1362894 _ 100年12月26日梭正替运頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種發光二極體光源裝置，特別係一種具有 較佳散熱效率之發光二極體光源裝置。 【先前技術】 [0002] 目前，發光二極體（Light Emi tt ing Diode, LED)因 其具較佳之光學性能而被廣泛應用到各種領域，具體可 參見Daniel A. Steigerwald等人於文獻IEEE Journal on Selected Topics in Quantum Elec-tronics，Vol. 8，No.2 (2002年3/4月）中之Illu-rainat ion With Solid State Lighting Technology— 文。 [0003] 發光二極體係為一種固態之半導體發光元件，其電、光 特性及壽命對溫度敏感。一般而言，較高之溫度會導致 低落之内部量子效應並且壽命亦會明顯縮短；另一方面 ，半導體之電阻隨著溫度之升高而降低，滑落之電阻會 帶來較大之電流及更多之熱產生，造成熱累積現象之發 生；此一熱破壞迴圈往往會加速破壞發光二極體光源裝 置。 [0004] 參見美國專利第6,428, 189 B1號揭示之一種發光二極體 光源裝置，其係利用散熱器（Heat Dissipater)來輔助 發光二極體進行散熱以抑制熱累積現象之產生。其中， 發光二極體與電路板形成電連接並穿過電路板上之通孔 與散熱器形成熱接觸，並且該發光二極體係經由熱耦合 劑（Thermal Coupling Agent)與散熱器黏合而形成熱 096141342 表單編號A0101 第4頁/共20頁 1003480424-0 1362894 100年.12月26日梭正_頁 接觸。然而，熱耦合劑通常難以提供足夠之結合力使發 光二極體與散熱器穩固地連接在一起以確保發光二極體 與散熱器之間有良好之熱傳遞，其於一定程度上會導致 該種發光二極體光源裝置之散熱效率不佳。 【發明内容】 [0005] 下面將以實施例說明一種發光二極體光源裝置，其可具 較佳之散熱效率。 [0006] —種發光二極體光源裝置，其包括：一電路板、複數個 發光二極體、一散熱裝置以及複數個固接裝置。該電路 板包括一第一表面以及一與該第一表面相對之第二表面 ，該第一表面上設置有電氣連線。該複數個發光二極體 設置於該電路板之第一表面上且與該電氣連線電性連接 。該散熱裝置與該電路板之該第二表面形成熱接觸。該 複數個固接裝置分別包括一第一端部及一與第一端部相 對之第二端部，該第一端部卡固於該電路板之第一表面 上，該第二端部與該散熱裝置固定連接。 [0007] 相對於先前技術，該發光二極體光源裝置經由設置複數 個固接裝置並將該複數個固接裝置之第一端部卡固於電 路板之第一表面上且其第二端部與散熱裝置固定連接， 用以施加壓力於電路板上使電路板與散熱裝置緊密接觸 ，因而可確保電路板與散熱裝置之間有良好之熱傳遞， 進而可確保發光二極體與散熱裝置之間有良好之熱傳遞 〇 【實施》方式】 [0008] 下面將結合圖式對本發明實施例作進一步之詳細說明。 096141342 表單編號A0101 第5頁/共20頁 1003480424-0 1362894 100年12月26日修正替铁頁 [〇〇〇9] 第_實施例 [〇〇1〇]參見圖1，本發明第一實施例提供之一種發光二極體光源 裝置10，其包括：一個電路板11、複數個發光二極體13 、一個散熱裝置15以及複數個固接裝置17。 [0011] 該電路板11包括一個第一表面112、一個第二表面114以 及一個通孔116。第一表面112與第二表面114相對設置 ’該通孔116貫穿該第一表面112及第二表面114。第一 表面112上配置有電氣連線118，例如銅導線。該電路板 11可選用金屬芯印刷電路板（Metal Core Printed Circuit Board，MCPCB)，以使其具有較佳之熱傳導效 率。 [0012] 該複數個發光二極體13設置於該電路板11之第一表面 上且與第一表面112上之電氣連線118形成電性連接。圖j 中不出兩個發光二極體13，其分別包括一個或複數個（亦 即多個）發光二極體晶片（圖中未示出）以及用於一個封裝 該一個或複數個發光二極體晶片之透光封裝體132。透光 封裝體132之外表面則作為發光二極體13之光出射面。該 兩個發光二極體13為表面黏著型發光二極體（Surface1362894 _ December 26, 100, the shuttle is the second page, the invention description: [Technical field of the invention] [0001] The present invention relates to a light-emitting diode light source device, in particular, a light-emitting device with better heat dissipation efficiency Polar body light source device. [Prior Art] [0002] At present, Light Emitter Diodes (LEDs) are widely used in various fields due to their better optical properties. For details, see Daniel A. Steigerwald et al. in the IEEE Journal On Selected Topics in Quantum Elec-tronics, Vol. 8, No. 2 (March/April 2002) Illu-raination With Solid State Lighting Technology. [0003] A light-emitting diode system is a solid-state semiconductor light-emitting element whose electrical, optical properties and lifetime are sensitive to temperature. In general, higher temperatures result in low internal quantum effects and a much shorter lifetime; on the other hand, the resistance of the semiconductor decreases with increasing temperature, and the resistance of the slip causes a larger current and more More heat is generated, causing the phenomenon of heat accumulation; this thermal damage loop tends to accelerate the destruction of the light-emitting diode light source device. [0004] A light-emitting diode light source device disclosed in U.S. Patent No. 6,428,189 B1 uses a heat sink (Heat Dissipater) to assist the light-emitting diode to dissipate heat to suppress the generation of heat accumulation. Wherein, the light emitting diode is electrically connected to the circuit board and is in thermal contact with the heat sink through the through hole of the circuit board, and the light emitting diode system is bonded to the heat sink via a Thermal Coupling Agent to form heat. 096141342 Form No. A0101 Page 4 of 20 Page 1003480424-0 1362894 100 years. December 26th Shuttle is _ page contact. However, it is often difficult for a thermal coupling agent to provide sufficient bonding force to firmly connect the light-emitting diode to the heat sink to ensure good heat transfer between the light-emitting diode and the heat sink, which will cause the The light-emitting diode light source device has poor heat dissipation efficiency. SUMMARY OF THE INVENTION [0005] An embodiment of a light-emitting diode light source device with better heat dissipation efficiency will be described below by way of example. [0006] A light emitting diode light source device includes: a circuit board, a plurality of light emitting diodes, a heat sink, and a plurality of fixing devices. The circuit board includes a first surface and a second surface opposite the first surface, the first surface being provided with an electrical connection. The plurality of light emitting diodes are disposed on the first surface of the circuit board and electrically connected to the electrical connection. The heat sink is in thermal contact with the second surface of the circuit board. The plurality of fastening devices respectively include a first end portion and a second end portion opposite to the first end portion, the first end portion being fastened on the first surface of the circuit board, the second end portion being The heat sink is fixedly connected. [0007] The light-emitting diode light source device is configured to fix a first end of the plurality of fastening devices on a first surface of the circuit board and a second end thereof by providing a plurality of fixing devices The portion is fixedly connected to the heat dissipating device for applying pressure on the circuit board to make the circuit board and the heat dissipating device in close contact, thereby ensuring good heat transfer between the circuit board and the heat dissipating device, thereby ensuring the light emitting diode and the heat dissipating device There is a good heat transfer between the two [implementation] mode [0008] The embodiments of the present invention will be further described in detail below with reference to the drawings. 096141342 Form No. A0101 Page 5 / Total 20 Page 1003480424-0 1362894 Revised iron sheet on December 26, 100 [〇〇〇9] The first embodiment [〇〇1〇] Referring to Figure 1, the first embodiment of the present invention An LED light source device 10 is provided, which includes a circuit board 11, a plurality of LEDs 13, a heat sink 15, and a plurality of fixing devices 17. [0011] The circuit board 11 includes a first surface 112, a second surface 114, and a through hole 116. The first surface 112 is disposed opposite the second surface 114. The through hole 116 extends through the first surface 112 and the second surface 114. An electrical connection 118, such as a copper wire, is disposed on the first surface 112. The circuit board 11 can be selected from a Metal Core Printed Circuit Board (MCPCB) to provide better thermal conductivity. [0012] The plurality of LEDs 13 are disposed on the first surface of the circuit board 11 and electrically connected to the electrical connections 118 on the first surface 112. There are no two LEDs 13 in FIG. j, which respectively include one or a plurality of (ie, a plurality of) LED chips (not shown) and one package for the one or more LEDs The light transmissive package 132 of the polar body wafer. The outer surface of the light-transmitting package 132 serves as a light-emitting surface of the light-emitting diode 13. The two light-emitting diodes 13 are surface-adhesive light-emitting diodes (Surface)
Mounted type Light Emitting Diode, SMT-type LED) 〇 [0013] 該散熱裝置15設置於該電路板Π之鄰近該第二表面114之 一側且與該第二表面114形成熱接觸。該散熱裝置15之遠 離s玄電路板11之第二表面114的一側設置有複數個散熱韓 片152，用以增大其散熱面積。該散熱裝置ι5可由銅、鋁 096141342 表單編號A0101 第6頁/共20頁 1003480424-0 1362894 1100年.12月26日修正替换 等金屬材料製成。為減小散熱裝置丨5與電路板丨丨之第二 表面114之間的接觸熱阻，可於散熱裝置15與第二表面 114之間增設一個熱介面層14，例如一導熱膠或其它合適 之熱介面材料。 [0014]邊複數個固接裝置1 7包括一個第一端部1 72及一個第二端 部174 ’第一端部172與第二端部174相對設置。該第一 端部172卡固於該電路板π之第一表面112上且與第一表 面112形成連續的線接觸（如圖2Α&2Β所示）或不連續的 線接觸（如圖3Α及3Β所示）。該第二端部174經由一鎖固 件18鎖固於散熱裝置15上而與該散熱裝置丨5形成固定連 接。該種設置使得該複數個固接裝置17可施加壓力於電 路板11上以使電路板11與散熱裝置丨5緊密接觸而具良好 之熱傳遞。.Mounted type Light Emitting Diode, SMT-type LED) 〇 [0013] The heat sink 15 is disposed on a side of the circuit board adjacent to the second surface 114 and in thermal contact with the second surface 114. A plurality of heat dissipating fins 152 are disposed on a side of the heat dissipating device 15 away from the second surface 114 of the sin circuit board 11 for increasing the heat dissipating area. The heat dissipating device ι5 can be made of a metal material such as copper, aluminum 096141342 Form No. A0101, Page 6 of 20, 1003480424-0 1362894, 1100, December 26, and the like. In order to reduce the thermal contact resistance between the heat sink 5 and the second surface 114 of the circuit board, a thermal interface layer 14 may be added between the heat sink 15 and the second surface 114, such as a thermal adhesive or other suitable Thermal interface material. The plurality of fastening means 17 includes a first end portion 172 and a second end portion 174'. The first end portion 172 is disposed opposite the second end portion 174. The first end portion 172 is fastened to the first surface 112 of the circuit board π and forms a continuous line contact with the first surface 112 (as shown in FIG. 2A & 2) or a discontinuous line contact (see FIG. 3). 3Β)). The second end portion 174 is fixed to the heat sink 15 via a locking member 18 to form a fixed connection with the heat sink unit 5. This arrangement allows the plurality of fastening devices 17 to apply pressure to the circuit board 11 to bring the circuit board 11 into close contact with the heat sink 丨5 for good heat transfer. .
[0015] 本實施例中，該複數個固接裝置17之材料可選用纖維強 化（Fiber Reinforced)塑膠（Plastic)，例如玻璃纖 維強化或碳纖維強化塑膠》該種纖維強化塑膠具較好之 耐疲勞性能、長時間使用仍能維持其彈性，以使施加於 電路板11上之壓力不致於消失。其中，玻璃纖維強化或 碳纖維強化塑膠可為玻璃纖維強化或碳纖維強化之聚碳 酸酯、聚甲搭樹脂、聚丙稀、聚鄰苯二甲醯胺（PPA)、聚 對本一甲酸二丁醋樹脂（PBT)等。該鎖固件18選用螺絲， 其使得施加於該電路板11上之壓力可調節。 [0016] 圖1中示出三個固接裝置17，其與該兩個發光二極體13相 互間隔配置且該兩個發光二極體13分別位於與其相鄰之 該三個固接裝置17中之兩個設置 兩個固接裝置17之間 表單編號A0101 096141342 第7頁/共20頁 1003480424-0 100年12月26日核正替换頁 於電路板11之相對的兩個側邊，另一個固接裝置ΐγ之第 —端部174則穿過電路板11之通孔He與該散熱裝置15固 定連接。可理解的是，亦可將複數個固接裝置17僅設置 於電路板11之側邊而非穿過電路板丨丨，相應地可無需於 電路板11上設置通孔116 ;其於一定程度上亦可使電路板 11與散熱裝置15之間有較好的熱接觸。還可理解的是， ‘發光一極體13之數目增多時，還可於電路板Η上設置 複數個通孔116並相應地增加穿過電路板n之通孔116的 固接裝置17之數目。 [0017] 另外，該發光二極體光源裝置10還可設置一個燈罩19， 該燈罩19固定於該散熱裝置15之與電路板η之第二表面 ^4形成熱接觸之表面上並與散熱裝置15形成一容置空間 (圖令未標示）’該複數個發光二極體13及電路板11配置 於該容置空間内。 [0018] [0019] 第一貫施例 參見圖4 ’本發明第二實施例提供之一種發光二極體光源 裝置20，其與本發明第一實施例提供之發光二極體光源 裝置10基本相同》該發光二極體光源裝置20包括：一個 電路板11 '複數個發光二極體13、一個散熱裝置15以及 複數個固接裝置27 ;其與發光二極體光源裝置10的不同 之處在於：固接裝置27與該複數個發光二極體13相互間 隔配置且該複數個發光二極體13分別位於與其相鄰之兩 個固接裝置27之間。該固接裝置27包括一個第一端部272 、一個第二端部274以及一個設置於第一端部272上之導 線273。該第一端部272與第二端部274相對設置，其卡 096141342 1003480424-0 第8頁/共20頁 表單編號Α0101 1362894 100年.12月26日修正替換百 固於電路板11之第一表面112上並使該導線273與該電路 板11之第一表面112上的電氣連線118接觸而形成電連接 ;該第二端部274經由一黏合劑（圖t未示出）以膠黏方式 與該散熱裝置15形成固定連接。該種設置使得該複數個 固接裝置27可施加壓力於電路板11上以使得電路板11與 散熱裝置15緊密接觸而具良好之熱傳遞。該導線273用以 電連接與固接裝置27相鄰之發光二極體13，其經由與一 外部電源（圖中未示出）電性連接可向該複數個發光二極 體13提供電能。另外，可理解的是，該固接裝置27之第 二端部274亦可經由如第一實施例的鎖固方式與該散熱裝 置15形成固定連接。 [0020] 第三實施例 [0021] 參見圖5，本發明第三實施例提供之一種發光二極體光源 裝置30，其與本發明第一實施例提供之發光二極體光源 裝置10基本相同。該發光二極體光源裝置30包括：一個 電路板11、複數個發光二極體13、一個散熱裝置15以及 複數個固接裝置37 ;其與發光二極體光源裝置10的不同 之處在於：固接裝置37包括一個第一端部372、一個第二 端部374以及一個彈性元件373，例如彈簧。該第一端部 372與第二端部374相對設置，該彈性元件373設置於第 一端部372與該電路板11之第一表面112之間，以使得第 一端部372彈性地卡固於電路板11之第一表面112上以向 電路板11施加一彈性壓力；該第二端部374經由一黏合劑 (圖中未示出）以膠黏方式與該散熱裝置15形成固定連接 。該種設置使得該複數個固接裝置37可施加彈性壓力於 096141342 表單編號A0101 第9頁/共20頁 1003480424-0 1362894 _ 100年.12月26日修正替病頁 電路板11上以使得電路板11與散熱裝置15緊密接觸而具 良好之熱傳遞。另外，可理解的是，該固接裝置37之第 二端部374亦可經由如第一實施例的鎖固方式與該散熱裝 置15形成固定連接。 [0022] 第四實施例 [0023] 參見圖6，本發明第四實施例提供之一種發光二極體光源 裝置40，其與本發明第一實施例提供之發光二極體光源 裝置10基本相同。該發光二極體光源裝置40包括：一個 電路板11、複數個發光二極體13、一個散熱裝置45以及 複數個固接裝置47 ;其與發光二極體光源裝置10的不同 之處在於：該固接裝置47包括一個第一端部472及一個第 二端部474。該散熱裝置45之遠離該電路板11之第二表面 114之一側形成有複數個散熱鰭片452，其鄰近該電路板 11之第二表面114的一側形成有複數個凹槽454。該固接 裝置47之第一端部472與第二端部474相對設置，其卡固 於電路板11之第一表面112上並與該第一表面112形成面 接觸；其第二端部474嵌設於該散熱裝置45的與之對應的 凹槽454内以與該散熱裝置45形成固定連接。該種設置使 得該複數個固接裝置47可施加壓力於電路板11上以使得 電路板11與散熱裝置45緊密接觸而具良好之熱傳遞。 [0024] 第五實施例 [0025] 參見圖7，本發明第五實施例提供之一種發光二極體光源 裝置50，其與本發明第四實施例提供之發光二極體光源 裝置40基本相同。該發光二極體光源裝置50包括：一個 096141342 表單编號A0101 第10頁/共20頁 1003480424-0 1362894 [0026] [0027] [0028] 096141342 100年.12月26日梭正替換頁 電路板11、複數個發光二極體13、一個散熱裝置45以及 複數個固接裝置57 ;其與發光二極體光源裝置40的不同 之處在於：該固接裝置57包括一個第一端部572、一個第 二端部574以及一個設置於第二端部572上之導線573。 該第一端部572與第二端部574相對設置，其卡固於電路 板11之第一表面112上並使該導線573與該電路板11之第 一表面112上的電氣連線118接觸而形成電連接；該第二 端部574嵌設於散熱裝置45的與之對應的凹槽454而與該 散熱裝置45形成固定連接。該種設置使得該複數個固接 裝置57可施加壓力於電路板11上以使得電路板11與散熱 裝置45緊密接觸而具良好之熱傳遞。該導線573用以電連 接與固接裝置57相鄰之發光二極體13，其經由與一外部 電源（圖中未示出）電性連接可向該複數個發光二極體1 3 提供電能。 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明第一實施例提供之發光二極體光源裝置之局 部剖示圖。 圖2A及2B分別係圖1所示發光二極體光源裝置之固接裝置 的側視及主視示意圖。 圖3A及3B分別係圖1所示發光二極體光源裝置之固接裝置 表單編號A0101 第11頁/共20頁 1003480424-0 [0029] 1362894 100年.12月26日核正替换頁 之另一實施例的側視及主視示意圖。 [0030] 圖4係本發明第二實施例提供之發光二極體光源裝置之局 部剖示圖。 [0031] 圖5係本發明第三實施例提供之發光二極體光源裝置之局 部剖示圖。 [0032] 圖6係本發明第四實施例提供之發光二極體光源裝置之局 部剖示圖。 [0033] 圖7係本發明第五實施例提供之發光二極體光源裝置之局 部剖示圖。 【主要元件符號說明】 [0034] 發光二極體光源裝置：10，20，30，40，50 [0035] 電路板：11 [0036] 第一表面：112 [0037] 第二表面：114 [0038] 通孔：116 [0039] 電氣連線：118 [0040] 發光二極體：13 [0041] 透光封裝體：132 [0042] 熱介面層：14 [0043] 散熱裝置：15，45 [0044] 散熱鰭片：152，452 096141342 表單編號A0101 第12頁/共20頁 1003480424-0 [0045] 固接裝置： 17， 27，37 ，47 [0046] 第一端部： 172 ，272， 372 [0047] 第二端部： 174 ，274， 374 [0048] 鎖固件：1 8 [0049] 燈罩：19 [0050] 導線：273 ，573 [0051] 彈性元件： 373 [0052] 凹槽：454 1362894 100年12月26日梭正替换頁 ，57 472 ， 572 474 ， 574 096141342 表單編號A0101 第13頁/共20頁 1003480424-0[0015] In this embodiment, the material of the plurality of fixing devices 17 may be made of Fiber Reinforced plastic (Plastic), such as glass fiber reinforced or carbon fiber reinforced plastic. The fiber reinforced plastic has good fatigue resistance. The performance and long-term use can maintain its elasticity so that the pressure applied to the circuit board 11 does not disappear. Among them, the glass fiber reinforced or carbon fiber reinforced plastic may be glass fiber reinforced or carbon fiber reinforced polycarbonate, polymethylated resin, polypropylene, polyphthalamide (PPA), polyparabencarboxylic acid dibutyl vinegar resin ( PBT) and so on. The lock 18 is a screw that allows the pressure applied to the circuit board 11 to be adjusted. [0016] FIG. 1 shows three fastening devices 17 which are spaced apart from the two light-emitting diodes 13 and which are respectively located adjacent to the three fastening devices 17 adjacent thereto. Two of the two fixing devices 17 are provided between the form number A0101 096141342, page 7 / total 20 pages 1003480424-0, December 26, 100, and the replacement page is on the opposite sides of the circuit board 11, and The first end portion 174 of a fixing device ΐ is fixedly connected to the heat sink 15 through the through hole He of the circuit board 11. It can be understood that a plurality of fixing devices 17 can be disposed only on the side of the circuit board 11 instead of passing through the circuit board, and accordingly, the through holes 116 need not be disposed on the circuit board 11; It also allows for better thermal contact between the circuit board 11 and the heat sink 15. It can also be understood that, when the number of the light-emitting diodes 13 is increased, a plurality of through holes 116 may be disposed on the circuit board and the number of the fixing devices 17 passing through the through holes 116 of the circuit board n may be correspondingly increased. . [0017] In addition, the light emitting diode device 10 can also be provided with a lamp cover 19 fixed on the surface of the heat sink 15 that is in thermal contact with the second surface 4 of the circuit board n and the heat sink. 15 is formed in an accommodating space (not illustrated) (the plurality of illuminating diodes 13 and the circuit board 11 are disposed in the accommodating space). [0019] The first embodiment of the invention provides a light-emitting diode light source device 20 according to a second embodiment of the present invention, which is basically the same as the light-emitting diode light source device 10 provided by the first embodiment of the present invention. The same LED light source device 20 includes: a circuit board 11 'a plurality of light emitting diodes 13 , one heat sink 15 and a plurality of fixing devices 27 ; the difference from the light emitting diode device 10 The fixing device 27 and the plurality of light emitting diodes 13 are spaced apart from each other, and the plurality of light emitting diodes 13 are respectively located between the two fixing devices 27 adjacent thereto. The fastening device 27 includes a first end 272, a second end 274, and a wire 273 disposed on the first end 272. The first end portion 272 is opposite to the second end portion 274, and the card 096141342 1003480424-0 is 8th page/total 20 pages form number Α0101 1362894 100 years. December 26th correction replaces the first one in the circuit board 11 The surface 112 is electrically connected to the electrical connection 118 on the first surface 112 of the circuit board 11 to form an electrical connection; the second end 274 is adhered via an adhesive (not shown) The manner forms a fixed connection with the heat sink 15 . This arrangement allows the plurality of fastening devices 27 to apply pressure to the circuit board 11 such that the circuit board 11 is in intimate contact with the heat sink 15 for good heat transfer. The wire 273 is electrically connected to the light-emitting diode 13 adjacent to the fixing device 27, and is electrically connected to the plurality of light-emitting diodes 13 via an external power source (not shown). In addition, it can be understood that the second end portion 274 of the fixing device 27 can also be fixedly connected to the heat dissipating device 15 via the locking method as in the first embodiment. [0020] Third Embodiment [0021] Referring to FIG. 5, a third embodiment of the present invention provides a light-emitting diode light source device 30 which is substantially the same as the light-emitting diode light source device 10 according to the first embodiment of the present invention. . The light emitting diode device 30 includes: a circuit board 11, a plurality of light emitting diodes 13, a heat sink 15 and a plurality of fixing devices 37; the difference from the light emitting diode device 10 is: The fastening device 37 includes a first end 372, a second end 374 and a resilient member 373, such as a spring. The first end portion 372 is disposed opposite to the second end portion 374. The elastic member 373 is disposed between the first end portion 372 and the first surface 112 of the circuit board 11 such that the first end portion 372 is elastically locked. The first surface 112 of the circuit board 11 is applied with a resilient pressure to the circuit board 11; the second end 374 is adhesively coupled to the heat sink 15 via an adhesive (not shown). The arrangement allows the plurality of fastening devices 37 to apply elastic pressure to the 096141342 form number A0101 page 9 / total 20 pages 1003480424-0 1362894 _ 100 years. December 26 revision of the disease page board 11 to make the circuit The plate 11 is in close contact with the heat sink 15 for good heat transfer. In addition, it can be understood that the second end portion 374 of the fixing device 37 can also be fixedly connected to the heat dissipating device 15 via the locking method as in the first embodiment. [0022] A fourth embodiment of the present invention provides a light-emitting diode light source device 40 which is substantially the same as the light-emitting diode light source device 10 according to the first embodiment of the present invention. . The light emitting diode device 40 includes: a circuit board 11, a plurality of light emitting diodes 13, a heat sink 45, and a plurality of fixing devices 47; the difference from the light emitting diode device 10 is: The fastening device 47 includes a first end 472 and a second end 474. A plurality of heat dissipation fins 452 are formed on one side of the heat dissipation device 45 away from the second surface 114 of the circuit board 11, and a plurality of recesses 454 are formed adjacent to a side of the second surface 114 of the circuit board 11. The first end portion 472 of the fixing device 47 is disposed opposite to the second end portion 474, and is fixed on the first surface 112 of the circuit board 11 and in surface contact with the first surface 112; the second end portion 474 thereof The recess 454 corresponding to the heat sink 45 is embedded to form a fixed connection with the heat sink 45. This arrangement allows the plurality of fastening devices 47 to apply pressure to the circuit board 11 such that the circuit board 11 is in intimate contact with the heat sink 45 for good heat transfer. [0024] A fifth embodiment of the present invention provides a light-emitting diode light source device 50 which is substantially the same as the light-emitting diode light source device 40 according to the fourth embodiment of the present invention. . The light-emitting diode light source device 50 includes: a 096141342 form number A0101 page 10 / total 20 pages 1003480424-0 1362894 [0026] [0028] 096141342 100 years. December 26 shuttle replacement page board 11. A plurality of light emitting diodes 13, a heat sink 45, and a plurality of fixing devices 57; the difference from the light emitting diode device 40 is that the fixing device 57 includes a first end portion 572, A second end 574 and a wire 573 disposed on the second end 572. The first end portion 572 is opposite to the second end portion 574 and is fastened to the first surface 112 of the circuit board 11 and contacts the wire 573 with the electrical connection 118 on the first surface 112 of the circuit board 11. The second end portion 574 is embedded in the corresponding recess 454 of the heat sink 45 to form a fixed connection with the heat sink 45. This arrangement allows the plurality of fastening devices 57 to apply pressure to the circuit board 11 such that the circuit board 11 is in intimate contact with the heat sink 45 for good heat transfer. The wire 573 is electrically connected to the light-emitting diode 13 adjacent to the fixing device 57, and is electrically connected to the plurality of light-emitting diodes 1 3 via an external power source (not shown). . In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial cross-sectional view showing a light-emitting diode light source device according to a first embodiment of the present invention. 2A and 2B are respectively a side view and a front view showing the fixing device of the light-emitting diode light source device shown in Fig. 1. 3A and 3B are respectively the fixing device of the light-emitting diode light source device shown in Fig. 1. Form No. A0101 Page 11 / Total 20 pages 1003480424-0 [0029] 1362894 100 years. December 26th, the nuclear replacement page is another A side view and a front view of an embodiment. 4 is a partial cross-sectional view showing a light-emitting diode light source device according to a second embodiment of the present invention. 5 is a partial cross-sectional view showing a light-emitting diode light source device according to a third embodiment of the present invention. 6 is a partial cross-sectional view showing a light-emitting diode light source device according to a fourth embodiment of the present invention. 7 is a partial cross-sectional view showing a light-emitting diode light source device according to a fifth embodiment of the present invention. [Main component symbol description] [0034] Light-emitting diode light source device: 10, 20, 30, 40, 50 [0035] Circuit board: 11 [0036] First surface: 112 [0037] Second surface: 114 [0038] ] Through hole: 116 [0039] Electrical connection: 118 [0040] Light-emitting diode: 13 [0041] Light-transmitting package: 132 [0042] Thermal interface layer: 14 [0043] Heat sink: 15, 45 [0044 ] Heat sink fins: 152,452 096141342 Form No. A0101 Page 12 of 20 1003480424-0 [0045] Fixing device: 17, 27, 37, 47 [0046] First end: 172, 272, 372 [ 0047] Second end: 174,274, 374 [0048] Locking: 1 8 [0049] Lampshade: 19 [0050] Wire: 273, 573 [0051] Elastic element: 373 [0052] Groove: 454 1362894 100 On December 26th, the shuttle replacement page, 57 472, 572 474, 574 096141342 Form No. A0101 Page 13 / Total 20 Page 1003480424-0