KR101767720B1 - 반도체 칩을 수용하는 스마트 카드 바디 및 그 제조 방법 - Google Patents

반도체 칩을 수용하는 스마트 카드 바디 및 그 제조 방법 Download PDF

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Publication number
KR101767720B1
KR101767720B1 KR1020147032945A KR20147032945A KR101767720B1 KR 101767720 B1 KR101767720 B1 KR 101767720B1 KR 1020147032945 A KR1020147032945 A KR 1020147032945A KR 20147032945 A KR20147032945 A KR 20147032945A KR 101767720 B1 KR101767720 B1 KR 101767720B1
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KR
South Korea
Prior art keywords
smart card
strip
card body
strip portion
substrate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020147032945A
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English (en)
Korean (ko)
Other versions
KR20150012259A (ko
Inventor
에릭 다니엘
프랭크 에버하르트
제바스티안 칼렉
프레데릭 모르겐탈러
라이너 무츠
티모 샤빈거
Original Assignee
프리테마 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE201210008176 external-priority patent/DE102012008176A1/de
Priority claimed from DE202012004102U external-priority patent/DE202012004102U1/de
Application filed by 프리테마 게엠베하 filed Critical 프리테마 게엠베하
Publication of KR20150012259A publication Critical patent/KR20150012259A/ko
Application granted granted Critical
Publication of KR101767720B1 publication Critical patent/KR101767720B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020147032945A 2012-04-26 2013-04-25 반도체 칩을 수용하는 스마트 카드 바디 및 그 제조 방법 Expired - Fee Related KR101767720B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE202012004102.9 2012-04-26
DE201210008176 DE102012008176A1 (de) 2012-04-26 2012-04-26 Verfahren zur Herstellung eines Smartcard-Körpers zur Aufnahme eines Halbleiter-Chips sowie ein derartiger Smartcard-Körper
DE102012008176.6 2012-04-26
DE202012004102U DE202012004102U1 (de) 2012-04-26 2012-04-26 Smartcard-Körper zur Aufnahme eines Halbleiter-Chips
PCT/EP2013/001245 WO2013159929A1 (de) 2012-04-26 2013-04-25 Verfahren zur herstellung eines smartcard-körpers zur aufnahme eines halbleiter-chips sowie eine derartiger smartcard-körper

Publications (2)

Publication Number Publication Date
KR20150012259A KR20150012259A (ko) 2015-02-03
KR101767720B1 true KR101767720B1 (ko) 2017-08-23

Family

ID=48520880

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147032945A Expired - Fee Related KR101767720B1 (ko) 2012-04-26 2013-04-25 반도체 칩을 수용하는 스마트 카드 바디 및 그 제조 방법

Country Status (7)

Country Link
US (1) US9092711B2 (enExample)
EP (1) EP2842082B1 (enExample)
JP (1) JP6108641B2 (enExample)
KR (1) KR101767720B1 (enExample)
CN (1) CN104364804B (enExample)
BR (1) BR112014026379A2 (enExample)
WO (1) WO2013159929A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201710090YA (en) * 2015-06-23 2018-01-30 Linxens Holding Smart card blank with at least one interface for contactless transmission of information
EP3335157B1 (en) 2015-08-14 2023-12-13 Capital One Services, LLC Two-piece transaction card construction
FR3081583B1 (fr) 2018-05-25 2021-10-01 Linxens Holding Procede de fabrication de cartes a puce electronique et cartes a puce electronique fabriquees par ce procede
US10763203B1 (en) * 2019-02-08 2020-09-01 Nxp B.V. Conductive trace design for smart card

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050174767A1 (en) 2004-02-06 2005-08-11 Barnes Group, Inc. Overmolded lens on leadframe and method for overmolding lens on lead frame
US20080017972A1 (en) 2006-07-21 2008-01-24 Infineon Technologies Ag Electronic circuit in a package-in-package configuration and production method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438481A (en) * 1987-11-17 1995-08-01 Advanced Interconnections Corporation Molded-in lead frames
JP3492212B2 (ja) * 1998-08-26 2004-02-03 新光電気工業株式会社 半導体装置用パッケージ及びその製造方法
US6291263B1 (en) * 2000-06-13 2001-09-18 Siliconware Precision Industries Co., Ltd. Method of fabricating an integrated circuit package having a core-hollowed encapsulation body
CN1898808A (zh) * 2004-02-06 2007-01-17 班斯集团公司 引线框上包覆成型的透镜和引线框上包覆成型透镜的方法
EP1884335A4 (en) * 2005-05-24 2010-01-13 Murata Manufacturing Co METHOD AND DEVICE FOR PRODUCING INSERTED PART
DE502005007956D1 (de) * 2005-11-14 2009-10-01 Tyco Electronics Amp Gmbh Smartcard-Körper, Smartcard und Herstellungsverfahren
DE102008033018A1 (de) * 2008-07-14 2010-02-11 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050174767A1 (en) 2004-02-06 2005-08-11 Barnes Group, Inc. Overmolded lens on leadframe and method for overmolding lens on lead frame
US20080017972A1 (en) 2006-07-21 2008-01-24 Infineon Technologies Ag Electronic circuit in a package-in-package configuration and production method

Also Published As

Publication number Publication date
EP2842082B1 (de) 2016-12-14
CN104364804A (zh) 2015-02-18
JP6108641B2 (ja) 2017-04-05
CN104364804B (zh) 2017-05-17
JP2015515699A (ja) 2015-05-28
EP2842082A1 (de) 2015-03-04
BR112014026379A2 (pt) 2017-06-27
WO2013159929A1 (de) 2013-10-31
KR20150012259A (ko) 2015-02-03
US9092711B2 (en) 2015-07-28
US20150076240A1 (en) 2015-03-19

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