KR20210085059A - Lamp for vehicle - Google Patents

Abstract

The present invention relates to a lamp for a vehicle, which comprises: a heat dissipation member having a first area in a planar shape as a predetermined area at least on a first surface; an insulating layer provided on the first surface of the heat dissipation member; a conductor layer of a conductor provided in the first area on the insulating layer and forming a circuit pattern; an element provided on the conductor layer; a protective layer provided on the conductor layer and the insulating layer; a pad portion for electrically connecting the element to the conductor layer at a position at which the element is mounted; and a connector detachably provided on a connection terminal provided in the first area at a predetermined position at least among the circumferential surfaces of the heat dissipation member and electrically connected to the connection terminal. In addition, the lamp for a vehicle can be implemented in various ways in accordance with embodiments. An LED element is directly mounted on a metal member which realizes heat dissipation, such that an assembly structure is simple.

Description

Lamp for vehicle

The present invention relates to a vehicle lamp, and relates to a vehicle lamp capable of directly implementing an LED element on a member capable of implementing heat dissipation, such as a metal member.

1 is a view schematically showing an LED lighting device mounted on a vehicle according to the related art.

Referring to Figure 1, the lamp provided in the conventional vehicle is located on the other side of the LED element 11, the substrate 13 on which the LED element 11 is mounted, the substrate 13, the LED element 11 and A heat sink 15 for dissipating heat generated from the substrate 13 may be included.

In the lamp provided in the vehicle, when the LED elements 11 are mounted on the substrate 13, heat accumulates in the junction, etc., so the heat dissipation effect is inevitably low with only the substrate 13. Accordingly, if the heat generated from the LED element 11 is not sufficiently removed, the rate of conversion to light due to the activation of electrons due to internal heat is lowered, and the LED element 11 is deteriorated by the rising heat to ensure a long lifespan. it becomes difficult to do

Therefore, the LED element 11 and the heat generated from the substrate 13 on which the LED element 11 is mounted is efficiently dissipated to prevent the efficiency of the LED element 11, for example, deterioration of light output characteristics, shortening of lifespan, and reduction of efficiency. To do this, a heat sink 15 may be provided.

The substrate 13 on which the LED element 11 is mounted may be directly attached to the heat sink 15 . In addition, in order to increase the heat dissipation effect of the heat sink 15 , a plurality of heat dissipation fins 19 protruding from the tile surface of the heat sink 15 to increase the heat dissipation area may be included.

Briefly looking at the manufacturing process of a lamp mounted on a conventional vehicle as described above, circuit patterns are manufactured on a substrate for electrical connection of the LED element, and the LED element is mounted on the manufactured circuit pattern, and then on the heat sink. will be implemented

However, during the manufacturing process of such a lamp, especially when mounting a circuit pattern for electrically connecting the LED element, acid and alkali treatment such as etching and pretreatment peeling process must be performed. In this process, byproducts of environmental pollutants are removed. There is a problem with ejection.

In addition, the conventional LED lighting device as described above has a complicated configuration or structure, and thus the assembly process is complicated, and the manufacturing cost is increased. There is a problem in that the space for mounting must be increased.

In addition, the conventional LED lighting device as described above has problems in that it is difficult to secure a mounting space for connecting a connector, and assembly is not easy.

(Patent Document) Japanese Patent Application Laid-Open No. 2012-004553 (published on: 2012.01.05)

The technical problem to be achieved by the present invention is to provide a vehicle lamp capable of connecting an external connector that is easy to attach and detach and easy to assemble to a heat dissipation member directly mounted with an LED element in a vehicle lamp.

The technical problem to be achieved by the present invention is that it is possible to effectively dissipate heat generated from an LED element or an external connector in a vehicle lamp, and a vehicle lamp that can reduce the manufacturing cost as well as facilitate the securing of a mounting space would like to provide

The problems of the present invention are not limited to the problems mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

A vehicle lamp according to an embodiment of the present invention,

a heat dissipation member having a first area having a planar shape as at least a predetermined area on a first surface;

an insulating layer provided on the first surface of the heat dissipation member;

a conductor layer provided in the first region on the insulating layer and forming a circuit pattern;

an element provided on the conductor layer;

a protective layer provided on the conductor layer and the insulating layer;

a pad portion for electrically connecting the device to the conductor layer at a position where the device is mounted; and

It may include a connection connector that is detachably provided on the connection terminal provided in the first area at least at a predetermined position among the circumferential surface of the heat dissipation member, and is electrically connected to the connection terminal.

A plurality of heat dissipation fins for implementing additional heat dissipation may be formed integrally or combined with the heat dissipation member on the tile surface of the heat dissipation member.

The heat dissipation member may include an aluminum plate.

The connector is

a body forming an insertion opening to be inserted into the first region of the heat dissipation member; and

It may include a connection terminal connected to the connection terminal on the inside of the body.

The heat dissipation member and the connection connector may be provided with a detachable member for fixing or releasing the fixing of the body of the connection connector to the heat dissipation member.

The detachable member,

a fastening groove formed on a lower surface of the heat dissipation member; and

It may include an inclined protrusion formed on the inner lower surface of the insertion opening of the body to be fastened to the fastening groove to be fixed or separated to release the fastening.

The body is formed in a clip shape of an upper plate, a lower plate facing the upper plate, and a support plate provided at the ends of the upper and lower plates and connected,

Between the upper plate and the lower plate, the insertion opening may be provided to be narrower from the other end to the one end.

Pressing members may be further provided on both sides of the body to provide an elastic force to widen or narrow the width of the insertion member according to the release of the pressure or pressurization toward the body.

The pressing member may be provided to move away from the side surface of the body from one end to the other end of the body.

The pressing member may be formed in a '⊃' shape extending from one end of the upper plate and one end of the lower plate to the other end and connected to each other at the other end.

The open area of the pressing member may be provided to have a wider gap than the end area.

The insulating layer may be formed by applying a solution having a viscosity including at least one of aluminum oxide and aluminum nitride.

The conductor layer may be formed by applying a solution having a viscosity including a material including at least one of copper, silver, gold, and copper-graphene.

The protective layer may be formed by applying a solution having a viscosity including a material including at least one of aluminum oxide, aluminum nitride, silicone resin, epoxy, polyimide, and polyester.

The surface insulation resistance value of the protective layer has a surface insulation resistance value lower than that of the insulation layer,

The thermal conductivity of the protective layer is smaller than that of the insulating layer,

The thermal resistance value of the protective layer is provided higher than that of the insulating layer,

The peel strength of the protective layer may be less than or equal to the peel strength of the insulating layer.

The insulating layer, the conductor layer, and the protective layer are printed electronic circuits laminated on the heat dissipation member, and the surface insulation resistance value of the printed electronic circuit may be 300 MΩ or more or 500 MΩ or more.

The peel strength of the insulating layer may be formed to be 1.5N/mm or more, the thermal conductivity of the insulating layer may be 0.5-3W/mK, and the surface insulation resistance value of the insulating layer may be formed to be 300 MΩ or more.

The details of other embodiments are included in the detailed description and drawings.

As described above, the vehicle lamp according to the embodiment of the present invention has the advantage of a simple assembly structure and a simple manufacturing process by directly mounting the LED element on a metal member for realizing heat dissipation.

In addition, the vehicle lamp according to the embodiment of the present invention has the advantage of being able to mount the LED lighting device in a narrow location by directly mounting the LED element on a metal member that realizes heat dissipation, and reducing the manufacturing cost. have.

In addition, the vehicle lamp according to the embodiment of the present invention has the advantage of being able to directly attach and detach the connector to the heat dissipation member on which the electrode element such as the LED element is directly mounted, so that the connector mounting is easy and the assembly is simple.

In addition, the vehicle lamp according to the embodiment of the present invention can realize resource and energy saving by forming a circuit only in the necessary parts, rather than in a way that only the necessary parts are left by etching the existing metal layer when the circuit pattern is formed, and the etching is performed There is an advantage in that a vehicle lamp can be implemented without affecting the environment because no chemical substances are used.

Effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a cross-sectional view schematically showing a conventional LED lighting device.
2 is a schematic perspective view of a vehicle lamp according to an embodiment of the present invention.
3 is a schematic plan view of a vehicle lamp according to an embodiment of the present invention.
4 is a schematic cross-sectional view of a vehicle lamp according to an embodiment of the present invention.
5 is a partial perspective view of a first region of a heat dissipation member of a vehicle lamp according to an embodiment of the present invention, as viewed from below.
6 is a cross-sectional view before the connection between the heat dissipation member and the connection connector of the vehicle lamp according to an embodiment of the present invention.
7 is a partial cross-sectional view illustrating a connection state between a heat dissipation member of a vehicle lamp and a connection connector according to an embodiment of the present invention.
8 is an exploded perspective view of a heat dissipation member mounted with an element and a connection connector in a vehicle lamp according to an embodiment of the present invention.
9 is a partially coupled perspective view of a connector coupled to a heat dissipation member of a vehicle lamp according to an embodiment of the present invention.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the art to which the present invention pertains It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

Accordingly, in some embodiments, well-known process steps, well-known structures, and well-known techniques have not been specifically described in order to avoid obscuring the present invention.

The terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention. As used herein, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and/or “comprising” refers to the presence or addition of one or more other components, steps, operations and/or components other than the stated components, steps, operations and/or components. It is used in the sense of not being excluded. And, “and/or” includes each and every combination of one or more of the recited items.

In addition, the embodiments described herein will be described with reference to cross-sectional and/or schematic diagrams that are ideal illustrative views of the present invention. Accordingly, the form of the illustrative drawing may be modified due to manufacturing technology and/or tolerance. Accordingly, the embodiments of the present invention are not limited to the specific form shown, but also include changes in the form generated according to the manufacturing process. In addition, in each of the drawings shown in the present invention, each component may be enlarged or reduced to some extent in consideration of convenience of description. Like reference numerals refer to like elements throughout.

Hereinafter, the present invention will be described with reference to the drawings for explaining the vehicle lamp 10 according to embodiments of the present invention.

2 is a schematic perspective view of a vehicle lamp 10 according to an embodiment of the present invention. 3 is a schematic plan view of a vehicle lamp 10 according to an embodiment of the present invention. 4 is a schematic cross-sectional view of a vehicle lamp 10 according to an embodiment of the present invention.

2 to 4, the vehicle lamp 10 according to an embodiment of the present invention has a lamp unit 100 provided as a heat dissipation member 110 in which an element 140 such as an LED element is directly installed on one surface; , a connection connector 200 electrically connected to the heat dissipation member 110 may be provided.

First, the heat dissipation member 110 may include at least one element 140 and a circuit pattern 131 on one surface as described above. In addition, a connection terminal 115 may be formed in at least a first region at a predetermined position among the circumferential surfaces of the heat dissipation member 110 .

Specifically, the lamp unit 100 of the vehicle lamp 10 according to an embodiment of the present invention includes a heat dissipation member, a heat dissipation member 110 , an insulating layer 120 , a conductor layer 130 , a protective layer 150 , and a pad. The unit 160 and the device 140 may be stacked.

The heat dissipation member 110 may have a first surface and a second surface opposite to the first surface. A device 140 to be described later may be directly mounted on the first surface of the heat dissipation member 110 . A plurality of heat dissipation fins 111 may be provided on the second surface of the heat dissipation member 110 . The heat dissipation member 110 is a configuration for dissipating heat generated by the device 140 to be described later, and may be provided as a heat sink including an aluminum plate made of aluminum. In addition, the heat dissipation member 110 may be made of a non-conductive metal or alloy.

The first surface of the heat dissipation member 110 may have at least a first area having a planar shape of a predetermined area. An electrode conductor layer 130 , which will be described later, may be formed in the first region, and the device 140 may be mounted thereon.

At least one protrusion or groove may be formed on the first surface of the heat dissipation member 110 . Various members may be coupled to the protrusion or the groove according to the element 140 . For example, when the device 140 is an LED module, a reflector, a lens holder, a lens, a light source module, etc. that reflect the light emitted from the LED module through a protrusion or a groove formed in the heat dissipation member 110 are coupled to each other. can be In addition, the second surface of the heat dissipation member 110 may be flat, or a plurality of protrusions may be formed as described above, or a plurality of heat dissipation fins 111 may be provided.

A plurality of heat dissipation fins 111 may be provided on the second surface of the heat dissipation member 110 according to an embodiment of the present invention.

The heat dissipation fin 111 may be integrally formed with the heat dissipation member 110 , or alternatively, it may be provided separately from the heat dissipation member 110 and then coupled to the heat dissipation member 110 . In addition, the heat dissipation fins 111 according to an embodiment of the present invention may be provided to be spaced apart from each other at regular intervals. Contrary to this, the heat dissipation fin 111 may be provided such that the central region has a wide separation distance while both regions of the central region have a relatively narrow separation distance. Also, unlike this, the heat dissipation fins 111 may be provided to have a separation distance that becomes wider at regular intervals as the distance from the central region increases.

In addition, the heat dissipation fin 111 according to an embodiment of the present invention may be provided to correspond to the position of the device 140 .

Printed electronic circuits 120 , 130 , and 150 may be provided on the first surface of the heat dissipation member 110 . The printed electronic circuits 120 , 130 , and 150 are structures stacked on the heat dissipation member 110 , and in the present invention may include an insulating layer 120 , a conductor layer 130 , and a protective layer 150 . .

First, the insulating layer 120 may be provided on the first surface of the heat dissipation member 110 according to an embodiment of the present invention.

The insulating layer 120 may include at least one of aluminum oxide and aluminum nitride as a main component, and may include a silane-based compound. For example, the insulating layer 120 may be made of a material including aluminum oxide, aluminum compound, such as aluminum nitride, silicone resin, epoxy, polyimide, and polyester.

In addition, the insulating layer 120 may include a silicone-based compound or a silane-based compound to increase adhesion with the heat dissipation member 110 , and the adhesive force may be adjusted by adjusting a composition ratio thereof.

When the thickness of the insulating layer 120 and the material of the insulating layer 120, specifically, the ratio of aluminum oxide, silicone resin, epoxy, polyimide, and polyester are adjusted, the insulating resistance value of the insulating layer 120 is and thermal conductivity may be adjusted.

The thickness of the insulating layer 120 may be provided to have a thickness of 10-200 μm, the surface insulation resistance value of the insulating layer 120 is provided as 10-500 MΩ, and the thickness of the insulating layer 120 is The thermal conductivity may be 0.5-3W/mK, and the thermal resistance of the insulating layer 120 may be 1-20K/W. In addition, the peel strength of the insulating layer 120 may be provided to be 1.5N/mm or more. However, preferably, the insulating layer 120 contains 90-99% of aluminum oxide or aluminum nitride and has a thickness of 30-100 μm, and a surface insulation resistance value of 300 MΩ or more (input voltage is DC250V- DC1000V), and may be provided to have a thermal conductivity of 1W/mK or more and a thermal resistance value of 15K/W or less.

In addition, the insulating layer 120 may be formed by applying the above material to the metal layer 110 in a solution state using one of gravure, offset, or screen printing, and then drying or sintering.

Also, with respect to the specific contents of the insulating layer 120, reference may be made to Korean Patent Registration Nos. 10-1887841 and 10-1533013.

The conductor layer 130 according to an embodiment of the present invention is positioned in the first region on the insulating layer 120 , and specifically, it may be formed of a conductor formed of the circuit pattern 131 portion. . The conductor layer 130 may include at least one of copper, silver, gold, and copper-graphene. The conductor layer 130 may be formed by applying the above material in a solution state on the insulating layer 120 using one of gravure, offset or screen printing, and then drying or sintering.

As described above, in the circuit pattern 131 of the conductor layer 130 of the present invention, only a necessary portion of the conductor layer 130 may be formed. Therefore, there is a difference from the conventional method of etching the metal layer to leave only a partial region of the pattern. Therefore, when the circuit pattern 131 is implemented as in the present invention, the use of harmful chemicals through conventional etching can be limited, and unnecessary parts are not discarded through etching even in the material part, thereby reducing the manufacturing cost. be able to do

Regarding the material of the conductor layer 130 and the gravure, offset or screen printing method for implementing the conductor layer 130, Korean Patent Application No. 10-2014-0120953, Korean Patent No. 10-1467470, If you refer to Korean Patent No. 10-1433639, Korean Patent No. 10-1143296, Korean Patent No. 10-1104123, Korean Patent No. 10-0844861, and Korean Patent No. 10-0759251, you will find out in detail. can

The protective layer 150 according to an embodiment of the present invention is a configuration provided on the first surface of the heat dissipation member 110 , and may be provided on the conductor layer 130 and the insulating layer 120 . . The protective layer 150 may have a function, configuration, and material similar to that of the insulating layer 120 .

However, the protective layer 150 may be thinner than the insulating layer 120 , and may have a high thermal resistance and low thermal conductivity. In addition, the protective layer 150 may have higher electrical conductivity than the insulating layer 120 and may be provided to have a low surface insulation resistance value. A specific configuration may be described later.

The protective layer 150 may be made of a material having a higher thermal resistance and higher electrical conductivity than the insulating layer 120 . The protective layer 150 may have insulating properties made of a material containing at least one of aluminum oxide and aluminum nitride as a main component. For example, the protective layer 150 may include at least one of a silicone resin, epoxy, polyimide, and polyester in an aluminum compound of aluminum oxide and aluminum nitride. In addition, the protective layer 150 may further include silicon-based and silane-based materials in addition to the above materials for adhesion between the protective layer 150 and the conductive layer 130 . In addition, in order to control the adhesive force between the protective layer 150 and the electrode, the composition ratio of the silicon-based and the silane-based may be adjusted.

When the thickness of the protective layer 150 and the material of the protective layer 150, specifically, the aluminum oxide, aluminum nitride, silicone resin, epoxy, polyimide, and polyester ratios are adjusted, the insulation layer 120 is Insulation resistance value and thermal conductivity can be adjusted.

The protective layer 150 is applied to the insulating layer 120 and the conductor layer 130 using one of gravure, offset, or screen printing in a solution state having a viscosity of the above material, and then dried or sintered. can be formed by

The thickness of the protective layer 150 may be 1-50 μm, the surface insulation resistance of the protective layer 150 may be provided in the range of 0.1-500 MΩ, and the thermal conductivity of the protective layer 150 may be 0.1 -3W/mK, the thermal resistance of the protective layer 150 may be 0.1-20K/W, and the peeling strength of the protective layer 150 may be 0.1N/mm or more.

As described above, the insulating layer 120 and the protective layer 150 are similar layers, and the insulating layer 120 is formed on the heat dissipation member 110 to provide insulation to form the conductor layer 130 . layer that can be implemented. In addition, the protective layer 150 is implemented on the protective layer 150 to prevent oxidation of the circuit pattern 131 of the conductor layer 130 , and in the SMT process when the device 140 to be described later is mounted. It may be provided to implement the prevention of the phenomenon of a soldering bridge (also referred to as 'solder crossing') between the circuit and the circuit.

The protective layer 150 of the present invention may form a layer thinner than the insulating layer 120 , and the surface insulation resistance value of the protective layer 150 is lower than the surface insulation resistance value of the insulation layer 120 . The protective layer 150 may have a thermal conductivity smaller than that of the insulating layer 120 , and a thermal resistance value of the protective layer 150 may be greater than that of the insulating layer 120 , and the protective layer 150 . ) may have a peel strength equal to or smaller than the peel strength of the insulating layer 120 .

Specifically, the protective layer 150 has a thickness of 1-50 μm, the surface insulation resistance of the protective layer 150 is provided in the range of 0.1-500 MΩ, and the thermal conductivity of the protective layer 150 is 0.1-3 W /mK, the thermal resistance of the protective layer 150 may be provided as 0.1-20K/W, and the peel strength of the protective layer 150 may be provided as 0.1N/mm or more. However, preferably, the protective layer 150 contains 90-99% of aluminum oxide and aluminum nitride, has a thickness of 5-30 μm, and has a surface insulation resistance value of 10 MΩ or more (input voltage is DC250V- DC1000V), and may be provided to have a thermal resistance value of 0.1W/mK or more and a thermal conductivity of 15K/W or less.

Also, the protective layer 150 may have a hardness of 3H or more.

As described above, the printed electronic circuits 120 , 130 , 150 provided with the insulating layer 120 , the conductor layer 130 , and the protective layer 150 may be provided on the upper surface of the heat dissipation member 110 . can The surface insulation resistance value of the printed electronic circuits 120 , 130 , 150 stacked on the heat dissipation member 110 is preferably formed to be 300 MΩ or more, or 500 MΩ or more.

The device 140 according to an embodiment of the present invention may be positioned on the protective layer 150 , and the device 140 includes the conductive layer 130 formed on a lower layer of the protective layer 150 and It may be provided to be electrically connected.

The device 140 may be mounted by an SMT method, and a mark for the SMT method, specifically a mark for the SMT direction, such as a marking or a reference point, may be formed on the surface of the protective layer 150 , It may be provided to indicate the reference number of the device 140 .

In addition, the electrical connection between the device 140 and the conductor layer 130 may be formed using a reflow method or may be formed using a conductive adhesive. The bonding of the element 140 and the conductor layer 130 through the conductive adhesive can be confirmed in more detail through Korean Patent Registration No. 10-1492890.

When the device 140 is electrically connected to the conductor layer 130 through the pad part 160 , the protective layer 150 is excluded only at the location of the device 140 so that the device 140 is moved to the device 140 . It may be provided to be connected to the top of the conductor layer 130 .

The device 140 may include at least one of an LED, a capacitor, an LED protection device, a connector, a resistor, a diode, an FET, and an IC.

The device 140 may include a pad unit 160 to be electrically connected to the conductor layer 130 .

The pad part 160 according to an embodiment of the present invention may be provided to electrically connect the device 140 and the conductor layer 130 .

The protective layer 150 is provided on the upper side of the conductive layer 130 , and the protective layer 150 is not stacked on a portion where the device 140 is located, so that the device 140 and the conductive layer 130 are not stacked. ) may be provided with the pad unit 160 for electrically connecting them. In addition, although not shown, the pad unit 160 forms a predetermined space in which the device is seated and is formed on the conductor layer 130 . The protective layer may be placed on the periphery. The device 140 may be electrically connected to the conductor layer 130 through the pad part 160 .

. An electrical coupling member 170 capable of electrically connecting them may be further provided between the devices 140 .

The electrical coupling member 170 may be implemented by including at least one of soldering or an electrically conductive adhesive.

The pad unit 160 may have a different shape or size according to the shape or size of the device 130 .

As described above, in the vehicle lamp 10 according to an embodiment of the present invention, the insulating layer 120 , the conductor layer 130 , and the protective layer 150 are disposed above the heat dissipation member 110 . The device 140 can be directly implemented on the heat dissipation member 110 .

5 is a partial perspective view of the first area of the heat dissipation member 100 of the vehicle lamp 10 according to an embodiment of the present invention, as shown from the lower side. 6 is a cross-sectional view before the connection between the heat dissipation member 100 and the connection connector 200 of the vehicle lamp 10 according to an embodiment of the present invention. 7 is a partial cross-sectional view of a connection state between the heat dissipation member 100 and the connection connector 200 of the vehicle lamp 10 according to an embodiment of the present invention.

5 to 7 , the connection connector 200 may be detachably provided around the periphery of the heat dissipation member 100 according to an embodiment of the present invention.

A connection terminal 115 capable of being electrically connected to the connection connector 200 may be provided in a first region at a predetermined position among the circumferential surfaces of the heat dissipation member 100 .

In addition, a fastening groove 116 of the detachable members 116 and 230 to be described later may be formed on the lower surface of the heat dissipation member 100 so as to be fixed or released when the connection connector 200 is coupled.

The connection connector 200 may be detachably provided in the first region of the heat dissipation member 100 and may be provided to be electrically connected to the connection terminal 115 .

The connection connector 200 may include a body 210 and a connection terminal 220 .

The body 210 may form an insertion opening 111 to be inserted into the first region of the heat dissipation member 100 .

The body 210 is provided at the ends of the upper plate 210a, the lower plate 210b facing the upper plate 210a, and the upper and lower plates 210a and 210b and connected to the support plate 210c. provided, may be formed in a clip shape.

In addition, the insertion opening 111 may be formed between the upper plate 210a and the lower plate 210b, and may be provided to be narrower from the other end to one end of the insertion opening 111 .

In addition, the width of the insertion opening 111 is formed to be the same as the side width of the heat dissipation member 100 or is formed to be wider than the side width, as described above, one end of the insertion opening 111 is the heat dissipation member ( 100), and the other end of the insertion opening 111 may be the same as the side width of the heat dissipation member 100 or may be formed to be wider than the side width of the heat dissipation member 100.

The connection terminal 220 may be provided on the inner side of the body 210 , specifically, on the inner surface of the upper plate 210a to correspond to the position of the connection terminal 115 .

The heat dissipation member 100 and the connection connector 200 may be provided with detachable members 116 and 230 for fixing or releasing the fixing of the body 210 of the connection connector 200 to the heat dissipation member 100 . can

The detachable members 116 and 230 may include a fastening groove 116 and an inclined protrusion 230 .

The fastening groove 116 may be formed on the lower surface of the heat dissipation member 100 to have a structure in which the inclined protrusion 230 is drawn in or drawn out.

The inclined protrusion 230 may be formed to protrude upward from an inner lower surface of the insertion opening 111 of the body 210 , specifically, a lower surface plate. In addition, the inclined protrusion 230 may be inclined in a direction in which the connection connector 200 is coupled to the heat dissipation member 100 to facilitate coupling. When the connecting connector 200 is inserted toward the heat dissipation member 100 , the inclined protrusion 230 may be fastened to and fixed to the fastening groove 116 , and the connecting connector 200 may be connected to the heat dissipation member 100 . ) side, the coupling may be released.

8 is an exploded perspective view of the heat dissipation member 100 on which the element 140 is mounted and the connection connector 200 in the vehicle lamp 10 according to an embodiment of the present invention. 9 is a partially coupled perspective view of the connector 200 coupled to the heat dissipation member 100 of the vehicle lamp 10 according to an embodiment of the present invention.

8 and 9 , a pressing member 250 may be provided on the body 210 of the connection connector 200 according to an embodiment of the present invention.

The pressing member 250 may be provided on both sides of the body 210, and the pressing member 250 is pressed toward the body 210 or widens or narrows the width of the insertion member according to the release of the pressure. It may be provided to provide an elastic force. In addition, the pressing member 250 may be provided to move away from the side surface of the body 210 from one end to the other end of the body 210 .

Specifically, the pressing member 250 may extend from one end of the upper plate 210a and one end of the lower plate 210b to the other end and may be connected to each other at the other end. Accordingly, the pressing member 250 may be formed in a '⊃' shape.

In addition, the open area of the pressing member 250 may be provided to have a wider interval than the end area. Specifically, the open regions of the pressing member 250 may have an elliptical shape, but may be provided so as to approach each other in a distant direction.

Accordingly, when the pressing member 250 is pressed toward the side surface of the body 210, the upper plate 210a and the lower plate 210b are formed with the support plate 210c as the center of the insertion opening 111. The entrance will be wider. Accordingly, the insertion opening 111 is easily inserted into the first region of the heat dissipation member 100. In addition, when the pressing member 250 is released, the wide insertion opening 111 is As the inlet is narrowed, it may be closely fixed to the upper and lower surfaces of the heat dissipation member 100 .

When the connection connector 200 is closely coupled to the heat dissipation member 100 , the connection terminal 115 may be electrically coupled to the connection terminal 220 . In addition, in order to release the connection connector 200 from the heat dissipation member 100, press the pressing member 250 toward the body 210 to widen the entrance of the insertion opening 111 and then the connection connector 200 ) may be separated from the heat dissipation member 100 .

Accordingly, the connection connector 200 can be easily detached and attached to the heat dissipation member 100 , and detachment and assembly can be simple.

Although embodiments of the present invention have been described with reference to the above and the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can practice the present invention in other specific forms without changing its technical spirit or essential features. You will understand that there is Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

10: vehicle lamp
100: lamp unit
110: heat dissipation member
111: heat dissipation fin
115: connection terminal
116: fastening groove
120: insulating layer
130: conductor layer
140: electrode element
150: protective layer
160: pad part
200: connector connector
210: body
210a: upper plate
210b: lower plate
210c: support plate
211: insertion opening
220: connector
230: inclined protrusion
250: no pressing

Claims (17)

in vehicle lamps,
a heat dissipation member having a first area having a planar shape as at least a predetermined area on a first surface;
an insulating layer provided on the first surface of the heat dissipation member;
a conductor layer provided in the first region on the insulating layer and forming a circuit pattern;
an element provided on the conductor layer;
a protective layer provided on the conductor layer and the insulating layer;
a pad portion for electrically connecting the device to the conductor layer at a position where the device is mounted; and
and a connection connector that is detachably provided on a connection terminal provided in at least a first region of a predetermined position among the circumferential surfaces of the heat dissipation member and is electrically connected to the connection terminal. According to claim 1,
A vehicle lamp in which a plurality of heat dissipation fins for implementing additional heat dissipation are integrally or combined with the heat dissipation member on the tile surface of the heat dissipation member. 3. The method of claim 2,
The heat dissipation member is a vehicle lamp including an aluminum plate. According to claim 1, wherein the connection connector,
a body forming an insertion opening to be inserted into the first region of the heat dissipation member; and
A vehicle lamp including a connection terminal connected to the connection terminal inside the body. 5. The method of claim 4,
The heat dissipating member and the connecting connector are provided with a detachable member for fixing or releasing the fixing of the body of the connecting connector to the heat dissipating member. The method of claim 5, wherein the detachable member,
a fastening groove formed on a lower surface of the heat dissipation member; and
A vehicle lamp including an inclined protrusion formed on an inner lower surface of the insertion opening of the body and fastened to the fastening groove to be fixed or released to release the fastening. 5. The method of claim 4,
The body is formed in a clip shape of an upper plate, a lower plate opposite to the upper plate, and a support plate provided at the ends of the upper and lower plates and connected;
The insertion opening between the upper plate and the lower plate is provided to be narrower from the other end to the one end. 8. The method of claim 7,
A vehicle lamp further provided with a pressing member provided on both sides of the body to provide an elastic force to widen or narrow the width of the insertion member according to the pressure toward the body or release of the pressure. 9. The method of claim 8,
The pressing member is provided so as to move away from the side surface of the body from one end of the body to the other end. 7. The method of claim 6,
The pressing member extends from one end to the other end of one end of the upper plate and the lower plate, and is formed in a '⊃' shape to be connected to each other at the other end. 11. The method of claim 10,
The open area of the pressing member is provided to have a wider interval than the end area of the vehicle ramp. According to claim 1,
The insulating layer is a vehicle lamp formed by applying a solution having a viscosity including at least one of aluminum oxide and aluminum nitride. According to claim 1,
The conductor layer is copper, silver, gold, and copper-a vehicle lamp formed by applying a solution having a viscosity including at least one of graphene. According to claim 1,
The protective layer is a vehicle lamp formed by applying a solution having a viscosity including a material including at least one of aluminum oxide, aluminum nitride, silicone resin, epoxy, polyimide, and polyester. According to claim 1,
The surface insulation resistance value of the protective layer has a surface insulation resistance value lower than that of the insulation layer,
The thermal conductivity of the protective layer is smaller than that of the insulating layer,
The thermal resistance value of the protective layer is provided higher than that of the insulating layer,
The peel strength of the protective layer is less than or equal to the peel strength of the insulating layer. 16. The method of claim 15,
The insulating layer, the conductor layer, and the protective layer are printed electronic circuits laminated on the heat dissipation member, and the surface insulation resistance value of the printed electronic circuit is formed to be 300 MΩ or more, or 500 MΩ or more. 16. The method of claim 15,
The peel strength of the insulating layer is formed to be 1.5N/mm or more, the thermal conductivity of the insulating layer is 0.5-3W/mK, and the surface insulation resistance value of the insulating layer is 300MΩ or more.

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