JP2015537374A - 容量性結合を備えるｌｅｄパッケージ - Google Patents

容量性結合を備えるｌｅｄパッケージ Download PDF

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Publication number
JP2015537374A
JP2015537374A JP2015536271A JP2015536271A JP2015537374A JP 2015537374 A JP2015537374 A JP 2015537374A JP 2015536271 A JP2015536271 A JP 2015536271A JP 2015536271 A JP2015536271 A JP 2015536271A JP 2015537374 A JP2015537374 A JP 2015537374A
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JP
Japan
Prior art keywords
led package
led
power supply
terminal
supply terminal
Prior art date
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Pending
Application number
JP2015536271A
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English (en)
Japanese (ja)
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JP2015537374A5 (cg-RX-API-DMAC7.html
Inventor
エフベルトス レイニエル ヤコブス
エフベルトス レイニエル ヤコブス
マーク アンドレ デサムベール
マーク アンドレ デサムベール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
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Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of JP2015537374A publication Critical patent/JP2015537374A/ja
Publication of JP2015537374A5 publication Critical patent/JP2015537374A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2015536271A 2012-10-15 2013-10-11 容量性結合を備えるｌｅｄパッケージ Pending JP2015537374A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261713733P 2012-10-15 2012-10-15
US61/713,733 2012-10-15
PCT/IB2013/059312 WO2014060921A1 (en) 2012-10-15 2013-10-11 Led package with capacitive couplings

Publications (2)

Publication Number Publication Date
JP2015537374A true JP2015537374A (ja) 2015-12-24
JP2015537374A5 JP2015537374A5 (cg-RX-API-DMAC7.html) 2016-12-01

Family

ID=49911751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015536271A Pending JP2015537374A (ja) 2012-10-15 2013-10-11 容量性結合を備えるｌｅｄパッケージ

Country Status (7)

Country Link
US (1) US9386640B2 (cg-RX-API-DMAC7.html)
EP (1) EP2907162A1 (cg-RX-API-DMAC7.html)
JP (1) JP2015537374A (cg-RX-API-DMAC7.html)
KR (1) KR20150066594A (cg-RX-API-DMAC7.html)
CN (1) CN104718621A (cg-RX-API-DMAC7.html)
RU (1) RU2637402C2 (cg-RX-API-DMAC7.html)
WO (1) WO2014060921A1 (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104769691A (zh) * 2012-11-02 2015-07-08 罗姆股份有限公司 片状电容器、电路组件以及电子设备
JP2017506415A (ja) 2014-02-12 2017-03-02 フィリップス ライティング ホールディング ビー ヴィ Ｌｅｄのアレイを備える照光システム
KR102727720B1 (ko) * 2015-12-23 2024-11-11 코닌클리케 필립스 엔.브이. 부하 장치 및 부하에 전력을 공급하기 위한 전력 장치
US10555388B2 (en) * 2015-12-23 2020-02-04 Koninklijke Philips N.V. Load arrangement and electrical power arrangement for powering a load
RU2722367C2 (ru) * 2015-12-23 2020-05-29 Конинклейке Филипс Н.В. Морская конструкция
WO2019007843A1 (en) * 2017-07-04 2019-01-10 Philips Lighting Holding B.V. LIGHTING ARRANGEMENT WITH NON-GALVANIC INTERCONNECTED DEVICES
EP3599797A1 (de) * 2018-07-26 2020-01-29 Bilton International GmbH Leuchtsystem und verfahren zum betreiben eines leuchtsystems
EP3599796B1 (de) * 2018-07-26 2021-02-24 Bilton International GmbH Led-lichtband und leuchtsystem
DE102018121451B3 (de) * 2018-07-26 2020-01-30 BILTON International GmbH LED-Lichtband und Leuchtsystem
TWI821402B (zh) 2018-09-20 2023-11-11 荷蘭商皇家飛利浦有限公司 用於保護表面免於生物污損之具有電感式電力轉移的抗污損系統

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0638266U (ja) * 1992-10-22 1994-05-20 日本航空電子工業株式会社 表面実装用チップ発光ダイオード
JP2006504265A (ja) * 2002-10-22 2006-02-02 クリー　インコーポレイテッド Ａｃ動作用発光ダイオードアセンブリおよびその製造方法
WO2012120404A1 (en) * 2011-03-07 2012-09-13 Koninklijke Philips Electronics N.V. Electroluminescent device

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW346916U (en) 1998-03-16 1998-12-01 Jun-Teng Bai Improved structure for disk box
WO2002031406A1 (en) * 2000-10-13 2002-04-18 Flat White Lighting Pty Ltd Lighting system
US6636027B1 (en) 2000-10-24 2003-10-21 General Electric Company LED power source
US6411045B1 (en) * 2000-12-14 2002-06-25 General Electric Company Light emitting diode power supply
JP3928384B2 (ja) * 2001-08-17 2007-06-13 松下電工株式会社 Ｌｅｄ照明器具
MXPA06009703A (es) * 2004-02-25 2007-03-30 Michael Miskin Diodo emisor de luz ac y metodos de accionamiento ac led y aparato.
CA2501447C (en) 2004-03-18 2014-05-13 Brasscorp Limited Led work light
US7294961B2 (en) * 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
EP1864339A4 (en) * 2005-03-11 2010-12-29 Seoul Semiconductor Co Ltd LED CAPSULATION WITH A GROUP IN A SERIES OF SWITCHED LUMINAIRES
US8704241B2 (en) * 2005-05-13 2014-04-22 Epistar Corporation Light-emitting systems
TW200702824A (en) * 2005-06-02 2007-01-16 Koninkl Philips Electronics Nv LED assembly and module
EP1898676A1 (en) * 2006-09-06 2008-03-12 THOMSON Licensing Display apparatus
JP2008198457A (ja) * 2007-02-13 2008-08-28 Seiko Epson Corp 発光装置の製造方法
US7791285B2 (en) * 2007-04-13 2010-09-07 Cree, Inc. High efficiency AC LED driver circuit
US20090159677A1 (en) * 2007-12-20 2009-06-25 General Electric Company Contactless power and data transfer system and method
US8004070B1 (en) 2008-04-29 2011-08-23 Wei Chen Wire-free chip module and method
DE102008024779A1 (de) * 2008-05-23 2009-11-26 Osram Gesellschaft mit beschränkter Haftung Drahtlos speisbares Leuchtmodul
JP4557049B2 (ja) * 2008-06-09 2010-10-06 ソニー株式会社 伝送システム、給電装置、受電装置、及び伝送方法
CN102067724B (zh) * 2008-06-17 2013-11-06 皇家飞利浦电子股份有限公司 适合于交流驱动的发光器件
US8269408B2 (en) * 2008-08-12 2012-09-18 Helio Optoelectronics Corporation LED base structure with embedded capacitor
JP5508425B2 (ja) * 2008-10-02 2014-05-28 コーニンクレッカ フィリップス エヌ ヴェ 改善されたフリッカ性能を備えるｌｅｄ回路配置
JP5525543B2 (ja) * 2008-12-12 2014-06-18 コーニンクレッカ フィリップス エヌ ヴェ Ｌｅｄランプ
US20100176735A1 (en) * 2009-01-15 2010-07-15 Chen-Sheng Yang LED light string assembly with constant current circuit
KR20100095826A (ko) 2009-02-23 2010-09-01 주식회사 마블덱스 Ｌｅｄ 전등 및 그 ｌｅｄ 전등을 포함한 전기전자시스템
TWM375821U (en) * 2009-06-06 2010-03-11 Iovision Photoelectric Co Ltd LED lamp strip with replaceable power source
JP5425303B2 (ja) * 2009-06-17 2014-02-26 コーニンクレッカ フィリップス エヌ ヴェ 光温度変化を伴う調光可能な光源
TWM382449U (en) * 2010-01-08 2010-06-11 Ying-Chia Chen Package of constant-current chip and light-emitting diode lamp drived by alternating current
US20110291573A1 (en) * 2010-05-27 2011-12-01 Inergy Technology Inc. Resonant power supply for light-emitting devices
US20120062147A1 (en) * 2010-09-13 2012-03-15 Suntec Enterprises High efficiency drive method for driving LED devices
RU101867U1 (ru) * 2010-09-16 2011-01-27 Ооо "Нпп "Волсон" Светодиодная лампа
US9022608B2 (en) * 2010-11-23 2015-05-05 Q Technology, Inc. Unlit LED circuit bypass element with system and method therefor
US8653748B2 (en) * 2011-05-11 2014-02-18 General Electric Company Isolated capacitor drive circuit for thin-film solid-state lighting
US8835945B2 (en) * 2013-01-11 2014-09-16 Lighting Science Group Corporation Serially-connected light emitting diodes, methods of forming same, and luminaires containing same
JP2013084557A (ja) * 2011-07-21 2013-05-09 Rohm Co Ltd 照明装置
RU2628953C2 (ru) * 2012-02-07 2017-08-23 Филипс Лайтинг Холдинг Б.В. Система освещения
CN102606944B (zh) * 2012-02-27 2014-01-15 中山伟强科技有限公司 一种可更换led路灯模组
KR102075991B1 (ko) * 2012-09-07 2020-02-11 삼성전자주식회사 광원장치 및 발광다이오드 패키지

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0638266U (ja) * 1992-10-22 1994-05-20 日本航空電子工業株式会社 表面実装用チップ発光ダイオード
JP2006504265A (ja) * 2002-10-22 2006-02-02 クリー　インコーポレイテッド Ａｃ動作用発光ダイオードアセンブリおよびその製造方法
WO2012120404A1 (en) * 2011-03-07 2012-09-13 Koninklijke Philips Electronics N.V. Electroluminescent device

Also Published As

Publication number Publication date
RU2015118136A (ru) 2016-12-10
WO2014060921A1 (en) 2014-04-24
US9386640B2 (en) 2016-07-05
RU2637402C2 (ru) 2017-12-04
CN104718621A (zh) 2015-06-17
KR20150066594A (ko) 2015-06-16
EP2907162A1 (en) 2015-08-19
US20150289326A1 (en) 2015-10-08

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