JP2015509138A5 - - Google Patents

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Publication number
JP2015509138A5
JP2015509138A5 JP2014546160A JP2014546160A JP2015509138A5 JP 2015509138 A5 JP2015509138 A5 JP 2015509138A5 JP 2014546160 A JP2014546160 A JP 2014546160A JP 2014546160 A JP2014546160 A JP 2014546160A JP 2015509138 A5 JP2015509138 A5 JP 2015509138A5
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JP
Japan
Prior art keywords
magnetic
inserts
insert
replaceable
template
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014546160A
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English (en)
Japanese (ja)
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JP2015509138A (ja
JP6106690B2 (ja
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Publication date
Priority claimed from US13/316,358 external-priority patent/US9347129B2/en
Application filed filed Critical
Publication of JP2015509138A publication Critical patent/JP2015509138A/ja
Publication of JP2015509138A5 publication Critical patent/JP2015509138A5/ja
Application granted granted Critical
Publication of JP6106690B2 publication Critical patent/JP6106690B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014546160A 2011-12-09 2012-12-07 交換可能な磁石パック Expired - Fee Related JP6106690B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/316,358 US9347129B2 (en) 2011-12-09 2011-12-09 Interchangeable magnet pack
US13/316,358 2011-12-09
PCT/US2012/068635 WO2013086466A1 (en) 2011-12-09 2012-12-07 Interchangeable magnet pack

Publications (3)

Publication Number Publication Date
JP2015509138A JP2015509138A (ja) 2015-03-26
JP2015509138A5 true JP2015509138A5 (enExample) 2016-01-28
JP6106690B2 JP6106690B2 (ja) 2017-04-05

Family

ID=48570988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014546160A Expired - Fee Related JP6106690B2 (ja) 2011-12-09 2012-12-07 交換可能な磁石パック

Country Status (8)

Country Link
US (1) US9347129B2 (enExample)
EP (1) EP2788524A4 (enExample)
JP (1) JP6106690B2 (enExample)
KR (1) KR20140138597A (enExample)
CN (1) CN104603325A (enExample)
SG (1) SG11201403053UA (enExample)
TW (1) TW201339343A (enExample)
WO (1) WO2013086466A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10573500B2 (en) * 2011-12-09 2020-02-25 Seagate Technology Llc Interchangeable magnet pack
FR3064423B1 (fr) 2017-03-22 2019-11-15 Whylot Sas Rotor pour moteur ou generatrice electromagnetique a structure alveolaire comportant des alveoles pour le logement d'aimants respectifs
US11322338B2 (en) * 2017-08-31 2022-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Sputter target magnet
FR3077414B1 (fr) * 2018-01-26 2022-03-11 Whylot Sas Aimant unitaire a configuration ovoide et structure d'aimant a plusieurs aimants unitaires
GB201815216D0 (en) * 2018-09-18 2018-10-31 Spts Technologies Ltd Apparatus and a method of controlling thickness variation in a material layer formed using physical vapour deposition
US11772812B1 (en) * 2020-09-09 2023-10-03 United States Of America As Represented By The Secretary Of The Air Force Magnetic mobile aircraft cover
US12014912B2 (en) * 2021-05-05 2024-06-18 Taiwan Semiconductor Manufacturing Company Limited Apparatus and method for physical vapor deposition

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3386568A (en) * 1967-06-22 1968-06-04 Ruby L. Harmon Magnet kit
DE3727901A1 (de) 1987-08-21 1989-03-02 Leybold Ag Zerstaeubungskathode nach dem magnetronprinzip
JPH04218905A (ja) 1990-03-23 1992-08-10 Unitika Ltd 薄膜状磁性材料及びその製造方法
US5407551A (en) 1993-07-13 1995-04-18 The Boc Group, Inc. Planar magnetron sputtering apparatus
JP3834111B2 (ja) * 1996-10-16 2006-10-18 松下電器産業株式会社 マグネトロンスパッタ方法、マグネトロンスパッタ装置及びそれに使用するマグネットユニット
GB9718947D0 (en) * 1997-09-05 1997-11-12 Nordiko Ltd Vacuum sputtering apparatus
US6287435B1 (en) 1998-05-06 2001-09-11 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6306265B1 (en) 1999-02-12 2001-10-23 Applied Materials, Inc. High-density plasma for ionized metal deposition capable of exciting a plasma wave
US6299740B1 (en) * 2000-01-19 2001-10-09 Veeco Instrument, Inc. Sputtering assembly and target therefor
KR100345924B1 (ko) * 2000-01-24 2002-07-27 한전건 평판 마그네트론 스퍼터링 장치
US6406599B1 (en) * 2000-11-01 2002-06-18 Applied Materials, Inc. Magnetron with a rotating center magnet for a vault shaped sputtering target
JP4411512B2 (ja) 2003-08-07 2010-02-10 アイシン精機株式会社 超電導磁場発生装置、その励磁方法、超電導磁場発生装置を用いたスパッタリング成膜装置、強磁性体着脱治具
US7018515B2 (en) * 2004-03-24 2006-03-28 Applied Materials, Inc. Selectable dual position magnetron
KR101243068B1 (ko) 2005-02-02 2013-03-13 히타치 긴조쿠 가부시키가이샤 마그네트론 스퍼터링용 자기 회로 장치 및 그 제조 방법
DE102005019100B4 (de) 2005-04-25 2009-02-12 Steag Hamatech Ag Magnetsystem für eine Zerstäubungskathode
US20070108041A1 (en) * 2005-11-11 2007-05-17 Guo George X Magnetron source having increased usage life
US8557094B2 (en) * 2006-10-05 2013-10-15 Applied Materials, Inc. Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum
JP5717444B2 (ja) * 2008-06-26 2015-05-13 株式会社アルバック カソードユニット及びこのカソードユニットを備えたスパッタリング装置
US20120097534A1 (en) * 2008-08-29 2012-04-26 Ulvac, Inc. Magnetron sputtering cathode and film formation apparatus
US8721796B2 (en) * 2008-10-23 2014-05-13 Applied Materials, Inc. Plasma cleaning apparatus and method
CN101851746A (zh) * 2009-04-03 2010-10-06 鸿富锦精密工业（深圳）有限公司 磁控式溅镀靶及磁控式溅镀系统

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