JP2016030364A - 貼り合わせ基板の分断方法及び分断装置 - Google Patents
貼り合わせ基板の分断方法及び分断装置 Download PDFInfo
- Publication number
- JP2016030364A JP2016030364A JP2014152902A JP2014152902A JP2016030364A JP 2016030364 A JP2016030364 A JP 2016030364A JP 2014152902 A JP2014152902 A JP 2014152902A JP 2014152902 A JP2014152902 A JP 2014152902A JP 2016030364 A JP2016030364 A JP 2016030364A
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- Japan
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- bonded substrate
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- elastic body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014152902A JP2016030364A (ja) | 2014-07-28 | 2014-07-28 | 貼り合わせ基板の分断方法及び分断装置 |
KR1020150047227A KR20160013795A (ko) | 2014-07-28 | 2015-04-03 | 접합 기판의 분단 방법 및 분단 장치 |
TW104114609A TWI686279B (zh) | 2014-07-28 | 2015-05-07 | 貼合基板之分斷方法及分斷裝置 |
CN201510350983.6A CN105304562A (zh) | 2014-07-28 | 2015-06-23 | 贴合基板的分断方法及分断装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014152902A JP2016030364A (ja) | 2014-07-28 | 2014-07-28 | 貼り合わせ基板の分断方法及び分断装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016036917A Division JP6114422B2 (ja) | 2016-02-29 | 2016-02-29 | 貼り合わせ基板の分断装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016030364A true JP2016030364A (ja) | 2016-03-07 |
Family
ID=55201635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014152902A Pending JP2016030364A (ja) | 2014-07-28 | 2014-07-28 | 貼り合わせ基板の分断方法及び分断装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2016030364A (zh) |
KR (1) | KR20160013795A (zh) |
CN (1) | CN105304562A (zh) |
TW (1) | TWI686279B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210014067A (ko) | 2019-07-29 | 2021-02-08 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 분단 방법 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015221739A (ja) * | 2014-05-23 | 2015-12-10 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
KR101656342B1 (ko) * | 2016-03-16 | 2016-09-23 | 제너셈(주) | 싱귤레이터 |
KR101656337B1 (ko) * | 2016-03-16 | 2016-09-13 | 제너셈(주) | 싱귤레이터 |
WO2019082724A1 (ja) * | 2017-10-27 | 2019-05-02 | 三星ダイヤモンド工業株式会社 | メタル膜付き基板の分断方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011121817A (ja) * | 2009-12-10 | 2011-06-23 | Seiko Instruments Inc | 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計 |
JP2013247147A (ja) * | 2012-05-23 | 2013-12-09 | Hamamatsu Photonics Kk | 加工対象物切断方法、加工対象物、及び、半導体素子 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000124537A (ja) * | 1998-10-21 | 2000-04-28 | Sharp Corp | 半導体レーザチップの製造方法とその方法に用いられる製造装置 |
JP5187421B2 (ja) * | 2010-11-30 | 2013-04-24 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法 |
JP2012206869A (ja) * | 2011-03-29 | 2012-10-25 | Seiko Instruments Inc | ガラス体の切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計 |
WO2013009833A1 (en) * | 2011-07-11 | 2013-01-17 | King Abdullah University Of Science And Technology | Integrated circuit manufacturing for low-profile and flexible devices |
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2014
- 2014-07-28 JP JP2014152902A patent/JP2016030364A/ja active Pending
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2015
- 2015-04-03 KR KR1020150047227A patent/KR20160013795A/ko not_active Application Discontinuation
- 2015-05-07 TW TW104114609A patent/TWI686279B/zh active
- 2015-06-23 CN CN201510350983.6A patent/CN105304562A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011121817A (ja) * | 2009-12-10 | 2011-06-23 | Seiko Instruments Inc | 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計 |
JP2013247147A (ja) * | 2012-05-23 | 2013-12-09 | Hamamatsu Photonics Kk | 加工対象物切断方法、加工対象物、及び、半導体素子 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210014067A (ko) | 2019-07-29 | 2021-02-08 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 분단 방법 |
Also Published As
Publication number | Publication date |
---|---|
TW201603980A (zh) | 2016-02-01 |
KR20160013795A (ko) | 2016-02-05 |
TWI686279B (zh) | 2020-03-01 |
CN105304562A (zh) | 2016-02-03 |
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