JP2016004861A5 - - Google Patents

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Publication number
JP2016004861A5
JP2016004861A5 JP2014123349A JP2014123349A JP2016004861A5 JP 2016004861 A5 JP2016004861 A5 JP 2016004861A5 JP 2014123349 A JP2014123349 A JP 2014123349A JP 2014123349 A JP2014123349 A JP 2014123349A JP 2016004861 A5 JP2016004861 A5 JP 2016004861A5
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JP
Japan
Prior art keywords
protective film
substrate
forming
groove
etching
Prior art date
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Application number
JP2014123349A
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English (en)
Japanese (ja)
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JP2016004861A (ja
JP6456049B2 (ja
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Priority to JP2014123349A priority Critical patent/JP6456049B2/ja
Priority claimed from JP2014123349A external-priority patent/JP6456049B2/ja
Priority to US14/728,065 priority patent/US9789689B2/en
Publication of JP2016004861A publication Critical patent/JP2016004861A/ja
Publication of JP2016004861A5 publication Critical patent/JP2016004861A5/ja
Application granted granted Critical
Publication of JP6456049B2 publication Critical patent/JP6456049B2/ja
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JP2014123349A 2014-06-16 2014-06-16 貫通基板の形成方法 Active JP6456049B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014123349A JP6456049B2 (ja) 2014-06-16 2014-06-16 貫通基板の形成方法
US14/728,065 US9789689B2 (en) 2014-06-16 2015-06-02 Method of forming through-substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014123349A JP6456049B2 (ja) 2014-06-16 2014-06-16 貫通基板の形成方法

Publications (3)

Publication Number Publication Date
JP2016004861A JP2016004861A (ja) 2016-01-12
JP2016004861A5 true JP2016004861A5 (enExample) 2017-07-20
JP6456049B2 JP6456049B2 (ja) 2019-01-23

Family

ID=54835426

Family Applications (1)

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JP2014123349A Active JP6456049B2 (ja) 2014-06-16 2014-06-16 貫通基板の形成方法

Country Status (2)

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US (1) US9789689B2 (enExample)
JP (1) JP6456049B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6869675B2 (ja) * 2016-09-23 2021-05-12 東芝テック株式会社 インクジェットヘッドおよびインクジェットヘッドの製造方法
JP6899252B2 (ja) * 2017-05-10 2021-07-07 株式会社ディスコ 加工方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637189A (en) * 1996-06-25 1997-06-10 Xerox Corporation Dry etch process control using electrically biased stop junctions
KR100499118B1 (ko) * 2000-02-24 2005-07-04 삼성전자주식회사 단결정 실리콘 웨이퍼를 이용한 일체형 유체 노즐어셈블리 및 그 제작방법
US6555480B2 (en) * 2001-07-31 2003-04-29 Hewlett-Packard Development Company, L.P. Substrate with fluidic channel and method of manufacturing
JP2006012889A (ja) * 2004-06-22 2006-01-12 Canon Inc 半導体チップの製造方法および半導体装置の製造方法
CN100565815C (zh) 2004-10-08 2009-12-02 西尔弗布鲁克研究有限公司 从蚀刻沟槽中移除聚合物涂层的方法
DE602007004770D1 (de) * 2006-05-31 2010-04-01 Konica Minolta Holdings Inc Verfahren zur Herstellung einer Siliciumdüsenplatte und Verfahren zur Herstellung eines Tintenstrahlkopfs
JP5177997B2 (ja) * 2006-11-22 2013-04-10 Ｓｐｐテクノロジーズ株式会社 高アスペクト比の開口を有するシリコン構造体、その製造方法、その製造装置、及びその製造プログラム
WO2008155986A1 (ja) * 2007-06-20 2008-12-24 Konica Minolta Holdings, Inc. 液体吐出ヘッド用ノズルプレートの製造方法、液体吐出ヘッド用ノズルプレート及び液体吐出ヘッド
US20090242512A1 (en) * 2008-03-27 2009-10-01 Dalsa Semiconductor Inc. Deep reactive ion etching
JP2011011425A (ja) * 2009-07-01 2011-01-20 Konica Minolta Holdings Inc 液体吐出ヘッド用ノズルプレートの製造方法
WO2011018900A1 (ja) * 2009-08-14 2011-02-17 株式会社アルバック エッチング方法
US20110207323A1 (en) * 2010-02-25 2011-08-25 Robert Ditizio Method of forming and patterning conformal insulation layer in vias and etched structures
JP2013028110A (ja) 2011-07-29 2013-02-07 Canon Inc 液体吐出ヘッド用基板の製造方法
JP6095320B2 (ja) 2011-12-02 2017-03-15 キヤノン株式会社 液体吐出ヘッド用基板の製造方法
JP6128972B2 (ja) 2013-06-06 2017-05-17 キヤノン株式会社 液体吐出ヘッド用基板の製造方法

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