|
DE102012010708B4
(de)
*
|
2012-05-30 |
2021-12-23 |
Carl Zeiss Microscopy Gmbh |
Kombiniertes bearbeitungssystem zur bearbeitung mittels laser und fokussierten ionenstrahlen
|
|
US8945731B2
(en)
|
2012-06-29 |
2015-02-03 |
Seagate Technology Llc |
Interlayer for device including NFT and cladding layers
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
US9701564B2
(en)
|
2013-01-15 |
2017-07-11 |
Corning Incorporated |
Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
|
|
EP2754524B1
(de)
*
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
CN105324207B
(zh)
|
2013-03-27 |
2018-01-16 |
浜松光子学株式会社 |
激光加工装置及激光加工方法
|
|
DE112014001688B4
(de)
*
|
2013-03-27 |
2024-06-06 |
Hamamatsu Photonics K.K. |
Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren
|
|
CN105209219B
(zh)
|
2013-03-27 |
2017-05-17 |
浜松光子学株式会社 |
激光加工装置及激光加工方法
|
|
CN105102179B
(zh)
*
|
2013-03-27 |
2017-04-26 |
浜松光子学株式会社 |
激光加工装置及激光加工方法
|
|
FR3012059B1
(fr)
*
|
2013-10-17 |
2016-01-08 |
Centre Nat Rech Scient |
Methode et dispositif de micro-usinage par laser
|
|
US10005152B2
(en)
*
|
2013-11-19 |
2018-06-26 |
Rofin-Sinar Technologies Llc |
Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
|
|
KR101407993B1
(ko)
*
|
2013-12-10 |
2014-06-18 |
주식회사 엘티에스 |
기판 절단방법
|
|
US9676167B2
(en)
*
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US9687936B2
(en)
*
|
2013-12-17 |
2017-06-27 |
Corning Incorporated |
Transparent material cutting with ultrafast laser and beam optics
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
JP2015188939A
(ja)
*
|
2014-03-31 |
2015-11-02 |
アイシン精機株式会社 |
レーザ接合方法、レーザ接合品及びレーザ接合装置
|
|
US10239155B1
(en)
*
|
2014-04-30 |
2019-03-26 |
The Boeing Company |
Multiple laser beam processing
|
|
JP6355194B2
(ja)
*
|
2014-05-30 |
2018-07-11 |
国立研究開発法人理化学研究所 |
半導体基材における除去加工装置およびその方法
|
|
TWI730945B
(zh)
|
2014-07-08 |
2021-06-21 |
美商康寧公司 |
用於雷射處理材料的方法與設備
|
|
CN107074611A
(zh)
*
|
2014-07-11 |
2017-08-18 |
康宁股份有限公司 |
通过将脉冲激光穿孔诱导到玻璃制品中进行玻璃切割的系统以及方法
|
|
US9617180B2
(en)
|
2014-07-14 |
2017-04-11 |
Corning Incorporated |
Methods and apparatuses for fabricating glass articles
|
|
WO2016010991A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
US10335902B2
(en)
|
2014-07-14 |
2019-07-02 |
Corning Incorporated |
Method and system for arresting crack propagation
|
|
JP2017530867A
(ja)
|
2014-07-14 |
2017-10-19 |
コーニング インコーポレイテッド |
長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
|
|
US10611667B2
(en)
|
2014-07-14 |
2020-04-07 |
Corning Incorporated |
Method and system for forming perforations
|
|
DE102014116958B9
(de)
|
2014-11-19 |
2017-10-05 |
Trumpf Laser- Und Systemtechnik Gmbh |
Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
|
|
DE102014116957A1
(de)
|
2014-11-19 |
2016-05-19 |
Trumpf Laser- Und Systemtechnik Gmbh |
Optisches System zur Strahlformung
|
|
EP3854513B1
(de)
|
2014-11-19 |
2024-01-03 |
TRUMPF Laser- und Systemtechnik GmbH |
System zur asymmetrischen optischen strahlformung
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
WO2016115017A1
(en)
|
2015-01-12 |
2016-07-21 |
Corning Incorporated |
Laser cutting of thermally tempered substrates using the multi photon absorption method
|
|
WO2016154284A1
(en)
|
2015-03-24 |
2016-09-29 |
Corning Incorporated |
Laser cutting and processing of display glass compositions
|
|
JP2018516215A
(ja)
|
2015-03-27 |
2018-06-21 |
コーニング インコーポレイテッド |
気体透過性窓、および、その製造方法
|
|
KR102499697B1
(ko)
|
2015-07-10 |
2023-02-14 |
코닝 인코포레이티드 |
유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품
|
|
CN105081565A
(zh)
*
|
2015-08-10 |
2015-11-25 |
武汉华工激光工程有限责任公司 |
一种用整形光束进行材料加工的系统及方法
|
|
DE102015218564B4
(de)
|
2015-09-28 |
2020-07-30 |
Trumpf Laser Gmbh |
Laserbearbeitungsmaschine und Verfahren zum Laserschweißen von Werkstücken
|
|
LT6428B
(lt)
|
2015-10-02 |
2017-07-25 |
Uab "Altechna R&D" |
Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys
|
|
US10494290B2
(en)
|
2016-01-14 |
2019-12-03 |
Corning Incorporated |
Dual-airy-beam systems and methods for processing glass substrates
|
|
DE102016102768A1
(de)
|
2016-02-17 |
2017-08-17 |
Schott Ag |
Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement
|
|
JP6938543B2
(ja)
|
2016-05-06 |
2021-09-22 |
コーニング インコーポレイテッド |
透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
WO2018020145A1
(fr)
|
2016-07-25 |
2018-02-01 |
Amplitude Systemes |
Procédé et appareil pour la découpe de matériaux par multi-faisceaux laser femtoseconde
|
|
FR3054151B1
(fr)
*
|
2016-07-25 |
2018-07-13 |
Amplitude Systemes |
Procede et appareil pour la decoupe de materiaux par multi-faisceaux laser femtoseconde
|
|
WO2018022476A1
(en)
|
2016-07-29 |
2018-02-01 |
Corning Incorporated |
Apparatuses and methods for laser processing
|
|
US10522963B2
(en)
|
2016-08-30 |
2019-12-31 |
Corning Incorporated |
Laser cutting of materials with intensity mapping optical system
|
|
EP3597353A1
(en)
|
2016-09-30 |
2020-01-22 |
Corning Incorporated |
Apparatuses for laser processing transparent workpieces using non-axisymmetric beam spots
|
|
US10730783B2
(en)
|
2016-09-30 |
2020-08-04 |
Corning Incorporated |
Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
|
|
CN107876971A
(zh)
*
|
2016-09-30 |
2018-04-06 |
上海微电子装备(集团)股份有限公司 |
一种激光切割装置及方法
|
|
EP3848333B1
(en)
|
2016-10-24 |
2025-12-03 |
Corning Incorporated |
Substrate processing station for laser-based machining of sheet-like glass substrates
|
|
DE102016120244A1
(de)
*
|
2016-10-24 |
2018-04-26 |
Cl Schutzrechtsverwaltungs Gmbh |
Vorrichtung zur additiven Herstellung dreidimensionaler Objekte
|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
EP3523083B1
(en)
*
|
2016-11-18 |
2023-08-09 |
IPG Photonics Corporation |
System and method for laser processing of materials.
|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
Corning Incorporated |
Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
|
US20230339042A1
(en)
*
|
2020-06-25 |
2023-10-26 |
Corning Incorporated |
Methods for laser processing transparent workpieces using radially variable laser beam focal columns
|
|
KR102375235B1
(ko)
|
2020-09-08 |
2022-03-16 |
주식회사 필옵틱스 |
레이저 가공 시스템 및 방법
|
|
US12434331B2
(en)
*
|
2020-09-11 |
2025-10-07 |
Corning Incorporated |
Laser forming non-square edges in transparent workpieces using modified airy beams
|
|
FR3121349B1
(fr)
*
|
2021-04-01 |
2024-08-16 |
Keranova |
Systeme de decoupe d’un tissu en portions par generation de bulles de gaz oblongues
|
|
GB2618976A
(en)
*
|
2021-08-24 |
2023-11-29 |
Intel Corp |
Method and apparatus for modifying a substrate
|
|
JP7730722B2
(ja)
|
2021-10-25 |
2025-08-28 |
ギガフォトン株式会社 |
極端紫外光生成方法、極端紫外光生成装置、及び電子デバイスの製造方法
|
|
KR20230064664A
(ko)
|
2021-11-03 |
2023-05-11 |
삼성디스플레이 주식회사 |
광학 시스템
|
|
WO2026049822A2
(en)
*
|
2024-05-24 |
2026-03-05 |
Board Of Regents, The University Of Texas System |
Inducing morphological changes and nanopatterning in a substrate using near-field focusing of ultrafast laser
|