JP5717444B2 - カソードユニット及びこのカソードユニットを備えたスパッタリング装置 - Google Patents
カソードユニット及びこのカソードユニットを備えたスパッタリング装置 Download PDFInfo
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- JP5717444B2 JP5717444B2 JP2010518017A JP2010518017A JP5717444B2 JP 5717444 B2 JP5717444 B2 JP 5717444B2 JP 2010518017 A JP2010518017 A JP 2010518017A JP 2010518017 A JP2010518017 A JP 2010518017A JP 5717444 B2 JP5717444 B2 JP 5717444B2
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- 238000004544 sputter deposition Methods 0.000 title claims description 49
- 239000013077 target material Substances 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 36
- 230000004308 accommodation Effects 0.000 claims description 15
- 239000010408 film Substances 0.000 description 30
- 239000007789 gas Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- -1 argon ions Chemical class 0.000 description 1
- 238000005513 bias potential Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/2855—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by physical means, e.g. sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
- H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating
Description
2 真空チャンバ
C、C1 カソードユニット
4 凹部
5 ターゲット材
5a 放電用の空間
6 収容孔
7 磁石(磁場発生手段)
9 DC電源
11 ガス管(ガス導入手段)
12 真空排気手段
W 基板
Claims (5)
- 片面に複数の凹部が形成されたホルダを備え、前記凹部に有底筒状のターゲット材がその底部側から装着されると共に、前記凹部内に配置された前記ターゲット材の内部空間に磁場を発生させる磁場発生手段を組み付けて構成し、
前記凹部は、前記ホルダの全面に亘って同一の開口径で所定の間隔を存して形成され、かつ前記ホルダの最外に位置する凹部の中心が基板の外周より径方向内側に位置するように定寸されたものであり、
前記磁場発生手段が、相互に隣接する各凹部の中心を結ぶ線上で当該凹部の深さ方向に沿って配置される棒状の磁石であり、
前記ホルダのうち前記凹部が形成された片面と背向する面に、前記磁石の収容を可能とする収容孔が開設されていることを特徴とするカソードユニット。 - 片面に複数の凹部が形成されたホルダを備え、前記凹部に有底筒状のターゲット材がその底部側から装着されると共に、前記凹部内に配置された前記ターゲット材の内部空間に磁場を発生させる磁場発生手段を組み付けて構成し、
前記凹部は、前記ホルダの全面に亘って同一の開口径で所定の間隔を存して形成され、かつ前記ホルダの最外に位置する凹部の中心が基板の外周より径方向内側に位置するように定寸されたものであり、
前記磁場発生手段が各凹部を囲繞するリング状の磁石であり、
前記ホルダのうち前記凹部が形成された片面と背向する他面に、前記磁石の収容を可能とする環状の収容溝が開設されていることを特徴とするカソードユニット。 - 前記磁石のそれぞれが一体の支持板に取付けられ、当該支持板をホルダの他面と接合すると、前記収容孔または収容溝に各磁石が挿設され、前記凹部の周囲に配置されることを特徴とする請求項1または請求項2記載のカソードユニット。
- 請求項1〜請求項3のいずれか1項に記載のカソードユニットと、前記カソードユニットが内部に配置される真空チャンバと、前記真空チャンバ内に所定のスパッタガスを導入するガス導入手段と、前記カソードユニットに電力投入するスパッタ電源とを備えたことを特徴とするスパッタリング装置。
- 前記カソードユニットと基板とを結ぶ基準軸の回りで真空チャンバの壁面に設けたコイルと、各コイルへの通電を可能とする電源装置とを更に備えることを特徴とする請求項4記載のスパッタリング装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010518017A JP5717444B2 (ja) | 2008-06-26 | 2009-06-23 | カソードユニット及びこのカソードユニットを備えたスパッタリング装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008167175 | 2008-06-26 | ||
JP2008167175 | 2008-06-26 | ||
PCT/JP2009/061397 WO2009157438A1 (ja) | 2008-06-26 | 2009-06-23 | カソードユニット及びこのカソードユニットを備えたスパッタリング装置 |
JP2010518017A JP5717444B2 (ja) | 2008-06-26 | 2009-06-23 | カソードユニット及びこのカソードユニットを備えたスパッタリング装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014239392A Division JP2015078440A (ja) | 2008-06-26 | 2014-11-26 | カソードユニット及びこのカソードユニットを備えたスパッタリング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009157438A1 JPWO2009157438A1 (ja) | 2011-12-15 |
JP5717444B2 true JP5717444B2 (ja) | 2015-05-13 |
Family
ID=41444504
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010518017A Active JP5717444B2 (ja) | 2008-06-26 | 2009-06-23 | カソードユニット及びこのカソードユニットを備えたスパッタリング装置 |
JP2014239392A Pending JP2015078440A (ja) | 2008-06-26 | 2014-11-26 | カソードユニット及びこのカソードユニットを備えたスパッタリング装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014239392A Pending JP2015078440A (ja) | 2008-06-26 | 2014-11-26 | カソードユニット及びこのカソードユニットを備えたスパッタリング装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8470145B2 (ja) |
JP (2) | JP5717444B2 (ja) |
KR (1) | KR101560384B1 (ja) |
CN (1) | CN102066604A (ja) |
DE (1) | DE112009001533T5 (ja) |
TW (1) | TWI465598B (ja) |
WO (1) | WO2009157438A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010070845A1 (ja) | 2008-12-15 | 2010-06-24 | 株式会社アルバック | スパッタリング装置及びスパッタリング方法 |
JP5572710B2 (ja) * | 2010-06-28 | 2014-08-13 | アルバックテクノ株式会社 | ターゲット取付機構 |
JP2013001965A (ja) * | 2011-06-16 | 2013-01-07 | Ulvac Japan Ltd | スパッタリング方法 |
US9347129B2 (en) * | 2011-12-09 | 2016-05-24 | Seagate Technology Llc | Interchangeable magnet pack |
US10573500B2 (en) | 2011-12-09 | 2020-02-25 | Seagate Technology Llc | Interchangeable magnet pack |
CN108018534B (zh) * | 2017-12-12 | 2020-12-11 | 中国电子科技集团公司第四十八研究所 | 一种用于装夹靶材的磁控溅射镀膜装夹装置 |
CN108396295B (zh) * | 2018-02-26 | 2023-06-27 | 温州职业技术学院 | 曲面磁控溅射阴极、闭合磁场涂层磁控溅射设备及其应用方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS60181268A (ja) * | 1984-02-29 | 1985-09-14 | Hitachi Ltd | スパツタリングタ−ゲツト |
JPS627855A (ja) * | 1985-07-05 | 1987-01-14 | Hitachi Ltd | スパツタリング装置 |
JPH02175864A (ja) * | 1988-12-27 | 1990-07-09 | Toshiba Corp | 薄膜形成装置およびこれを用いた薄膜形成方法 |
JPH0693442A (ja) * | 1992-09-11 | 1994-04-05 | Ulvac Japan Ltd | マグネトロン・スパッタカソード |
JPH07183219A (ja) * | 1993-10-08 | 1995-07-21 | Varian Assoc Inc | プラズマからのイオン抽出を採用するpvd装置 |
Family Cites Families (10)
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JPS5779170A (en) | 1980-11-06 | 1982-05-18 | Fujitsu Ltd | Target for magnetron sputtering |
JPS57158381A (en) | 1981-03-27 | 1982-09-30 | Nippon Sheet Glass Co Ltd | Magnetron sputtering device |
JPS60224775A (ja) | 1984-04-20 | 1985-11-09 | Fujitsu Ltd | スパツタ装置 |
JPS62260055A (ja) | 1986-05-06 | 1987-11-12 | Hitachi Ltd | スパツタリングタ−ゲツト |
JP3069180B2 (ja) * | 1991-11-15 | 2000-07-24 | 東京エレクトロン株式会社 | 中空形状マグネトロンスパッタ電極 |
JP5026631B2 (ja) * | 1999-06-24 | 2012-09-12 | 株式会社アルバック | スパッタリング装置 |
US6352629B1 (en) * | 2000-07-10 | 2002-03-05 | Applied Materials, Inc. | Coaxial electromagnet in a magnetron sputtering reactor |
US7618521B2 (en) | 2005-03-18 | 2009-11-17 | Applied Materials, Inc. | Split magnet ring on a magnetron sputter chamber |
JP2008047661A (ja) | 2006-08-14 | 2008-02-28 | Seiko Epson Corp | 成膜装置及び半導体装置の製造方法 |
KR101584396B1 (ko) * | 2012-10-31 | 2016-01-11 | 제일모직주식회사 | 도광판 및 이를 포함하는 투명 디스플레이 장치 |
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2009
- 2009-06-23 DE DE112009001533T patent/DE112009001533T5/de not_active Withdrawn
- 2009-06-23 CN CN2009801238993A patent/CN102066604A/zh active Pending
- 2009-06-23 WO PCT/JP2009/061397 patent/WO2009157438A1/ja active Application Filing
- 2009-06-23 JP JP2010518017A patent/JP5717444B2/ja active Active
- 2009-06-23 US US12/991,777 patent/US8470145B2/en active Active
- 2009-06-23 KR KR1020117000340A patent/KR101560384B1/ko active IP Right Grant
- 2009-06-25 TW TW098121398A patent/TWI465598B/zh active
-
2014
- 2014-11-26 JP JP2014239392A patent/JP2015078440A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60181268A (ja) * | 1984-02-29 | 1985-09-14 | Hitachi Ltd | スパツタリングタ−ゲツト |
JPS627855A (ja) * | 1985-07-05 | 1987-01-14 | Hitachi Ltd | スパツタリング装置 |
JPH02175864A (ja) * | 1988-12-27 | 1990-07-09 | Toshiba Corp | 薄膜形成装置およびこれを用いた薄膜形成方法 |
JPH0693442A (ja) * | 1992-09-11 | 1994-04-05 | Ulvac Japan Ltd | マグネトロン・スパッタカソード |
JPH07183219A (ja) * | 1993-10-08 | 1995-07-21 | Varian Assoc Inc | プラズマからのイオン抽出を採用するpvd装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101560384B1 (ko) | 2015-10-14 |
JP2015078440A (ja) | 2015-04-23 |
CN102066604A (zh) | 2011-05-18 |
JPWO2009157438A1 (ja) | 2011-12-15 |
TW201009102A (en) | 2010-03-01 |
WO2009157438A1 (ja) | 2009-12-30 |
DE112009001533T5 (de) | 2011-04-28 |
US20110056829A1 (en) | 2011-03-10 |
KR20110039238A (ko) | 2011-04-15 |
US8470145B2 (en) | 2013-06-25 |
TWI465598B (zh) | 2014-12-21 |
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