4 are fixed in the first adhesive layer 2, and 1 Since the adhesive layer 2 hardly flows at the time of the thermocompression, and the conductive particles are efficiently captured between the opposing electrodes, the connection resistance between the opposing electrodes 12 and 15 is reduced. Therefore, a circuit connection structure with excellent connection reliability is obtained.

<Adhesive film storage set>

Fig. 4 is a perspective view showing an adhesive film housing set according to one embodiment. As shown in FIG. 4, the adhesive film accommodation set 20 includes an adhesive film 1 for circuit connection, a reel 21 on which the adhesive film 1 is wound, and the adhesive film 1 and the reel 21. It is provided with a receiving member 22 that accommodates.

As shown in Fig. 4, the adhesive film 1 is, for example, in the form of a tape. The tape-like adhesive film 1 is produced, for example, by cutting a sheet-like fabric into long pieces with a width appropriate for the intended use. A base material may be provided on one side of the adhesive film 1. As a base material, a base material such as the above-mentioned PET film can be used.

The reel 21 includes a first side plate 24 having a winding core 23 around which the adhesive film 1 is wound, and a second side plate disposed to face the first side plate 24 with the winding core 23 sandwiched therebetween. (25) is provided.

The first side plate 24 is, for example, a disk made of plastic, and an opening having a circular cross-section is provided in the central portion of the first side plate 24.

The winding core 23 of the first side plate 24 is a portion that winds the adhesive film 1. The winding core 23 is made of plastic, for example, and has an annular shape with a thickness equal to the width of the adhesive film 1. The winding core 23 is fixed to the inner surface of the first side plate 24 so as to surround the opening of the first side plate 24 . Additionally, the central portion of the reel 21 is provided with an axial hole 26 into which the rotating shaft of a winding device or a feeding device (not shown) is inserted. When the rotating shaft of the winding device or the feeding device is inserted into the shaft hole 26 and the rotating shaft is driven, the reel 21 rotates without idling. A desiccant container containing a desiccant may be inserted into the shaft hole 26.

The second side plate 25 is the same as the first side plate 24, for example, a disk made of plastic, and the central portion of the second side plate 25 has the same diameter as the opening of the first side plate 24. An opening with a circular cross-section is provided.

The housing member 22 is, for example, shaped like a bag and accommodates the adhesive film 1 and the reel 21. The accommodating member 22 has an insertion hole 27 for accommodating (inserting) the adhesive film 1 and the reel 21 into the accommodating member 22 .

The housing member 22 has a visibility portion 28 that allows the inside of the housing member 22 to be visible from the outside. The housing member 22 shown in FIG. 4 is configured so that the entire housing member 22 becomes the visible portion 28.

The visible portion 28 has transparency to visible light. For example, when the light transmittance in the visible portion 28 is measured in the wavelength range of 450 to 750 nm, the average value of the light transmittance is 30% or more between the wavelengths of 450 and 750 nm, and the region with a wavelength width of 50 nm is 30% or more. At least one of these exists. The light transmittance of the visible portion 28 is obtained by producing a sample in which the visible portion 28 is cut to a predetermined size and measuring the light transmittance of the sample with an ultraviolet-visible spectrophotometer. Since the receiving member 22 has this visible portion 28, various information such as the product name, lot number, and expiration date attached to the inside of the receiving member 22, for example, the reel 21, can be displayed on the receiving member 22. ) can also be checked from outside. This can be expected to prevent mixing of other products and improve the efficiency of sorting work.

The transmittance of light with a wavelength of 365 nm in the visible portion 28 is 10% or less. Since the transmittance of light with a wavelength of 365 nm in the visible portion 28 is 10% or less, the light incident from the outside to the inside of the receiving member 22 and the photopolymerization initiator remaining in the first adhesive layer 2 cause It can inhibit curing of the thermosetting composition. As a result, the effect of reducing the connection resistance of the adhesive film 1 can be maintained, and when the adhesive film 1 is used to connect circuit members, the connection resistance between opposing electrodes can be reduced. From the viewpoint of further suppressing the generation of active species (e.g. radicals) from the photopolymerization initiator, the transmittance of light with a wavelength of 365 nm in the visible portion 28 is preferably 10% or less, more preferably 5% or less. , more preferably 1% or less, particularly preferably 0.1% or less.

From the same viewpoint, the maximum value of the light transmittance in the visible portion 28 in the wavelength range in which radicals, cations, or anions can be generated from the photopolymerization initiator (component (B)) described above is preferably 10% or less. , more preferably 5% or less, further preferably 1% or less, particularly preferably 0.1% or less. Specifically, the maximum value of light transmittance in the visible portion 28 at a wavelength of 254 to 405 nm is preferably 10% or less, more preferably 5% or less, further preferably 1% or less, and particularly preferably Typically, it is 0.1% or less.

The visible portion 28 (accommodating member 22) is formed of, for example, a sheet with a thickness of 10 to 5000 μm. The sheet is made of a material that has a transmittance of 10% or less for light with a wavelength of 365 nm in the visible portion 28. These materials may contain one type of component or may contain multiple types of components. Examples of the material include low-density polyethylene, linear low-density polyethylene, polycarbonate, polyester, acrylic resin, polyamide, and glass. These materials may contain an ultraviolet absorber. The visible portion 28 may have a laminated structure formed by laminating a plurality of layers with different light transmittances. In this case, each layer constituting the visible portion 28 may contain the materials described above.

The insertion port 27 may be sealed when accommodated, for example, by closing with a sealer or the like to prevent air from entering from the outside. In this case, it is desirable to suction and remove the air in the receiving member 22 before closing the insertion port 27. It can be expected that the moisture in the housing member 22 will decrease from the initial stage of housing, and the entry of air from the outside will be prevented. In addition, as the inner surface of the receiving member 22 and the reel 21 come into close contact, the inner surface of the receiving member 22 and the surface of the reel 21 rub against each other due to vibration during transportation, causing foreign matter to be generated, and the reel ( It is possible to prevent scratches on the outer surfaces of the side plates 24 and 25 of 21).

In the above embodiment, the housing member is configured so that the entire housing member has a visible portion. However, in another embodiment, the housing member may have a visible portion in a part of the housing member. For example, the accommodating member may have a rectangular visible portion at approximately the center of the side surface of the accommodating member. In this case, the parts other than the visible portion of the housing member may be colored black so as not to transmit ultraviolet light and visible light, for example.

Additionally, in the above embodiment, the shape of the housing member was bag-shaped, but the housing member may be, for example, box-shaped. It is preferable that the receiving member has a cut for opening. In this case, the opening operation during use becomes easy.

Example

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to the examples.

<Synthesis of polyurethane acrylate (UA1)>

Poly(1,6-hexanediol carbonate) (Product name: Duranol T5652, Asahi Kasei Chemicals Co., Ltd.) was placed in a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser with a calcium chloride drying tube, and a nitrogen gas introduction tube. 2,500 parts by mass (2.50 mol) of number average molecular weight 1000) and 666 parts by mass (3.00 mol) of isophorone diisocyanate (manufactured by Sigma-Aldrich) were uniformly added dropwise over 3 hours. Next, after sufficiently introducing nitrogen gas into the reaction vessel, the inside of the reaction vessel was heated to 70 to 75°C to cause reaction. Next, 0.53 parts by mass (4.3 mmol) of hydroquinone monomethyl ether (manufactured by Sigma-Aldrich) and 5.53 parts by mass (8.8 mmol) of dibutyltin dilaurate (manufactured by Sigma-Aldrich) were added to the reaction vessel, and then 2-hydride 238 parts by mass (2.05 mol) of oxyethyl acrylate (manufactured by Sigma-Aldrich) were added, and reaction was performed at 70°C for 6 hours in an air atmosphere. As a result, polyurethane acrylate (UA1) was obtained. The weight average molecular weight of polyurethane acrylate (UA1) was 15000. In addition, the weight average molecular weight was measured using a calibration curve using standard polystyrene from gel permeation chromatography (GPC) according to the following conditions.

(Measuring conditions)

Device: GPC-8020 manufactured by Tosoh Corporation

Detector: RI-8020 manufactured by Tosoh Corporation.

Column: Gelpack GLA160S+GLA150S made by Hitachi Kasei Co., Ltd.

Sample concentration: 120mg/3mL

Solvent: Tetrahydrofuran

Injection volume: 60μL

Pressure: 2.94×10 ⁶ Pa (30kgf/cm ² )

Flow rate: 1.00mL/min

<Production of conductive particles>

On the surface of the polystyrene particles, a layer containing nickel was formed so that the thickness of the layer was 0.2 μm. In this way, conductive particles with an average particle diameter of 4 μm, a maximum particle diameter of 4.5 μm, and a specific gravity of 2.5 were obtained.

<Preparation of varnish (varnish composition) of photocurable composition>

The components shown below were mixed in the amounts (mass parts) shown in Table 1 to prepare varnishes of photocurable compositions 1 to 18. In addition, the content (volume %) of the conductive particles and the content (volume %) of the filler shown in Table 1 are contents based on the total volume of the photocurable composition.

(polymerizable compound)

A1: Dicyclopentadiene type diacrylate (Product name: DCP-A, manufactured by Toagose Co., Ltd.)

A2: Polyurethane acrylate (UA1) synthesized as described above.

A3: 2-methacryloyloxyethyl acid phosphate (Product name: Light Ester P-2M, manufactured by Kyoesha Chemical Co., Ltd.)

(Photopolymerization initiator)

B1: 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(O-benzoyloxime)] (brand name: Irgacure (registered trademark) OXE01, manufactured by BASF)

B2: Ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(o-acetyloxime) (trade name: Irgacure (registered trademark) OXE02, (made by BASF)

B3: 2-Benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (trade name: Irgacure (registered trademark) 369, manufactured by BASF)

B4: 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one (trade name: Irgacure (registered trademark) 907, manufactured by BASF)

B5: Bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (brand name: Irgacure (registered trademark) 279, manufactured by BASF)

B6: 1-Hydroxy-cyclohexyl-phenyl-ketone (trade name: Irgacure (registered trademark) 184, manufactured by BASF)

B7: 2-Hydroxy-2-methyl-1-phenyl-propan-1-one (trade name: Irgacure (registered trademark) 1173, manufactured by BASF)

B8: 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one (trade name: Irgacure (registered trademark) 2959, manufactured by BASF)

B9: 2-Hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methyl-propane (trade name: Irgacure (registered trademark) 127, (made by BASF)

(conductive particle)

C1: Conductive particles prepared as described above

(thermoplastic resin)

F1: Bisphenol A type phenoxy resin (Product name: PKHC, manufactured by Union Carbide)

(Coupling agent)

G1: 3-methacryloxypropyltrimethoxysilane (Product name: KBM503, manufactured by Shin-Etsu Chemical Co., Ltd.)

(filling)

H1: Silica fine particles (brand name: R104, manufactured by Nippon Aerosil Co., Ltd., average particle size (primary particle size): 12 nm)

(solvent)

I1: Methyl ethyl ketone

<Preparation of varnish (varnish composition) of thermosetting composition>

Polymerizable compounds a1 to a3, thermoplastic resin f1, coupling agent g1, filler h1 and solvent i1, which are the same as polymerizable compounds A1 to A3, thermoplastic resin F1, coupling agent G1, filler H1 and solvent I1 in the photocurable composition. The varnish of thermosetting composition 1 was prepared by mixing these components and the thermal polymerization initiator shown below in the amount (mass parts) shown in Table 2. In addition, the content (volume %) of the filler shown in Table 2 is the content based on the total volume of the thermosetting composition.

(Thermal polymerization initiator)

b1:: Benzoyl peroxide (Product name: Naifer BMT-K40, manufactured by Nichiyu Corporation)

(Example 1)

[Production of the first adhesive film]

The varnish of photocurable composition 1 was applied using a coating device on a PET film with a thickness of 50 μm. Next, hot air drying was performed at 70°C for 3 minutes to form a layer containing photocurable composition 1 with a thickness (thickness after drying) of 2 μm on the PET film. Next, the layer containing the photocurable composition 1 was irradiated with light using a metal halide lamp at an integrated light amount of 3000 mJ/cm ² to polymerize the polymerizable compound. In this way, the photocurable composition 1 was cured to form a first adhesive layer. Through the above operation, a first adhesive film including a first adhesive layer with a thickness of 2 μm was obtained on a PET film. The conductive particle density at this time was about 7000pcs/mm ² . In addition, the thickness of the first adhesive layer was measured using a laser microscope OLS4100 manufactured by Olympus Corporation.

[Production of the second adhesive film]

The varnish of thermosetting composition 1 was applied onto a PET film with a thickness of 50 μm using a coating device. Next, hot air drying was performed at 70°C for 3 minutes to form a second adhesive layer (layer containing thermosetting composition 1) with a thickness of 10 μm on the PET film. Through the above operation, a second adhesive film provided with a second adhesive layer on a PET film was obtained.

[Production of adhesive film for circuit connection]

The first adhesive film and the second adhesive film were laminated together with the PET film as the substrate using a roll laminator while heating at 40°C. In this way, an adhesive film for circuit connection with a two-layer structure in which the first adhesive layer and the second adhesive layer were laminated was produced.

[Production of circuit connection structure]

A thin film electrode-equipped glass comprising a COF (manufactured by FLEXSEED) with a pitch of 25 μm and a thin film electrode (height: 1200 Å) containing amorphous indium tin oxide (ITO) on a glass substrate through the produced adhesive film for circuit connection. The substrate (manufactured by Geomatech) was heated and pressed using a heat compression device (heating method: constant heat type, manufactured by Taiyo Kikai Seisakusho Co., Ltd.) at 170°C and 6 MPa for 4 seconds to spread over a width of 1 mm. They were connected, and a circuit connection structure (connection structure) was produced. In addition, at the time of connection, the adhesive film for circuit connection was placed on the glass substrate so that the surface on the side of the first adhesive layer in the adhesive film for circuit connection faced the glass substrate.

[Evaluation of circuit connection structure]

With respect to the obtained circuit connection structure, the connection resistance value between opposing electrodes immediately after connection and after the high-temperature, high-humidity test was measured with a multimeter. The high temperature and high humidity test was conducted by leaving the circuit connection structure in a constant temperature and humidity chamber at 85°C and 85%RH for 200 hours. The connection resistance value was determined as the average value of 16 resistance points between opposing electrodes. The results are shown in Table 3.

(Examples 2 to 10 and Comparative Examples 1 to 8)

An adhesive film for circuit connection and a circuit connection structure were produced in the same manner as in Example 1, except that photocurable compositions 2 to 18 were used as the photocurable composition, and evaluation of the circuit connection structure was performed in the same manner as in Example 1. was carried out. The results are shown in Tables 3 to 5.

In Examples 1 to 10 using a photopolymerization initiator having a structure represented by Formula (I), Formula (II), or Formula (III), the connection resistance value can be reduced compared to Comparative Examples 1 to 8, and the circuit It was confirmed that the connection reliability of the connection structure was excellent.

One… Adhesive film for circuit connection, 2… First adhesive layer, 3... Second adhesive layer, 4... Conductive particle, 10… Circuit connection structure, 12... Circuit electrode (first electrode), 13... First circuit member, 15... Bump electrode (second electrode), 16... Second circuit member, 20... Adhesive film receiving set, 22… Absence of acceptance, 28… Poet department.

Claims (14)

Provided with a first adhesive layer and a second adhesive layer laminated on the first adhesive layer,
The first adhesive layer includes a cured product of a photocurable composition,
The second adhesive layer includes a thermosetting composition,
The photocurable composition contains a polymerizable compound, conductive particles, and a photopolymerization initiator,
The polymerizable compound includes a radically polymerizable compound having a radical polymerizable group,
The photopolymerization initiator is 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(o-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl) )-9H-carbazol-3-yl]-, 1-(o-acetyloxime) and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one Contains at least one species selected from the group,
Here, the first adhesive layer is pre-cured,
The adhesive film for circuit connection wherein the thickness of the first adhesive layer is 0.2 to 0.8 times the average particle diameter of the conductive particles. The method of claim 1, wherein the photopolymerization initiator is 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(o-benzoyloxime)], and 2-methyl-1-[4-( An adhesive film for circuit connection, comprising at least one selected from the group consisting of methylthio)phenyl]-2-morpholinopropan-1-one. The adhesive film for circuit connection according to claim 1 or 2, wherein the content of the photopolymerization initiator is 2 to 3% by mass based on the total mass of the photocurable composition. The adhesive film for circuit connection according to claim 1 or 2, wherein the thermosetting composition contains a radically polymerizable compound having a radically polymerizable group. delete A preparation process for preparing a first adhesive layer,
A laminating process of laminating a second adhesive layer containing a thermosetting composition on the first adhesive layer,
The preparation step includes a step of curing the photocurable composition by irradiating light to the layer containing the photocurable composition to obtain the first adhesive layer,
The photocurable composition is a method for producing an adhesive film for circuit connection containing a polymerizable compound, conductive particles, and a photopolymerization initiator,
The polymerizable compound includes a radically polymerizable compound having a radical polymerizable group,
The photopolymerization initiator is 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(o-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl) )-9H-carbazol-3-yl]-, 1-(o-acetyloxime) and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one Contains at least one species selected from the group,
A method of manufacturing an adhesive film for circuit connection, wherein the thickness of the first adhesive layer is 0.2 to 0.8 times the average particle diameter of the conductive particles. The method of claim 6, wherein the photopolymerization initiator is 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(o-benzoyloxime)], and 2-methyl-1-[4-( A method for producing an adhesive film for circuit connection, comprising at least one selected from the group consisting of methylthio)phenyl]-2-morpholinopropan-1-one. The method for producing an adhesive film for circuit connection according to claim 6 or 7, wherein the content of the photopolymerization initiator is 2 to 3% by mass based on the total mass of the photocurable composition. The method for producing an adhesive film for circuit connection according to claim 6 or 7, wherein the thermosetting composition contains a radically polymerizable compound having a radically polymerizable group. delete The adhesive film for circuit connection according to claim 1 or 2 is interposed between a first circuit member having a first electrode and a second circuit member having a second electrode, and the first circuit member and the second circuit member are interposed between the first circuit member and the second circuit member. A method of manufacturing a circuit connection structure comprising the step of thermocompressing a circuit member to electrically connect the first electrode and the second electrode to each other. Equipped with the adhesive film for circuit connection according to claim 1 or 2, and a receiving member for accommodating the adhesive film,
The accommodating member has a visibility portion that allows the interior of the accommodating member to be viewed from the outside,
An adhesive film housing set in which the transmittance of light with a wavelength of 365 nm in the visible portion is 10% or less. delete delete

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