JP2016004112A - 表示装置の製造方法 - Google Patents

表示装置の製造方法 Download PDF

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Publication number
JP2016004112A
JP2016004112A JP2014123284A JP2014123284A JP2016004112A JP 2016004112 A JP2016004112 A JP 2016004112A JP 2014123284 A JP2014123284 A JP 2014123284A JP 2014123284 A JP2014123284 A JP 2014123284A JP 2016004112 A JP2016004112 A JP 2016004112A
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JP
Japan
Prior art keywords
glass substrate
display device
resin film
organic resin
substrate
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Pending
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JP2014123284A
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English (en)
Japanese (ja)
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JP2016004112A5 (enExample
Inventor
智彦 長沼
Tomohiko Naganuma
智彦 長沼
木村 泰一
Taiichi Kimura
泰一 木村
拓磨 西ノ原
Takuma Nishinohara
拓磨 西ノ原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2014123284A priority Critical patent/JP2016004112A/ja
Priority to KR1020150078969A priority patent/KR101701614B1/ko
Priority to US14/737,023 priority patent/US9391098B2/en
Publication of JP2016004112A publication Critical patent/JP2016004112A/ja
Publication of JP2016004112A5 publication Critical patent/JP2016004112A5/ja
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0212Manufacture or treatment of multiple TFTs comprising manufacture, treatment or coating of substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0214Manufacture or treatment of multiple TFTs using temporary substrates

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  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2014123284A 2014-06-16 2014-06-16 表示装置の製造方法 Pending JP2016004112A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014123284A JP2016004112A (ja) 2014-06-16 2014-06-16 表示装置の製造方法
KR1020150078969A KR101701614B1 (ko) 2014-06-16 2015-06-04 표시 장치의 제조 방법
US14/737,023 US9391098B2 (en) 2014-06-16 2015-06-11 Method of manufacturing a display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014123284A JP2016004112A (ja) 2014-06-16 2014-06-16 表示装置の製造方法

Publications (2)

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JP2016004112A true JP2016004112A (ja) 2016-01-12
JP2016004112A5 JP2016004112A5 (enExample) 2016-09-23

Family

ID=54836830

Family Applications (1)

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JP2014123284A Pending JP2016004112A (ja) 2014-06-16 2014-06-16 表示装置の製造方法

Country Status (3)

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US (1) US9391098B2 (enExample)
JP (1) JP2016004112A (enExample)
KR (1) KR101701614B1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017199928A1 (ja) * 2016-05-16 2017-11-23 株式会社Nsc 表示装置製造方法
JP2018006263A (ja) * 2016-07-07 2018-01-11 株式会社ジャパンディスプレイ 表示装置
JP2019124806A (ja) * 2018-01-16 2019-07-25 株式会社Joled 転送回路、シフトレジスタ、ゲートドライバ、表示パネル、およびフレキシブル基板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190140081A1 (en) * 2017-11-06 2019-05-09 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Tft substrate and manufacturing method thereof
JP6664037B1 (ja) * 2018-05-09 2020-03-13 堺ディスプレイプロダクト株式会社 フレキシブル発光デバイスの製造方法および製造装置
CN109860437B (zh) * 2019-01-31 2021-12-03 京东方科技集团股份有限公司 柔性有机发光显示面板及其制作方法
CN110828520B (zh) * 2019-11-15 2022-09-09 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示面板和显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181430A (ja) * 1988-01-08 1989-07-19 Nissan Chem Ind Ltd 電気・電子デバイス用絶縁膜
US20080292786A1 (en) * 2007-05-23 2008-11-27 Hitachi Displays, Ltd. Method of manufacturing display device
JP2009296000A (ja) * 2004-01-16 2009-12-17 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
US20100026938A1 (en) * 2008-07-29 2010-02-04 Hitachi Displays, Ltd. Image display device and manufacturing method thereof
WO2011030716A1 (ja) * 2009-09-08 2011-03-17 旭硝子株式会社 ガラス/樹脂積層体、及びそれを用いた電子デバイス
US20110223697A1 (en) * 2010-03-09 2011-09-15 Samsung Mobile Display Co., Ltd. Method of manufacturing flexible display device
WO2014061612A1 (ja) * 2012-10-17 2014-04-24 旭硝子株式会社 導電性薄膜付きガラス基板、薄膜太陽電池、低放射ガラス基板、導電性薄膜付きガラス基板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100835053B1 (ko) 2006-01-05 2008-06-03 삼성전기주식회사 반도체 발광 소자를 이용한 플렉서블 디스플레이 및 그제조 방법
US20100215873A1 (en) * 2008-10-10 2010-08-26 Tpo Displays Corp. System for display images and fabrication method of display panels
WO2011024690A1 (ja) * 2009-08-27 2011-03-03 旭硝子株式会社 フレキシブル基材-支持体の積層構造体、支持体付き電子デバイス用パネル、および電子デバイス用パネルの製造方法
KR102079188B1 (ko) * 2012-05-09 2020-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
KR20140029987A (ko) * 2012-08-31 2014-03-11 삼성디스플레이 주식회사 캐리어 기판, 이의 제조방법 및 이를 이용한 플렉서블 디스플레이 장치의 제조방법
JP2014186169A (ja) * 2013-03-22 2014-10-02 Toshiba Corp 表示装置の製造方法及び表示装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181430A (ja) * 1988-01-08 1989-07-19 Nissan Chem Ind Ltd 電気・電子デバイス用絶縁膜
JP2009296000A (ja) * 2004-01-16 2009-12-17 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
US20080292786A1 (en) * 2007-05-23 2008-11-27 Hitachi Displays, Ltd. Method of manufacturing display device
JP2008292608A (ja) * 2007-05-23 2008-12-04 Hitachi Displays Ltd 表示装置の製造方法
US20100026938A1 (en) * 2008-07-29 2010-02-04 Hitachi Displays, Ltd. Image display device and manufacturing method thereof
JP2010032768A (ja) * 2008-07-29 2010-02-12 Hitachi Displays Ltd 表示装置およびその製造方法
WO2011030716A1 (ja) * 2009-09-08 2011-03-17 旭硝子株式会社 ガラス/樹脂積層体、及びそれを用いた電子デバイス
US20110223697A1 (en) * 2010-03-09 2011-09-15 Samsung Mobile Display Co., Ltd. Method of manufacturing flexible display device
JP2011187446A (ja) * 2010-03-09 2011-09-22 Samsung Mobile Display Co Ltd フレキシブルディスプレイ装置の製造方法
WO2014061612A1 (ja) * 2012-10-17 2014-04-24 旭硝子株式会社 導電性薄膜付きガラス基板、薄膜太陽電池、低放射ガラス基板、導電性薄膜付きガラス基板の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017199928A1 (ja) * 2016-05-16 2017-11-23 株式会社Nsc 表示装置製造方法
JP2017207528A (ja) * 2016-05-16 2017-11-24 株式会社Nsc 表示装置製造方法
KR20190010871A (ko) 2016-05-16 2019-01-31 가부시키가이샤 엔에스씨 표시장치 제조방법
JP2018006263A (ja) * 2016-07-07 2018-01-11 株式会社ジャパンディスプレイ 表示装置
JP2019124806A (ja) * 2018-01-16 2019-07-25 株式会社Joled 転送回路、シフトレジスタ、ゲートドライバ、表示パネル、およびフレキシブル基板

Also Published As

Publication number Publication date
US9391098B2 (en) 2016-07-12
US20150364506A1 (en) 2015-12-17
KR101701614B1 (ko) 2017-02-01
KR20150144276A (ko) 2015-12-24

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