JP2022095802A - Electronic component for plastic substrate connection, connector, connector manufacturing method and electronic component connection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component for plastic substrate connection to be connected to a flexible substrate with improved conductivity and adhesive strength.

SOLUTION: A drive circuit element 20 includes: input terminal rows 21 in which bumps 6 are arrayed along one of the side edges of a mounting surface 4a; and output terminal rows 22 in which bumps are arrayed along the other side edge. Different numbers of the input terminal rows and the output terminal rows are arrayed. When the input terminal rows and the output terminal rows are configured in one row, a plurality of bumps configuring a bump row are arranged in such a manner that mutually neighboring bumps are alternately arranged in a direction (a) orthogonal to an array direction (b). When the input terminal rows and the output terminal rows are configured in a plurality of rows, a plurality of bumps configuring one bump row arrayed on the most central side of the element are arranged in such a manner that the mutually neighboring bumps are alternately arranged in the direction orthogonal to the array direction. The plurality of bumps configuring the bump row in which the mutually neighboring bumps are alternately arranged in the direction orthogonal to the array direction are arranged such that a part of the neighboring bumps are overlapped in the array direction.

SELECTED DRAWING: Figure 11

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to an electronic component for connecting a plastic substrate connected to a flexible plastic substrate as a circuit board, a connector in which the electronic component for connecting the plastic substrate is connected to the flexible plastic substrate, and a connector. The present invention relates to a manufacturing method and a method of connecting electronic components for connecting a plastic substrate.

Conventionally, a liquid crystal display device or an organic EL panel has been used as various display means such as a television, a PC monitor, a mobile phone, a smart phone, a portable game machine, a tablet terminal, a wearable terminal, or an in-vehicle monitor. In recent years, in such a display device, a so-called COG (chip on glass) in which a drive IC is directly mounted on a glass substrate of a display panel has been adopted from the viewpoint of fine pitch, light weight and thinness.

For example, in a liquid crystal display panel in which a COG mounting method is adopted, as shown in FIGS. 8A and 8B, a transparent substrate 101 made of a glass substrate or the like has a transparent electrode 102 made of ITO (indium tin oxide) or the like. A plurality of them are formed, and electronic components such as a liquid crystal drive IC 103 are connected on these transparent electrodes 102. In the liquid crystal drive IC 103, a plurality of electrode terminals 104 corresponding to the transparent electrodes 102 are formed on the mounting surface, and the electrode terminals 104 are thermocompression bonded onto the transparent substrate 101 via the anisotropic conductive film 105. And the transparent electrode 102 are connected.

The anisotropic conductive film 105 is formed by mixing conductive particles with a binder resin to form a film, and by heat-pressing between two conductors, electrical conduction between the conductors is taken by the conductive particles. The binder resin maintains the mechanical connection between the conductors. As the adhesive constituting the anisotropic conductive film 105, a highly reliable thermosetting binder resin is usually used, but a photocurable binder resin or a photoheat-combined type binder resin may be used.

When connecting the liquid crystal drive IC 103 to the transparent electrode 102 via such an anisotropic conductive film 105, first, the anisotropic conductive film 105 is placed on the transparent electrode 102 of the transparent substrate 101 by a temporary crimping means (not shown). Temporarily paste. Subsequently, the liquid crystal drive IC 103 is mounted on the transparent substrate 101 via the anisotropic conductive film 105 to form a temporary connector, and then the liquid crystal drive IC 103 is anisotropic by a thermocompression bonding means such as a thermocompression bonding head 106. It is heated and pressed toward the transparent electrode 102 side together with the conductive film 105. By heating by the thermocompression bonding head 106, the anisotropic conductive film 105 causes a thermosetting reaction, whereby the liquid crystal driving IC 103 is adhered on the transparent electrode 102.

Japanese Unexamined Patent Publication No. 3-231437 Japanese Unexamined Patent Publication No. 2005-203758 Japanese Patent Application Laid-Open No. 2003-303852 Japanese Unexamined Patent Publication No. 2008-258494

In recent years, displays having curved surfaces have been proposed and partially put into practical use. In this type of flexible display, a flexible plastic substrate is used instead of glass as a base material, and various electronic components such as drive ICs are also mounted on the plastic substrate. COP (chip on plastic) using an anisotropic conductive film is also being studied as a method for mounting electronic components such as drive ICs on a plastic substrate.

However, since metal bumps are formed on IC chips such as drive ICs as connection terminals to the substrate, crimping similar to COG in the process of mounting electronic components on a plastic substrate using an anisotropic conductive film. When anisotropic conductive connection is performed under the conditions, a high pressing force is locally applied from the metal bump. Therefore, as shown in FIG. 9, the flexible plastic substrate 110 is bent with the metal bump 112 of the driving IC 111 sandwiching the conductive particles 107 at the apex. At this time, the bending of the plastic substrate 110 becomes larger than the height of the metal bump 112 due to the stiffness of the substrate itself, the position facing the metal bump 112 rises, and the plastic substrate 110 is formed on the metal bump 112 and the plastic substrate 110. Conductive particles cannot be sufficiently sandwiched between the transparent electrode and the transparent electrode.

Further, when the metal bump 112 is pressed against the plastic substrate 110 and the bending becomes large with respect to the height of the metal bump 112, conversely, the region where the metal bump 112 of the drive IC 111 is not provided and the plastic substrate 110 The distance between the two is narrowed, and the binder resin is excessively eliminated. Therefore, the connection strength between the plastic substrate 110 and the drive IC 111 is lowered as a whole.

Further, as shown in FIG. 10A, when the metal bump rows 114A to 114C in which a plurality of metal bumps 112 are arranged are arranged in parallel on the IC substrate 113 of the drive IC 111, the plastic substrate 110 bends. As a result, as shown in FIG. 10B, the plastic substrate 110 floats between the outer metal bump row 114A and the inner metal bump row 114C, and the continuity with the middle metal bump row 114B is impaired. There is a risk.

Further, in the process of mounting the electronic component on the plastic substrate using the anisotropic conductive film, the metal bump 112 is locally formed on the plastic substrate as shown in FIGS. 10A and 10B due to the pressing force at the time of crimping. There is a possibility that the plastic substrate 110 will be greatly bent by being pushed into the 110. In this case, cracks and peeling are likely to occur in the plastic substrate 110 of the portion corresponding to the metal bump row 114C arranged on the most central side of the IC substrate 113, and the continuity of the connection body obtained by this is impaired. There is a risk.

Here, as a method of suppressing bending of the plastic substrate as described above, for example, a method of using a drive IC in which a dummy bump is formed as in the technique described in Patent Document 2, a method of using a drive IC in which a dummy bump is formed, and a low pressure of the plastic substrate and the drive IC. A method of crimping with a plastic substrate or a method of thinning / hardening the adhesive layer when the plastic substrate has a structure in which a PET film, an adhesive layer, and a PI film are laminated can be considered.

However, when a drive IC on which a dummy bump is formed is used, the metal portion of the dummy bump is often made of a noble metal material (for example, gold), which increases the cost. Further, when using a drive IC in which dummy bumps are formed, it is necessary to increase the pressing force (thrust) at the time of crimping as compared with the case where a drive IC in which dummy bumps are not formed is used. The bending of the substrate becomes larger, and as a result, cracks and peeling are likely to occur in the plastic substrate.

Further, when the plastic substrate and the driving IC are crimped at a low pressure, it is required to use soft conductive particles. In this case, since the conductive particles are soft, the conductive particles do not bite into the terminals of the plastic substrate and the terminals of the drive IC less, and as a result, the conductivity may not be improved. Further, since it is required to use soft conductive particles, the characteristics of the binder resin used for the conductive film are limited.

Further, when the adhesive layer of the plastic substrate is thinned, the PET film and the PI film are easily peeled off. Further, when the adhesive layer of the plastic substrate is hardened, the flexibility of the plastic substrate may be impaired.

Therefore, the present invention is an electronic component for connecting a plastic substrate, which can improve conductivity and adhesive strength in an electronic component for connecting a plastic substrate connected to a flexible plastic substrate as a circuit board, and the electronic component for connecting the plastic substrate. It is an object of the present invention to provide a connector in which electronic components are connected to a flexible plastic substrate, a method for manufacturing the connector, and a method for connecting electronic components for connecting a plastic substrate.

Further, according to the present invention, in an electronic component for connecting a plastic substrate connected to a flexible plastic substrate as a circuit board, cracks and peeling of the plastic substrate are suppressed, and the substrate of the plastic substrate and the electronic component for connecting the plastic substrate are suppressed. Electronic components for connecting to a plastic substrate that can improve continuity with, a connector in which this electronic component for connecting a plastic substrate is connected to a flexible plastic substrate, a method for manufacturing the connector, and a plastic substrate connection. It is an object of the present invention to provide a method of connecting electronic components for use.

In order to solve the above-mentioned problems, the electronic component for connecting a plastic substrate according to the present invention includes a bump array in which a plurality of bumps are arranged along the side edges of the electronic component, and is anisotropic containing conductive particles. An electronic component for connecting a plastic substrate to be connected to a plastic substrate by a conductive adhesive, the input terminal array in which the bumps are arranged along one side edge of the mounting surface, and the other facing the one side edge. It has an output terminal row in which the bumps are arranged along the side edge of the above, the input terminal row and the output terminal row are arranged in a different number of rows, and the input terminal row and the output terminal row are composed of one row. If so, the plurality of bumps constituting the bump row are arranged alternately in the direction in which the adjacent bumps are orthogonal to the arrangement direction, and the input terminal row and the output terminal row are configured by the plurality of rows. If so, the plurality of bumps constituting one of the above-mentioned bump rows arranged on the most central side of the electronic component are arranged alternately in a direction in which adjacent bumps are orthogonal to the above-mentioned arrangement direction, and the above-mentioned adjacent bumps are arranged. The plurality of bumps constituting the bump row in which the bumps to be formed are alternately arranged in the direction orthogonal to the arrangement direction are arranged so that a part of the adjacent bumps overlaps in the above arrangement direction. However, the plastic substrate is a laminated body in which a cured adhesive layer is interposed, and is bent against a pressing force at the time of connection with the electronic component.

Further, the connector according to the present invention contains an electronic component having a bump row in which a plurality of bumps are arranged on the substrate, a plastic substrate in which a plurality of electrodes connected to the bumps are arranged, and conductive particles. It is provided with an anisotropic conductive adhesive that connects the electronic component and the plastic substrate, and the plastic substrate is a laminate in which a cured adhesive layer is interposed, and is used at the time of connection with the electronic component. The electronic component is bent with respect to a pressing force, and the electronic component is formed on an input terminal array in which the bumps are arranged along one side edge of the mounting surface and the other side edge facing the one side edge. When the output terminal row has the bumps arranged along the same, the input terminal row and the output terminal row are arranged in a different number of rows, and the input terminal row and the output terminal row are composed of one row. , When a plurality of bumps constituting the bump row are arranged alternately in a direction in which adjacent bumps are orthogonal to the arrangement direction, and the input terminal row and the output terminal row are composed of a plurality of rows. In the plurality of bumps constituting the one bump row arranged on the most central side of the electronic component, adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction, and the adjacent bumps are arranged with each other. The plurality of bumps constituting the bump rows arranged alternately in the direction orthogonal to the arrangement direction are arranged so that a part of the adjacent bumps overlaps in the arrangement direction.

Further, in the method for manufacturing a connector according to the present invention, an electronic component having a bump array in which a plurality of bumps are arranged on a substrate and a plastic substrate in which a plurality of electrodes connected to the bumps are arranged are conductive. The bump and the electrode are arranged so as to face each other via an anisotropic conductive adhesive containing sex particles, and the electronic component and the plastic substrate are crimped with a crimping tool, and the anisotropic conductive adhesion is performed. The plastic substrate has a step of curing the agent, and the plastic substrate is a laminate in which a cured adhesive layer is interposed, and is bent by a pressing force at the time of connection with the electronic component. Has an input terminal array in which the bumps are arranged along one side edge of the mounting surface, and an output terminal array in which the bumps are arranged along the other side edge facing the one side edge. , The input terminal row and the output terminal row are arranged in a different number of rows, and when the input terminal row and the output terminal row are composed of one row, a plurality of bumps constituting the bump row are adjacent bumps. When they are arranged alternately in a direction orthogonal to the arrangement direction, and the input terminal row and the output terminal row are composed of a plurality of rows, they are arranged on the most central side of the electronic component. The plurality of bumps constituting the above-mentioned bump row are arranged in which adjacent bumps are alternately arranged in a direction orthogonal to the above-mentioned arrangement direction, and the above-mentioned adjacent bumps are alternately arranged in a direction orthogonal to the above-mentioned arrangement direction. The plurality of bumps constituting the above are arranged so that a part of the adjacent bumps overlaps in the above-mentioned arrangement direction.

Further, in the method for connecting an electronic component according to the present invention, an electronic component having a bump array in which a plurality of bumps are arranged on a substrate and a plastic substrate in which a plurality of electrodes connected to the bumps are arranged are conductive. The bump and the electrode are arranged so as to face each other via an anisotropic conductive adhesive containing sex particles, and the electronic component and the plastic substrate are crimped with a crimping tool, and the anisotropic conductive adhesion is performed. The plastic substrate has a step of curing the agent, and the plastic substrate is a laminate in which a cured adhesive layer is interposed, and is bent by a pressing force at the time of connection with the electronic component. Has an input terminal array in which the bumps are arranged along one side edge of the mounting surface, and an output terminal array in which the bumps are arranged along the other side edge facing the one side edge. , The input terminal row and the output terminal row are arranged in a different number of rows, and when the input terminal row and the output terminal row are composed of one row, a plurality of bumps constituting the bump row are adjacent bumps. When they are arranged alternately in a direction orthogonal to the arrangement direction, and the input terminal row and the output terminal row are composed of a plurality of rows, they are arranged on the most central side of the electronic component. The plurality of bumps constituting the above-mentioned bump row are arranged in which adjacent bumps are alternately arranged in a direction orthogonal to the above-mentioned arrangement direction, and the above-mentioned adjacent bumps are alternately arranged in a direction orthogonal to the above-mentioned arrangement direction. The plurality of bumps constituting the above are arranged so that a part of the adjacent bumps overlaps in the above-mentioned arrangement direction.

According to the present invention, when the bump is pressed against the plastic substrate, the bump is elastically deformed, and the bending of the plastic substrate due to the local high-pressure pressing force applied by the bump is alleviated. Therefore, according to the present invention, the electrodes formed on the plastic substrate do not float with respect to the bumps of the electronic components, and the conductive particles are sufficiently sandwiched and have good conductivity.

Further, according to the present invention, the pressing force at the time of crimping between the electronic component and the plastic substrate can be dispersed, and the bending of the plastic substrate can be alleviated, so that cracking and peeling of the plastic substrate can be suppressed. Further, according to the present invention, since the bending of the plastic substrate can be alleviated, it is possible to prevent the electrodes formed on the plastic substrate from floating with respect to the bumps of the electronic components, and the conductive particles can be sufficiently sandwiched with the plastic substrate. The conductivity of electronic components with the substrate can be improved.

FIG. 1 is a schematic diagram showing a configuration of an organic EL display shown as an example of a connector to which the present invention is applied. FIG. 2 is a plan view showing a mounting surface of a drive circuit element shown as an example of an electronic component to which the present invention is applied. FIG. 3 is a cross-sectional view of a drive circuit element shown as an example of an electronic component to which the present invention is applied. FIG. 4 is a cross-sectional view of an organic EL display shown as an example of a connector to which the present invention is applied. 5A and 5B are views showing another drive circuit element shown as an example of an electronic component to which the present invention is applied. FIG. 5A is a plan view, FIG. 5B is a side view, and FIG. A'is a cross-sectional view. FIG. 6 is a cross-sectional view showing an anisotropic conductive film. FIG. 7 is a cross-sectional view of an organic EL display shown as an example of a connector to which the present invention is applied. 8A and 8B are views showing a conventional COG connection process, FIG. 8A is a cross-sectional view showing a state before the connection process, and FIG. 8B is a cross-sectional view showing a state during the connection process. FIG. 9 is a cross-sectional view showing a connection body in which a drive IC provided with a metal bump is connected to a plastic substrate. 10A and 10B are views showing a connecting body in which a driving IC having three rows of metal bumps is connected to a plastic substrate, where FIG. 10A is a plan view and FIG. 10B is a cross-sectional view. FIG. 11 is a plan view showing a mounting surface of a drive circuit element shown as an example of an electronic component to which the present invention is applied. FIG. 12 is a plan view showing the positional relationship of a plurality of electrode terminals constituting the output terminal array arranged on the most central side of the mounting surface of the drive circuit element shown in FIG. FIG. 13 is a plan view showing a mounting surface of a drive circuit element shown as an example of an electronic component to which the present invention is applied. FIG. 14 is a plan view showing another example of the positional relationship of a plurality of electrode terminals constituting the output terminal array arranged on the most central side of the mounting surface of the drive circuit element. FIG. 15 is a cross-sectional view taken along the line AA'of FIG.

Hereinafter, an electronic component for connecting a plastic substrate, a connecting body, a method for manufacturing the connecting body, and a method for connecting the electronic component to which the present invention is applied will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention. In addition, the drawings are schematic, and the ratio of each dimension may differ from the actual one. Specific dimensions, etc. should be determined in consideration of the following explanation. In addition, it goes without saying that parts having different dimensional relationships and ratios are included between the drawings.

[First Embodiment]
[Connector]
The connection body to which the present invention is applied can be used for any connection body in which a flexible substrate such as a plastic substrate and an electronic component are connected. For example, as shown in FIG. 1, an organic EL element can be used. A flexible organic electroluminescent color display (organic EL display) 1 in which a drive circuit element 3 which is a driver for displaying an image is mounted on a regularly arranged plastic substrate 2 can be exemplified. Further, the connecting body may be a so-called touch panel in which a display element such as an organic EL display and a position input device such as a touch pad are combined. In addition, the present invention can be applied to any connection body to which electronic components are connected if it is flexible. In addition, regardless of the use of the connector to which the present invention is applied, various monitors such as smart phones, tablets, televisions, vehicle navigation systems, wearable terminals, and other flexible electronic components are connected to each other. Anything with a body can be used for furniture, home appliances, daily necessities, etc.

[Plastic substrate]
In the plastic substrate 2, pixel drive circuits 9 such as organic TFTs and a plurality of organic EL elements 2R, 2G, and 2B are regularly arranged in a matrix on a substrate made of a flexible material such as PET or PEN. A display area 5 is formed in the display area 5, and signal lines and scanning lines for displaying an image are formed in the display area 5 in directions orthogonal to each other. In the organic EL display 1, for example, a pair of organic EL elements 2R, 2G, and 2B that emit red, green, and blue light constitutes one pixel. The organic layer on which the organic EL element is formed is covered with a protective layer and sealed with a sealing substrate via an adhesive layer.

Further, in the plastic substrate 2, electrodes of signal lines and scanning lines for displaying an image are drawn out from the outside of the display area 5, and a drive circuit element 3 which is a driver for displaying an image is connected to each electrode. The electrodes of the signal line and the scanning line connected to the drive circuit element 3 are arranged according to the arrangement of the bumps provided on the drive circuit element 3.

By using a light-transmitting material for the plastic substrate 2, the light of the organic EL element can be taken out from the back surface side of the substrate, and the plastic substrate 2 is photocured as an adhesive for connecting the drive circuit element 3 described later. By using a mold adhesive, it is possible to connect at low temperature and low pressure.

When a resin having poor heat resistance such as PET is used for the plastic substrate 2, a PI film having excellent heat resistance may be laminated with an adhesive to form an organic EL element on the PI film.

The elastic modulus of the plastic substrate 2 is determined in consideration of factors such as the flexibility required for the connecting body and the relationship between the flexibility and the connection strength with electronic components such as the drive circuit element 3 described later, but is generally 2000 MPa. It is set to ~ 4100 MPa. When an adhesive layer is interposed as the plastic substrate 2, the elastic modulus of the adhesive layer is generally 0.1 MPa to 1.0 MPa, and the adhesive layer is the most among the layers constituting the plastic substrate 2. soft. Therefore, the effect of bending of the plastic substrate 2 is likely to appear on the adhesive layer, and the deformation of the adhesive layer is directly linked to the deformation of the entire plastic substrate 2.

[Electronic components]
The drive circuit element 3 can perform a desired display by selectively applying a drive voltage to the pixels. Further, as shown in FIG. 2, the drive circuit element 3 has a plurality of electrode terminals 6 (bumps) conductively connected to each electrode of a signal line or a scanning line on the mounting surface 4a of the substrate 4 mounted on the plastic substrate 2. ) Is formed. On the mounting surface 4a of the substrate 4, for example, an input terminal row 7 in which electrode terminals 6 are arranged along one side edge of the mounting surface 4a is arranged in a row, and the other side edge facing one side edge is arranged. The output terminal rows 8 in which the electrode terminals 6 are arranged are arranged in a staggered manner in a plurality of rows, for example, three rows (8A, 8B, 8C). The electrode terminals 6 and the electrodes provided on the plastic substrate 2 are formed in the same number and at the same pitch, respectively, and are connected by aligning and connecting the plastic substrate 2 and the drive circuit element 3.

Further, as shown in FIG. 3, the electrode terminal 6 has an elastic member 6a provided on the substrate 4 of the drive circuit element 3 and a terminal portion 6b laminated on the elastic member 6a. As a result, as shown in FIG. 4, when the drive circuit element 3 is pressed against the plastic substrate 2, the electrode terminal 6 is elastically deformed, and the electrode terminal 6 locally applies a high pressure to the plastic substrate 2. Relieves bending. Therefore, in the organic EL display 1, the electrodes formed on the plastic substrate 2 do not float with respect to the electrode terminals 6 of the drive circuit element 3, and the conductive particles are sufficiently sandwiched and have good conductivity.

Further, in the organic EL display 1, since the bending of the plastic substrate 2 is suppressed, the distance between the plastic substrate 2 and the substrate 4 of the drive circuit element 3 in the region between terminals where the electrode terminals 6 are not provided is appropriately maintained. , Has strong connection strength without excessive removal of the binder resin.

The elastic member 6a constituting the electrode terminal 6 is made of a resin or a rubber material that elastically deforms when the drive circuit element 3 is mounted. Further, the terminal portion 6b laminated on the elastic member 6a and connected to each electrode of the plastic substrate 2 is made of a known electrode material such as Cu, Ag, and Au. In the case of a wiring material that is easily oxidized such as Cu, a protective layer such as Sn plating may be appropriately provided on the surface as an antioxidant measure.

Here, in the electrode terminal 6, if the elastic modulus of the elastic member 6a is too high, the bending of the plastic substrate 2 becomes large, which causes a decrease in conductivity and connection strength, and the plastic substrate 2 has a PI film and a PET film as an adhesive. When connected via a layer, the adhesive layer is deformed, resulting in poor connection at the electrode terminal 6. Further, when the elastic modulus of the elastic member 6a is too low, the electrode terminal 6 cannot compress the conductive particles 11 to the extent that sufficient conductivity is ensured, and the conductive particles 11 are insulated and coated. It cannot break through the insulating film and impairs conductivity. Therefore, the elastic modulus of the elastic member 6a is set in consideration of relaxation of bending of the plastic substrate 2, conductivity, and connection strength, and is, for example, 2 to 8 GPa, preferably 3 to 7 GPa.

As shown in FIG. 3, the plurality of electrode terminals 6 are formed by independently laminating the terminal portions 6b on the elastic members 6a. The electrode terminal 6 shown in FIG. 3 is a known film forming method such as plating or printing after the elastic member 6a is formed by supplying a rubber material to the mounting surface 4a of the substrate 4 of the drive circuit element 3 by a dispenser or the like. It can be formed by laminating the terminal portions 6b.

The electrode terminal 6 shown in FIG. 3 is an adjacent electrode due to elastic displacement of the elastic member 6a due to the pressure of a thermal crimping head (not shown) when the plastic substrate 2 and the drive circuit element 3 are ACF-connected. Since the distance from the terminals 6 is narrowed, it is desirable to parallel them at a distance necessary to prevent a short circuit between the terminals.

Further, as shown in FIG. 5, the electrode terminal 6 may have a plurality of terminal portions 6b laminated on a rectangular elastic member 6a formed on the substrate 4. 5 (B) is a side view of the drive circuit element 3 shown in FIG. 5 (A), and FIG. 5 (C) is a sectional view taken along the line AA'of the drive circuit element 3 shown in FIG. 5 (A). The terminal portions 6b are laminated in a striped shape at predetermined intervals in the longitudinal direction of the elastic member 6a formed in a rectangular shape. The electrode terminal 6 shown in FIG. 5 also has the terminal portion 6b laminated by a known film forming method such as plating or printing after the elastic member 6a is formed on the mounting surface 4a of the substrate 4 of the drive circuit element 3. Can be formed.

Further, in the electrode terminal 6 shown in FIG. 5, even when the terminal portions 6b are formed at a narrow pitch, the adjacent terminal portions 6b do not come into contact with each other due to the elastic displacement of the elastic member 6a, resulting in a short circuit between the terminals. Can be prevented.

[Animate conductive film]
The drive circuit element 3 has an anisotropic conductive film (ACF) 10 as a circuit connection adhesive in a region outside the display region 5 of the plastic substrate 2 provided with electrodes for signal lines and scanning lines. Is connected using. The anisotropic conductive film 10 contains the conductive particles 11, and the electrode terminals 6 of the drive circuit element 3 and the electrodes formed on the plastic substrate 2 are electrically connected via the conductive particles 11. It is a thing. The anisotropic conductive film 10 is thermocompression-bonded by a thermocompression-bonding head to fluidize the binder resin, and the conductive particles 11 are crushed between the electrode of the plastic substrate 2 and the electrode terminal 6 of the drive circuit element 3. In this state, the binder resin is cured. As a result, the anisotropic conductive film 10 electrically and mechanically connects the plastic substrate 2 and the drive circuit element 3.

As shown in FIG. 6, the anisotropic conductive film 10 is usually formed with a binder resin layer (adhesive layer) 13 containing conductive particles 11 formed on a release film 12 as a base material. The anisotropic conductive film 10 is a heat-curable adhesive or a photocurable adhesive such as ultraviolet rays, and is attached onto an electrode formed on a plastic substrate 2 of an organic EL display 1 and mounted on a drive circuit element 3. The conductive particles 11 are fluidized by being heat-pressurized by the heat-bonding head, and are crushed between the electrodes of the plastic substrate 2 facing each other and the electrode terminals 6 of the drive circuit element 3, and heated or irradiated with ultraviolet rays. As a result, the conductive particles 11 are cured in a crushed state. Thereby, the anisotropic conductive film 10 can connect the plastic substrate 2 and the drive circuit element 3 and make them conductive.

Further, in the anisotropic conductive film 10, the conductive particles 11 are dispersed in a normal binder resin layer 13 containing a film-forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, and the like.

The release film 12 that supports the binder resin layer 13 is, for example, a release agent such as silicone applied to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene) and the like. It is coated to prevent the anisotropic conductive film 10 from drying and to maintain the shape of the anisotropic conductive film 10.

As the film-forming resin contained in the binder resin layer 13, a resin having an average molecular weight of about 10,000 to 80,000 is preferable. Examples of the film-forming resin include various resins such as epoxy resin, modified epoxy resin, urethane resin, and phenoxy resin. Of these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability and the like.

The thermosetting resin is not particularly limited, and examples thereof include commercially available epoxy resins and acrylic resins.

The epoxy resin is not particularly limited, but for example, a naphthalene type epoxy resin, a biphenyl type epoxy resin, a phenol novolac type epoxy resin, a bisphenol type epoxy resin, a stillben type epoxy resin, a triphenol methane type epoxy resin, and a phenol aralkyl type epoxy resin. , Naftor type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. These may be used alone or in combination of two or more.

The acrylic resin is not particularly limited, and an acrylic compound, a liquid acrylate, or the like can be appropriately selected depending on the intended purpose. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethyloltricyclodecanediacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-. 1,3-Diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples thereof include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what made acrylate into methacrylate can also be used. These may be used alone or in combination of two or more.

The latent curing agent is not particularly limited, and examples thereof include various curing agents such as a heat curing type and a UV curing type. The latent curing agent does not normally react, but is activated by various triggers selected according to the application such as heat, light, and pressurization to initiate the reaction. The method of activating the heat-active latent curing agent is a method of generating active species (cations, anions, radicals) by a dissociation reaction by heating, and a method of stably dispersing in an epoxy resin near room temperature and epoxy at a high temperature. There are a method of incompatible / dissolving with a resin to start a curing reaction, a method of eluting a molecular sieve-encapsulated type curing agent at a high temperature to start a curing reaction, a method of eluting / curing with microcapsules, and the like. Thermally active latent curing agents include imidazole type, hydrazide type, boron trifluoride-amine complex, sulfonium salt, amineimide, polyamine salt, dicyandiamide and the like, and modified products thereof. The above mixture may be used. Of these, a microcapsule type imidazole-based latent curing agent is preferable.

The silane coupling agent is not particularly limited, and examples thereof include epoxy-based, amino-based, mercapto-sulfide-based, and ureido-based. By adding the silane coupling agent, the adhesiveness at the interface between the organic material and the inorganic material is improved.

[Conductive particles]
Examples of the conductive particles 11 include any known conductive particles used in the anisotropic conductive film 10. Examples of the conductive particles 11 include particles of various metals such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, and gold, particles of metal alloys, metal oxides, carbon, graphite, glass, and ceramics. Examples thereof include those in which the surface of particles such as plastic is coated with metal, and those in which the surface of these particles is further coated with an insulating thin film. When the surface of the resin particles is coated with a metal, the resin particles include, for example, epoxy resin, phenol resin, acrylic resin, acrylonitrile / styrene (AS) resin, benzoguanamine resin, divinylbenzene resin, styrene resin and the like. Particles can be mentioned.

The shape of the anisotropic conductive film 10 is not particularly limited, but for example, as shown in FIG. 6, the shape of the anisotropic conductive film 10 is cut by a predetermined length by forming a long tape shape that can be wound around the take-up reel 14. Can be used.

Further, in the above-described embodiment, as the anisotropic conductive film 10, an adhesive film obtained by molding a thermosetting resin composition containing conductive particles 11 in a binder resin layer 13 into a film shape has been described as an example. The adhesive according to the present invention is not limited to this, and has, for example, a structure in which an insulating adhesive layer made of only a binder resin and a conductive particle-containing layer made of a binder resin layer 13 containing conductive particles 11 are laminated. can do. Further, as the adhesive for connecting the drive circuit element 3, in addition to the anisotropic conductive film 10 formed in the form of a film, the anisotropic conductive paste in which the conductive particles 11 are dispersed in the paste-like binder resin. But it may be.

[Connection process]
Next, a connection process for connecting the drive circuit element 3 to the plastic substrate 2 will be described. First, the anisotropic conductive film 10 is temporarily attached on the connection region provided with the electrodes of the signal lines and the scanning lines outside the display region 5 of the plastic substrate 2. Next, the plastic substrate 2 is placed on the stage of the connecting device, and the drive circuit element 3 is arranged on each electrode of the plastic substrate 2 via the anisotropic conductive film 1.

Next, the binder resin layer 13 is thermally pressurized from above the drive circuit element 3 at a predetermined pressure and time by a thermocompression bonding head heated to a predetermined temperature. As a result, the binder resin layer 13 of the anisotropic conductive film 10 exhibits fluidity and flows out from between the substrate 4 of the drive circuit element 3 and the plastic substrate 2, and the conductive particles 11 in the binder resin layer 13 are separated from each other. It is sandwiched between the electrode terminal 6 of the drive circuit element 3 and the electrode of the plastic substrate 2 and crushed.

As a result, the conductive particles 11 are electrically connected by sandwiching the conductive particles 11 between the electrode terminal 6 of the drive circuit element 3 and the electrode of the plastic substrate 2, and the binder resin heated by the thermocompression bonding head is cured in this state. do. This makes it possible to manufacture the organic EL display 1 in which the continuity is ensured between the drive circuit element 3 and the plastic substrate 2.

The conductive particles 11 that are not between the electrode terminals 6 of the drive circuit element 3 and the electrodes of the plastic substrate 2 are dispersed in the binder resin between the adjacent electrode terminals 6 and maintain an electrically insulated state. There is. As a result, electrical conduction is achieved only between the electrode terminal 6 of the drive circuit element 3 and the electrode of the plastic substrate 2. By using a radical polymerization reaction system, which is a fast-curing type, as the binder resin, the binder resin can be quickly cured even with a short heating time. Further, the anisotropic conductive film 10 is not limited to the thermosetting type, and a photocurable type or a photothermal combined type adhesive may be used.

Further, as described above, the plastic substrate 2 is bent due to the local high-pressure pressing force applied by the electrode terminal 6 due to the elastic displacement of the electrode terminal 6 of the drive circuit element 3 due to the pressing of the thermocompression bonding head. Has been relaxed. Therefore, in the organic EL display 1, the electrodes formed on the plastic substrate 2 do not float with respect to the electrode terminals 6 of the drive circuit element 3, and the conductive particles 11 are sufficiently sandwiched and have good conductivity.

Further, in the organic EL display 1, since the bending of the plastic substrate 2 is suppressed, the distance between the plastic substrate 2 and the substrate 4 of the drive circuit element 3 in the region between terminals where the electrode terminals 6 are not provided is appropriately maintained. , Has strong connection strength without excessive removal of the binder resin.

[Minimum distance between terminal rows]
Here, as described above, in the drive circuit element 3, a plurality of output terminal rows 8 in which a plurality of electrode terminals 6 are arranged are formed in a direction orthogonal to the arrangement direction of the electrode terminals 6. Then, as shown in FIG. 7, the organic EL display 1 has an area between one output terminal row 8 and an output terminal row 8 adjacent to the one output terminal row 8 or an opposite input terminal row 7. The minimum distance D between the substrate 4 of the drive circuit element 3 and the plastic substrate 2 is preferably 80% or more of the height H of the electrode terminal 6 from the substrate 4 after connection, and more preferably larger than 80%. preferable. As a result, in the organic EL display 1, bending of the plastic substrate 2 is alleviated, and the distance between the plastic substrate 2 and the substrate 4 of the drive circuit element 3 is maintained at an appropriate level, so that the binder resin is excessively eliminated. Has a strong connection strength.

Further, in the organic EL display 1, the distance D between the substrate 4 of the drive circuit element 3 and the plastic substrate 2 is minimized between the adjacent output terminal rows 8 and 8 or between the input / output terminal rows 7 and 8. It is preferable to have 80% or more of the height H of the electrode terminal 6 from the substrate 4 after connection. In the middle between the output terminal rows 8 and 8 of the drive circuit element 3 or between the input / output terminal rows 7 and 8, the plastic substrate 2 is most likely to bend, and the binder resin is easily removed. The minimum distance D between the substrate 4 of the drive circuit element 3 and the plastic substrate 2 between the output terminal rows 8 and 8 or between the input / output terminal rows 7 and 8 is from the substrate 4 of the electrode terminal 6 after connection. When the height H is 80% or more, preferably larger than 80%, the removal of the binder resin is suppressed, and a strong connection strength can be provided.

[Second Embodiment]
[Connector]
The connector according to the second embodiment can be used for a connector in which a flexible substrate such as a plastic substrate and an electronic component are connected. As the connector according to the second embodiment, for example, as shown in FIG. 1, a flexible organic electroluminescent color display 1 in which a drive circuit element 20 as an electronic component is mounted on a plastic substrate 2 can be exemplified.

The plastic substrate 2 has the same meaning as the plastic substrate 2 described in the connection body according to the first embodiment described above, and the preferred range is also the same.

The drive circuit element 20 can perform a desired display by selectively applying a drive voltage to the pixels. As shown in FIG. 11, the drive circuit element 20 has an input terminal row 21 and an output terminal row 22 (in which a plurality of electrode terminals (bumps) 6 are arranged on the mounting surface 4a of the substrate 4 mounted on the plastic substrate 2). 22A to 22C). As the electrode terminal 6, for example, a copper bump, a gold bump, a copper bump plated with gold, or the like can be used.

In the input terminal row 21, a plurality of electrode terminals 6 are arranged along one side edge 4b of the mounting surface 4a of the substrate 4, and adjacent electrode terminals 6 are arranged in the arrangement direction of the electrode terminals 6 (in FIG. 11). B direction) and the direction orthogonal to the direction (a direction in FIG. 11, hereinafter also referred to as the bump row direction) are arranged alternately. Further, the plurality of electrode terminals 6 constituting the input terminal row 21 are arranged so that a part of the electrode terminals 6 adjacent to each other in the arrangement direction of the electrode terminals 6 overlap each other.

In the output terminal row 22, a plurality of electrode terminals 6 are arranged along the other side edge 4c facing the one side edge 4b of the mounting surface 4a of the substrate 4. The output terminal row 22 is formed of one or more in a direction orthogonal to the arrangement direction of the electrode terminals 6. For example, as shown in FIG. 11, when the output terminal rows 22 are formed by a plurality of (three rows; 22A, 22B, 22C), the output terminal rows 22C (hereinafter referred to as the output terminal rows 22C) arranged on the most central side of the drive circuit element 20. , Also referred to as a specific bump row), the adjacent electrode terminals 6 are arranged alternately in a direction orthogonal to the arrangement direction of the electrode terminals 6. Further, the plurality of electrode terminals 6 constituting the output terminal row 22C are arranged so that a part of the adjacent electrode terminals 6 overlaps with each other in the arrangement direction of the electrode terminals 6.

It is preferable that the plurality of electrode terminals 6 constituting the specific bump row do not have too small overlap in the bump row direction between the electrode terminals 6 adjacent to each other in the arrangement direction of the electrode terminals 6. That is, it is preferable that the distance between the electrode terminals 6 adjacent to each other in the arrangement direction of the electrode terminals 6 in the direction orthogonal to the arrangement direction is not too large. If the distance between the plurality of electrode terminals 6 constituting the specific bump row in the bump row direction is too large (for example, if the adjacent electrode terminals 6 do not overlap in the bump row direction), the pressurizing tool for anisotropic connection can be used. There is a concern that the pressing force will be uneven.

Further, in the plurality of electrode terminals 6 constituting the specific bump row, the electrode terminals 6 adjacent to each other in the arrangement direction of the electrode terminals 6 overlap each other in the bump row direction from the viewpoint of more effectively relaxing the bending of the plastic substrate 2. It is preferable that it is not too large.

As described above, by using the drive circuit element 20 including the input terminal row 21 and the output terminal row 22C formed so that the bump region actually connected becomes larger in the bump row direction, the bending base point of the plastic substrate 2 is used. The positions of the conductive particles captured by each of the bumps are appropriately dispersed in the bump row direction. As a result, the pressing force at the time of crimping between the driving element 20 and the plastic substrate 2 can be dispersed, the bending of the plastic substrate 2 can be alleviated, and cracks and peeling of the plastic substrate 2 can be suppressed. Further, since the bending of the plastic substrate 2 can be alleviated, it is possible to prevent the electrodes formed on the plastic substrate 2 from floating with respect to the electrode terminals 6 of the drive circuit element 20. As a result, the conductive particles can be sufficiently sandwiched, and the conductivity between the plastic substrate 2 and the substrate 4 of the driving element 20 can be improved.

In particular, it is preferable that the plurality of electrode terminals 6 constituting the specific bump row satisfy the following formula (1). If the overlap of the electrode terminals 6 in the bump row direction is too large, it tends to be difficult to alleviate the bending of the plastic substrate 2. Therefore, it is preferable that the distance between the electrode terminals 6 adjacent to each other in the arrangement direction of the electrode terminals 6 in the direction orthogonal to the arrangement direction is equal to or more than the distance between the electrode terminals 6. As a result, cracks and peeling of the plastic substrate 2 can be more effectively suppressed, and the conductivity between the plastic substrate 2 and the substrate 4 of the driving element 20 can be improved.
(1) S ≦ L

In the formula (1), S represents the distance between one electrode terminal 6 constituting the specific bump row and another electrode terminal 6 adjacent to one electrode terminal in the arrangement direction of the electrode terminals 6. For example, in the output terminal row 22C shown in FIG. 12, the distance S between the electrode terminal 6A and the electrode terminal 6B or the electrode terminal 6C adjacent to the electrode terminal 6A in the arrangement direction of the electrode terminals is set to S in the equation (1). Equivalent to.

If the distance S in the arrangement direction of the electrode terminals 6 is too small, the distance between the bumps becomes too narrow, which may induce a short circuit between the terminals due to the connection of the conductive particles. For the same reason, it is preferable to provide a certain distance or more in any direction as well as the distance in the arrangement direction of the electrode terminals 6. In a specific bump row, the occurrence of the shortest is most concerned. Therefore, in the specific bump row, the direction perpendicular to the arrangement direction of the electrode terminals 6 between one electrode terminal 6 and the other electrode terminals 6 adjacent to the one electrode terminal 6 rather than the distance S in the arrangement direction of the electrode terminals 6. By increasing the deviation distance L, it is possible to easily avoid a short circuit (short circuit between terminals) at the distance S in the specific bump row.

In the formula (1), L is a deviation in the direction orthogonal to the arrangement direction of the electrode terminals 6 between one electrode terminal 6 constituting the specific bump row and the other electrode terminals 6 adjacent to the one electrode terminal 6. Represents a distance. For example, in the output terminal row 22C shown in FIG. 12, the distance L between one end of the electrode terminal 6A and one end of the electrode terminal 6B or the electrode terminal 6C adjacent to the electrode terminal 6A is orthogonal to the arrangement direction of the electrode terminals. , Corresponds to L in equation (1).

As described above, when the plurality of electrode terminals 6 constituting the specific bump row satisfy the equation (1), the length of the bump region in the bump row direction becomes large, which becomes the base point of bending of the plastic substrate 2. The positions of the conductive particles captured by the bumps are likely to be appropriately dispersed in the bump row direction. Here, the bump region refers to the entire region having a plurality of bump rows when there are a plurality of bump rows as in the output terminal rows 22A to 22C shown in FIG. 11, for example. As a result, the pressing force at the time of crimping between the drive circuit element 20 and the plastic substrate 2 can be more uniformly dispersed, and the bending of the plastic substrate 2 can be more effectively relaxed. Further, since the bending of the plastic substrate 2 can be alleviated, it is possible to more effectively prevent the electrodes formed on the plastic substrate 2 from floating with respect to the electrode terminals 6 of the drive circuit element 20, and as a result, the conductivity is increased. Can hold particles sufficiently. Therefore, it is possible to more effectively suppress cracks and peeling of the plastic substrate 2 and improve the conductivity between the plastic substrate 2 and the substrate 4 of the drive circuit element 20.

The output terminal rows 22A and 22B other than the output terminal rows 22C arranged on the most central side of the drive circuit element 20 may be arranged in a row in the arrangement direction of the electrode terminals 6, for example, as shown in FIG. can. Further, in the output terminal rows 22A to 22C, for example, as shown in FIG. 11, the spacing between the output terminal rows in the direction orthogonal to the arrangement direction of the electrode terminals 6 is substantially the same.

Further, as shown in FIG. 13, the drive circuit element 20 has a signal or the like between the input terminal row 21 and the output terminal row 22 within a range where restrictions such as bump layout, manufacturing manpower, and cost are allowed. A dummy bump row 24 in which a plurality of dummy bumps 23 not used for input / output are arranged may be formed.

The configuration of the drive circuit element 20 may be appropriately changed as long as the crack and peeling of the plastic substrate 2 can be suppressed and the conductivity between the plastic substrate 2 and the substrate 4 of the drive element 20 can be improved. For example, the number of output terminal rows 22 formed in the drive circuit element 20 may be singular. In this case, the single output terminal row 22 corresponds to the above-mentioned specific bump row. Further, the input terminal row 21 may be arranged in a single row in the same manner as the output terminal rows 22A and 22B, instead of arranging the plurality of electrode terminals 6 in a staggered manner as shown in FIG. Further, the arrangement of the output terminal rows 22A and 22B may be staggered in the same manner as the output terminal rows 22C.

As shown in FIG. 12, for example, the bump rows arranged alternately include one electrode terminal (electrode terminal 6A) and another electrode terminal further adjacent to the electrode terminal (electrode terminal 6C) adjacent to one electrode terminal. The position in the bump row direction may be the same as that of (electrode terminal 6D). Further, the bump rows arranged alternately are adjacent to one electrode terminal (electrode terminal 6E) and one electrode terminal so as to be wavy within a range satisfying the equation (1), for example, as shown in FIG. The position in the bump row direction may be different from that of another electrode terminal (electrode terminal 6G) further adjacent to the electrode terminal (electrode terminal 6F). That is, L1 and L2 shown in FIG. 14 may be different as long as the equation (1) is satisfied.

Further, as shown in FIG. 15, for example, the bump rows arranged alternately are further adjacent to the height of one electrode terminal (electrode terminal 6H) and the electrode terminal (electrode terminal 6I) adjacent to one electrode terminal. The height may be the same as or different from that of the other electrode terminals (electrode terminal 6J).

When there are a plurality of bump rows, it is preferable that the alternating bump rows protrude inward (center portion side) in the width direction of the driving element 20 (IC chip). By setting the distance between the plurality of bump rows to a certain level or more, it is possible to more effectively suppress the occurrence of short circuits. In the anisotropic connection, generally, the substantially central portion in the width direction of the driving element 20 (IC chip) is pressed, so that the resin flows outward from the substantially central portion in the width direction. That is, by arranging the bumps of the bump row that receive the flow of the resin relatively strongly in a staggered manner, it is possible to easily avoid the connection of the conductive particles (that is, the occurrence of a short circuit) due to the flow of the resin. That is, in one bump constituting the bump row and another bump adjacent to this one bump, the region overlapping in the bump row direction (overlap in the bump row direction) is reduced to connect the conductive particles. It can be easier to avoid.

For the same reason, it is preferable that the distance between the arbitrary bump and the bump in all directions adjacent to the arbitrary bump is kept above a certain level. This distance is not particularly limited, but for example, it is preferable that the distance between bumps between the narrowest bump rows is the shortest distance between bumps in all directions.

In addition, the array of bump rows may be regular or irregular as long as the stress from the pressurizing tool on the back of the electronic component is uniformly transmitted to the bumps during anisotropic connection. There may be. Since the bump arrangement is regular, the design can be simplified, and the cost can be reduced from the viewpoint of suppressing the manufacturing yield. Further, since the bump arrangement is irregular, a bump layout that can easily meet the demand for high integration becomes possible. Such high integration is required when there is a strong demand for miniaturization, such as wearable terminals.

As shown in FIG. 1, for example, the drive circuit element 20 is connected to a region outside the display region 5 of the plastic substrate 2 by using an anisotropic conductive adhesive. As the anisotropic conductive adhesive, for example, an anisotropic conductive film containing conductive particles can be used. The anisotropic conductive film and the conductive particles are synonymous with the anisotropic conductive film 10 and the conductive particles 11 described in the connector according to the first embodiment described above, and the preferred range is also the same.

Further, the electrode terminals 6 provided on the drive circuit element 20 and the electrodes provided on the plastic substrate 2 are formed in the same number and at the same pitch, and the plastic substrate 2 and the drive circuit element 20 are aligned and connected to each other. Will be done.

[Manufacturing method of connector]
The method for manufacturing a connector according to the second embodiment is, for example, a drive circuit element 20 having an output terminal row 22 in which a plurality of electrode terminals 6 are arranged on a substrate 4, and a plurality of drive circuit elements 20 connected to the electrode terminals 6. The plastic substrate 2 in which the electrodes are arranged is arranged so that the electrode terminals 6 and the electrodes of the plastic substrate 2 face each other via an adhesive, and the drive circuit element 20 and the plastic substrate 2 are crimped by a crimping tool. At the same time, it has a step of curing the adhesive. The connection step of connecting the drive circuit element 20 to the plastic substrate 2 can be performed in the same manner as the connection step described in the first embodiment described above.

According to the method for manufacturing a connector according to the second embodiment, by using the drive circuit element 20 provided with the output terminal row 22C, the pressing force at the time of crimping between the drive circuit element 20 and the plastic substrate 2 is dispersed. , The bending of the plastic substrate 2 can be alleviated. As a result, cracks and peeling of the plastic substrate 2 can be suppressed. Further, since the bending of the plastic substrate 2 can be alleviated, it is possible to prevent the electrodes formed on the plastic substrate 2 from floating with respect to the electrode terminals 6 of the drive circuit element 20. As a result, the conductive particles can be sufficiently sandwiched, and the conductivity between the plastic substrate 2 and the substrate 4 of the driving element 20 can be improved.

Next, examples of the present invention will be described. In this embodiment, an anisotropic conductive film is used to form a sample of a connector in which an evaluation element is connected to a plastic substrate, and the minimum distance between the plastic substrate and the substrate of the evaluation element, conductivity, and short circuit between terminals are formed. Incidence rate (ppm) was measured and evaluated. As the anisotropic conductive film, a general-purpose anion-based film in which conductive particles having an average particle diameter of 3.0 μm were dispersed was used. The crimping conditions for the evaluation element are 200 ° C., 10 and 100 MPa, and 5 seconds.

For the plastic substrate to which the evaluation element is ACF-connected, a PI film having excellent heat resistance is bonded to a transparent PET film with an insulating adhesive. The thickness of each layer of the plastic substrate is PI film: 10 μm, adhesive: 30 μm, PET film: 75 μm. The plastic substrate has an electrode formed on the PI film to be connected to the electrode terminal of the evaluation element. The elastic modulus of the entire plastic substrate is 3500 MPa, and the elastic modulus of the adhesive layer is 0.13 MPa.

In the evaluation element, an input terminal array in which electrode terminals are arranged along one side edge of a mounting surface on a plastic substrate is arranged in a row, and electrode terminals are arranged along the other side edge facing one side edge. The output terminal rows in which are arranged are arranged in a staggered manner in three rows. The wiring pitch of the electrode terminals is L / S = 16/14 (μm).

[Example 1]
In the first embodiment, as the electrode terminals constituting the terminal row, an evaluation element is used in which a plurality of terminal portions are laminated in a striped shape by subjecting the surface of a rectangular rubber member with Ag plating along the longitudinal direction. (See Fig. 5). The electrode terminals of the evaluation element according to the first embodiment have an elastic modulus of 5 GPa, a height before pressing of 17 μm, a height of 16 μm when pressed at 10 MPa, and a height of 13 μm when pressed at 100 MPa. there were.

[Example 2]
In the second embodiment, as the electrode terminals constituting the terminal row, an evaluation element in which the terminal portions are laminated by applying Ag plating to the surface of each rubber member was used (see FIG. 3). The electrode terminals of the evaluation element according to the second embodiment have an elastic modulus of 5 GPa, a height before pressing of 17 μm, a height of 16 μm when pressed at 10 MPa, and a height of 13 μm when pressed at 100 MPa. there were.

[Comparative Example 1]
In Comparative Example 1, an evaluation element having Au stud bumps formed was used as the electrode terminals constituting the terminal row (see FIG. 9). The electrode terminal of the evaluation element according to Comparative Example 1 has an elastic modulus of 82 GPa, a height before pressing is 15 μm, a height when pressed at 10 MPa is 15 μm, and a height when pressed at 100 MPa is 15 μm. there were.

After temporarily attaching an anisotropic conductive film to a plastic substrate, an evaluation element was mounted while maintaining alignment, and a thermocompression bonding head was used for thermocompression bonding under the above conditions to prepare a connected sample. For each connection sample, the minimum distance between the plastic substrate and the substrate of the evaluation element, the conductivity, and the occurrence rate (ppm) of short circuit between terminals were measured and evaluated.

The minimum distance between the plastic substrate and the substrate of the evaluation element was determined by cutting the connector sample between the input terminal row and the output terminal row and observing the cross section. In the continuity evaluation, when the average conduction resistance value was less than 2.0Ω, it was evaluated as 〇 (good), when it was 2.0Ω or more and less than 5.0Ω, it was evaluated as Δ (normal), and when it was 5Ω or more, it was evaluated as × (defective).

As shown in Table 1, in the connection sample according to Examples 1 and 2, the minimum distance between the plastic substrate and the substrate of the evaluation element was 12 μm or more even when pressed at 100 MPa. This is because the bending of the plastic substrate is alleviated by the elastic deformation of the electrode terminals of the evaluation element according to Examples 1 and 2. Further, in the connected body samples according to Examples 1 and 2, the minimum distance is 80% or more of the height of the electrode terminals after connection (Example 1: 13 μm, Example 2: 13 μm), and thus bending. Can be seen to be relaxed. Therefore, in the connection sample according to Examples 1 and 2, the electrodes formed on the plastic substrate can sandwich the conductive particles without floating from the electrode terminals of the evaluation element, and have good conductivity. ..

Further, in the connection sample according to Examples 1 and 2, the minimum distance between the plastic substrate and the substrate of the evaluation element is 14 μm even when pressed at 10 MPa, and the height of the electrode terminal (16 μm) is 80. Since it was% or more, bending was alleviated and the conduction resistance value was suppressed to less than 5Ω.

Further, in the connection sample according to Examples 1 and 2, since the minimum distance between the plastic substrate and the substrate of the evaluation element is 12 μm or more, the binder resin is not removed more than necessary, and the connection strength is good. Was to play.

On the other hand, in the connector sample according to Comparative Example 1, the minimum distance between the plastic substrate and the substrate of the evaluation element was 12 μm even when pressed at 10 MPa. This is because the plastic substrate was greatly bent by the Au bump, and the distance between the two substrates was rather narrowed. Then, due to the large bending of the plastic substrate, the electrodes of the plastic substrate were lifted from the Au bumps, and the conductive particles could not be sufficiently sandwiched. Therefore, in the connected body sample according to Comparative Example 1, the conduction resistance value was 5 Ω or more.

Further, in the connected body sample according to Comparative Example 1, by increasing the pressing force to 100 MPa, the bending of the plastic substrate is further increased, and the adhesive layer of the plastic substrate is deformed to conduct conduction with the evaluation element. It became difficult to take.

Comparing Example 1 and Example 2, in Example 1 in which the terminal portions are laminated in a striped pattern over the longitudinal direction of the rectangular elastic member, the elastic members are independently provided and the terminals are provided. The incidence of short circuits between the electrode terminals was lower than that of Example 2 in which the portions were laminated. This is because in Example 1, since the space between the electrode terminals is filled with an elastic member, it is rare that the conductive particles are continuous between the terminal parts, whereas in Example 2, they are provided independently. When the electrode terminal portion is pressed, it expands in the width direction, and the space between the terminals is narrowed. Therefore, a continuous situation in which the conductive particles are continuous in the narrowed area between the terminals is more likely to occur as compared with the first embodiment. Because it became.

1 organic EL display, 2 plastic substrate, 3 drive circuit element, 4 substrate, 5 display area, 6 electrode terminal, 6a elastic member, 6b terminal part, 7 input terminal row, 8 output terminal row, 10 anisotropic conductive film, 11 Conductive particles, 12 Release film, 13 Binder resin, 20 Drive circuit elements, 21 Input terminal rows, 22 Output terminal rows, 23 Dummy bumps, 24 Dummy bump rows

Claims (9)

An electronic component for connecting a plastic substrate, which has a bump row in which a plurality of bumps are arranged along the side edges of the electronic component and is connected to the plastic substrate by an anisotropic conductive adhesive containing conductive particles.
It has an input terminal array in which the bumps are arranged along one side edge of the mounting surface, and an output terminal array in which the bumps are arranged along the other side edge facing the one side edge. The input terminal row and the above output terminal row are arranged in different numbers of columns,
When the input terminal row and the output terminal row are configured in a single row, the plurality of bumps constituting the bump row are arranged alternately in a direction in which adjacent bumps are orthogonal to the arrangement direction.
When the input terminal row and the output terminal row are composed of a plurality of rows, the plurality of bumps constituting the one bump row arranged on the most central side of the electronic component are adjacent to each other. Arranged alternately in the direction orthogonal to the above arrangement direction,
A plurality of bumps constituting a bump row in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction are arranged so that a part of the adjacent bumps overlaps in the arrangement direction. Electronic components for connection.
However, the plastic substrate is a laminated body in which a cured adhesive layer is interposed, and is bent against a pressing force at the time of connection with the electronic component. The electronic component for connecting a plastic substrate according to claim 1, wherein the bump rows in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction satisfy the following formula (1).
(1) S ≦ L
(In the equation (1), S is one bump constituting a bump row in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction, and another bump adjacent to the one bump. Represents the distance in the arrangement direction, and L represents the distance between the one bump and the other bump in the direction orthogonal to the arrangement direction.) The plastic substrate connection according to claim 1 or 2, wherein the plurality of the bump rows have three or more rows of the bump rows, and the spacing between the bump rows in the direction orthogonal to the arrangement direction of the bumps is substantially the same. Electronic components for. Claims 1 to 1, wherein the plurality of bump rows are plural, and the plurality of bumps constituting the arrangement of the bump rows other than the one bump row are also arranged alternately in the direction orthogonal to the arrangement direction of the adjacent bumps. The electronic component for connecting to a plastic substrate according to any one of 3. The second aspect of claim 2, wherein the one bump row has a different position in the bump row direction between the first bump and the third bump further adjacent to the second bump adjacent to the first bump. Electronic components for connecting plastic boards. The electronic component for connecting to a plastic substrate according to any one of claims 1 to 5, which is an IC chip. An electronic component that has a bump row on the board in which multiple bumps are arranged,
A plastic substrate in which multiple electrodes connected to the bumps are arranged,
It contains conductive particles and is provided with an anisotropic conductive adhesive that connects the electronic component and the plastic substrate.
The plastic substrate is a laminated body in which a cured adhesive layer is interposed, and bends against a pressing force at the time of connection with the electronic component.
The above electronic components are
It has an input terminal array in which the bumps are arranged along one side edge of the mounting surface, and an output terminal array in which the bumps are arranged along the other side edge facing the one side edge. The input terminal row and the above output terminal row are arranged in different numbers of columns,
When the input terminal row and the output terminal row are configured in a single row, the plurality of bumps constituting the bump row are arranged alternately in a direction in which adjacent bumps are orthogonal to the arrangement direction.
When the input terminal row and the output terminal row are composed of a plurality of rows, the plurality of bumps constituting the one bump row arranged on the most central side of the electronic component are adjacent to each other. Arranged alternately in the direction orthogonal to the above arrangement direction,
A plurality of bumps constituting a bump row in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction are arranged so that a part of the adjacent bumps overlaps in the arrangement direction. .. An electronic component having a bump row in which a plurality of bumps are arranged on a substrate and a plastic substrate in which a plurality of electrodes connected to the bumps are arranged are connected to each other via an anisotropic conductive adhesive containing conductive particles. The bump and the electrode are arranged so as to face each other.
It has a step of crimping the electronic component and the plastic substrate with a crimping tool and curing the anisotropic conductive adhesive.
The plastic substrate is a laminated body in which a cured adhesive layer is interposed, and bends against a pressing force at the time of connection with the electronic component.
The above electronic components are
It has an input terminal array in which the bumps are arranged along one side edge of the mounting surface, and an output terminal array in which the bumps are arranged along the other side edge facing the one side edge. The input terminal row and the above output terminal row are arranged in different numbers of columns,
When the input terminal row and the output terminal row are configured in a single row, the plurality of bumps constituting the bump row are arranged alternately in a direction in which adjacent bumps are orthogonal to the arrangement direction.
When the input terminal row and the output terminal row are composed of a plurality of rows, the plurality of bumps constituting the one bump row arranged on the most central side of the electronic component are adjacent to each other. Arranged alternately in the direction orthogonal to the above arrangement direction,
A plurality of bumps constituting a bump row in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction are arranged so that a part of the adjacent bumps overlaps in the arrangement direction. Manufacturing method. An electronic component having a bump row in which a plurality of bumps are arranged on a substrate and a plastic substrate in which a plurality of electrodes connected to the bumps are arranged are connected to each other via an anisotropic conductive adhesive containing conductive particles. The bump and the electrode are arranged so as to face each other.
It has a step of crimping the electronic component and the plastic substrate with a crimping tool and curing the anisotropic conductive adhesive.
The plastic substrate is a laminated body in which a cured adhesive layer is interposed, and bends against a pressing force at the time of connection with the electronic component.
The above electronic components are
It has an input terminal array in which the bumps are arranged along one side edge of the mounting surface, and an output terminal array in which the bumps are arranged along the other side edge facing the one side edge. The input terminal row and the above output terminal row are arranged in different numbers of columns,
When the input terminal row and the output terminal row are configured in a single row, the plurality of bumps constituting the bump row are arranged alternately in a direction in which adjacent bumps are orthogonal to the arrangement direction.
When the input terminal row and the output terminal row are composed of a plurality of rows, the plurality of bumps constituting the one bump row arranged on the most central side of the electronic component are adjacent to each other. Arranged alternately in the direction orthogonal to the above arrangement direction,
A plurality of bumps constituting a bump row in which the adjacent bumps are alternately arranged in a direction orthogonal to the arrangement direction are arranged so that a part of the adjacent bumps overlaps in the arrangement direction. Connection method.

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