KR20210141954A - Adhesive film for circuit connection, manufacturing method thereof, manufacturing method of circuit connection structure, and adhesive film accommodation set - Google Patents

Abstract

A first adhesive layer (2) and a second adhesive layer (3) laminated on the first adhesive layer (2), the first adhesive layer (2) is made of a cured product of the photocurable composition, The 2nd adhesive bond layer 3 consists of a thermosetting composition, The photocurable composition contains a polymeric compound, the photoinitiator which has an oxime ester structure, and the electrically-conductive particle 4, Content of a photoinitiator is photocurable. The adhesive film (1) for circuit connection which is 0.3-1.2 mass % on the basis of the total amount of components other than the electrically-conductive particle in a composition.

Description

Adhesive film for circuit connection, manufacturing method thereof, manufacturing method of circuit connection structure, and adhesive film accommodation set

The present invention relates to an adhesive film for circuit connection, a manufacturing method thereof, a manufacturing method of a circuit connection structure, and an adhesive film accommodation set.

Conventionally, various adhesive materials have been used for circuit connection. For example, as an adhesive material for connection of a liquid crystal display and a tape carrier package (TCP), a connection between a flexible printed wiring board (FPC) and TCP, or a connection between an FPC and a printed wiring board, anisotropic conductive particles in which conductive particles are dispersed in an adhesive The adhesive film for circuit connection which has is used.

In the field of precision electronic equipment in which an adhesive film for circuit connection having anisotropic conductivity is used, circuit densification is progressing, and electrode width and electrode spacing are extremely narrow. For this reason, it is not necessarily easy to trap an electrically-conductive particle efficiently on a microelectrode, and to obtain high connection reliability.

On the other hand, in patent document 1, for example, the method of making an electrically-conductive particle unevenly distributed on one side of an anisotropically conductive adhesive sheet, and making an electrically-conductive particle space apart is proposed.

Patent Document 1: International Publication No. 2005/54388

However, in the method of patent document 1, since electroconductive particle flows at the time of circuit connection, electroconductive particle aggregates between electrodes, and a short circuit may arise. Moreover, distribution of the density|dense of the electrically-conductive particle according to the flow of an electrically-conductive particle may produce not only the fall of an insulating characteristic but also the nonuniformity of a connection resistance value, and there exists still room for improvement.

In addition, the adhesive film for circuit connection is required not to peel from the circuit member after the circuit member is connected, even when the circuit connection structure is used for a long time in a high temperature and high humidity environment (for example, 85°C, 85%RH) .

Therefore, this invention suppresses the flow of the electrically-conductive particle which generate|occur|produces at the time of manufacture of a circuit connection structure, The circuit connection part formed by the circuit member and adhesive film which generate|occur|produces when a circuit connection structure is used in a high-temperature, high-humidity environment. An adhesive film for circuit connection capable of suppressing peeling at an interface, a manufacturing method thereof, a manufacturing method of a circuit connection structure using the adhesive film, and an adhesive film accommodation set comprising the adhesive film do.

The adhesive film for circuit connection of one aspect of the present invention includes a first adhesive layer and a second adhesive layer laminated on the first adhesive layer, wherein the first adhesive layer is made of a cured product of a photocurable composition, , the second adhesive layer is made of a thermosetting composition, the photocurable composition contains a polymerizable compound, a photoinitiator having an oxime ester structure, and conductive particles, and the content of the photoinitiator is other than the conductive particles in the photocurable composition. It is 0.3-1.2 mass % on the basis of the total amount of the component of.

According to the adhesive film for circuit connection of the above aspect, while suppressing the flow of conductive particles generated during manufacture of the circuit connection structure, the circuit connection structure is used in a high-temperature, high-humidity environment at the interface between the circuit member and the adhesive film, peeling can be suppressed. According to such an adhesive film for circuit connection, the connection resistance between opposing electrodes of a circuit connection structure can be reduced, and also maintain low connection resistance even in a high-temperature, high-humidity environment (for example, 85 degreeC, 85%RH). can That is, according to this adhesive film for circuit connection, the connection reliability of a circuit connection structure can be improved.

A method for producing an adhesive film for circuit connection of one aspect of the present invention includes a preparation step of preparing a first adhesive layer, and a lamination step of laminating a second adhesive layer made of a thermosetting composition on the first adhesive layer, The preparatory step includes a step of curing the photocurable composition by irradiating light to a layer made of the photocurable composition to obtain a first adhesive layer, wherein the photocurable composition is a photopolymerizable compound and a photopolymerization having an oxime ester structure An initiator and an electrically-conductive particle are contained, and content of a photoinitiator is 0.3-1.2 mass % on the basis of the total amount of components other than the electrically-conductive particle in a photocurable composition. According to this method, while suppressing the flow of conductive particles generated during manufacture of the circuit connection structure, peeling at the interface between the circuit member and the adhesive film that occurs when the circuit connection structure is used in a high temperature and high humidity environment can be suppressed. An adhesive film for circuit connection can be obtained.

A radically polymerizable compound which has a radically polymerizable group may be sufficient as a polymeric compound.

The thermosetting composition may contain the radically polymerizable compound which has a radically polymerizable group.

The compound which has a structure represented by following formula (VI) may be sufficient as the photoinitiator which has an oxime ester structure.

[Formula 1]

[In formula (VI), R ¹¹ , R ¹² and R ¹³ each independently represent an organic group containing a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an aromatic hydrocarbon group.]

The thickness of a 1st adhesive bond layer may be 0.1-0.8 times of the average particle diameter of an electrically-conductive particle.

In the manufacturing method of the circuit connection structure of one aspect of this invention, the adhesive film for circuit connection mentioned above is interposed between the 1st circuit member which has a 1st electrode, and the 2nd circuit member which has a 2nd electrode, and thermocompression bonding the first circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other.

An adhesive film accommodating set of one aspect of the present invention includes the above-described adhesive film for circuit connection and a accommodating member for accommodating the adhesive film, wherein the accommodating member allows the inside of the accommodating member to be visually recognized from the outside. It has the visual recognition part which is said, and the transmittance|permeability of the light of wavelength 365nm in the visual recognition part is 10 % or less.

However, in general, the environment in which the adhesive film for circuit connection is used is a room in which the temperature, humidity, and cleanliness of the room, called a clean room, are managed at a certain level, and when shipped from the production site, it is directly exposed to outside air. The adhesive film for circuit connection is accommodated in an accommodation member such as a packing bag so as not to be exposed and cause deterioration in quality due to dust and moisture. Usually, this accommodating member is provided with a visual recognition part formed of a transparent material so that various information, such as a product name, a lot number, and an expiration date, affixed to the adhesive film inside can be confirmed from the outside of the accommodating member.

However, when the adhesive film for circuit connection described above is accommodated in a conventional accommodating member and used after storage or transport, the above-described effect of the adhesive film may not be obtained in some cases. As a result of further investigation by the present inventors based on such examination results, when a compound capable of reacting with the photoinitiator in the photocurable composition is used as the polymerizable compound in the thermosetting composition, during storage and transportation of the adhesive film It became clear that the thermosetting composition hardened|cured and the reduction effect of connection resistance decreased. Therefore, the present inventors further investigated based on the assumption that polymerization of the polymerizable compound in the thermosetting composition is progressing by radicals derived from the photopolymerization initiator remaining in the first adhesive layer. By setting it as an adhesive film accommodation set, hardening of the thermosetting composition at the time of storage or conveyance could be suppressed, and it discovered that the reduction effect of the connection resistance of an adhesive bond film could be maintained.

That is, according to the adhesive film accommodation set of one aspect of the present invention, in the case of using a compound capable of reacting with the photopolymerization initiator in the photocurable composition as the polymerizable compound in the thermosetting composition, when storing or transporting the adhesive film hardening of the said thermosetting composition of can be suppressed, and the reduction effect of the connection resistance of an adhesive agent film can be maintained.

According to the present invention, while suppressing the flow of conductive particles generated during manufacture of the circuit connection structure, peeling at the interface between the circuit member and the adhesive film, which occurs when the circuit connection structure is used in a high temperature, high humidity environment, can be suppressed. It is possible to provide an adhesive film for circuit connection and a method for manufacturing the same. Moreover, according to this invention, the manufacturing method of the circuit connection structure using such an adhesive film can be provided. Moreover, according to this invention, the adhesive film accommodation set provided with such an adhesive film can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows the adhesive film for circuit connection of one Embodiment of this invention.
It is a schematic cross section which shows the circuit connection structure of one Embodiment of this invention.
3 : is a schematic sectional drawing which shows the manufacturing process of the circuit connection structure of one Embodiment of this invention.
Fig. 4 is a perspective view showing an adhesive film accommodating set according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as necessary. In addition, in this specification, the numerical range indicated using "-" shows the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In addition, the upper limit and the lower limit described individually can be combined arbitrarily. In addition, in this specification, "(meth)acrylate" means at least one of an acrylate and the methacrylate corresponding thereto. The same applies to other similar expressions such as "(meth)acryloyl". In addition, "(poly)" means both the case where the prefix "poly" exists and the case where it does not.

<Adhesive film for circuit connection>

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows the adhesive film for circuit connection of one Embodiment. As shown in FIG. 1 , the adhesive film 1 for circuit connection (hereinafter also simply referred to as "adhesive film 1") is on the 1st adhesive bond layer 2 and the 1st adhesive bond layer 2 A laminated second adhesive layer (3) is provided.

(1st adhesive layer)

The 1st adhesive bond layer 2 consists of hardened|cured material (photocured material) of a photocurable composition. The photocurable composition includes (A) a polymerizable compound (hereinafter also referred to as “component (A)”), (B) a photopolymerization initiator having an oxime ester structure (hereinafter also referred to as “component (B)”), and (C) It contains the electrically-conductive particle 4 (henceforth "(C) component".) is contained. Even if the photocurable composition further contains (D) thermosetting resin (henceforth "(D) component") and/or (E) thermal polymerization initiator (henceforth also referred to as "(E) component".) do. That is, a photocurable composition may be sufficient as a photocurable composition.

The 1st adhesive bond layer 2 is obtained by polymerizing the (A) component by irradiating light energy with respect to the layer which consists of a photocurable composition, for example, and hardening the photocurable composition. That is, the 1st adhesive bond layer 2 consists of the electrically-conductive particle 4 and the adhesive agent component 5 formed by photocuring a photocurable composition. The adhesive component (5) contains the polymer of (A) component at least. The adhesive component (5) may contain unreacted (A) component and (B) component, and does not need to contain it.

[(A) component: polymerizable compound]

(A) A component is a compound which superposes|polymerizes with the radical, cation, or anion which the photoinitiator generate|occur|produced by irradiation of light (for example, ultraviolet light), for example. (A) Any of a monomer, an oligomer, or a polymer may be sufficient as a component. (A) As a component, 1 type of compound may be used independently and you may use combining multiple types of compounds.

(A) Component has at least 1 polymerizable group. It is preferable that it is a radically polymerizable group which a polymeric group reacts with a radical from a viewpoint that the reduction effect of connection resistance further improves and connection reliability is more excellent. That is, it is preferable that (A) component is a radically polymerizable compound. As a radically polymerizable group, a vinyl group, an allyl group, a styryl group, an alkenyl group, an alkenylene group, a (meth)acryloyl group, a maleimide group etc. are mentioned, for example. (A) The number of polymerizable groups in the component may be 2 or more from the viewpoint of easily obtaining the physical properties and crosslinking density required for reducing the connection resistance after polymerization, and from the viewpoint of suppressing curing shrinkage during polymerization, 10 It may be as follows. 2-10 may be sufficient as the number of the polymeric groups which (A) component has from these viewpoints. Suppression of cure shrinkage during polymerization is preferable from the viewpoint of obtaining a uniform and stable film (first adhesive layer) after light irradiation. In this embodiment, in order to balance crosslinking density and cure shrinkage, after using the polymeric compound whose number of polymeric groups is in the said range, you may further use the polymeric compound whose number of polymeric groups is outside the said range.

Specific examples of the component (A) include (meth)acrylate compounds, maleimide compounds, vinyl ether compounds, allyl compounds, styrene derivatives, acrylamide derivatives, nadimide derivatives, natural rubber, isoprene rubber, butyl and rubber, nitrile rubber, butadiene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, and carboxylated nitrile rubber.

As (meth)acrylate compound, Epoxy (meth)acrylate, (poly)urethane (meth)acrylate, methyl (meth)acrylate, polyether (meth)acrylate, polyester (meth)acrylate , polybutadiene (meth) acrylate, silicone acrylate, ethyl (meth) acrylate, 2-cyanoethyl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-hexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, isopropyl (meth) acrylate, hydride Roxypropyl (meth) acrylate, isobutyl (meth) acrylate, isobornyl (meth) acrylate, isodecyl (meth) acrylate, isooctyl (meth) acrylate, n-lauryl (meth) acrylic Rate, 2-methoxyethyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2- (meth) acryloyloxyethyl phosphate, N,N- Dimethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylol propane tri (meth) Acrylate, tetramethylolmethane tetra (meth) acrylate, polyethylene glycol di (meth) acrylate, polyalkylene glycol di (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol (meth) acrylate, dipentaerythritol hexa (meth) acrylate, Isocyanuric acid-modified bifunctional (meth)acrylate, isocyanuric acid-modified trifunctional (meth)acrylate, tricyclodecanyl acrylate, dimethylol-tricyclodecane diacrylate, 2-hydr Roxy-1,3-diacryloxypropane, 2,2-bis[4-(acryloxymethoxy)phenyl]propane, 2,2-bis[4-(acryloxypolyethoxy)phenyl]propane , 2,2-di (meth) acryloyloxy diethyl phosphate, 2- (meth) a Acryloyloxyethyl acid phosphate etc. are mentioned.

Examples of the maleimide compound include 1-methyl-2,4-bismaleimidebenzene, N,N'-m-phenylenebismaleimide, N,N'-p-phenylenebismaleimide, and N,N'-m -Toluylenebismaleimide, N,N'-4,4-biphenylenebismaleimide, N,N'-4,4-(3,3'-dimethyl-biphenylene)bismaleimide, N ,N'-4,4-(3,3'-dimethyldiphenylmethane)bismaleimide, N,N'-4,4-(3,3'-diethyldiphenylmethane)bismaleimide , N,N'-4,4-diphenylmethanebismaleimide, N,N'-4,4-diphenylpropanebismaleimide, N,N'-4,4-diphenyletherbismaleimide Mead, N,N'-3,3-diphenylsulfonebismaleimide, 2,2-bis(4-(4-maleimidephenoxy)phenyl)propane, 2,2-bis(3-s-butyl -4-8(4-maleimidephenoxy)phenyl)propane, 1,1-bis(4-(4-maleimidephenoxy)phenyl)decane, 4,4'-cyclohexylidenebis(1 -(4-maleimidephenoxy)-2-cyclohexyl)benzene, 2,2'-bis(4-(4-maleimidephenoxy)phenyl)hexafluoropropane, etc. are mentioned.

Examples of the vinyl ether compound include diethylene glycol divinyl ether, dipropylene glycol divinyl ether, cyclohexane dimethanol divinyl ether, and trimethylol propane trivinyl ether. .

As an allyl compound, 1, 3- diallyl phthalate, 1,2- diallyl phthalate, triallyl isocyanurate, etc. are mentioned.

It is preferable that (A) component is a (meth)acrylate compound from a viewpoint which is excellent in the balance of a hardening reaction rate and the physical property after hardening. The component (A) may be a (poly)urethane (meth)acrylate compound from the viewpoint of achieving both the cohesive force for reducing connection resistance and the elongation for improving the adhesive force, thereby obtaining more excellent adhesive properties. Moreover, the (meth)acrylate compound which has high Tg frame|skeleton, such as a dicyclopentadiene frame|skeleton, may be sufficient as (A) component from a viewpoint of improving cohesion force and reducing connection resistance more.

(A) component takes the balance of crosslinking density and cure shrinkage, reduces connection resistance more, and from a viewpoint of improving connection reliability, the terminal of thermoplastic resins, such as an acrylic resin, a phenoxy resin, a polyurethane resin, or The compound (for example, polyurethane (meth)acrylate) which introduce|transduced polymeric groups, such as a vinyl group, an allyl group, and a (meth)acryloyl group, may be sufficient as a side chain. In this case, the weight average molecular weight of (A) component may be 3000 or more, 5000 or more, and 10,000 or more may be sufficient as it from a viewpoint of being excellent in the balance of a crosslinking density and cure shrinkage. Moreover, from a viewpoint of being excellent in compatibility with another component, the weight average molecular weight of (A) component may be 1 million or less, 500,000 or less may be sufficient, and 250,000 or less may be sufficient as it. From these viewpoints, 30-1 million may be sufficient as the weight average molecular weight of (A) component, 50-500,000 may be sufficient, and 10,000-250,000 may be sufficient as it. In addition, a weight average molecular weight means the value measured using the calibration curve by standard polystyrene from a gel permeation chromatograph (GPC) according to the conditions described in an Example.

It is preferable that (A) component contains the radically polymerizable compound which has a phosphate ester structure represented by following formula (1) as a (meth)acrylate compound. In this case, since the adhesive strength with respect to the surface of an inorganic substance (metal etc.) improves, it is suitable for adhesion|attachment of electrodes (for example, circuit electrodes).

[Formula 2]

In Formula (1), n represents the integer of 1-3, and R represents a hydrogen atom or a methyl group.

The radically polymerizable compound which has the said phosphoric acid ester structure is obtained by making phosphoric anhydride and 2-hydroxyethyl (meth)acrylate react, for example. Mono(2-(meth)acryloyloxyethyl)acid phosphate, di(2-(meth)acryloyloxyethyl)acid phosphate etc. are mentioned as a specific example of the radically polymerizable compound which has a phosphate ester structure.

(A) Content of component reduces connection resistance and, in order to improve connection reliability, from a viewpoint of being easy to obtain the crosslinking density required on the basis of the total amount of components other than the electrically-conductive particle in a photocurable composition, 5 mass % or more may be sufficient, 10 mass % or more may be sufficient, and 20 mass % or more may be sufficient. (A) Content of component may be 90 mass % or less, 80 mass % or less, based on the total amount of components other than the electrically-conductive particle in a photocurable composition from a viewpoint of suppressing cure shrinkage at the time of polymerization, 70 mass % or less, The mass % or less may be sufficient. From these viewpoints, content of (A) component may be 5-90 mass % on the basis of the total amount of components other than the electrically-conductive particle in a photocurable composition, 10-80 mass % may be sufficient, and 20-70 mass % may be

[(B) component: photoinitiator]

A photocurable composition contains the photoinitiator which has an oxime ester structure as (B) component.

A photoinitiator may have two or more photoinitiators which have an oxime ester structure. (B) As a component, 1 type of compound may be used independently and may be used combining multiple types of compounds.

As a compound which has an oxime ester structure, the compound which has a structure represented by following formula (VI) is used preferably.

[Formula 3]

In formula (VI), R ¹¹ , R ¹² and R ¹³ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an organic group containing an aromatic hydrocarbon group.

Specific examples of the compound having an oxime ester structure include 1-phenyl-1,2-butanedione-2-(o-methoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2- (o-methoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2-(o-ethoxycarbonyl)oxime, 1-phenyl-1,2-propanedione-2- o-benzoyloxime, 1,3-diphenylpropanetrione-2-(o-ethoxycarbonyl)oxime, 1-phenyl-3-ethoxypropanetrione-2-(o-benzoyl)oxime, 1, 2-Octanedione, 1-[4-(phenylthio)phenyl-, 2-(o-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H -carbazol-3-yl]-, 1-(o-acetyloxime), etc. are mentioned.

Content of the photoinitiator which has an oxime ester structure is 0.3 mass % or more based on the total amount of components other than the electrically conductive particle in a photocurable composition from a viewpoint of further improving the flow inhibitory effect of an electrically-conductive particle, Preferably it is 0.45 It is mass % or more, More preferably, it is 0.55 mass % or more, More preferably, it is 0.85 mass % or more. Content of the photoinitiator which has an oxime ester structure is 1.2 mass % or less based on the total amount of components other than the electrically-conductive particle in a photocurable composition from a viewpoint of further improving the inhibitory effect of peeling, Preferably it is 0.9 mass %. It is below, More preferably, it is 0.6 mass % or less. From these viewpoints, the content of the photoinitiator having an oxime ester structure is 0.3 to 1.2 mass%, preferably 0.45 to 0.9 mass%, based on the total amount of components other than the conductive particles in the photocurable composition, more Preferably it is 0.45-0.6 mass %.

The photocurable composition is, in addition to the photoinitiator having an oxime ester structure, α-aminoalkylphenone structure, aminobenzophenone structure, N-phenylglycine structure, acylphosphine oxide structure, benzyldimethyl ketal structure, α-hydroxyalkyl You may further contain the photoinitiator which has structures, such as a phenone structure.

The total content of the photoinitiator is 0.3% by mass or more, preferably 0.45% by mass or more, based on the total amount of components other than the conductive particles in the photocurable composition from the viewpoint of further improving the effect of inhibiting the flow of conductive particles. and more preferably 0.55 mass % or more, and still more preferably 0.85 mass % or more. (B) The content of the component is preferably 1.2% by mass or less, more preferably 0.9% by mass, based on the total amount of components other than the conductive particles in the photocurable composition from the viewpoint of further improving the effect of suppressing peeling. % or less, more preferably 0.6 mass % or less. From these viewpoints, the content of component (B) is preferably 0.3 to 1.2 mass%, more preferably 0.45 to 0.9 mass%, based on the total amount of components other than the conductive particles in the photocurable composition, More preferably, it is 0.45-0.6 mass %.

[(C) component: conductive particles]

(C) A component will not restrict|limit especially if it is particle|grains which have electroconductivity, The metal particle comprised from metals, such as Au, Ag, Ni, Cu, and solder, conductive carbon particle comprised from conductive carbon, etc. may be sufficient. The component (C) may be coated conductive particles having a core made of non-conductive glass, ceramic, plastic (such as polystyrene) and the like, and a coating layer containing the metal or conductive carbon and covering the core. Among these, the metal particle|grains formed from the metal of heat-melting property, or the coating|coated electrically-conductive particle provided with the coating layer which coat|covers the core containing the core containing a plastics, and a metal or conductive carbon is used preferably. In this case, since it is easy to deform the cured product of the photocurable composition by heating or pressurization, when the electrodes are electrically connected, the contact area between the electrodes and the component (C) is increased to further improve the conductivity between the electrodes. can

The component (C) may be insulating coating conductive particles provided with an insulating layer covering the surface of the particles, including the metal particles, conductive carbon particles or coated conductive particles, and an insulating material such as resin. If the component (C) is an insulating coated conductive particle, even when the content of the component (C) is high, since the surface of the particle is coated with a resin, the occurrence of a short circuit due to the contact between the components (C) can be suppressed. , it is also possible to improve the insulation between adjacent electrode circuits. (C) A component is used individually by 1 type of the various electrically-conductive particle mentioned above, or in combination of 2 or more type.

(C) The maximum particle diameter of the component needs to be smaller than the minimum distance between electrodes (shortest distance between adjacent electrodes). (C) From a viewpoint of being excellent in dispersibility and electroconductivity, 1.0 micrometer or more may be sufficient, 2.0 micrometers or more may be sufficient as the largest particle diameter of component, and 2.5 micrometers or more may be sufficient as it. (C) The maximum particle size of component may be 50 micrometers or less, 30 micrometers or less may be sufficient from a viewpoint of being excellent in dispersibility and electroconductivity, and 20 micrometers or less may be sufficient as it. From these viewpoints, the maximum particle diameter of (C)component may be 1.0-50 micrometers, 2.0-30 micrometers may be sufficient, and 2.5-20 micrometers may be sufficient as it. In this specification, about 300 arbitrary electrically-conductive particles (pcs), the particle diameter is measured by observation using a scanning electron microscope (SEM), and let the largest value obtained be the largest particle diameter of (C)component. In addition, when (C) component is not spherical, such as having a processus|protrusion, let the particle diameter of (C) component be the diameter of the circle circumscribed to the electrically-conductive particle in the image of SEM.

(C) From a viewpoint of being excellent in dispersibility and electroconductivity, the average particle diameter of (C) component may be 1.0 micrometer or more, 2.0 micrometers or more may be sufficient, and 2.5 micrometers or more may be sufficient as it. (C) From a viewpoint of being excellent in dispersibility and electroconductivity, the average particle diameter of (C) component may be 50 micrometers or less, 30 micrometers or less may be sufficient, and 20 micrometers or less may be sufficient as it. From these viewpoints, the average particle diameter of (C)component may be 1.0-50 micrometers, 2.0-30 micrometers may be sufficient, and 2.5-20 micrometers may be sufficient as it. In this specification, about 300 arbitrary electrically-conductive particles (pcs), the particle diameter is measured by observation using a scanning electron microscope (SEM), and let the average value of the obtained particle diameter be an average particle diameter.

In the 1st adhesive bond layer 2, it is preferable that (C)component is disperse|distributed uniformly. A first particle density of the (C) component in the adhesive layer 2 may be either in an easy point of view becomes a stable connection resistance is obtained, 100pcs / mm ² or more, 1000pcs / mm ² or more, and may be, 2000pcs / mm ² or more may be The particle density of the component (C) in the first adhesive layer 2 is, from the viewpoint of improving the insulating property between the electrodes neighboring, and even 100000pcs / mm ² or less, and even 50000pcs / mm ² or less, 10000pcs / mm ² It may be as follows. In their view, the first particle density of the (C) component in the adhesive layer 2, 100 to be 100000pcs / mm ² even, 1000 to be even 50000pcs / mm ^2, or may be 2000 ~ 10000pcs / mm ² .

(C) Content of component may be 0.1 volume% or more, 1 volume% or more, and 5 volume% or more may be sufficient on the basis of the total volume in a 1st adhesive bond layer from a viewpoint which can improve electroconductivity more. (C) Content of component may be 50 volume% or less, 30 volume% or less, and 20 volume% or less on the basis of the total volume in a 1st adhesive bond layer from a viewpoint of being easy to suppress a short circuit. From these viewpoints, content of (C)component may be 0.1-50 volume%, 1-30 volume% may be sufficient as the total volume reference in a 1st adhesive bond layer, and 5-20 volume% may be sufficient as it. In addition, content of (C)component based on the total volume of a photocurable composition may be the same as the said range.

[(D) component: thermosetting resin]

(D) Component is resin hardened|cured by heat, and has at least 1 thermosetting group. (D) A component is a compound bridge|crosslinked by reacting with a hardening|curing agent by heat, for example. (D) As a component, 1 type of compound may be used independently and you may use combining multiple types of compounds.

An epoxy group, an oxetane group, etc. may be sufficient as a thermosetting group from a viewpoint which the reduction effect of connection resistance further improves and is more excellent in connection reliability, for example.

(D) As a specific example of component, epichlorohydrin and bisphenol type epoxy resin which are reaction products, such as bisphenol A, F, AD, epichlorohydrin, and epoxy no, which is a reaction product such as phenol novolac, cresol novolac, etc. Epoxy resins such as various epoxy compounds having two or more glycidyl groups in one molecule, such as rock resin, naphthalene-based epoxy resins having a skeleton containing a naphthalene ring, glycidylamine, and glycidyl ether. .

(D) Content of component may be 30 mass % or more on the basis of the total amount of components other than the electrically-conductive particle in a 1st adhesive bond layer, 70 mass % or less may be sufficient, and 30-70 mass % may be sufficient as it.

When a 1st adhesive bond layer contains a thermosetting resin, the 1st adhesive bond layer may contain the hardening|curing agent used in order to harden a thermosetting resin further. There is no restriction|limiting in particular as a hardening|curing agent, as long as it is a hardening|curing agent which generate|occur|produces cationic species by heat, According to the objective, it can select suitably. As a hardening|curing agent, a sulfonium salt, an iodonium salt, etc. are mentioned, for example. 0.1 mass part or more may be sufficient, 50 mass parts or less may be sufficient as content of a hardening|curing agent with respect to 100 mass parts of thermosetting resins, and 0.1-50 mass parts may be sufficient, for example.

[Component (E): Thermal polymerization initiator]

(E) component may be a thermal polymerization initiator (thermal radical polymerization initiator, thermal cationic polymerization initiator or thermal anionic polymerization initiator) that generates radicals, cations or anions by heat, and the effect of reducing connection resistance is further improved, connection reliability From a viewpoint more excellent than this, it is preferable that it is a thermal radical polymerization initiator. (E) As a component, 1 type of compound may be used independently and may be used combining multiple types of compounds.

A thermal radical polymerization initiator is decomposed|disassembled by heat|fever, and generate|occur|produces a free radical. That is, a thermal radical polymerization initiator is a compound which generate|occur|produces a radical by provision of thermal energy from the outside. The thermal radical polymerization initiator can be arbitrarily selected from conventionally known organic peroxides and azo compounds. As the thermal radical polymerization initiator, an organic peroxide is preferable from the viewpoint of further improving the effect of inhibiting the flow of conductive particles and the effect of inhibiting peeling, and from the viewpoint of stability, reactivity and compatibility, the half-life temperature for 1 minute is 90 to 175 ° C. Moreover, the organic peroxide whose weight average molecular weights are 180-1000 is more preferable. When the 1 minute half-life temperature is in this range, the storage stability is more excellent, the radical polymerization property is also sufficiently high, and it can be cured in a short time.

(E) Specific examples of the component include 1,1,3,3-tetramethylbutylperoxyneodecanoate, di(4-t-butylcyclohexyl)peroxydicarbonate, di(2-ethylhexyl)peroxy Dicarbonate, cumyl peroxyneodecanoate, dilauroyl peroxide, 1-cyclohexyl-1-methylethylperoxyneodecanoate, t-hexylperoxyneodecanoate, t-butylperoxyneode Canoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di(2-ethylhexanoyl) Peroxy) hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyneoheptanoate, t-amylperoxy-2- Ethylhexanoate, di-t-butylperoxyhexahydroterephthalate, t-amylperoxy-3,5,5-trimethylhexanoate, 3-hydroxy-1,1-dimethylbutylperoxyneo Decanoate, t-amylperoxyneodecanoate, di(3-methylbenzoyl)peroxide, dibenzoylperoxide, di(4-methylbenzoyl)peroxide, t-hexylperoxyisopropylmonocarbonate, t -Butylperoxymaleic acid, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, 2,5-dimethyl-2,5-di(3-methylbenzoyl) Peroxy) hexane, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexyl peroxybenzoate, 2,5-dimethyl-2,5-di (benzoyl peroxy) hexane, t-view organic peroxides such as tylperoxybenzoate, dibutylperoxytrimethyladipate, t-amylperoxynormaloctoate, t-amylperoxyisononanoate, and t-amylperoxybenzoate; 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'-azobis (1-acetoxy-1-phenylethane), 2,2'-azobisisobutyronitrile , 2,2'-azobis (2-methylbutyronitrile), 4,4'-azobis (4-cyanovaleric acid), 1,1'-azobis (1-cyclohexanecarbonitrile) Azo compounds, such as these, etc. are mentioned.

The content of the component (E) is, from the viewpoint of excellent fast curing properties, the effect of inhibiting the flow of conductive particles, and the inhibitory effect of peeling off, of components other than the conductive particles in the first adhesive layer from the viewpoint of further improvement. Based on the total amount, 0.1 mass % or more may be sufficient, 0.5 mass % or more may be sufficient, and 1 mass % or more may be sufficient. (E) Content of component may be 20 mass % or less, 10 mass % or less, and 5 mass % or less on the basis of the total amount of components other than the electrically conductive particle in a 1st adhesive bond layer from a pot life viewpoint. do. From these viewpoints, content of (E) component may be 0.1-20 mass %, 0.5-10 mass % may be sufficient on the basis of the total amount of components other than the electrically-conductive particle in a 1st adhesive bond layer, 1-5 mass % may be The 1st adhesive bond layer 2 does not need to contain (E) component. In addition, content of (E) component based on the total amount of components other than the electrically-conductive particle in a photocurable composition may be the same as the said range.

[Other ingredients]

The photocurable composition may further contain other components other than (A) component, (B) component, (C)component, (D)component, and (E) component. As other components, a thermoplastic resin, a coupling agent, a filler, and the hardening|curing agent mentioned above are mentioned, for example. These components may be contained in the 1st adhesive bond layer 2 .

Examples of the thermoplastic resin include phenoxy resin, polyester resin, polyamide resin, polyurethane resin, polyester urethane resin, and acrylic rubber. When the photocurable composition contains a thermoplastic resin, the first adhesive layer can be easily formed. Moreover, when a photocurable composition contains a thermoplastic resin, the stress of the 1st adhesive bond layer which generate|occur|produces at the time of hardening of a photocurable composition can be relieve|moderated. Moreover, when a thermoplastic resin has functional groups, such as a hydroxyl group, the adhesiveness of a 1st adhesive bond layer improves easily. Content of a thermoplastic resin may be 5 mass % or more, 80 mass % or less, and 5-80 mass % may be sufficient, for example on the basis of the total amount of components other than the electrically-conductive particle in a photocurable composition.

Examples of the coupling agent include a silane coupling agent having an organic functional group such as a (meth)acryloyl group, a mercapto group, an amino group, an imidazole group, and an epoxy group, a silane compound such as tetraalkoxysilane, a tetraalkoxy titanate derivative, a poly A dialkyl titanate derivative etc. are mentioned. When the photocurable composition contains a coupling agent, adhesiveness can be further improved. Content of a coupling agent may be 0.1 mass % or more, 20 mass % or less may be sufficient, for example on the basis of the total amount of components other than the electrically-conductive particle in a photocurable composition, and 0.1-20 mass % may be sufficient as it.

As a filler, a nonelectroconductive filler (for example, nonelectroconductive particle) is mentioned, for example. When a photocurable composition contains a filler, the improvement of connection reliability can be anticipated further. Any of an inorganic filler and an organic filler may be sufficient as a filler. Examples of the inorganic filler include fine metal oxide fine particles such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles; Inorganic microparticles|fine-particles, such as nitride microparticles|fine-particles, are mentioned. Examples of the organic filler include organic fine particles such as silicon fine particles, methacrylate-butadiene-styrene fine particles, acryl-silicon fine particles, polyamide fine particles, and polyimide fine particles. These microparticles|fine-particles may have a uniform structure, and may have a core-shell type structure. It is preferable that the largest diameter of a filler is less than the minimum particle diameter of the electrically-conductive particle 4 . The content of the filler may be, for example, 1% by volume or more, 30% by volume or less, or 1 to 30% by volume based on the total volume of the photocurable composition.

The photocurable composition may contain other additives, such as a softening agent, an accelerator, a deterioration inhibitor, a coloring agent, a flame retardant, and a thixotropic agent. Content of these additives may be 0.1-10 mass %, for example on the basis of the total amount of components other than the electrically-conductive particle in a photocurable composition. These additives may be contained in the 1st adhesive bond layer 2 .

The 1st adhesive bond layer 2 may contain the unreacted component (B). When the adhesive film 1 of the present embodiment is accommodated in a conventional housing member and stored and transported, unreacted component (B) remains in the first adhesive layer 2, so that during storage and transport, It is estimated that a part of the thermosetting composition in the 2nd adhesive bond layer 3 hardens|cures, and the reduction effect of the connection resistance of the adhesive bond film 1 decreases. Therefore, when the 1st adhesive bond layer 2 contains (B) component, the reduction of the reduction effect of connection resistance can be prevented by accommodating the adhesive bond film 1 in the accommodating member mentioned later.

The thickness d1 of the first adhesive layer 2 is 0.1 of the average particle diameter of the conductive particles 4 from the viewpoint that the conductive particles 4 are easily captured between the opposing electrodes and the connection resistance can be further reduced. Twice or more may be sufficient, 0.2 times or more may be sufficient, and 0.3 times or more may be sufficient. The thickness d1 of the first adhesive layer 2 is, when the conductive particles are sandwiched between opposing electrodes at the time of thermocompression bonding, the conductive particles are more likely to collapse, and the connection resistance can be further reduced from the viewpoint of being electrically conductive. 0.8 times or less of the average particle diameter of the particle|grains 4 may be sufficient, and 0.7 times or less may be sufficient. From these viewpoints, the thickness d1 of the 1st adhesive bond layer 2 may be 0.1-0.8 times of the average particle diameter of the electrically-conductive particle 4, 0.2-0.8 times may be sufficient, and 0.3-0.7 times may be sufficient as them. In addition, the thickness d1 of the 1st adhesive bond layer 2 says the thickness of the 1st adhesive bond layer located in the spaced part between the adjacent electrically-conductive particles 4 and 4 .

When the thickness d1 of the 1st adhesive bond layer 2 and the average particle diameter of the electrically-conductive particle 4 satisfy the above relationship, as shown in FIG. 1, for example, the electrically-conductive particle in the 1st adhesive bond layer 2 A part of (4) may protrude from the 1st adhesive bond layer 2 to the 2nd adhesive bond layer 3 side. In this case, the boundary S between the 1st adhesive bond layer 2 and the 2nd adhesive bond layer 3 is located in the spaced part of the adjacent conductive particles 4 and 4 . Since the boundary S exists on the conductive particles so as to follow the surface of the conductive particles, the conductive particles 4 in the first adhesive layer 2 protrude from the first adhesive layer 2 to the second adhesive layer 3 side. not, and the above relation may be satisfied. The electrically-conductive particle 4 is not exposed on the surface 2a on the opposite side to the 2nd adhesive bond layer 3 side in the 1st adhesive bond layer 2, The surface 2a on the opposite side is a flat surface. may be made as The relationship between the thickness d1 of the 1st adhesive bond layer 2 and the maximum particle diameter of the electrically-conductive particle 4 may be the same as the above. For example, the thickness d1 of the 1st adhesive bond layer 2 may be 0.1-0.8 times of the largest particle diameter of the electrically-conductive particle 4, 0.2-0.8 times may be sufficient, and 0.3-0.7 times may be sufficient as it.

The thickness d1 of the 1st adhesive bond layer 2 may be suitably set according to the height etc. of the electrode of the circuit member to adhere|attach. The thickness d1 of the 1st adhesive bond layer 2 may be 0.5 micrometer or more, 20 micrometers or less may be sufficient, for example, and 0.5-20 micrometers may be sufficient as it. In addition, when a part of the electrically-conductive particle 4 is exposed from the surface of the 1st adhesive bond layer 2 (for example, it protrudes toward the 2nd adhesive bond layer 3 side), in the 1st adhesive bond layer 2 From the surface 2a on the opposite side to the second adhesive layer 3 side, the first adhesive layer 2 and the second adhesive layer 3 positioned in the space between the adjacent conductive particles 4 and 4 The shortest distance (distance shown by d1 in FIG. 1) to the boundary S is the thickness of the 1st adhesive bond layer 2, The exposed part of the electrically-conductive particle 4 is included in the thickness of the 1st adhesive bond layer 2 doesn't happen The length of the exposed part of the electrically-conductive particle 4 may be 0.1 micrometer or more, 20 micrometers or less may be sufficient, for example, and 0.1-20 micrometers may be sufficient as it.

The thickness of an adhesive bond layer can be measured with the following method. First, an adhesive film is sandwiched between two pieces of glass (thickness: about 1 mm). Next, it casts into a resin composition comprising 100 g of a bisphenol A epoxy resin (trade name: JER811, manufactured by Mitsubishi Chemical Corporation) and 10 g of a curing agent (trade name: Epomount curing agent, manufactured by Refinetech Corporation). Thereafter, cross-section is polished using a polishing machine, and the thickness of each adhesive layer is measured using a scanning electron microscope (SEM, trade name: SE-8020, manufactured by Hitachi High-Tech Sciences Co., Ltd.).

(Second adhesive layer)

The second adhesive layer 3 contains, for example, (a) a polymerizable compound (hereinafter, also referred to as (a) component.) and (b) thermal polymerization initiator (hereinafter, also referred to as (b) component.) It consists of a thermosetting composition. The thermosetting composition which comprises the 2nd adhesive bond layer 3 is a thermosetting composition which can flow at the time of circuit connection, for example, is an uncured thermosetting composition.

[(a) component: polymerizable compound]

(a) A component is a compound which superposes|polymerizes with the radical, cation, or anion which the thermal-polymerization initiator generate|occur|produced by heat, for example. (a) As a component, the compound illustrated as (A) component can be used. It is preferable that the component (a) is a radically polymerizable compound having a radically polymerizable group that reacts with radicals from the viewpoint that connection at low temperature and short time becomes easy, the effect of reducing connection resistance is further improved, and connection reliability is more excellent. do. The combination of the example of the preferable radically polymerizable compound in (a) component, and a preferable radically polymerizable compound is the same as that of (A) component. When the component (a) is a radically polymerizable compound, and the component (B) in the first adhesive layer is a photoradical polymerization initiator, by accommodating the adhesive film in a accommodating member described later, during storage or transport of the adhesive film There exists a tendency for hardening of the thermosetting composition in a city to be suppressed remarkably.

(a) Any of a monomer, an oligomer, or a polymer may be sufficient as a component. (a) As a component, 1 type of compound may be used independently and you may use combining multiple types of compounds. (a) A component may be the same as or different from (A) component.

(a) The content of the component may be 10% by mass or more, or 20% by mass or more, based on the total mass of the thermosetting composition, from the viewpoint of reducing the connection resistance and easily obtaining the crosslinking density required to improve the connection reliability. and 30 mass % or more may be sufficient. (a) Content of component can suppress cure shrinkage at the time of polymerization, and may be 90 mass % or less, 80 mass % or less, 70 mass % or less, based on the total mass of a thermosetting composition from a viewpoint of obtaining favorable reliability. % or less. From these viewpoints, content of (a) component may be 10-90 mass %, 20-80 mass %, and 30-70 mass % may be sufficient as the total mass reference of a thermosetting composition.

[(b) component: thermal polymerization initiator]

(b) As a component, the thermal-polymerization initiator similar to (E) component can be used. (b) As a component, 1 type of compound may be used independently and you may use combining multiple types of compounds. (b) It is preferable that a component is a thermal radical polymerization initiator. The example of the preferable thermal radical polymerization initiator in (b) component is the same as that of (E) component.

(b) The content of the component may be 0.1 mass% or more, 0.5 mass% or more, or 1 mass, based on the total mass of the thermosetting composition, from the viewpoint that the reduction effect of the connection resistance is further improved and the connection reliability is more excellent. % or more. (b) Content of a component may be 30 mass % or less, 20 mass % or less, and 10 mass % or less may be sufficient as the total mass reference|standard of a thermosetting composition from a viewpoint of a pot life. From these viewpoints, content of (b) component may be 0.1-30 mass %, 0.5-20 mass %, and 1-10 mass % may be sufficient as the total mass reference|standard of a thermosetting composition.

[Other ingredients]

The thermosetting composition may further contain other components other than (a) component and (b) component. As other components, a thermoplastic resin, a coupling agent, a filler, a softening agent, an accelerator, a deterioration inhibitor, a coloring agent, a flame retardant, a thixotropic agent etc. are mentioned, for example. The details of other components are the same as the details of other components in the first adhesive layer 2 .

The thermosetting composition may contain the same thermosetting resin as (D) component mentioned above instead of (a) component and (b) component, or in addition to (a) component and (b) component. In this case, the thermosetting composition may contain the hardening|curing agent used in order to harden|cure the above-mentioned thermosetting resin. When a thermosetting resin is used instead of the component (a) and the component (b), the content of the thermosetting resin in the thermosetting composition may be, for example, 20% by mass or more, based on the total mass of the thermosetting composition, 80 Mass % or less may be sufficient and 20-80 mass % may be sufficient. When a thermosetting resin is used in addition to (a) component and (b) component, the content of the thermosetting resin in the thermosetting composition may be, for example, 20 mass% or more based on the total mass of the thermosetting composition, 80 Mass % or less may be sufficient and 20-80 mass % may be sufficient. The content of the curing agent may be the same as the range described as the content of the curing agent in the photocurable composition.

Content of the electrically-conductive particle 4 in the 2nd adhesive bond layer 3 may be 1 mass % or less on the total mass reference|standard of a 2nd adhesive bond layer, for example, and 0 mass % may be sufficient as it. It is preferable that the 2nd adhesive bond layer 3 does not contain the electrically-conductive particle 4 .

The thickness d2 of the 2nd adhesive bond layer 3 may be suitably set according to the height etc. of the electrode of the circuit member to adhere|attach. The thickness d2 of the second adhesive layer 3 may be 5 µm or more, 200 µm or less, or 5-200 µm from the viewpoint of sufficiently filling the space between the electrodes to seal the electrodes, and better connection reliability is obtained. . In addition, when a part of the electrically-conductive particle 4 is exposed from the surface of the 1st adhesive bond layer 2 (for example, it protrudes toward the 2nd adhesive bond layer 3 side), in the 2nd adhesive bond layer 3 From the surface 3a on the opposite side to the first adhesive layer 2 side, the first adhesive layer 2 and the second adhesive layer 3 positioned in the space between the adjacent conductive particles 4 and 4 The distance (distance shown by d2 in FIG. 1) to the boundary S is the thickness of the 2nd adhesive bond layer 3 .

The ratio of the thickness d1 of the first adhesive layer 2 to the thickness d2 of the second adhesive layer 3 (thickness d1/thickness d2 of the second adhesive layer 3) of the first adhesive layer 2 is the electrode From the viewpoint of being able to sufficiently fill the interstitial space to seal the electrode and obtain better reliability, one or more may be sufficient, and 100 or less may be sufficient as it.

The thickness of the adhesive film 1 (the sum of the thicknesses of all the layers constituting the adhesive film 1). In Fig. 1, the thickness d1 of the first adhesive layer 2 and the thickness d2 of the second adhesive layer 3 Total.) may be, for example, 5 µm or more, 200 µm or less, or 5-200 µm.

In the adhesive film 1 , the conductive particles 4 are dispersed in the first adhesive layer 2 . Therefore, the adhesive film 1 is an anisotropically conductive adhesive film which has anisotropic conductivity. The adhesive film 1 is interposed between the 1st circuit member which has a 1st electrode, and the 2nd circuit member which has a 2nd electrode, the 1st circuit member and the 2nd circuit member are thermocompression-bonded, The 1st electrode and electrically connecting the second electrode to each other.

According to the adhesive film 1, the circuit formed by the circuit member and the adhesive film which generate|occur|produces when a circuit connection structure is used in the high-temperature, high-humidity environment while suppressing the flow of the electronic particle which generate|occur|produces at the time of manufacture of a circuit connection structure. The peeling in the interface of a connection part can be suppressed.

As mentioned above, although the adhesive film for circuit connection of this embodiment was demonstrated, this invention is not limited to the said embodiment.

For example, the adhesive film for circuit connection may be comprised from two layers of a 1st adhesive bond layer and a 2nd adhesive bond layer, and layers other than a 1st adhesive bond layer and a 2nd adhesive bond layer (for example, 3rd adhesive bond layer) ), and may be constituted of three or more layers. The third adhesive layer may be a layer having the same composition as the composition described above for the first adhesive layer or the second adhesive layer, or a layer having the same thickness as the thickness described for the first adhesive layer or the second adhesive layer. . The adhesive film for circuit connection may further be equipped with the 3rd adhesive bond layer on the surface on the opposite side to the 2nd adhesive bond layer in a 1st adhesive bond layer, for example. That is, the adhesive film for circuit connection consists of a 2nd adhesive bond layer, a 1st adhesive bond layer, and a 3rd adhesive bond layer laminated|stacked in this order, for example. In this case, the 3rd adhesive bond layer consists of a thermosetting composition similarly to a 2nd adhesive bond layer, for example.

Moreover, although the adhesive agent film for circuit connection of the said embodiment is an anisotropically conductive adhesive film which has anisotropic electroconductivity, the conductive adhesive film which does not have anisotropic electroconductivity may be sufficient as the adhesive film for circuit connection.

<Method for producing adhesive film for circuit connection>

The manufacturing method of the adhesive bond film 1 for circuit connection of this embodiment, the preparation process (1st preparation process) of preparing the 1st adhesive bond layer 2 mentioned above, for example, The 1st adhesive bond layer 2 The lamination process of laminating|stacking the 2nd adhesive bond layer 3 mentioned above on it is provided. The manufacturing method of the adhesive bond film 1 for circuit connection may further be equipped with the preparatory process (2nd preparatory process) of preparing the 2nd adhesive bond layer 3 .

At a 1st preparatory process, the 1st adhesive bond layer 2 is prepared, for example by forming the 1st adhesive bond layer 2 on a base material, and obtaining a 1st adhesive bond film. Specifically, first, (A) component, (B) component, and (C) component, and other components such as (D) component and (E) component added as needed are added in an organic solvent, and stirred and mixed , kneading or the like to dissolve or disperse to prepare a varnish composition (varnish of a photocurable composition). Then, on the substrate subjected to the release treatment, the varnish composition is applied using a knife coater, a roll coater, an applicator, a comma coater, a die coater, etc., and then the organic solvent is volatilized by heating, and the photocurable composition on the substrate to form a layer made of Then, the photocurable composition is hardened by irradiating light with respect to the layer which consists of a photocurable composition, and the 1st adhesive bond layer 2 is formed on a base material (curing process). Thereby, a 1st adhesive film is obtained.

As an organic solvent used for preparation of a varnish composition, what has the characteristic which can melt|dissolve or disperse|distribute each component uniformly is preferable, For example, toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, propyl acetate. , butyl acetate, and the like. These organic solvents can be used individually or in combination of 2 or more types. Stirring mixing and kneading at the time of preparation of a varnish composition can be performed using, for example, a stirrer, a grinder, three rolls, a ball mill, a bead mill, or a homodisper.

The substrate is not particularly limited as long as it has heat resistance capable of withstanding the heating conditions at the time of volatilizing the organic solvent, and for example, stretched polypropylene (OPP), polyethylene terephthalate (PET), polyethylene naphthalate, polyethylene isophthalate. , polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, polyimide, cellulose, ethylene/vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber, liquid crystal polymer A base material (for example, a film) made of, etc. can be used.

It is preferable that heating conditions at the time of volatilizing an organic solvent from the varnish composition apply|coated with the base material make it into conditions that an organic solvent fully volatilizes. Heating conditions are, for example, 40 degreeC or more and 120 degrees C or less, and may be 0.1 minute or more and 10 minutes or less may be sufficient.

It is preferable to use the irradiation light (for example, ultraviolet light) within the range of wavelength 150-750 nm for irradiation of the light in a hardening process. Light irradiation can be performed using, for example, a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a xenon lamp, a metal halide lamp, an LED light source, or the like. Light irradiation amount is not particularly limited, for example, with light having a wavelength of 365nm accumulated light quantity, and may be more than 100mJ / cm ^2, and may be 200mJ / cm ² or more, and may be more than 300mJ / cm ^2. The irradiation amount of light is, for example, the accumulated light amount of light with a wavelength of 365 nm, ^{and may be 10000 mJ/cm 2} or less, 5000 mJ/cm ² or less, or 3000 mJ/cm ² or less.

In a 2nd preparatory process, similarly to a 1st preparatory process, the 2nd adhesive agent on a base material except using (a) component and (b) component, and other components added as needed, and not performing light irradiation. By forming the layer 3 to obtain a second adhesive film, the second adhesive layer 3 is prepared.

In a lamination process, by bonding a 1st adhesive bond film and a 2nd adhesive bond film together, you may laminate|stack the 2nd adhesive bond layer 3 on the 1st adhesive bond layer 2, On the 1st adhesive bond layer 2, ( A varnish composition (varnish of a thermosetting composition) obtained using the component a) and the component (b), and other components added as needed, is applied, and the organic solvent is volatilized to evaporate the second adhesive layer on the first adhesive layer 2 . The adhesive layer 3 may be laminated. You may perform a lamination|stacking process in the middle of a 1st preparatory process. For example, after forming a layer made of a photocurable composition, a lamination step is performed, and a layer made of the photocurable composition (precursor of the first adhesive layer 2) and a layer made of a thermosetting composition (the second adhesive layer 3) )), you may obtain a laminated body provided with). In this case, the layer which consists of a photocurable composition may be hardened by irradiating light with respect to the obtained laminated body, and you may complete a 1st preparatory process.

As a method of bonding a 1st adhesive film and a 2nd adhesive film together, methods, such as a hot press, roll lamination, and vacuum lamination, are mentioned, for example. You may perform lamination on temperature conditions of 0-80 degreeC, for example.

<Circuit connection structure and its manufacturing method>

Hereinafter, the circuit connection structure using the adhesive film 1 for circuit connection mentioned above as a circuit connection material, and its manufacturing method are demonstrated.

2 : is a schematic sectional drawing which shows the circuit connection structure of one Embodiment. As shown in FIG. 2 , the circuit connection structure 10 has a first circuit board 11 and a first electrode 12 formed on a main surface 11a of the first circuit board 11 . a second circuit member 16 having a first circuit member 13, a second circuit board 14 and a second electrode 15 formed on a main surface 14a of the second circuit board 14; A circuit connecting portion 17 is provided between the first circuit member 13 and the second circuit member 16 and electrically connects the first electrode 12 and the second electrode 15 to each other.

The first circuit member 13 and the second circuit member 16 may be the same as or different from each other. The first circuit member 13 and the second circuit member 16 are a glass substrate or a plastic substrate on which an electrode is formed. , a printed wiring board, a ceramic wiring board, a flexible wiring board, a semiconductor silicon IC chip, or the like. The first circuit board 11 and the second circuit board 14 may be formed of an inorganic material such as a semiconductor, glass, or ceramic, an organic material such as polyimide or polycarbonate, or a composite such as glass/epoxy. The first electrode 12 and the second electrode 15 are gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, aluminum, molybdenum, titanium, indium tin oxide (ITO), Indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. may be formed. The first electrode 12 and the second electrode 15 may be circuit electrodes or bump electrodes. At least one of the first electrode 12 and the second electrode 15 may be a bump electrode. In FIG. 2 , the second electrode 15 is a bump electrode.

The circuit connection part 17 consists of the hardened|cured material of the adhesive agent film 1 mentioned above. The circuit connecting portion 17 is, for example, on the side of the first circuit member 13 in the direction in which the first circuit member 13 and the second circuit member 16 oppose each other (hereinafter, “opposing direction”). The first region 18 made of a cured product of components such as component (A) and component (B) other than the conductive particles 4 of the photocurable composition described above, and the second circuit member in the opposite direction ( 16), a second region 19 made of a cured product of the above-described thermosetting composition containing component (a), component (b), and the like, and at least the first electrode 12 and the second electrode 15 ) interposed between the conductive particles 4 to electrically connect the first electrode 12 and the second electrode 15 to each other. The circuit connecting portion does not have to have two regions like the first region 18 and the second region 19, for example, a cured product of components other than the conductive particles 4 of the photocurable composition and the above-mentioned cured product. It may consist of a hardened|cured material in which the hardened|cured material of one thermosetting composition was mixed.

3 : is a schematic sectional drawing which shows the manufacturing method of the circuit connection structure 10. As shown in FIG. As shown in FIG. 3, the manufacturing method of the circuit connection structure 10 has the 1st circuit member 13 which has the 1st electrode 12, and the 2nd circuit which has the 2nd electrode 15, for example. The adhesive film 1 described above is interposed between the members 16, and the first circuit member 13 and the second circuit member 16 are thermocompression-bonded, and the first electrode 12 and the second electrode ( 15) to electrically connect each other.

Specifically, as shown in FIG. 3A , first, the first circuit board 11 and the first electrode 12 formed on the main surface 11a of the first circuit board 11 are first provided. A second circuit member 16 including one circuit member 13 and a second circuit board 14 and a second electrode 15 formed on the main surface 14a of the second circuit board 14 is prepared .

Next, the 1st circuit member 13 and the 2nd circuit member 16 are arrange|positioned so that the 1st electrode 12 and the 2nd electrode 15 may face each other, and the 1st circuit member 13 and the 2nd circuit member An adhesive film 1 is disposed between the circuit members 16 . For example, as shown to Fig.3 (a), the 1st adhesive bond layer 2 side is made to oppose the mounting surface 11a of the 1st circuit member 13, and the adhesive bond film 1 is attached to a 1st circuit. Laminate on the member (13). Next, the adhesive film 1 is laminated so that the first electrode 12 on the first circuit board 11 and the second electrode 15 on the second circuit board 14 face each other. The second circuit member 16 is disposed on the circuit member 13 .

And as shown to FIG.3(b), heating the 1st circuit member 13, the adhesive film 1, and the 2nd circuit member 16, the 1st circuit member 13 and the 2nd circuit member By pressing (16) in the thickness direction, the first circuit member 13 and the second circuit member 16 are thermocompression-bonded to each other. At this time, as indicated by an arrow in FIG. 3B , the second adhesive layer 3 is made of a flowable, uncured thermosetting composition, so as to fill the gap between the second electrodes 15 and 15 . While flowing, it hardens by the said heating. Thereby, the 1st electrode 12 and the 2nd electrode 15 are electrically connected to each other via the electrically-conductive particle 4, and the 1st circuit member 13 and the 2nd circuit member 16 adhere|attach each other. and the circuit connection structure 10 shown in FIG. 2 is obtained. In the manufacturing method of the circuit connection structure 10 of this embodiment, since the 1st adhesive bond layer 2 is a previously hardened layer, the electrically-conductive particle 4 is fixed in the 1st adhesive bond layer 2, and, Since the 1st adhesive bond layer 2 hardly flows at the time of the said thermocompression bonding, and an electrically-conductive particle is efficiently captured between the opposing electrodes, the connection resistance between the opposing electrodes 12 and 15 is reduced. Therefore, the circuit connection structure excellent in connection reliability is obtained.

<Adhesive film accommodation set>

It is a perspective view which shows the adhesive film accommodation set of one Embodiment. As shown in FIG. 4 , the adhesive film accommodation set 20 includes an adhesive film 1 for circuit connection, a reel 21 on which the adhesive film 1 is wound, an adhesive film 1 and a reel 21 . and a accommodating member 22 for accommodating it.

As shown in FIG. 4 , the adhesive film 1 is, for example, in the form of a tape. The tape-shaped adhesive film 1 is produced, for example, by cutting out a sheet-like original to a length according to the use. A base material may be provided on one surface of the adhesive film 1 . As a base material, base materials, such as the above-mentioned PET film, can be used.

The reel 21 includes a first side plate 24 having a core 23 on which the adhesive film 1 is wound, and a first side plate 24 with the core 23 interposed therebetween and disposed to face the first side plate 24 . 2 side plates 25 are provided.

The first side plate 24 is, for example, a disk made of plastic, and a central portion of the first side plate 24 is provided with an opening having a circular cross section.

The winding core 23 which the 1st side plate 24 has is the part which winds the adhesive agent film 1 . The core 23 is made of, for example, plastic, and has an annular shape having the same thickness as the width of the adhesive film 1 . The core 23 is being fixed to the inner surface of the first side plate 24 so as to surround the opening of the first side plate 24 . Moreover, in the center part of the reel 21, the shaft hole 26 which is a part into which the rotating shaft of a winding device or a feeding device (not shown) is inserted is provided. When the rotating shaft is driven in a state in which the rotating shaft of the winding device or the feeding device is inserted into the shaft hole 26, the reel 21 rotates without idling. A desiccant storage container in which the desiccant is accommodated may be inserted into the shaft hole 26 .

The second side plate 25 is, similarly to the first side plate 24, a circular plate made of, for example, plastic, and has a central portion of the second side plate 25 having the same diameter as the opening of the first side plate 24 . An opening having a circular cross-section is provided.

The housing member 22 has, for example, a bag shape, and accommodates the adhesive film 1 and the reel 21 . The accommodating member 22 has an insertion hole 27 for accommodating (inserting) the adhesive film 1 and the reel 21 inside the accommodating member 22 .

The accommodating member 22 has a visual recognition part 28 which makes the inside of the accommodating member 22 visually visible from the outside. The accommodating member 22 shown in FIG. 4 is comprised so that the whole accommodating member 22 may become the visual recognition part 28. As shown in FIG.

The viewing part 28 has transparency with respect to visible light. For example, when the transmittance of light in the viewing unit 28 is measured in the range of wavelength 450 to 750 nm, the average value of transmittance of light between wavelengths 450 to 750 nm is 30% or more, and the wavelength is 50 nm At least one region exists. The light transmittance of the viewing portion 28 is obtained by preparing a sample in which the viewing portion 28 is cut to a predetermined size, and measuring the light transmittance of the sample with an ultraviolet-visible spectrophotometer. Since the accommodating member 22 has such a viewing part 28, various information such as a product name, a lot number, and an expiration date affixed to the inside of the accommodating member 22, for example, on the reel 21 can be stored in the accommodating member. (22) can also be confirmed outside. Thereby, it can be expected that mixing of other products is prevented and that the sorting operation becomes efficient.

The transmittance of light having a wavelength of 365 nm in the viewing portion 28 is 10% or less. Since the transmittance of light having a wavelength of 365 nm in the viewing portion 28 is 10% or less, it is caused by the light incident from the outside of the housing member 22 to the inside and the photopolymerization initiator remaining in the first adhesive layer 2 . Curing of the thermosetting composition can be suppressed. As a result, the effect of reducing the connection resistance of the adhesive film 1 can be maintained, and when the adhesive film 1 is used for connection between circuit members, the connection resistance between opposing electrodes can be reduced. From the viewpoint of further suppressing the generation of radicals from the photopolymerization initiator, the transmittance of light having a wavelength of 365 nm in the viewing portion 28 is preferably 10% or less, more preferably 5% or less, still more preferably 1 % or less, particularly preferably 0.1% or less.

From the same viewpoint, the maximum value of the transmittance of light in the wavelength region capable of generating radicals, cations or anions from the above-described photopolymerization initiator (component (B)) in the visual recognition unit 28 is preferably 10% or less. , more preferably 5% or less, still more preferably 1% or less, particularly preferably 0.1% or less. Specifically, the maximum value of the transmittance of light at a wavelength of 254 to 405 nm in the viewing portion 28 is preferably 10% or less, more preferably 5% or less, still more preferably 1% or less, particularly preferably In most cases, it is less than 0.1%.

The visual recognition part 28 (accommodating member 22) is formed from the sheet|seat with a thickness of 10-5000 micrometers, for example. The sheet is made of a material in which the transmittance of light having a wavelength of 365 nm in the viewing portion 28 is 10% or less. Such a material may consist of 1 type of component, and may consist of multiple types of components. Examples of the material include low-density polyethylene, linear low-density polyethylene, polycarbonate, polyester, polyacrylate, polyamide, and glass. These materials may contain the ultraviolet absorber. The visual recognition unit 28 may have a laminated structure formed by laminating a plurality of layers having different light transmittances. In this case, each layer constituting the visual recognition portion 28 may be made of the above-described material.

The insertion port 27 may be sealed by closing, for example with a sealing device etc. in order to prevent the intrusion of air from the outside at the time of accommodation. In this case, it is preferable to remove the air in the accommodation member 22 by suction before closing the insertion hole 27 . It can be expected that the moisture in the accommodating member 22 decreases from the initial stage of accommodating, and the entry of air from the outside is prevented. In addition, when the inner surface of the housing member 22 and the reel 21 are brought into close contact, the inner surface of the housing member 22 and the surface of the reel 21 rub against each other due to vibration during transport to generate foreign matter, and the reel It is possible to prevent damage to the outer surface of the side plates (24, 25) of (21).

In the said embodiment, although the accommodation member was comprised so that the whole accommodation member might become a visual recognition part, in another one Embodiment, the accommodation member may have a visual recognition part in a part of accommodation member. For example, the accommodating member may have a rectangular visual recognition part in the substantially center of the side surface of the accommodating member. In this case, the portion other than the viewing portion of the accommodating member may be black so as not to transmit ultraviolet light and visible light, for example.

Moreover, in the said embodiment, although the shape of the accommodation member was a bag shape, the shape of a box may be sufficient as the accommodation member, for example. It is preferable that the notch for opening enters in the accommodation member. In this case, the unsealing operation at the time of use becomes easy.

Example

Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to an Example.

<Synthesis of polyurethane acrylate (UA1)>

In a reaction vessel equipped with a stirrer, a thermometer, a reflux cooling tube having a calcium chloride drying tube, and a nitrogen gas introduction tube, poly(1,6-hexanediolcarbonate) (trade name: Duranol T5652, Asahi Kasei Chemicals) Co., Ltd., number average molecular weight 1000) 2500 mass parts (2.50 mol) and 666 mass parts (3.00 mol) of isophorone diisocyanate (made by Sigma Aldrich) were dripped uniformly over 3 hours. Next, after sufficiently introducing nitrogen gas into the reaction vessel, the inside of the reaction vessel was heated to 70 to 75°C for reaction. Next, 0.53 mass parts (4.3 mmol) of hydroquinone monomethyl ether (manufactured by Sigma-Aldrich) and 5.53 mass parts (8.8 mmol) of dibutyltin dilaurate (manufactured by Sigma-Aldrich) were added to the reaction vessel, 238 mass parts (2.05 mol) of 2-hydroxyethyl acrylate (made by Sigma-Aldrich) was added, and it was made to react at 70 degreeC in air atmosphere for 6 hours. Thereby, polyurethane acrylate (UA1) was obtained. The weight average molecular weight of polyurethane acrylate (UA1) was 15000. In addition, the weight average molecular weight was measured using the analytical curve by standard polystyrene from a gel permeation chromatograph (GPC) according to the following conditions.

(Measuring conditions)

Apparatus: GPC-8020 made by Tosoh Corporation

Detector: RI-8020 manufactured by Tosoh Corporation

Column: Gelpack GLA160S+GLA150S manufactured by Hitachi Kasei Co., Ltd.

Sample Concentration: 120mg/3mL

Solvent: tetrahydrofuran

Injection volume: 60 μL

Pressure: 2.94×10 ⁶ Pa (30 kgf/cm ² )

Flow: 1.00mL/min

<Production of conductive particles>

On the surface of the polystyrene particles, a layer made of nickel was formed so that the layer had a thickness of 0.2 µm. In this way, conductive particles having an average particle size of 4 µm, a maximum particle size of 4.5 µm, and specific gravity of 2.5 were obtained.

<Preparation method of polyester urethane resin>

48 parts by mass of isophthalic acid and 37 parts by mass of neopentyl glycol were put into a stainless steel autoclave equipped with a heater equipped with a stirrer, a thermometer, a condenser, a vacuum generator and a nitrogen gas introduction tube, and tetrabutoxytitanate as a catalyst 0.02 parts by mass was further added. Then, it heated up to 220 degreeC under nitrogen stream, and stirred as it was for 8 hours. Then, it pressure-reduced to atmospheric pressure (760 mmHg), and it cooled to room temperature. Thereby, a white precipitate was deposited. Next, the white precipitate was taken out, washed with water, and then vacuum-dried to obtain a polyester polyol. After the obtained polyester polyol was sufficiently dried, it was dissolved in MEK (methyl ethyl ketone) and put into a four-necked flask equipped with a stirrer, a dropping funnel, a reflux condenser and a nitrogen gas introduction tube. Moreover, dibutyl tin laurate as a catalyst is injected|thrown-in in the amount used as 0.05 mass parts with respect to 100 mass parts of polyester polyols, and 4,4'- diphenylmethanedia in the quantity used as 50 mass parts with respect to 100 mass parts of polyester polyols. Isocyanate was dissolved in MEK, put into a dropping funnel, and stirred at 80°C for 4 hours to obtain a target polyester urethane resin.

<Preparation of varnish (varnish composition) of photocurable composition>

The components shown below were mixed in the compounding quantity (mass part) shown in Table 1, and the varnish of the photocurable compositions 1-8 was prepared.

(Polymerizable compound)

A1: dicyclopentadiene type diacrylate (trade name: DCP-A, manufactured by Toagosei Co., Ltd.)

A2: Polyurethane acrylate (UA1) synthesized as described above

A3: 2-methacryloyloxyethyl acid phosphate (trade name: Light Ester P-2M, manufactured by Kyoeisha Chemical Co., Ltd.)

(Photoinitiator)

B1: 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(O-benzoyloxime)] (trade name: Irgacure (registered trademark) OXE01, manufactured by BASF)

B2: ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(o-acetyloxime) (trade name: Irgacure (registered trademark) OXE02, BASF Corporation)

(conductive particles)

C1: Conductive particles produced as described above

(thermal polymerization initiator)

E1: benzoyl peroxide (brand name: Nyper BMT-K40, manufactured by Nichiyu Corporation)

(thermoplastic resin)

F1: Polyester urethane resin synthesized as described above

(Coupling agent)

G1: 3-methacryloxypropyl trimethoxysilane (trade name: KBM503, manufactured by Shin-Etsu Chemical Co., Ltd.)

(filling)

H1: silica fine particles (trade name: R104, manufactured by Nippon Aerosil Co., Ltd., average particle size (primary particle size): 12 nm)

(solvent)

I1: methyl ethyl ketone

[Table 1]

<Preparation of varnish (varnish composition) of thermosetting composition>

As polymerizable compounds a1 to a3, thermal polymerization initiator b1, coupling agent g1, filler h1, and solvent i1, polymerizable compounds A1 to A3 in the photocurable composition, thermal polymerization initiator E1, coupling agent G1, filler H1, and solvent I1 Using the same thing as described above, the thermoplastic resin f1 used the components shown below and mixed these components in the amount (parts by mass) shown in Table 2 to prepare the varnish of the thermosetting composition 1.

(thermoplastic resin)

f1: phenoxy resin (trade name: PKHC, manufactured by Union Carbide)

[Table 2]

(Example 1)

[Production of first adhesive film]

The varnish of the photocurable composition 1 was apply|coated using the coating apparatus on 50-micrometer-thick PET film. Then, hot-air drying was performed at 70 degreeC for 3 minutes, and the layer which consists of the photocurable composition 1 whose thickness (thickness after drying) is 4 micrometers was formed on PET film. The thickness here was measured using a contact thickness gauge. In addition, when the contact thickness meter is used, the size of the conductive particles is reflected, and the thickness of the region where the conductive particles are present is measured. Therefore, after laminating|stacking a 2nd adhesive bond layer and producing the adhesive film for circuit connection of a two-layer structure, by the method mentioned later, the thickness of the 1st adhesive bond layer located in the spaced part of the adjacent electrically-conductive particle was measured. .

Next, with respect to the layer which consists of photocurable composition 1, using a metal halide lamp, ^{light irradiation was performed so that the accumulated light amount might be 1500 mJ/cm<2>} , and the polymeric compound was polymerized. Thereby, the photocurable composition 1 was hardened and the 1st adhesive bond layer was formed. By the above operation, the 1st adhesive film (thickness of the area|region where an electrically-conductive particle exists: 4 micrometers) provided with a 1st adhesive bond layer on PET film was obtained. The conductive particle density at this time was about 7000 pcs/mm<^2> .

[Production of the second adhesive film]

The varnish of the thermosetting composition 1 was apply|coated using the coating apparatus on the PET film of thickness 50 micrometers. Subsequently, hot air drying was performed at 70°C for 3 minutes to form a second adhesive layer (layer made of thermosetting composition 1) having a thickness of 8 µm on the PET film. By the above operation, the 2nd adhesive bond film provided with a 2nd adhesive bond layer on PET film was obtained.

[Production of adhesive film for circuit connection]

The first adhesive film and the second adhesive film were laminated with a roll laminator while placing each adhesive layer facing each other and heating at 40° C. together with a PET film as a substrate. Thereby, the adhesive film for circuit connection of the two-layer structure in which the 1st adhesive bond layer and the 2nd adhesive bond layer were laminated|stacked was produced.

The thickness of the 1st adhesive bond layer of the produced adhesive bond film for circuit connection was measured with the following method. First, an adhesive film for circuit connection is sandwiched between two pieces of glass (thickness: about 1 mm), 100 g of bisphenol A epoxy resin (trade name: JER811, manufactured by Mitsubishi Chemical Co., Ltd.), and a curing agent (brand name: Epomount curing agent, Refine) It molded into the resin composition which consists of 10 g of Tec Corporation). Thereafter, the cross-section is polished using a polishing machine, and using a scanning electron microscope (SEM, trade name: SE-8020, manufactured by Hitachi High-Tech Sciences Co., Ltd.), the first adhesive layer located in the space between the adjacent conductive particles. The thickness was measured. The thickness of the first adhesive layer was 2 μm.

[Production of circuit connection structure]

A glass substrate with a thin film electrode provided with a thin film electrode (height: 1200 Å) made of amorphous indium tin oxide (ITO) on a glass substrate and a COF (manufactured by FLEXSEED) having a pitch of 25 μm through the produced adhesive film for circuit connection Using a thermocompression bonding device (manufactured by Geomatek Co., Ltd.) (heating method: constant heat type, manufactured by Daiyo Kikai Seisakusho Co., Ltd.), heat and press at 170° C. and 6 MPa for 4 seconds, and connect over a width of 1 mm. Thus, a circuit connection structure (connection structure) was produced. In addition, at the time of connection, the adhesive bond film for circuit connection was arrange|positioned on the glass substrate so that the surface by the side of the 1st adhesive bond layer in the adhesive bond film for circuit connection might oppose a glass substrate.

<Evaluation of circuit connection structure>

[Particle fluidity evaluation]

About the obtained circuit connection structure, the particle|grain flow state of the resin oozing part of the adhesive agent film for circuit connection was evaluated using the microscope (trade name: ECLIPSE L200, manufactured by Nikon Corporation). Specifically, the produced circuit connection structure was observed under a microscope from the glass substrate side, and the particle state of the part which exuded outside the width|variety of the adhesive agent film for circuit connection was evaluated in three steps. The state in which the particles hardly move and there are no particles in the exuding part is 1, the state in which the particles are moving slightly but the connection between the particles is not seen, 2 is the state in which the particles are flowing and the connection between the particles is visible, and the state is 3 did.

[Evaluation of connection resistance value]

About the obtained circuit connection structure, the connection resistance value between the opposing electrodes immediately after connection and after a high temperature, high humidity test was measured with a multimeter. The high-temperature, high-humidity test was performed by leaving it to stand in a constant temperature and humidity chamber of 85 degreeC and 85 %RH for 200 hours. The connection resistance value was calculated|required as an average value of 16 resistance points between opposing electrodes.

[Peel evaluation]

The presence or absence of peeling in the circuit connection part of the circuit connection structure after a high temperature, high humidity test was evaluated using the microscope (brand name: ECLIPSE L200, the product made from Nikon Corporation). Specifically, the circuit-connected structure produced as described above was observed under a microscope from the glass substrate side, and the peeling state of the glass substrate and the adhesive film for circuit connection was evaluated in three stages. In the total area of the adhesive film for circuit connection, the ratio of peeling from the glass substrate was obtained, and the case in which peeling hardly occurred (the ratio of the peeling portion was less than 5% of the total) was A, and the peeling occurred in a small amount ( The thing in which the ratio of the peeling part is 5% or more of the whole and less than 20% of the whole) is B, and the thing in which peeling has generate|occur|produced (the ratio of the peeling part is 20% or more of the whole) was made into C.

(Examples 2-6 and Comparative Examples 1-2)

As a photocurable composition, except having used the photocurable compositions 2-8, it carried out similarly to Example 1, produced the adhesive film for circuit connection, and a circuit connection structure, It carried out similarly to Example 1, and evaluated the circuit connection structure. did The results are shown in Tables 3 and 4.

[Table 3]

[Table 4]

One… Adhesive film for circuit connection
2… first adhesive layer
3… second adhesive layer
4… conductive particles
10… circuit connection structure
12… Circuit electrode (first electrode)
13… first circuit member
15… Bump electrode (second electrode)
16… second circuit member
20… Adhesive Film Receiving Set
22… lack of accommodation
28… poet

Claims (11)

A first adhesive layer and a second adhesive layer laminated on the first adhesive layer,
The first adhesive layer is made of a cured product of the photocurable composition,
The second adhesive layer is made of a thermosetting composition,
The photocurable composition contains a polymerizable compound, a photoinitiator having an oxime ester structure, and conductive particles,
The adhesive film for circuit connection whose content of the said photoinitiator is 0.3-1.2 mass % on the basis of the total amount of components other than the electrically-conductive particle in the said photocurable composition. The method according to claim 1,
The adhesive film for circuit connection whose said polymeric compound is a radically polymerizable compound which has a radically polymerizable group. The method according to claim 1 or 2,
The adhesive film for circuit connection in which the said thermosetting composition contains the radically polymerizable compound which has a radically polymerizable group. 4. The method according to any one of claims 1 to 3,
The thickness of the said 1st adhesive bond layer is 0.1-0.8 times of the average particle diameter of the said electrically-conductive particle, The adhesive film for circuit connection. 5. The method according to any one of claims 1 to 4,
The adhesive film for circuit connection whose photoinitiator which has the said oxime ester structure is a compound which has a structure represented by following formula (VI).
[Formula 1]

[In formula (VI), R ¹¹ , R ¹² and R ¹³ each independently represent an organic group containing a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an aromatic hydrocarbon group.] A preparation process of preparing a first adhesive layer;
a lamination process of laminating a second adhesive layer made of a thermosetting composition on the first adhesive layer;
The preparatory step includes a step of curing the photocurable composition by irradiating light to the layer made of the photocurable composition to obtain the first adhesive layer,
The photocurable composition contains a polymerizable compound, a photoinitiator having an oxime ester structure, and conductive particles,
Content of the said photoinitiator is 0.3-1.2 mass % on the basis of the total amount of components other than the electrically-conductive particle in the said photocurable composition, The manufacturing method of the adhesive agent film for circuit connection. 7. The method of claim 6,
The said polymeric compound is a radically polymerizable compound which has a radically polymerizable group, The manufacturing method of the adhesive agent film for circuit connection. 8. The method according to claim 6 or 7,
The said thermosetting composition contains the radically polymerizable compound which has a radically polymerizable group, The manufacturing method of the adhesive agent film for circuit connection. 9. The method according to any one of claims 6 to 8,
The thickness of the said 1st adhesive bond layer is 0.1-0.8 times of the average particle diameter of the said electrically-conductive particle, The manufacturing method of the adhesive bond film for circuit connection. The adhesive film for circuit connection in any one of Claims 1-5 is interposed between the 1st circuit member which has a 1st electrode, and the 2nd circuit member which has a 2nd electrode, The said 1st circuit member and and thermocompression bonding the second circuit member to electrically connect the first electrode and the second electrode to each other. An adhesive film for circuit connection according to any one of claims 1 to 5, and a housing member for accommodating the adhesive film,
The accommodating member has a viewing unit that allows the inside of the accommodating member to be visually recognized from the outside,
The adhesive film accommodation set in which the transmittance|permeability of the light of wavelength 365nm in the said visual recognition part is 10 % or less.

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