JP2015527740A5 - - Google Patents

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JP2015527740A5
JP2015527740A5 JP2015525602A JP2015525602A JP2015527740A5 JP 2015527740 A5 JP2015527740 A5 JP 2015527740A5 JP 2015525602 A JP2015525602 A JP 2015525602A JP 2015525602 A JP2015525602 A JP 2015525602A JP 2015527740 A5 JP2015527740 A5 JP 2015527740A5
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Japan
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dies
error
exposure
printed
focus
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JP2015525602A
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JP6282650B2 (ja
JP2015527740A (ja
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Priority claimed from US13/783,291 external-priority patent/US8948495B2/en
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JP2015525602A 2012-08-01 2013-08-01 ウェーハの検査、及び／又はウェーハ上に形成されるデバイスの一つ若しくは複数の特性の予測 Active JP6282650B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261678576P 2012-08-01 2012-08-01
US61/678,576 2012-08-01
US13/783,291 US8948495B2 (en) 2012-08-01 2013-03-02 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
US13/783,291 2013-03-02
PCT/US2013/053252 WO2014022682A1 (en) 2012-08-01 2013-08-01 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018009314A Division JP2018097376A (ja) 2012-08-01 2018-01-24 ウェーハの検査、及び／又はウェーハ上に形成されるデバイスの一つ若しくは複数の特性の予測

Publications (3)

Publication Number Publication Date
JP2015527740A JP2015527740A (ja) 2015-09-17
JP2015527740A5 true JP2015527740A5 (OSRAM) 2016-09-15
JP6282650B2 JP6282650B2 (ja) 2018-02-21

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Application Number Title Priority Date Filing Date
JP2015525602A Active JP6282650B2 (ja) 2012-08-01 2013-08-01 ウェーハの検査、及び／又はウェーハ上に形成されるデバイスの一つ若しくは複数の特性の予測
JP2018009314A Pending JP2018097376A (ja) 2012-08-01 2018-01-24 ウェーハの検査、及び／又はウェーハ上に形成されるデバイスの一つ若しくは複数の特性の予測
JP2019224429A Pending JP2020057008A (ja) 2012-08-01 2019-12-12 デバイスの特性の予測方法及びシステム
JP2021132300A Pending JP2021182162A (ja) 2012-08-01 2021-08-16 デバイスの特性の予測方法及びシステム

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2018009314A Pending JP2018097376A (ja) 2012-08-01 2018-01-24 ウェーハの検査、及び／又はウェーハ上に形成されるデバイスの一つ若しくは複数の特性の予測
JP2019224429A Pending JP2020057008A (ja) 2012-08-01 2019-12-12 デバイスの特性の予測方法及びシステム
JP2021132300A Pending JP2021182162A (ja) 2012-08-01 2021-08-16 デバイスの特性の予測方法及びシステム

Country Status (8)

Country Link
US (1) US8948495B2 (OSRAM)
EP (1) EP2880427A1 (OSRAM)
JP (4) JP6282650B2 (OSRAM)
KR (2) KR102129826B1 (OSRAM)
CN (1) CN104620097B (OSRAM)
IL (2) IL236957B (OSRAM)
TW (1) TWI591326B (OSRAM)
WO (1) WO2014022682A1 (OSRAM)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5960198B2 (ja) 2013-07-02 2016-08-02 キヤノン株式会社 パターン形成方法、リソグラフィ装置、リソグラフィシステムおよび物品製造方法
WO2015120996A1 (en) 2014-02-12 2015-08-20 Asml Netherlands B.V. Method of optimizing a process window
US10576603B2 (en) * 2014-04-22 2020-03-03 Kla-Tencor Corporation Patterned wafer geometry measurements for semiconductor process controls
KR102202517B1 (ko) 2014-07-13 2021-01-13 케이엘에이 코포레이션 오버레이 및 수율 임계 패턴을 이용한 계측
US10712289B2 (en) * 2014-07-29 2020-07-14 Kla-Tencor Corp. Inspection for multiple process steps in a single inspection process
WO2016096524A1 (en) * 2014-12-19 2016-06-23 Asml Netherlands B.V. Method of measuring asymmetry, inspection apparatus, lithographic system and device manufacturing method
US10036964B2 (en) * 2015-02-15 2018-07-31 Kla-Tencor Corporation Prediction based chucking and lithography control optimization
GB2536056B (en) * 2015-03-06 2017-07-12 Blatchford Products Ltd Lower Limb Prosthesis
US10012599B2 (en) * 2015-04-03 2018-07-03 Kla-Tencor Corp. Optical die to database inspection
CN109917622B (zh) * 2015-04-10 2021-08-06 Asml荷兰有限公司 用于检查和量测的方法和设备
US9767548B2 (en) * 2015-04-24 2017-09-19 Kla-Tencor Corp. Outlier detection on pattern of interest image populations
US9410902B1 (en) 2015-05-05 2016-08-09 United Microelectronics Corp. Overlay measurement method
US9940429B2 (en) 2015-06-29 2018-04-10 International Business Machines Corporation Early overlay prediction and overlay-aware mask design
KR20170016681A (ko) * 2015-08-04 2017-02-14 에스케이하이닉스 주식회사 레지스트레이션 제어된 포토마스크의 결함 검출 방법
US9679100B2 (en) * 2015-08-21 2017-06-13 Taiwan Semiconductor Manufacturing Company, Ltd. Environmental-surrounding-aware OPC
US9916965B2 (en) * 2015-12-31 2018-03-13 Kla-Tencor Corp. Hybrid inspectors
US10181185B2 (en) 2016-01-11 2019-01-15 Kla-Tencor Corp. Image based specimen process control
JP6752593B2 (ja) * 2016-03-07 2020-09-09 東レエンジニアリング株式会社 欠陥検査装置
US10068323B2 (en) * 2016-04-10 2018-09-04 Kla-Tencor Corporation Aware system, method and computer program product for detecting overlay-related defects in multi-patterned fabricated devices
US10740888B2 (en) * 2016-04-22 2020-08-11 Kla-Tencor Corporation Computer assisted weak pattern detection and quantification system
US11175591B2 (en) 2016-05-12 2021-11-16 Asml Netherlands B.V. Method of obtaining measurements, apparatus for performing a process step, and metrology apparatus
US10902576B2 (en) * 2016-08-12 2021-01-26 Texas Instruments Incorporated System and method for electronic die inking after automatic visual defect inspection
US10679909B2 (en) * 2016-11-21 2020-06-09 Kla-Tencor Corporation System, method and non-transitory computer readable medium for tuning sensitivies of, and determining a process window for, a modulated wafer
US10761128B2 (en) * 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US10262408B2 (en) * 2017-04-12 2019-04-16 Kla-Tencor Corporation System, method and computer program product for systematic and stochastic characterization of pattern defects identified from a semiconductor wafer
JP6778666B2 (ja) 2017-08-24 2020-11-04 株式会社日立製作所 探索装置及び探索方法
EP3451061A1 (en) * 2017-09-04 2019-03-06 ASML Netherlands B.V. Method for monitoring a manufacturing process
EP3743771A1 (en) 2018-01-24 2020-12-02 ASML Netherlands B.V. Computational metrology based sampling scheme
US10867877B2 (en) * 2018-03-20 2020-12-15 Kla Corporation Targeted recall of semiconductor devices based on manufacturing data
CN111426701B (zh) * 2019-06-25 2024-01-30 合肥晶合集成电路股份有限公司 一种晶圆缺陷检测方法及其装置
US11494895B2 (en) * 2020-02-14 2022-11-08 KLA Corp. Detecting defects in array regions on specimens
DE102020104167B4 (de) 2020-02-18 2023-01-26 Carl Zeiss Smt Gmbh Verfahren zur Vermessung von Photomasken
CN115516382A (zh) * 2020-05-04 2022-12-23 Asml荷兰有限公司 用于产生衬底的表面的水平数据的系统和方法
CN111721779B (zh) * 2020-05-27 2023-02-28 联宝(合肥)电子科技有限公司 一种产品重工方法、装置及存储介质
US11614480B2 (en) * 2021-06-08 2023-03-28 Kla Corporation System and method for Z-PAT defect-guided statistical outlier detection of semiconductor reliability failures
US12111355B2 (en) * 2021-11-22 2024-10-08 Onto Innovation Inc. Semiconductor substrate yield prediction based on spectra data from multiple substrate dies
KR20230118317A (ko) 2022-02-04 2023-08-11 삼성전자주식회사 선폭 모니터링을 위한 매크로 패턴 구조물을 포함하는 반도체 소자
US12487273B2 (en) * 2023-02-23 2025-12-02 Applied Materials Israel Ltd. Optimal determination of an overlay target
WO2024220605A1 (en) * 2023-04-18 2024-10-24 Onto Innovation Inc. Tracking and/or predicting substrate yield during fabrication

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6215896B1 (en) * 1995-09-29 2001-04-10 Advanced Micro Devices System for enabling the real-time detection of focus-related defects
JPH09260446A (ja) * 1996-03-26 1997-10-03 Fujitsu Ltd 半導体装置の位置ずれ測定方法
JP3757482B2 (ja) * 1996-08-09 2006-03-22 ソニー株式会社 半導体装置の製造方法
JPH11186132A (ja) * 1997-12-19 1999-07-09 Sony Corp 半導体装置の製造工程のフィードバック方法
JPH11274037A (ja) * 1998-03-23 1999-10-08 Hitachi Ltd 半導体装置の製造方法および装置
US6020957A (en) 1998-04-30 2000-02-01 Kla-Tencor Corporation System and method for inspecting semiconductor wafers
US6910203B2 (en) * 2001-12-10 2005-06-21 Toppan Photomasks, Inc. Photomask and method for qualifying the same with a prototype specification
US20040032581A1 (en) 2002-01-15 2004-02-19 Mehrdad Nikoonahad Systems and methods for inspection of specimen surfaces
JP2003257838A (ja) * 2002-03-06 2003-09-12 Hitachi Ltd 露光方法およびそのシステム
US6902855B2 (en) 2002-07-15 2005-06-07 Kla-Tencor Technologies Qualifying patterns, patterning processes, or patterning apparatus in the fabrication of microlithographic patterns
US7418124B2 (en) 2002-07-15 2008-08-26 Kla-Tencor Technologies Corp. Qualifying patterns, patterning processes, or patterning apparatus in the fabrication of microlithographic patterns
US8185230B2 (en) * 2002-08-22 2012-05-22 Advanced Micro Devices, Inc. Method and apparatus for predicting device electrical parameters during fabrication
US7003758B2 (en) * 2003-10-07 2006-02-21 Brion Technologies, Inc. System and method for lithography simulation
US7403264B2 (en) * 2004-07-08 2008-07-22 Asml Netherlands B.V. Lithographic projection apparatus and a device manufacturing method using such lithographic projection apparatus
US7729529B2 (en) 2004-12-07 2010-06-01 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
US7769225B2 (en) * 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
TWI342043B (en) * 2005-08-30 2011-05-11 Camtek Ltd A pipelined inspection system and method for inspecting a diced wafer
JP2007081292A (ja) * 2005-09-16 2007-03-29 Toshiba Corp 検査方法、検査システムおよびプログラム
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
JP4333770B2 (ja) * 2007-04-12 2009-09-16 ソニー株式会社 マスクパターン作成プログラム、半導体製造方法、マスクパターン作成方法および半導体設計プログラム
JP2008294352A (ja) * 2007-05-28 2008-12-04 Nuflare Technology Inc 露光方法及び露光用フォトマスク
US20080304025A1 (en) * 2007-06-08 2008-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for immersion lithography
JP4973876B2 (ja) * 2007-08-22 2012-07-11 信越化学工業株式会社 パターン形成方法及びこれに用いるパターン表面コート材
JP5065943B2 (ja) * 2008-02-29 2012-11-07 株式会社日立ハイテクノロジーズ 製造プロセスモニタリングシステム
DE102008017645A1 (de) 2008-04-04 2009-10-08 Carl Zeiss Smt Ag Vorrichtung zur mikrolithographischen Projektionsbelichtung sowie Vorrichtung zur Inspektion einer Oberfläche eines Substrats
WO2009152046A1 (en) * 2008-06-11 2009-12-17 Kla-Tencor Corporation Systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof
JP5268532B2 (ja) * 2008-09-30 2013-08-21 株式会社日立ハイテクノロジーズ 試料計測方法、及び計測装置
US8041106B2 (en) * 2008-12-05 2011-10-18 Kla-Tencor Corp. Methods and systems for detecting defects on a reticle
JP5235719B2 (ja) * 2009-02-27 2013-07-10 株式会社日立ハイテクノロジーズ パターン測定装置
NL2004531A (nl) 2009-05-29 2010-11-30 Asml Netherlands Bv Apparatus and method for providing resist alignment marks in a double patterning lithographic process.
CN102484084B (zh) * 2009-07-17 2014-12-10 克拉-坦科股份有限公司 使用设计和缺陷数据的扫描仪性能比较和匹配
JP5644290B2 (ja) * 2010-09-08 2014-12-24 凸版印刷株式会社 フォトマスクの製造方法
CN103201682B (zh) 2010-11-12 2015-06-17 Asml荷兰有限公司 量测方法和设备、光刻系统和器件制造方法

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