JP2016015522A5 - - Google Patents
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- Publication number
- JP2016015522A5 JP2016015522A5 JP2015205325A JP2015205325A JP2016015522A5 JP 2016015522 A5 JP2016015522 A5 JP 2016015522A5 JP 2015205325 A JP2015205325 A JP 2015205325A JP 2015205325 A JP2015205325 A JP 2015205325A JP 2016015522 A5 JP2016015522 A5 JP 2016015522A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- plate
- release film
- electronic component
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 40
- 229920005989 resin Polymers 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 claims description 33
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims description 4
- 238000000748 compression moulding Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 230000006837 decompression Effects 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000001179 sorption measurement Methods 0.000 claims 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 238000005520 cutting process Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015205325A JP6193951B2 (ja) | 2015-10-19 | 2015-10-19 | 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015205325A JP6193951B2 (ja) | 2015-10-19 | 2015-10-19 | 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012051057A Division JP6039198B2 (ja) | 2012-03-07 | 2012-03-07 | 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017155007A Division JP6349447B2 (ja) | 2017-08-10 | 2017-08-10 | 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016015522A JP2016015522A (ja) | 2016-01-28 |
| JP2016015522A5 true JP2016015522A5 (https=) | 2016-03-10 |
| JP6193951B2 JP6193951B2 (ja) | 2017-09-06 |
Family
ID=55231449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015205325A Active JP6193951B2 (ja) | 2015-10-19 | 2015-10-19 | 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6193951B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7134926B2 (ja) * | 2019-07-10 | 2022-09-12 | Ｔｏｗａ株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3190702B2 (ja) * | 1990-10-08 | 2001-07-23 | 株式会社東芝 | 半導体装置の製造方法 |
| JP4373237B2 (ja) * | 2004-02-13 | 2009-11-25 | Ｔｏｗａ株式会社 | 半導体チップの樹脂封止成形方法および樹脂封止成形用金型 |
| JP5128363B2 (ja) * | 2008-05-02 | 2013-01-23 | Ｔｏｗａ株式会社 | 半導体チップの樹脂封止成形方法及び金型 |
| JP2011187877A (ja) * | 2010-03-11 | 2011-09-22 | Panasonic Corp | 半導体装置及びその製造方法 |
| US8012799B1 (en) * | 2010-06-08 | 2011-09-06 | Freescale Semiconductor, Inc. | Method of assembling semiconductor device with heat spreader |
| JP5576197B2 (ja) * | 2010-07-08 | 2014-08-20 | Ｔｏｗａ株式会社 | 電子部品の圧縮成形方法及び成形装置 |
-
2015
- 2015-10-19 JP JP2015205325A patent/JP6193951B2/ja active Active
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