JP2015515699A5 - - Google Patents

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Publication number
JP2015515699A5
JP2015515699A5 JP2015507416A JP2015507416A JP2015515699A5 JP 2015515699 A5 JP2015515699 A5 JP 2015515699A5 JP 2015507416 A JP2015507416 A JP 2015507416A JP 2015507416 A JP2015507416 A JP 2015507416A JP 2015515699 A5 JP2015515699 A5 JP 2015515699A5
Authority
JP
Japan
Prior art keywords
smart card
card body
strip portion
strip
carrier material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015507416A
Other languages
English (en)
Japanese (ja)
Other versions
JP6108641B2 (ja
JP2015515699A (ja
Filing date
Publication date
Priority claimed from DE201210008176 external-priority patent/DE102012008176A1/de
Priority claimed from DE202012004102U external-priority patent/DE202012004102U1/de
Application filed filed Critical
Priority claimed from PCT/EP2013/001245 external-priority patent/WO2013159929A1/de
Publication of JP2015515699A publication Critical patent/JP2015515699A/ja
Publication of JP2015515699A5 publication Critical patent/JP2015515699A5/ja
Application granted granted Critical
Publication of JP6108641B2 publication Critical patent/JP6108641B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015507416A 2012-04-26 2013-04-25 半導体チップを受け入れるためのスマートカード本体を製造する方法、および適当なスマートカード本体 Expired - Fee Related JP6108641B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE202012004102.9 2012-04-26
DE201210008176 DE102012008176A1 (de) 2012-04-26 2012-04-26 Verfahren zur Herstellung eines Smartcard-Körpers zur Aufnahme eines Halbleiter-Chips sowie ein derartiger Smartcard-Körper
DE102012008176.6 2012-04-26
DE202012004102U DE202012004102U1 (de) 2012-04-26 2012-04-26 Smartcard-Körper zur Aufnahme eines Halbleiter-Chips
PCT/EP2013/001245 WO2013159929A1 (de) 2012-04-26 2013-04-25 Verfahren zur herstellung eines smartcard-körpers zur aufnahme eines halbleiter-chips sowie eine derartiger smartcard-körper

Publications (3)

Publication Number Publication Date
JP2015515699A JP2015515699A (ja) 2015-05-28
JP2015515699A5 true JP2015515699A5 (enExample) 2016-06-16
JP6108641B2 JP6108641B2 (ja) 2017-04-05

Family

ID=48520880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015507416A Expired - Fee Related JP6108641B2 (ja) 2012-04-26 2013-04-25 半導体チップを受け入れるためのスマートカード本体を製造する方法、および適当なスマートカード本体

Country Status (7)

Country Link
US (1) US9092711B2 (enExample)
EP (1) EP2842082B1 (enExample)
JP (1) JP6108641B2 (enExample)
KR (1) KR101767720B1 (enExample)
CN (1) CN104364804B (enExample)
BR (1) BR112014026379A2 (enExample)
WO (1) WO2013159929A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201710090YA (en) * 2015-06-23 2018-01-30 Linxens Holding Smart card blank with at least one interface for contactless transmission of information
EP3335157B1 (en) 2015-08-14 2023-12-13 Capital One Services, LLC Two-piece transaction card construction
FR3081583B1 (fr) 2018-05-25 2021-10-01 Linxens Holding Procede de fabrication de cartes a puce electronique et cartes a puce electronique fabriquees par ce procede
US10763203B1 (en) * 2019-02-08 2020-09-01 Nxp B.V. Conductive trace design for smart card

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438481A (en) * 1987-11-17 1995-08-01 Advanced Interconnections Corporation Molded-in lead frames
JP3492212B2 (ja) * 1998-08-26 2004-02-03 新光電気工業株式会社 半導体装置用パッケージ及びその製造方法
US6291263B1 (en) * 2000-06-13 2001-09-18 Siliconware Precision Industries Co., Ltd. Method of fabricating an integrated circuit package having a core-hollowed encapsulation body
US7081644B2 (en) * 2004-02-06 2006-07-25 Barnes Group Inc. Overmolded lens on leadframe and method for overmolding lens on lead frame
CN1898808A (zh) * 2004-02-06 2007-01-17 班斯集团公司 引线框上包覆成型的透镜和引线框上包覆成型透镜的方法
EP1884335A4 (en) * 2005-05-24 2010-01-13 Murata Manufacturing Co METHOD AND DEVICE FOR PRODUCING INSERTED PART
DE502005007956D1 (de) * 2005-11-14 2009-10-01 Tyco Electronics Amp Gmbh Smartcard-Körper, Smartcard und Herstellungsverfahren
DE102006033864B4 (de) * 2006-07-21 2009-04-16 Infineon Technologies Ag Elektronische Schaltung in einer Package-in-Package-Konfiguration und Herstellungsverfahren für eine solche Schaltung
DE102008033018A1 (de) * 2008-07-14 2010-02-11 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement

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