JP2015505172A - Ledモジュール、ledユニット、及びledモジュールを備える照明器具 - Google Patents
Ledモジュール、ledユニット、及びledモジュールを備える照明器具 Download PDFInfo
- Publication number
- JP2015505172A JP2015505172A JP2014553831A JP2014553831A JP2015505172A JP 2015505172 A JP2015505172 A JP 2015505172A JP 2014553831 A JP2014553831 A JP 2014553831A JP 2014553831 A JP2014553831 A JP 2014553831A JP 2015505172 A JP2015505172 A JP 2015505172A
- Authority
- JP
- Japan
- Prior art keywords
- led module
- led
- planar substrate
- heat sink
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
Abstract
Description
しかし、LEDプリント回路基板のLEDの発熱容量が制限されている場合、このような別個のヒートスプレッダを含まないことも可能である。この場合、プリント回路基板が熱伝導性平面基板を構成し、LEDとプリント回路基板からなるLEDプリント回路基板がLEDモジュールとなる。ヒートスプレッダ106をヒートシンク118に固定するため、以下に特殊な適応を説明する。この特殊な適応は、LEDモジュールがLEDプリント回路基板である場合にも含まれている。この実施形態は、その構成は図面に示されていない。
このネジ用アイ108の周辺には、ヒートスプレッダ106に一体的に形成された変形可能領域112がある。この変形可能領域112は、それらが一定の限界の力を超えると変形し始めるような方法で設計されている。ヒートスプレッダ106とヒートシンク118との間に、熱界面材料(TIM)116がある。
このネジ用アイ208の周辺には、ヒートスプレッダ220(106)に一体的に形成された変形可能領域206がある。ヒートスプレッダ206とヒートシンク218との間に、熱界面材料(TIM)214がある。図2に示されたネジ210はヒートシンク218の螺刻されたネジ穴216に既に締め付けられている。結果として、ネジ用アイ208の近傍にある変形可能領域206が変形されており、熱界面材料214を介した、ヒートスプレッダ220とヒートシンク218との間の良好な熱接触が確立される(熱が発生するLEDからヒートシンクへの熱輸送を促進する)。
102,202 LED
104,204 プリント回路基板(pcb)
106,220,300 ヒートスプレッダ
108,208,302 ネジ用アイ(締結具用アイ)
112,206,306 変形可能領域
114,210 ネジ(締結具)
116,214 熱界面材料(TIM)
118,218 ヒートシンク
120,216,304 ネジ穴(螺刻されたネジ穴、締結具用穴)
Claims (12)
- 熱界面材料とヒートシンクと一緒に使用されるためのLEDモジュールであって、
少なくとも1つのLEDと、
該少なくとも1つのLEDが上に実装され、前記熱界面材料を介して前記ヒートシンクへ熱を発散するための熱伝導性平面基板と、を有しており、
該熱伝導性平面基板には、前記熱伝導性平面基板を前記ヒートシンクへ取り付ける締結具を受け止めるのに適用される複数の締結具用アイがあり、
前記熱伝導性平面基板は、前記複数の締結具用アイの周辺に一体的に形成された変形可能領域を備え、該一体的に形成された変形可能領域は、前記熱伝導性平面基板と密接に結び付いている、
LEDモジュール。 - 前記熱伝導性平面基板はプリント回路基板であり、前記LEDモジュールはLEDプリント回路基板である、
請求項1記載のLEDモジュール。 - 前記熱伝導性平面基板は、プリント回路基板が接合されたヒートスプレッダである、
請求項1記載のLEDモジュール。 - 前記ヒートスプレッダは、最大厚みが4mmのシート状金属ヒートスプレッダである、
請求項3記載のLEDモジュール。 - 前記一体的に形成された変形可能領域は、前記熱伝導性平面基板の残りの部分よりも薄い、又は剛性が低い、
請求項1から4のいずれか1項記載のLEDモジュール。 - 前記一体的に形成された変形可能領域の厚さは、前記熱伝導性平面基板の残りの部分の多くとも半分である、
請求項5記載のLEDモジュール。 - 前記締結具は、ネジ又はリベットである
請求項1記載のLEDモジュール。 - 前記請求項1から7のいずれか一項記載のLEDモジュールと、
ヒートシンクと、を有しており、
前記締結具を、前記締結具用アイを通って前記ヒートシンクの締結具用穴内に配置することで、前記LEDモジュールが前記ヒートシンクに取り付けられる、
LEDユニット。 - 前記熱界面材料は、前記LEDモジュールの前記熱伝導性平面基板と、前記ヒートシンクとの間に配置されている、
請求項8記載のLEDユニット。 - 前記熱界面材料は、熱パッド、熱パテ及び熱ペーストの群から選択される、
請求項9記載のLEDユニット。 - 前記締結具は、ネジ又はリベットである
請求項8記載のLEDユニット。 - 請求項1から7のいずれの一項記載のLEDモジュール又は請求項8から11のいずれか一項の記載のLEDユニットを備える、照明器具。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261590351P | 2012-01-25 | 2012-01-25 | |
US61/590,351 | 2012-01-25 | ||
PCT/IB2013/050423 WO2013111037A2 (en) | 2012-01-25 | 2013-01-17 | Led module and luminaire comprising said module |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015505172A true JP2015505172A (ja) | 2015-02-16 |
Family
ID=47790278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014553831A Pending JP2015505172A (ja) | 2012-01-25 | 2013-01-17 | Ledモジュール、ledユニット、及びledモジュールを備える照明器具 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9989235B2 (ja) |
EP (1) | EP2807421B1 (ja) |
JP (1) | JP2015505172A (ja) |
CN (1) | CN103998863A (ja) |
ES (1) | ES2583167T3 (ja) |
RU (1) | RU2612563C2 (ja) |
WO (1) | WO2013111037A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020527282A (ja) * | 2017-07-31 | 2020-09-03 | シグニファイ ホールディング ビー ヴィSignify Holding B.V. | サージ保護照明器具 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US20150117039A1 (en) * | 2013-10-25 | 2015-04-30 | Kevin Yang | Substrate Gap Mounted LED |
CN104728811A (zh) * | 2015-04-08 | 2015-06-24 | 北京神州普镓照明科技发展有限公司 | Led灯壳装置 |
JP6584189B2 (ja) | 2015-07-27 | 2019-10-02 | 株式会社小糸製作所 | 灯具 |
FR3048153B1 (fr) * | 2016-02-22 | 2019-11-29 | Valeo Vision | Module lumineux pour un vehicule automobile avec reprise de masse |
CN107683016A (zh) * | 2017-11-21 | 2018-02-09 | 生益电子股份有限公司 | 一种快速散热pcb |
RU191247U1 (ru) * | 2019-03-21 | 2019-07-31 | Закрытое акционерное общество "БТМ" | Светодиодный светильник |
RU196224U1 (ru) * | 2019-08-02 | 2020-02-21 | Юрий Борисович Соколов | Светоизлучающая структура для неизолированного драйвера |
US10986722B1 (en) * | 2019-11-15 | 2021-04-20 | Goodrich Corporation | High performance heat sink for double sided printed circuit boards |
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- 2013-01-17 JP JP2014553831A patent/JP2015505172A/ja active Pending
- 2013-01-17 ES ES13707440.7T patent/ES2583167T3/es active Active
- 2013-01-17 CN CN201380004336.9A patent/CN103998863A/zh active Pending
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Also Published As
Publication number | Publication date |
---|---|
EP2807421A2 (en) | 2014-12-03 |
RU2014127291A (ru) | 2016-02-10 |
US20150036362A1 (en) | 2015-02-05 |
US9989235B2 (en) | 2018-06-05 |
WO2013111037A3 (en) | 2013-10-31 |
CN103998863A (zh) | 2014-08-20 |
ES2583167T3 (es) | 2016-09-19 |
WO2013111037A2 (en) | 2013-08-01 |
EP2807421B1 (en) | 2016-04-27 |
RU2612563C2 (ru) | 2017-03-09 |
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