JP2016008230A5 - - Google Patents

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Publication number
JP2016008230A5
JP2016008230A5 JP2014128158A JP2014128158A JP2016008230A5 JP 2016008230 A5 JP2016008230 A5 JP 2016008230A5 JP 2014128158 A JP2014128158 A JP 2014128158A JP 2014128158 A JP2014128158 A JP 2014128158A JP 2016008230 A5 JP2016008230 A5 JP 2016008230A5
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JP
Japan
Prior art keywords
meth
thermosetting
thermosetting composition
group
component
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JP2014128158A
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English (en)
Japanese (ja)
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JP6359889B2 (ja
JP2016008230A (ja
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Priority claimed from JP2014128158A external-priority patent/JP6359889B2/ja
Priority to JP2014128158A priority Critical patent/JP6359889B2/ja
Priority to CN201580034292.3A priority patent/CN106459550B/zh
Priority to PCT/JP2015/003111 priority patent/WO2015198580A1/ja
Priority to US15/321,517 priority patent/US10668650B2/en
Priority to KR1020167030278A priority patent/KR101930148B1/ko
Priority to TW104120183A priority patent/TWI639642B/zh
Publication of JP2016008230A publication Critical patent/JP2016008230A/ja
Publication of JP2016008230A5 publication Critical patent/JP2016008230A5/ja
Publication of JP6359889B2 publication Critical patent/JP6359889B2/ja
Application granted granted Critical
Priority to US16/857,215 priority patent/US11364663B2/en
Active legal-status Critical Current
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JP2014128158A 2014-06-23 2014-06-23 熱硬化性組成物、及び熱硬化樹脂の製造方法 Active JP6359889B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014128158A JP6359889B2 (ja) 2014-06-23 2014-06-23 熱硬化性組成物、及び熱硬化樹脂の製造方法
KR1020167030278A KR101930148B1 (ko) 2014-06-23 2015-06-22 열경화성 조성물 및 당해 열경화 수지의 제조 방법
PCT/JP2015/003111 WO2015198580A1 (ja) 2014-06-23 2015-06-22 熱硬化性組成物、及び当該熱硬化性樹脂の製造方法
US15/321,517 US10668650B2 (en) 2014-06-23 2015-06-22 Thermosetting composition, and method for manufacturing thermoset resin
CN201580034292.3A CN106459550B (zh) 2014-06-23 2015-06-22 热固性组合物、和该热固化树脂的制造方法
TW104120183A TWI639642B (zh) 2014-06-23 2015-06-23 熱硬化性組成物及該熱硬化樹脂的製造方法
US16/857,215 US11364663B2 (en) 2014-06-23 2020-04-24 Thermosetting composition, and method for manufacturing thermoset resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014128158A JP6359889B2 (ja) 2014-06-23 2014-06-23 熱硬化性組成物、及び熱硬化樹脂の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018087025A Division JP6666947B2 (ja) 2018-04-27 2018-04-27 熱硬化性組成物、及び当該熱硬化性樹脂の製造方法

Publications (3)

Publication Number Publication Date
JP2016008230A JP2016008230A (ja) 2016-01-18
JP2016008230A5 true JP2016008230A5 (OSRAM) 2017-10-26
JP6359889B2 JP6359889B2 (ja) 2018-07-18

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Family Applications (1)

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JP2014128158A Active JP6359889B2 (ja) 2014-06-23 2014-06-23 熱硬化性組成物、及び熱硬化樹脂の製造方法

Country Status (6)

Country Link
US (2) US10668650B2 (OSRAM)
JP (1) JP6359889B2 (OSRAM)
KR (1) KR101930148B1 (OSRAM)
CN (1) CN106459550B (OSRAM)
TW (1) TWI639642B (OSRAM)
WO (1) WO2015198580A1 (OSRAM)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6359889B2 (ja) * 2014-06-23 2018-07-18 出光興産株式会社 熱硬化性組成物、及び熱硬化樹脂の製造方法
JP6973886B2 (ja) * 2017-06-30 2021-12-01 出光興産株式会社 熱硬化性材料、及び当該熱硬化性材料の成形方法
JP7147774B2 (ja) * 2017-10-05 2022-10-05 Agc株式会社 硬化性組成物及び硬化物
CN112166135A (zh) * 2018-06-05 2021-01-01 出光兴产株式会社 热固性组合物、使用其的成型品的制造方法、和固化物
US11910728B2 (en) * 2019-07-23 2024-02-20 The Trustees Of Princeton University Flopping-mode electric dipole spin resonance
JP7393170B2 (ja) 2019-09-27 2023-12-06 出光興産株式会社 熱硬化性組成物、それを用いた成形品の製造方法、及び硬化物
JP7752303B2 (ja) * 2019-10-30 2025-10-10 株式会社スリーボンド 樹脂組成物
KR102181368B1 (ko) * 2019-12-31 2020-11-20 (주)오톡스 주형 우레탄용 사출장치 및 제조방법
CN111330610A (zh) * 2020-04-10 2020-06-26 合肥工业大学 一种银纳米花/Ti3C2Tx复合材料的制备方法及其应用
JP7627092B2 (ja) 2020-06-05 2025-02-05 出光興産株式会社 射出成形用金型及び熱硬化性組成物の射出成形方法
KR102417278B1 (ko) * 2020-10-29 2022-07-06 (주)오톡스 주형 우레탄용 사출장치
CN112940204B (zh) * 2021-02-04 2023-04-07 万华化学(四川)有限公司 一种用于附聚的聚丁二烯胶乳的制备方法及制备的abs树脂
US20240208116A1 (en) * 2021-04-07 2024-06-27 Idemitsu Kosan Co.,Ltd. Thermosetting composition for injection molding, method for producing molded article using the same, and cured product
JP7769230B2 (ja) * 2022-12-27 2025-11-13 日亜化学工業株式会社 パッケージの製造方法及び発光装置の製造方法
WO2025028473A1 (ja) * 2023-08-03 2025-02-06 出光興産株式会社 熱硬化性組成物、これを用いた成形品の製造方法、及び硬化物

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* Cited by examiner, † Cited by third party
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CN1259975A (zh) * 1997-05-14 2000-07-12 三菱丽阳株式会社 用于热固型注射模塑的(甲基)丙烯酸类树脂组合物,它的制备方法以及制备(甲基)丙烯酸类树脂模塑制件的方法
WO2010011835A1 (en) * 2008-07-25 2010-01-28 Henkel Corporation Mold assembly and attenuated light process for fabricating molded parts
WO2010095593A1 (ja) * 2009-02-23 2010-08-26 住友ベークライト株式会社 半導体ウエハー接合体、半導体ウエハー接合体の製造方法および半導体装置
EP2634199B1 (en) * 2010-10-25 2016-03-16 Idemitsu Kosan Co., Ltd. (meth)acrylate composition
JP2012107096A (ja) * 2010-11-16 2012-06-07 Kaneka Corp 熱伝導性硬化性樹脂組成物及び硬化性樹脂成形体
JP5683936B2 (ja) * 2010-12-20 2015-03-11 出光興産株式会社 熱硬化性樹脂の射出成形方法、射出成形用金型および射出成形機
DE102011102330A1 (de) * 2011-05-25 2012-11-29 Audi Ag Verfahren zum Betrieb eines Sicherheitssystems zur Kollisionsvermeidung und/oder Kollisionsschwereminderung in einem Kraftfahrzeug und Kraftfahrzeug
WO2013146081A1 (ja) * 2012-03-30 2013-10-03 出光興産株式会社 樹脂組成物及びその硬化物ならびにそれを用いた光半導体用反射材
US8822593B2 (en) * 2012-06-22 2014-09-02 Shin-Etsu Chemical Co., Ltd. Curable resin composition, hardened material thereof, and optical semiconductor apparatus
WO2014054256A1 (ja) * 2012-10-01 2014-04-10 出光興産株式会社 反射材用組成物及びこれを用いた光半導体発光装置
JP2014080503A (ja) * 2012-10-16 2014-05-08 Idemitsu Kosan Co Ltd 反射材用組成物及びこれを用いた光半導体発光装置
JP2014095038A (ja) * 2012-11-09 2014-05-22 Idemitsu Kosan Co Ltd 反射材用組成物及びこれを用いた光半導体発光装置
JP6039372B2 (ja) 2012-11-09 2016-12-07 三菱エンジニアリングプラスチックス株式会社 ポリブチレンテレフタレート系樹脂組成物
JP6359889B2 (ja) * 2014-06-23 2018-07-18 出光興産株式会社 熱硬化性組成物、及び熱硬化樹脂の製造方法
JP6973886B2 (ja) * 2017-06-30 2021-12-01 出光興産株式会社 熱硬化性材料、及び当該熱硬化性材料の成形方法

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