MY149763A - Light-emitting device and method for manufacturing same. - Google Patents

Light-emitting device and method for manufacturing same.

Info

Publication number
MY149763A
MY149763A MYPI20110871A MY149763A MY 149763 A MY149763 A MY 149763A MY PI20110871 A MYPI20110871 A MY PI20110871A MY 149763 A MY149763 A MY 149763A
Authority
MY
Malaysia
Prior art keywords
light
emitting device
gate
substrate
covering layer
Prior art date
Application number
Inventor
Setsuo Kikuchi
Tajima
Original Assignee
Fuji Polymer Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Polymer Ind filed Critical Fuji Polymer Ind
Publication of MY149763A publication Critical patent/MY149763A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

THE LIGHT-EMITTING DEVICE (100) FOR THE PRESENT INVENTION INCLUDES A SEMICONDUCTOR LIGHT-EMITTING ELEMENT (403) MOUNTED ON A SUBSTRATE (401). THE LIGHT-EMITTING ELEMENT (403) IS SURROUNDED BY A GATE (421) FORMED OF AN ELASTIC RESIN AND A COVERING LAYER (427) CONTAINING A PHOSPHOR (423) IS FORMED IN A SPACE INSIDE THE GATE (421). THE LIGHT-EMITTING DEVICE (100) IS OBTAINED AS FOLLOWS: POSITIONING, ON THE SUBSTRATE (401) ON WHICH THE LIGHT-EMITTING ELEMENT (403) IS MOUNTED, A STENCIL PLATE SUBSTRATE (420) INCLUDING AN OPENING (425) FOR FILING A COVERING MATERIAL (424) IN A STENCIL PLATE SUBSTRATE FILM (426) AND INTEGRAL WITH A GATE (421) FORMED OF A RESIN AT A POSITION CORRESPONDING TO THE OPENING (425); FILING A COVERING MATERIAL (424) CONTAINING A PHOSPHOR (423) THROUGH THE OPENING (425); CURING THE COVERING MATERIAL (424) TO FORM A COVERING LAYER (427); AND REMOVING THE STENCIL PLATE SUBSTRATE FILM (426) TO INTEGRATE THE GATE (421) WITH THE COVERING LAYER (427) ON THE SUBSTRATE (401) INTO ONE PIECE. THE COVERING LAYER (427) IS PREFERABLY FORMED OF A SILICONE-BASED RUBBER OR RESIN. A LENS (407) MAY BE FORMED ON THE COATING LAYER (427). CONSEQUENTLY, AS LIGHT-EMITTING DEVICE (100) WITH LESS DEFECTS AND AN IMPROVED PRODUCT YIELD AND A METHOD FOR MANUFACTURING THE LIGHT-EMITTING DEVICE (100) ARE PROVIDED.
MYPI20110871 2008-08-27 2009-04-23 Light-emitting device and method for manufacturing same. MY149763A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008218719 2008-08-27

Publications (1)

Publication Number Publication Date
MY149763A true MY149763A (en) 2013-10-14

Family

ID=41721170

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20110871 MY149763A (en) 2008-08-27 2009-04-23 Light-emitting device and method for manufacturing same.

Country Status (3)

Country Link
JP (1) JP4773580B2 (en)
MY (1) MY149763A (en)
WO (1) WO2010023993A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8993358B2 (en) * 2011-12-28 2015-03-31 Ledengin, Inc. Deposition of phosphor on die top by stencil printing
US8858022B2 (en) 2011-05-05 2014-10-14 Ledengin, Inc. Spot TIR lens system for small high-power emitter
DE102010063760B4 (en) 2010-12-21 2022-12-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Method for producing an optoelectronic component and optoelectronic component
WO2012090867A1 (en) * 2010-12-28 2012-07-05 コニカミノルタオプト株式会社 Method for manufacturing light emitting device
US9234801B2 (en) 2013-03-15 2016-01-12 Ledengin, Inc. Manufacturing method for LED emitter with high color consistency
DE102014116076A1 (en) * 2014-11-04 2016-05-04 Osram Opto Semiconductors Gmbh Method for applying a material to a surface

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4418686B2 (en) * 2003-01-10 2010-02-17 豊田合成株式会社 Light emitting device
KR100621154B1 (en) * 2005-08-26 2006-09-07 서울반도체 주식회사 Manufacturing method of light emitting diode
JP4678389B2 (en) * 2005-09-20 2011-04-27 パナソニック電工株式会社 Light emitting device
JP4872296B2 (en) * 2005-09-30 2012-02-08 日亜化学工業株式会社 Silicone rubber-sealed light emitting device and method for manufacturing the light emitting device
JP2008027999A (en) * 2006-07-19 2008-02-07 Matsushita Electric Ind Co Ltd Light-emitting device manufacturing method and light-emitting device
KR100796524B1 (en) * 2006-09-20 2008-01-21 삼성전기주식회사 Method for manufacturing multi-layer printed circuit board

Also Published As

Publication number Publication date
JP4773580B2 (en) 2011-09-14
WO2010023993A1 (en) 2010-03-04
JPWO2010023993A1 (en) 2012-01-26

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