JP2015523296A5 - - Google Patents

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Publication number
JP2015523296A5
JP2015523296A5 JP2015504561A JP2015504561A JP2015523296A5 JP 2015523296 A5 JP2015523296 A5 JP 2015523296A5 JP 2015504561 A JP2015504561 A JP 2015504561A JP 2015504561 A JP2015504561 A JP 2015504561A JP 2015523296 A5 JP2015523296 A5 JP 2015523296A5
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Japan
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panel
substrate
crack
laser
starting
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JP2015504561A
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Japanese (ja)
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JP6378167B2 (ja
JP2015523296A (ja
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Priority claimed from PCT/US2013/029871 external-priority patent/WO2013151660A1/en
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Publication of JP6378167B2 publication Critical patent/JP6378167B2/ja
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JP2015504561A 2012-04-05 2013-03-08 エレクトロクロミック素子を製造するためのサーマルレーザースクライブ切断の方法及び装置、並びに対応する切断されたガラスパネル Expired - Fee Related JP6378167B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261620713P 2012-04-05 2012-04-05
US61/620,713 2012-04-05
PCT/US2013/029871 WO2013151660A1 (en) 2012-04-05 2013-03-08 Method of and apparatus for thermal laser scribe cutting for electrochromic device production; corresponding cut glass panel

Publications (3)

Publication Number Publication Date
JP2015523296A JP2015523296A (ja) 2015-08-13
JP2015523296A5 true JP2015523296A5 (cg-RX-API-DMAC7.html) 2016-04-07
JP6378167B2 JP6378167B2 (ja) 2018-08-22

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JP2015504561A Expired - Fee Related JP6378167B2 (ja) 2012-04-05 2013-03-08 エレクトロクロミック素子を製造するためのサーマルレーザースクライブ切断の方法及び装置、並びに対応する切断されたガラスパネル

Country Status (6)

Country Link
US (1) US9272941B2 (cg-RX-API-DMAC7.html)
EP (1) EP2834036B1 (cg-RX-API-DMAC7.html)
JP (1) JP6378167B2 (cg-RX-API-DMAC7.html)
CN (1) CN104661787A (cg-RX-API-DMAC7.html)
IN (1) IN2014DN08858A (cg-RX-API-DMAC7.html)
WO (1) WO2013151660A1 (cg-RX-API-DMAC7.html)

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KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
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CN112222631B (zh) * 2020-09-24 2022-08-09 中国航空制造技术研究院 一种非晶零件激光切割方法
CN112589225A (zh) * 2020-11-11 2021-04-02 鞍钢股份有限公司 一种降低导电钢盘条轧制事故率的切割方法
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