JP2015513068A - 熱画像センサ - Google Patents
熱画像センサ Download PDFInfo
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- JP2015513068A JP2015513068A JP2014553853A JP2014553853A JP2015513068A JP 2015513068 A JP2015513068 A JP 2015513068A JP 2014553853 A JP2014553853 A JP 2014553853A JP 2014553853 A JP2014553853 A JP 2014553853A JP 2015513068 A JP2015513068 A JP 2015513068A
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/205—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using distributed sensing elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/225—Measuring circuits therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
- G01L9/045—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges with electric temperature compensating means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2213/00—Temperature mapping
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nonlinear Science (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Description
Claims (16)
- 基板上のパターン内に配置された離間したセンサ素子のアレイを備え、
各センサ素子は、抵抗部品を備えると共に、電気的に接続され、各センサ素子によって独立して測定された物理的変数が、外部機器によって記録及び/又は表示可能である、センサデバイス。 - 前記センサ素子は、温度検出素子であり、
前記センサデバイスは、温度検出デバイスである、請求項1に記載のセンサデバイス。 - 前記温度検出素子は、温度依存抵抗器である、請求項2に記載のセンサデバイス。
- 前記温度検出素子は、負温度係数(NTC)サーミスタである、請求項3に記載のセンサデバイス。
- 前記センサ素子は、ピエゾ抵抗素子を含み、
前記センサデバイスは、歪み又は圧力検出デバイスである、請求項1に記載のセンサデバイス。 - 前記センサ素子は、フォトレジスタを含み、
前記センサデバイスは、光学イメージングデバイスである、請求項1に記載のセンサデバイス。 - 少なくとも1つのセンサ素子は、直列の温度に依存しない測定抵抗器を含む、請求項1に記載のセンサデバイス。
- 前記少なくとも1つのセンサ素子は、直列の温度に依存しない負荷抵抗器と、並列の温度に依存しないシャント抵抗器と、を含む、請求項7に記載のセンサデバイス。
- 前記センサ素子は、共通ソースに接続される、即ちライト・オール−リード・ワン構成で接続される、請求項1に記載のセンサデバイス。
- 前記センサ素子は、共通出力に接続される、即ちライト・ワン−リード・オール構成で接続される、請求項1に記載のセンサデバイス。
- 前記センサ素子は、ライトX−リードY構成において、X行とY列とを備えるアレイに接続される、請求項1に記載のセンサデバイス。
- 個々の前記センサ素子の位置及び/又はサイズは、前記センサデバイスが、温度プロフィール、又は別の物理的変数のプロフィールが測定されるべき対象物のサイズ、形状及び形態に適合できるように選択される、請求項1に記載のセンサデバイス。
- 前記基板は、フレキシブルであるか、又は測定されるべき対象物の形状に適合する、請求項12に記載のセンサデバイス。
- 前記センサ素子は、測定された物理的変数の表示において、使用中に、マッピングされたパターン内に配置されている、請求項1に記載のセンサデバイス。
- 基板上に印刷されたセンサ素子を含むセンサアレイを備える、請求項1に記載のセンサデバイス。
- 温度に依存しない抵抗器、導電体トラック及び絶縁体を含むがこれらに限定されるものではない前記センサアレイの他の部品はまた、前記基板上に印刷される、請求項15に記載のセンサデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ZA2012/00708 | 2012-01-30 | ||
ZA201200708 | 2012-01-30 | ||
PCT/IB2013/050780 WO2013114291A1 (en) | 2012-01-30 | 2013-01-30 | Thermal imaging sensors |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015513068A true JP2015513068A (ja) | 2015-04-30 |
Family
ID=48904488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014553853A Pending JP2015513068A (ja) | 2012-01-30 | 2013-01-30 | 熱画像センサ |
Country Status (7)
Country | Link |
---|---|
US (1) | US9664573B2 (ja) |
EP (1) | EP2810037A4 (ja) |
JP (1) | JP2015513068A (ja) |
KR (1) | KR20140111714A (ja) |
CN (1) | CN104185780A (ja) |
WO (1) | WO2013114291A1 (ja) |
ZA (1) | ZA201406077B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017075854A (ja) * | 2015-10-15 | 2017-04-20 | ニッタ株式会社 | 感温素子 |
JP2017151014A (ja) * | 2016-02-26 | 2017-08-31 | 積水化学工業株式会社 | 電気回路およびセンサ |
JP2018146427A (ja) * | 2017-03-07 | 2018-09-20 | 東芝キヤリア株式会社 | 温度測定装置およびショーケース |
US10718680B2 (en) | 2014-12-18 | 2020-07-21 | Nitta Corporation | Sensor sheet |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106158886A (zh) * | 2015-03-30 | 2016-11-23 | 中航(重庆)微电子有限公司 | 带有热敏电阻阵列的集成结构及像元电路 |
US10034609B2 (en) * | 2015-11-05 | 2018-07-31 | Nano And Advanced Materials Institute Limited | Temperature sensor for tracking body temperature based on printable nanomaterial thermistor |
JP2018536472A (ja) | 2015-11-06 | 2018-12-13 | ポディメトリクス インコーポレイテッドPodimetrics, Inc. | 潰瘍または潰瘍前病変を検出するためのフットウェアシステム |
RU2622236C1 (ru) * | 2016-06-15 | 2017-06-13 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Санкт-Петербургский государственный университет промышленных технологий и дизайна" | Датчик измерения температурного поля |
RU2622094C1 (ru) * | 2016-06-15 | 2017-06-09 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Санкт-Петербургский государственный университет промышленных технологий и дизайна" | Способ определения температурного поля |
RU2633652C1 (ru) * | 2016-06-20 | 2017-10-16 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Санкт-Петербургский государственный университет промышленных технологий и дизайна" | Датчик измерения температурного поля |
CN107300426B (zh) * | 2017-06-23 | 2019-06-25 | 北京金风科创风电设备有限公司 | 温度检测系统和温度检测方法 |
EP3435048A1 (de) * | 2017-07-25 | 2019-01-30 | Heraeus Sensor Technology GmbH | Sensor zur erfassung eines räumlichen temperaturprofils und verfahren zur herstellung einer sensoreinheit |
PL239378B1 (pl) * | 2018-02-07 | 2021-11-29 | Sensdx Spolka Z Ograniczona Odpowiedzialnoscia | Czujnik do pomiarów impedancyjnych próbki czynnika biologicznego lub chemicznego oraz sposób wykrywania czynnika biologicznego lub chemicznego w próbce za pomocą takiego czujnika |
JP7066557B2 (ja) * | 2018-07-12 | 2022-05-13 | 東京エレクトロン株式会社 | 温度測定センサ、温度測定システム、および、温度測定方法 |
CN112735993B (zh) * | 2021-04-01 | 2022-01-18 | 中山德华芯片技术有限公司 | 一种晶圆表面温度探测器及其应用 |
CN113237566A (zh) * | 2021-04-23 | 2021-08-10 | 广州碳思科技有限公司 | 一种阵列式温度传感器及其制作方法 |
CA3238042A1 (en) | 2021-12-06 | 2023-06-15 | Podimetrics, Inc. | Apparatus and method of measuring blood flow in the foot |
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-
2013
- 2013-01-30 EP EP13743119.3A patent/EP2810037A4/en not_active Withdrawn
- 2013-01-30 JP JP2014553853A patent/JP2015513068A/ja active Pending
- 2013-01-30 CN CN201380014957.5A patent/CN104185780A/zh active Pending
- 2013-01-30 WO PCT/IB2013/050780 patent/WO2013114291A1/en active Application Filing
- 2013-01-30 US US14/375,459 patent/US9664573B2/en not_active Expired - Fee Related
- 2013-01-30 KR KR1020147024376A patent/KR20140111714A/ko not_active Application Discontinuation
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2014
- 2014-08-19 ZA ZA2014/06077A patent/ZA201406077B/en unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS55105476A (en) * | 1978-07-12 | 1980-08-13 | Elettronica Spa | Electronic address device for reading mosaic matrix of photoelectric element |
JPS60164231A (ja) * | 1984-02-06 | 1985-08-27 | Hitachi Ltd | 力分布検出器 |
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US10718680B2 (en) | 2014-12-18 | 2020-07-21 | Nitta Corporation | Sensor sheet |
JP2017075854A (ja) * | 2015-10-15 | 2017-04-20 | ニッタ株式会社 | 感温素子 |
JP2017151014A (ja) * | 2016-02-26 | 2017-08-31 | 積水化学工業株式会社 | 電気回路およびセンサ |
JP2018146427A (ja) * | 2017-03-07 | 2018-09-20 | 東芝キヤリア株式会社 | 温度測定装置およびショーケース |
Also Published As
Publication number | Publication date |
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EP2810037A1 (en) | 2014-12-10 |
EP2810037A4 (en) | 2015-12-09 |
ZA201406077B (en) | 2015-11-25 |
KR20140111714A (ko) | 2014-09-19 |
WO2013114291A1 (en) | 2013-08-08 |
US20150007665A1 (en) | 2015-01-08 |
US9664573B2 (en) | 2017-05-30 |
CN104185780A (zh) | 2014-12-03 |
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